WO2010001961A1 - クーラント再生方法およびスラリー再生方法 - Google Patents
クーラント再生方法およびスラリー再生方法 Download PDFInfo
- Publication number
- WO2010001961A1 WO2010001961A1 PCT/JP2009/062126 JP2009062126W WO2010001961A1 WO 2010001961 A1 WO2010001961 A1 WO 2010001961A1 JP 2009062126 W JP2009062126 W JP 2009062126W WO 2010001961 A1 WO2010001961 A1 WO 2010001961A1
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- WO
- WIPO (PCT)
- Prior art keywords
- coolant
- slurry
- distillation
- acid
- abrasive grains
- Prior art date
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- 239000002826 coolant Substances 0.000 title claims abstract description 154
- 239000002002 slurry Substances 0.000 title claims abstract description 138
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000001172 regenerating effect Effects 0.000 title abstract description 8
- 238000004821 distillation Methods 0.000 claims abstract description 61
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000006061 abrasive grain Substances 0.000 claims abstract description 48
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 44
- 239000010703 silicon Substances 0.000 claims abstract description 44
- 238000011069 regeneration method Methods 0.000 claims abstract description 38
- 238000005520 cutting process Methods 0.000 claims abstract description 35
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000008929 regeneration Effects 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims description 52
- 238000011282 treatment Methods 0.000 claims description 38
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 36
- 239000003513 alkali Substances 0.000 claims description 30
- 239000010419 fine particle Substances 0.000 claims description 25
- 238000001914 filtration Methods 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 33
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 30
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 27
- 239000007788 liquid Substances 0.000 description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 22
- 238000006243 chemical reaction Methods 0.000 description 17
- 238000005119 centrifugation Methods 0.000 description 15
- 238000001879 gelation Methods 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 238000011084 recovery Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 11
- 239000012535 impurity Substances 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- -1 iron ions Chemical class 0.000 description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000011863 silicon-based powder Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 5
- 239000010802 sludge Substances 0.000 description 5
- 239000013256 coordination polymer Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000010979 pH adjustment Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000011946 reduction process Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000004310 lactic acid Substances 0.000 description 3
- 235000014655 lactic acid Nutrition 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 241000960387 Torque teno virus Species 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000002440 industrial waste Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000008213 purified water Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 2
- 235000019345 sodium thiosulphate Nutrition 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 208000033962 Fontaine progeroid syndrome Diseases 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- DOAYJPJLHNHQSU-UHFFFAOYSA-N aluminum;lithium;hydrate Chemical compound [Li].O.[Al] DOAYJPJLHNHQSU-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- MOOAHMCRPCTRLV-UHFFFAOYSA-N boron sodium Chemical compound [B].[Na] MOOAHMCRPCTRLV-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000013373 food additive Nutrition 0.000 description 1
- 239000002778 food additive Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001819 mass spectrum Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000003921 particle size analysis Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
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- 229940005605 valeric acid Drugs 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Definitions
- the present invention relates to a coolant regeneration method and a slurry regeneration method. Specifically, a coolant regeneration method for regenerating coolant from used slurry discharged when cutting silicon ingots such as single crystal silicon for solar cells, polycrystalline silicon for solar cells, single crystal silicon for semiconductor integrated circuits, and the like.
- the present invention relates to a slurry regeneration method used.
- Wire saws are widely used as cutting devices in the manufacturing process of thin plates (hereinafter referred to as silicon wafers) made of silicon single crystal or polycrystal widely used for solar cells and semiconductor integrated circuits (IC chips).
- silicon wafers thin plates
- IC chips semiconductor integrated circuits
- a wire saw configured to cut a large number (for example, 100 or more) at a time may be particularly referred to as a multi-wire saw (hereinafter referred to as MWS).
- MWS multi-wire saw
- MWS refers to pressing a workpiece (silicon ingot in the present invention) against a wire spirally wound between a plurality of rollers, and moving the wire while supplying slurry to the contact portion between the workpiece and the wire.
- the slurry used here is a mixture of an oil-based coolant based on mineral oil or a water-soluble coolant using water and abrasive grains made of silicon carbide, aluminum oxide, zirconium oxide or the like.
- the discharged slurry that has been discharged is generally discarded as industrial waste (for example, landfill disposal) through combustion treatment (in the case of oil-based coolant) and concentration treatment (in the case of aqueous coolant).
- industrial waste for example, landfill disposal
- combustion treatment in the case of oil-based coolant
- concentration treatment in the case of aqueous coolant.
- Such processing of industrial waste is a cause of an increase in costs for combustion and concentration and product costs due to energy consumption (in the present invention, the price of silicon wafers, solar cells and ICs produced therefrom), It contributes to environmental problems caused by combustion and landfill.
- Patent Document 1 a used slurry used for a wire saw is guided to a first centrifuge and contains recovered abrasive grains, fine cutting scraps and crushed abrasive grains. After the fine particle mixture is separated into the fine particle mixed liquid and subsequently passed through the high density electric field, the fine particle solid in the fine particle mixed liquid is increased in particle size, and then led to the second centrifuge to increase the fine particle size.
- a slurry regeneration method is disclosed in which the recovered abrasive separated by a first centrifuge and the recovered cutting liquid separated by a second centrifuge are mixed and reused after being separated into a solid and a recovered cutting liquid. .
- Patent Document 2 discloses a slurry regeneration method including a crushing step of crushing the agglomerated particles of abrasive grains in the used slurry.
- Patent Document 3 the present inventors perform one or more centrifugation and / or distillation steps without using a special apparatus or method such as a high-density electric field or a crushing step. It is disclosed that slurry regeneration is possible by performing.
- the present inventors have found that when a slurry using a water-soluble coolant is regenerated using a conventional method, the viscosity of the regenerated slurry tends to increase.
- the regenerated slurry does not gel when the current silicon wafer is manufactured, and there is no problem in the MWS itself using the regenerated slurry according to Patent Document 3.
- this level of MWS typically has a slurry of about 200 L. This is because the tank is provided, so that at the end of one cutting step, 15% by weight of silicon is not contained in the slurry (note that one cutting time is about 6 to 12 hours). ).
- This invention is made in view of the said problem, and makes it a subject to provide the coolant reproduction
- the used slurry discharged at the time of cutting the silicon ingot using the slurry containing abrasive grains and water-soluble coolant is subjected to at least a distillation step, and the regenerated coolant is obtained from the obtained distilled coolant.
- a coolant regeneration method to obtain There is provided a coolant regeneration method in which the distilled coolant contains 5% by weight or more of water and 80% by weight or more of propylene glycol.
- a slurry regeneration method for obtaining a regenerated slurry from a used slurry discharged at the time of cutting a silicon ingot using a slurry containing abrasive grains and a water-soluble coolant,
- a slurry regeneration method including a mixing step of mixing new abrasive grains and / or recovered abrasive grains recovered from the used slurry with the regenerated coolant obtained by using the above coolant regeneration method.
- the present inventors conducted the following experiment in order to confirm the cause of the increase in viscosity of the regenerated slurry.
- Recovered abrasive grains and recovered coolant obtained by washing and drying the abrasive-containing liquid disclosed in Example 1 of Patent Document 3 (same as “heavy specific gravity liquid” in Patent Document 3) (see “Patent Document 3”
- the recovered abrasive and the new coolant were mixed at a weight ratio of 1: 1, and 15% by weight of silicon powder having a particle size of 1 to 5 ⁇ m and 1% by weight of Fe powder were added thereto.
- new abrasive grains and recovered coolant are mixed at a weight ratio of 1: 1, and 15% by weight of silicon powder having a particle size of 1 to 5 ⁇ m and 1% by weight of Fe powder are added thereto.
- experimental slurry B This is called experimental slurry B.
- gelation After about 9 hours had passed (hereinafter referred to as “gelation”). Further, gas was continuously generated from the experimental slurry B.
- pH of each of the experimental slurry A and the experimental slurry B before and after being left for 9 hours was measured, it was as shown in Table 1.
- the recovered coolant used here is the one obtained by the distillation method of Patent Document 3, and only the organic solvent (here, using a glycol solvent) and water are detected in the recovered coolant. It was found that only a very small amount of a modified product (oxide) of glycol was present. In order to demonstrate this, water is removed from the recovered coolant, and the new abrasive grains and the recovered coolant (moisture-removed product) are mixed at a weight ratio of 1: 1, and 15 weight of silicon powder having a particle size of 1 to 5 ⁇ m is mixed here.
- experimental slurry C Fe powder 1% by weight
- gelation Fe powder 1% by weight
- the present inventors have intensively studied and found that by mixing an appropriate amount of acid and alkali as a reaction inhibitor, an increase in the pH of the slurry can be suppressed and the viscosity of the slurry can be stabilized.
- reaction suppression principle is not necessarily clear, it can be estimated as follows from the change in pH before and after being left for 9 hours.
- the pH of the coolant in the slicing process should be 4 or more and 9 or less, but it is difficult to stabilize the pH at a value of 4 to 9 by adding only acid. That is, it is not practically preferable because the pH may be too low to oxidize silicon. That is, by coexisting an acid and an alkali, the amount of acid added to the coolant can be increased at the same pH, so in an environment where Fe (wire scrap) like slices is continuously supplied, It is effective as long as there is a limitation.
- the above conditions can be satisfied by using an organic acid such as citric acid (pH 4 at the solid solubility limit with water) to increase the addition amount, It is also possible to obtain an effect.
- the gelation of the regenerated slurry can be suppressed by using the regenerated coolant obtained by the coolant regenerating method of the present invention. That is, it is possible to obtain a regenerated coolant and a regenerated slurry that are easy to use in a wire saw such as MWS.
- Coolant regeneration method A coolant regeneration method according to an embodiment of the present invention will be described with reference to the flowchart of FIG.
- a used slurry discharged at the time of cutting a silicon ingot using a slurry containing abrasive grains and a water-soluble coolant is used as a raw material, and the used slurry is subjected to at least a distillation step.
- distillation coolant used in the method of the present embodiment can be obtained by subjecting the used slurry to at least a distillation step.
- the used slurry is discharged when a silicon ingot is cut using a slurry containing abrasive grains and a water-soluble coolant.
- the cutting of the silicon ingot is, for example, slicing a silicon ingot using a wire saw such as MWS or corner processing of a silicon block using an OD saw.
- the water-soluble coolant is a water-soluble coolant and contains propylene glycol and water as essential components. In the water-soluble coolant, the total content of propylene glycol and water is 85% by weight or more, and more preferably 95% by weight or more. The remaining breakdown is, for example, bentonite added for the purpose of viscosity adjustment and the like.
- the abrasive grains are made of silicon carbide or the like.
- the distillation coolant is obtained by subjecting the used slurry to at least a distillation step, and contains 5% by weight or more of water and 80% by weight or more of propylene glycol.
- the distillation coolant contains at least 5% by weight water and at least 80% by weight propylene glycol, with the remaining 15% by weight comprising water, propylene glycol, other water soluble solvents (such as polyethylene glycol) 1 or 2 or more among water-soluble glycols).
- a distillation process is performed on a recovered liquid obtained by performing a solid-liquid separation process on the used slurry will be described, but only a distillation process is performed on the used slurry. Also good.
- the solid-liquid separation step includes a primary centrifugation step and a subsequent secondary centrifugation step.
- the solid-liquid separation step may be performed by other methods (filtration, one-stage or three-stage or more centrifugation, or a combination of filtration and centrifugation).
- the used slurry contains reusable abrasive grains. Therefore, in the primary centrifugation step, the used slurry is separated into the recovered abrasive grains and the primary recovered liquid by performing primary centrifugation (preferably centrifugal force of 100 to 1000 G).
- the recovered abrasive grains are used as they are or after being subjected to one or more steps of concentration, washing, drying and classification, and then mixed with a pH adjusting coolant (described later) and used for slurry regeneration.
- a secondary centrifugation step is performed on the primary recovery solution.
- the primary recovery liquid is subjected to secondary centrifugation (preferably centrifugal force 2000 to 5000 G) to separate the primary recovery liquid into sludge and secondary recovery liquid.
- the sludge is generally discarded (such as landfill disposal) as it is or after drying treatment or recovery of some materials.
- centrifuge used for primary centrifugation and secondary centrifugation
- a known apparatus for example, a decanter type centrifuge or a basket type centrifuge
- a decanter type centrifuge or a basket type centrifuge may be used alone or in appropriate combination. it can.
- the distillation step is a step of distilling the recovered slurry (primary recovery solution or secondary recovery solution) from the used slurry or solid-liquid separation step.
- the used slurry or recovered liquid is separated into a distillation coolant and a residue.
- the residue is discarded (such as landfill disposal) as it is or after drying or recovery of some materials.
- a distillation apparatus used for the distillation step a known apparatus can be used as appropriate. For example, an evaporator for distilling a 1 L order secondary recovery liquid may be used, or a distillation column for distilling a 1 t order secondary recovery liquid.
- distillation may be performed under an atmospheric pressure atmosphere or may be performed under reduced pressure.
- Neutralizing treatment step when the pH of the distilled coolant is not 4 or more and 9 or less, it is desirable to carry out a neutralizing treatment in view of the burden on the apparatus.
- This neutralization treatment is a treatment method that is generally performed, and its purpose is to reduce the load on the apparatus including the subsequent steps.
- the neutralization treatment is not particularly necessary.
- Pretreatment Step it is preferable to perform a pretreatment step consisting of at least one of a fine particle removal treatment and a reduction treatment on the distilled coolant.
- a pretreatment step consisting of at least one of a fine particle removal treatment and a reduction treatment on the distilled coolant.
- the amount of impurities in the distilled coolant can be reduced.
- an increase in viscosity during standing can be suppressed by reducing the amount of impurities by performing a pretreatment step.
- the amount of impurities can be evaluated by turbidity.
- the impurities removed in the pretreatment step include silicon fine particles (for example, fine particles having a particle size of about 0.01 to 5 ⁇ m) and wire-derived iron fine particles (for example, a particle size of about 0.01 to 1 ⁇ m).
- Fine particles iron ions or iron-based fine particles, water-soluble glycol denatured products (considered oxides generated by the heat generated during the production of the distillation coolant), and organic carbides added to glycol or acid addition + pH adjustment And so on.
- fine particle removal process and the reduction process will be described in detail.
- the fine particle removal treatment is a treatment for removing fine particles present in the distillation coolant, and includes, for example, at least one of activated carbon treatment, filtration, and re-distillation.
- the fine particles include silicon fine particles (eg, fine particles having a particle size of about 0.01 to 5 ⁇ m), iron-derived iron fine particles (eg, fine particles having a particle size of about 0.01 to 1 ⁇ m), iron ions, and the like. Can be considered).
- the activated carbon treatment is a treatment for adsorbing the particulate impurities in the distilled coolant to the activated carbon, and can be performed, for example, by mixing and stirring the activated carbon in the distilled coolant and then removing the activated carbon by filtration.
- the activated carbon used for this treatment can be appropriately selected from granular and powdered activated carbon used in the liquid phase.
- the filtering material used for filtration include filters made of organic materials such as polypropylene and polyester, and inorganic materials such as glass fiber and diatomaceous earth. As filter shapes, flat membrane filters and hollow fiber filters adopting a pleated shape. Etc. can be appropriately selected.
- the re-distillation is a step of further distilling the distillation coolant, and may be a distillation step in which one or more distillations are repeated using a single distillation apparatus. Although distillation steps arranged in series may be performed, it is preferable to perform precision distillation with 1 to 100 theoretical plates.
- the reduction treatment refers to a chemical treatment for reducing oxides such as glycol oxide produced during the production of the distillation coolant. By reducing such an oxide, the glycol oxide can be removed.
- oxides such as glycol oxide produced during the production of the distillation coolant.
- the reduction treatment for example, sodium borohydride, sodium thiosulfate, lithium aluminum hydrate, sodium boron hydride and the like are added to the pH adjusting coolant so that the weight ratio is 5 ppm or more and 30 ppm or less, and 50 ° C. or more and 60 ° C. This can be done by heating below.
- This reduction treatment is characterized by a low temperature, low danger, and relatively low cost.
- Acid addition step and alkali addition step Next, an acid addition step of adding an acid to the distillation coolant and an alkali addition step of adding an alkali are performed at least once to adjust the pH of the distillation coolant to 4 or more and 9 or less. Do. Thereby, a pH adjusting coolant is obtained.
- the order of the acid addition step and the alkali addition step is not particularly limited, and either one may be performed first, or both may be performed simultaneously.
- the acid addition step is a step of adding an acid to the distillation coolant.
- an acid By adding an acid to the distillation coolant, hydroxide ions generated during wire scrap oxidation can be suppressed, and supply of hydroxide ions in the distillation coolant can be prevented during slicing, so that gelation can be suppressed.
- the acid is preferably added in the form of an aqueous solution.
- the acid used in the acid addition step may be an inorganic acid such as hydrochloric acid or sulfuric acid, or an organic acid such as acetic acid, lactic acid, citric acid, formic acid, butyric acid, propionic acid, or valeric acid.
- Weak acids can be preferably used, and citric acid and lactic acid (which are food additives and safe for the human body) are particularly preferred.
- citric acid and lactic acid which are food additives and safe for the human body are particularly preferred.
- the advantages of using organic acids are listed below.
- the amount of NaOH (molecular weight: 40) added after acid addition is about 2.1 wt% in the case of hydrochloric acid, but it may be 0.08 wt% to 0.008 wt% in the case of citric acid.
- a strong acid means a sulfuric acid or an acid stronger than this
- a weak acid means an acid weaker than a sulfuric acid.
- pH of the distillation coolant after the acid addition and before the alkali addition may be 4 or more or less than 4.
- the alkali addition step is a step of adding alkali to the distillation coolant.
- alkali used in the alkali addition step sodium hydroxide, potassium hydroxide and the like are preferably used.
- the alkali is preferably added in the form of an aqueous solution.
- the acid addition step and the alkali addition step are performed so as to adjust the pH of the distillation coolant to 4 or more and 9 or less.
- the reason for adjusting the pH is that, first, when the pH of the coolant is less than 4, it is disadvantageous in terms of cost because an acid-resistant treatment is required for the use device such as MWS, and second, the pH of the coolant is less than 4. In this case, it may be difficult to continue using the MWS because iron and acid derived from the wire react with each other during the use of the MWS to generate a large amount of hydrogen gas.
- the slurry regeneration method of one embodiment of the present invention is a slurry regeneration method for obtaining a regeneration slurry from a used slurry discharged when a silicon ingot is cut using a slurry containing abrasive grains and a water-soluble coolant as a raw material.
- a mixing step of mixing new abrasive grains and / or recovered abrasive grains recovered from the used slurry with the recycled coolant obtained by using the above-described coolant recycling method is included.
- only new abrasive grains may be mixed with the regenerated coolant, only recovered abrasive grains may be mixed, or both new abrasive grains and recovered abrasive grains may be mixed. From the viewpoint of efficient use of abrasive grains, it is preferable to mix at least recovered abrasive grains (only recovered abrasive grains or both new abrasive grains and recovered abrasive grains).
- new coolant may be mixed with the regenerated coolant.
- the ratio of new abrasive grains in all abrasive grains contained in the regenerated slurry is preferably 20% by weight or less (preferably 15% by weight or less, particularly preferably 10% by weight or less). This is because the use efficiency of the abrasive grains is high. Further, the ratio of the new coolant in all the coolants contained in the regenerated slurry is preferably 50% by weight or less (preferably 45% by weight or less, particularly preferably 40% by weight or less). This is because the use efficiency of the coolant is high in this case.
- the essential steps as the coolant regeneration method are an acid addition step and an alkali addition step for the distilled coolant, and the other steps are optional steps. Therefore, the steps shown in Examples 1 to 3 are merely examples, but are considered to be one of the most efficient methods for regenerating the coolant.
- the MWS used in Examples 1 to 3 slices four silicon ingots (125W ⁇ 125D ⁇ 400L) in a single cutting process and produces about 3200 silicon wafers (125W ⁇ 125D ⁇ 0.3L). And an apparatus (E400SD manufactured by TOYO ATEC Co., Ltd.) having a slurry tank having a capacity of about 200 L to 400 L.
- Example 1 An example of a coolant regeneration method for obtaining a regenerated slurry from a used slurry obtained by cutting a silicon wafer using MWS will be described as Example 1.
- Example 1 A water-soluble coolant obtained by mixing commercially available purified water and propylene glycol at a weight ratio of 2: 8, and abrasive grains (made of silicon carbide, GC # 800, specific gravity: 3.21) with respect to the MWS is a weight ratio of 1: 1.
- the silicon ingot was cut using 480 kg (specific gravity: 1.6) of the slurry mixed in the above.
- the slurry having a silicon chip content of about 12% by weight or more is recovered as a used slurry, and 510 kg (specific gravity: about 1.65) of the used slurry is subjected to a primary centrifuge (IHI rotating machine). Using a centrifugal separator, a centrifugal force of 500 G was applied to separate the recovered abrasive grains and the primary recovered liquid.
- the recovered abrasive grains obtained from the primary centrifugation step were 290 kg and contained about 30 to 40% by weight of the coolant component.
- the primary recovery liquid obtained from the primary centrifugation step is about 220 kg, and this is applied to the sludge and 2 by applying a centrifugal force of 3000 G in a secondary centrifuge (using a centrifuge manufactured by IHI rotating machinery). Separated into the next recovered liquid.
- the sludge was about 69 kg (containing about 20% by weight coolant component).
- the secondary recovered liquid obtained from the secondary centrifugation step is about 181 kg, and this secondary recovered liquid is heated at 200 ° C. in a reduced pressure state of 0.5 Torr using a vacuum distillation apparatus (manufactured by IHI Rotating Machinery). ) To separate into distilled coolant and residue.
- the residual amount is about 36 kg (including about 15% by weight of coolant component), and 105 kg of waste is generated together with sludge. Therefore, according to this example, the conventional coolant regeneration method (for example, 50% by volume (waste: 255 kg) to 70% by volume (waste: 357 kg) of the secondary recovered liquid (used slurry) is discarded The amount of waste is reduced by about 59% to 71% in weight ratio (255 kg-105 kg to 357 kg-105 kg) as compared with a method of replacing with a simple slurry).
- the conventional coolant regeneration method for example, 50% by volume (waste: 255 kg) to 70% by volume (waste: 357 kg) of the secondary recovered liquid (used slurry) is discarded
- the amount of waste is reduced by about 59% to 71% in weight ratio (255 kg-105 kg to 357 kg-105 kg) as compared with a method of replacing with a simple slurry).
- the distillation coolant obtained from the distillation process was a mixture of 10 wt% water and 90 wt% propylene glycol, about 145 kg, and the initial pH was 3. This time, a sample was prepared when neutralization was necessary.
- the frequency of occurrence of pH of the distilled coolant is as shown in Table 2 below, and most is in the range of pH 4 to 9.
- distilled coolant An appropriate amount of distilled coolant was manufactured by repeating the cutting of the silicon ingot with MWS and the treatment of the used slurry. First, sodium hydroxide (concentration 5 wt%) was added to neutralize (pH 7), and then a fine particle removal process and a reduction process were performed. This time, filtration treatment and activated carbon treatment were selected. Details will be described later in Example 3.
- a citric acid aqueous solution (concentration 20 wt%) was added to adjust the pH to 3, and then a sodium hydroxide aqueous solution (concentration 10 wt%) was added to prepare a coolant sample having a pH of 6 (numerical values are increments of 1).
- the pH was measured at 25 ° C. using a glass electrode.
- a product with a pH of less than 4 was prepared by adding citric acid to pH 5 and then using lactic acid to prepare a pH-adjusted product. .
- the number of days after slicing until gelation of the same solution was investigated. It was left in an environment of 28 ° C., and the number of days until gelation or solidification was investigated. As shown in Table 4, it was confirmed that there was durability for 4 days or more at pH 4 or more and 9 or less, and that there was no problem in use time particularly in the slicing step.
- Comparative Example 1 In Comparative Example 1, as in Example 1, the silicon ingot was cut with MWS and the used slurry was repeatedly processed to produce an appropriate amount of distilled coolant. For the distilled coolant having a pH of 3, sodium hydroxide was used as a pH adjuster. The pH was adjusted using only an aqueous solution and no acid.
- Comparative Example 2 Similar to Example 1, the silicon ingot was cut with MWS and the used slurry was repeatedly processed to produce an appropriate amount of distilled coolant, only acid was used as a pH adjuster, and any alkaline solution was used. First, pH adjustment was performed. However, in Comparative Example 2, a distilled coolant having a pH of 10 before the pH adjustment step was used. In Comparative Example 2, the same acid as in Example 1 was used.
- TTV Total Thichness Variation
- Example 1 among the regenerated slurry samples in Example 1, one having a pH of 7 was used, and this was designated as regenerated slurry A.
- the silicon ingot was cut using a new slurry consisting only of new abrasive grains and water-soluble coolant, and recycled slurries A, B, and C, and the TTVs were compared. The results are shown in Table 7.
- TTV the yield of the regenerated slurry were comparable to those when using the new slurry.
- TTV is 30 ⁇ m or less as a non-defective product, defective products are within 2%, the machine is operated normally, and the generation of bubbles and gelation of the used slurry are not determined. Standard.
- water or glycol was appropriately added to the regenerated slurry to keep the ratio of water and glycol substantially constant.
- TTV measurement in Example 2 Note that a Mitutoyo micrometer was used for TTV measurement in Example 2.
- the TTVs listed in Table 3 are average values of about 3000 silicon wafers.
- Example 3 In the third embodiment, the effects of the fine particle removal process and the reduction process in the present invention will be described.
- a pH 7 distillation coolant having a turbidity of 5 cm to 100 cm was prepared to confirm the necessity. After the acid was added, the alkali was added and the viscosity was measured using a pH 7 solution. In order to measure the viscosity of the slurry, 15% by weight of silicon powder having a weight ratio of 1: 1 and a particle size of 1 to 5 ⁇ m was added. The results are shown in Table 8. Viscosity 1 shows the initial value, and viscosity 2 shows 2 hours later. Five samples with different distillation times were prepared. The turbidity was measured by a method based on JIS K0101. The viscosity was measured using a Viscotester VT-04K (manufactured by Rion).
- FIG. 2 is a flowchart showing the third embodiment.
- Example 2 The same distillation coolant as in Example 1 was subjected to simple filtration (using a membrane filter manufactured by Advantech Co., Ltd. (pore size: 5 ⁇ m)), followed by (1) activated carbon treatment, (2) filtration, (3) redistillation, (4 ) Reduction, respectively.
- An aqueous citric acid solution (concentration 20 wt%) was added to adjust the pH to 2
- an aqueous sodium hydroxide solution (concentration 10 wt%) was added to adjust the pH to 6.
- the materials and conditions used in each process are as follows.
- Adsorption treatment was performed for 3 hours, and this was filtered to separate the coolant and activated carbon.
- Filtration A membrane filter (pore size: 1 ⁇ m) manufactured by Advantech Co., Ltd. was used, and processing was performed at a flow rate of about 100 ml per minute by vacuum filtration.
- Redistillation Distillation was performed at 180 ° C. at a pressure of 50 mmHg using a three-necked stirrable glass container (300 ml).
- Reduction Sodium thiosulfate was added to 10 ppm with respect to the pH adjusting coolant, and heated at 50 ° C. for 30 minutes.
- the untreated coolant was coolant A, and the coolant obtained by simple filtration of the treated coolant again (1) to (5) was used as coolants B to F, and the respective impurities were analyzed.
- the obtained solution is heated to 500 ° C., and the generated vapor (organic impurity analysis, in the following table, a modified product of glycol corresponds) is analyzed by GC mass spectrum (gas chromatograph / mass spectrometer manufactured by Shimadzu Corporation): GCMS-QP2010PLUS).
- thermobalance BRUKER: TG-DTA
- silicon, silicon oxide, and iron particle size analysis using Nikkiso Microtrac particle size distribution analyzer: MT3000II
- ICP-AES ICP emission analyzer manufactured by Shimadzu Corp .: using ICPS-1000IV
- the measurement limit of the fine particle diameter in Example 3 is 0.02 ⁇ m.
- the total amount of impurities was 0.1 wt% or less. Table 9 shows the measurement results.
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JP2012143859A (ja) * | 2010-12-24 | 2012-08-02 | Kao Corp | 研磨液組成物の製造方法 |
WO2013035541A1 (ja) * | 2011-09-07 | 2013-03-14 | 株式会社クラレ | 分離回収装置 |
WO2013054577A1 (ja) * | 2011-10-12 | 2013-04-18 | 株式会社村田製作所 | 加工廃液循環装置及び加工廃液循環方法 |
WO2013099595A1 (ja) * | 2011-12-27 | 2013-07-04 | 旭硝子株式会社 | 研磨剤用添加剤および研磨方法 |
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JP5332914B2 (ja) * | 2009-05-29 | 2013-11-06 | 信越半導体株式会社 | シリコンインゴットの切断方法 |
JP5640260B2 (ja) * | 2010-06-25 | 2014-12-17 | 日本碍子株式会社 | クーラント回収方法 |
JP2013248706A (ja) * | 2012-05-31 | 2013-12-12 | Panasonic Corp | クーラント廃液の再生方法、クーラント廃液の処理方法、クーラント廃液の処理システム、及び再生クーラント液の製造方法 |
JP5860026B2 (ja) * | 2013-12-12 | 2016-02-16 | アミタ株式会社 | シリコンスラリー廃液の全量リサイクルシステム、クーラント回収液、回収砥粒、及び回収切削粉 |
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ITRM20050329A1 (it) * | 2005-06-24 | 2006-12-25 | Guido Fragiacomo | Procedimento per il trattamento di sospensioni abrasive esauste per il recupero delle loro componenti riciclabili e relativo impianto. |
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JP2012143859A (ja) * | 2010-12-24 | 2012-08-02 | Kao Corp | 研磨液組成物の製造方法 |
WO2013035541A1 (ja) * | 2011-09-07 | 2013-03-14 | 株式会社クラレ | 分離回収装置 |
WO2013054577A1 (ja) * | 2011-10-12 | 2013-04-18 | 株式会社村田製作所 | 加工廃液循環装置及び加工廃液循環方法 |
WO2013099595A1 (ja) * | 2011-12-27 | 2013-07-04 | 旭硝子株式会社 | 研磨剤用添加剤および研磨方法 |
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