WO2009107599A1 - Procédé de fabrication pour un corps stratifié - Google Patents

Procédé de fabrication pour un corps stratifié Download PDF

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Publication number
WO2009107599A1
WO2009107599A1 PCT/JP2009/053254 JP2009053254W WO2009107599A1 WO 2009107599 A1 WO2009107599 A1 WO 2009107599A1 JP 2009053254 W JP2009053254 W JP 2009053254W WO 2009107599 A1 WO2009107599 A1 WO 2009107599A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
heat
drying
heat treatment
superheated steam
Prior art date
Application number
PCT/JP2009/053254
Other languages
English (en)
Japanese (ja)
Inventor
剛志 八塚
潤一郎 大西
Original Assignee
東洋紡績株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋紡績株式会社 filed Critical 東洋紡績株式会社
Priority to JP2010500687A priority Critical patent/JP5447365B2/ja
Publication of WO2009107599A1 publication Critical patent/WO2009107599A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/04—Treatment by energy or chemical effects using liquids, gas or steam
    • B32B2310/049—Treatment by energy or chemical effects using liquids, gas or steam using steam or damp
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Definitions

  • the present invention relates to a method for producing a laminate by directly applying, drying, and heat-treating a polyimide resin solution on a metal foil, and more particularly to a method for producing a laminate including a drying / heat treatment step using superheated steam. Is.
  • printed wiring boards are used in which laminated boards made of insulating materials and conductive materials are processed.
  • Printed wiring boards can be broadly classified into plate-shaped rigid printed wiring boards and flexible printed wiring boards with great flexibility.
  • the three-layer flexible substrate is obtained by bonding a base film such as polyimide and a copper foil using an adhesive such as an epoxy resin, an acrylic resin, or a polyester resin.
  • the two-layer flexible substrate is obtained by providing a heat-resistant insulating layer directly on a copper foil without using an adhesive.
  • an adhesive such as epoxy resin, acrylic resin or polyester resin.
  • thermoplastic heat-resistant resin layer is provided on at least one side of a heat-resistant film such as a polyimide film, and the thermoplastic resin layer and a metal foil such as a copper foil are bonded together.
  • Plating such as copper plating is applied to a heat-resistant film such as a polyimide film.
  • a method of applying a polyimide-based heat-resistant resin solution to a metal foil such as a copper foil, drying it, and subjecting it to a heat treatment if necessary is called a casting method. Since the flexible wiring board obtained by the casting method has excellent dimensional stability, it is a material corresponding to the recent increase in density and fine pitch of printed wiring boards.
  • the flexible substrate is manufactured, hot air drying, hot roll contact drying, infrared heating drying, far infrared heating drying, or the like is used as a drying method used for drying the solvent of the heat-resistant resin solution.
  • the heat resistant resin used at this time include a polyimide precursor resin, a solvent-soluble polyimide resin, and a polyamideimide resin.
  • these solvents N-methyl-2-pyrrolidone, N, N-dimethylacetamide, ⁇ -butyrolactone, phenol, cresol, and the like are used, but these solvents have a high boiling point and thus have poor drying properties.
  • amide solvents such as N-methyl-2-pyrrolidone and N, N-dimethylacetamide have low vapor pressure due to intermolecular hydrogen bonding, and the diffusion of the solvent is poor due to the high glass transition temperature of the heat-resistant resin. Yes, it tends to remain in the coating film. Residual solvent causes a decrease in heat resistance and a decrease in dimensional stability. If the drying temperature or heat treatment temperature is too high in order not to leave the solvent, the discoloration or characteristic change of the copper foil, the adhesive strength is reduced due to the deterioration of the resin, or the mechanical characteristics are deteriorated. Drying and heat treatment are performed over time in order to avoid adverse effects caused by an increase in drying and heat treatment temperature and prevent the solvent from remaining. Therefore, there is a problem in productivity.
  • Superheated steam refers to steam that has been heated by heating saturated steam without increasing the pressure. Since superheated steam has a radiant heat energy significantly higher than that of normal steam at a temperature of 150 ° C. or higher, the substance can be heated in a short time. Superheated steam is used for cooking food, washing resin products and metal products, sterilizing food containers, or treating soil. The use of superheated steam as a heating heat source is not very popular except for cooking food. However, when superheated steam is compared with general heated air, it has the following characteristics. (1) Since the heat capacity is larger than that of heated air, rapid heating is possible. (2) Since it has a constant-pressure specific heat about twice that of heated air, it has excellent heating capacity.
  • Patent Documents 1 to 6 propose a method of drying the moisture of wet paper mainly composed of cellulose fibers with superheated steam.
  • Patent Document 6 proposes application of superheated steam to a polyolefin film, a polyamide film, a coating film on a polyester film, or a wet cellophane film.
  • the object of the present invention is to increase the heating and drying efficiency by using superheated steam when producing a laminate by the casting method. Furthermore, it is providing the manufacturing method of a laminated body which does not have the harmful
  • the present invention includes a step of applying a heat treatment using superheated steam in a method of manufacturing a laminate having an insulating resin layer by applying and drying a resin solution containing a polyimide resin on a metal foil. It is the manufacturing method of the laminated body to perform.
  • a laminate comprising a metal foil and a heat-resistant insulating layer can be produced efficiently.
  • the laminate obtained by the present invention can improve the adverse effects caused by the solvent remaining in the heat-resistant insulating layer, such as a decrease in heat resistance and a deterioration in dimensional stability.
  • adverse effects caused by excessive heating such as a decrease in peel strength between the metal and the resin layer and a deterioration in the physical properties of the resin, can be improved at the same time.
  • Examples of the polyimide resin used in the present invention include a polyimide precursor resin, a solvent-soluble polyimide resin, and a polyamideimide resin.
  • the polyimide resin can be polymerized by a usual method. For example, a method of obtaining a polyimide precursor solution by reacting tetracarboxylic dianhydride and diamine in a solution at low temperature, and a method of obtaining a solvent-soluble polyimide solution by reacting tetracarboxylic dianhydride and diamine in a high temperature solution. There are a method using isocyanate as a raw material and a method using acid chloride as a raw material.
  • Examples of raw materials used for the polyimide precursor resin and the solvent-soluble polyimide resin include the following.
  • Examples of acid components include pyromellitic acid, benzophenone-3,3 ', 4,4'-tetracarboxylic acid, biphenyl-3,3', 4,4'-tetracarboxylic acid, diphenylsulfone-3,3 ', 4, 4'-tetracarboxylic acid, diphenyl ether-3,3 ', 4,4'-tetracarboxylic acid, naphthalene-2,3,6,7-tetracarboxylic acid, naphthalene-1,2,4,5-tetracarboxylic acid , Monoanhydrides, dianhydrides, esterified products such as naphthalene-1,4,5,8-tetracarboxylic acid, hydrogenated pyromellitic acid, hydrogenated biphenyl-3,3 ', 4,4'-tetracarboxylic acid Etc.
  • amine component p-phenylenediamine, m-phenylenediamine, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl sulfone, 3,3′-diaminodiphenyl sulfone, 3,4'-diaminobiphenyl, 3,3-diaminobiphenyl, 3,3'-diaminobenzanilide, 4,4'-diaminobenzanilide, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, 3 , 4'-diaminobenzophenone, 2,6-tolylenediamine, 2,4-tolylenediamine, 4,4'-diaminodiphenyl sulfide, 3,3'-diamino
  • Raw materials used for polyamideimide resins include trimellitic anhydride, diphenyl ether-3,3 ', 4'-tricarboxylic acid anhydride, diphenylsulfone-3,3', 4'-tricarboxylic acid anhydride, benzophenone as acid components
  • Tricarboxylic acid anhydrides such as -3,3 ′, 4′-tricarboxylic acid anhydride, naphthalene-1,2,4-tricarboxylic acid anhydride, and hydrogenated trimellitic acid anhydride may be used alone or as a mixture.
  • tetracarboxylic acids mentioned in the polyimide resin their anhydrides, dicarboxylic acids and the like can also be used in combination.
  • the amine component include diamines mentioned for polyimide resins, or diisocyanates alone or as a mixture.
  • a resin separately polymerized by a combination of these acid component and amine component can be mixed and used.
  • the solvent of the polyimide resin solution used in the present invention is that the solubility of the polyimide resin is good, the formation of water and an azeotropic compound in the gas layer, and the compatibility with water is the effect of superheated steam To increase. Further, if the solvent is compatible with water, the evaporated solvent can be easily recovered, which is industrially advantageous. Specifically, N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, 1,3-dimethyl-2-imidazolidinone, tetramethylurea, sulfolane, dimethyl sulfoxide, ⁇ -butyrolactone, cyclohexanone, cyclopentanone and the like can be mentioned.
  • N-methyl-2-pyrrolidone and N, N-dimethylacetamide are preferred.
  • a solvent such as toluene, xylene, diglyme, tetrahydrofuran, methyl ethyl ketone, etc. may be added as long as the solubility is not inhibited.
  • the concentration of the polyimide resin in the polyimide resin solution can be selected from a wide range, but is generally preferably about 5 to 60% by weight, particularly preferably about 8 to 30% by weight from the viewpoint of processability.
  • Examples of the metal foil used in the present invention include copper foil, aluminum foil, stainless steel foil, steel foil, and nickel foil. You may use the composite metal foil which compounded these metal foils, and the metal foil processed with other metals, such as zinc and chromium. Moreover, you may perform the surface treatment of metal foil with a silane coupling agent or a titanium coupling agent.
  • the thickness of the metal foil is not particularly limited, but a 1 mm metal sheet can be used from an ultrathin copper foil with a carrier of 2 ⁇ m.
  • other resins and various additives may be blended or reacted for the purpose of improving various properties of the metal laminate, such as mechanical properties, electrical properties, slipperiness, and flame retardancy.
  • the lubricant include silica, talc, and silicone compounds.
  • the flame retardant include phosphorus-containing compounds, triazine compounds, aluminum hydroxide, and magnesium hydroxide.
  • stabilizers such as antioxidants and UV absorbers, plating activators, and organic and inorganic fillers.
  • curing agents such as an isocyanate compound, an epoxy resin, and a phenol resin, a polyester resin, a polyurethane resin, and a polyamide resin.
  • the method for producing the laminate of the present invention will be described. It is desirable to apply a polyimide resin solution to a metal foil and perform primary drying, followed by drying and heat treatment at a higher temperature.
  • the polyimide resin solution is preferably applied so that the thickness after coating, drying and heat treatment is 5 ⁇ m to 100 ⁇ m, more preferably 10 ⁇ m to 50 ⁇ m.
  • the primary drying conditions are preferably 60 to 150 ° C. and 1 to 10 minutes. Superheated steam may be used during the primary drying.
  • the next heat treatment (secondary heat treatment) is performed.
  • the polyimide resin is a polyimide precursor resin
  • a heat treatment involving an imidization reaction is performed.
  • the polyimide resin is a solvent-soluble polyimide resin or polyamideimide resin
  • the solvent is removed by heating.
  • the secondary heat treatment always includes heat treatment with superheated steam.
  • the treatment with superheated steam may be used in combination with hot air drying or infrared or far infrared drying.
  • the temperature of the superheated steam used is preferably 150 to 400 ° C, more preferably 200 to 350 ° C.
  • the residual solvent concentration in the polyimide resin layer after the secondary heat treatment is preferably 0.7% by weight or less, more preferably 0.5% by weight or less. If it is less than 150 ° C., sufficient effects may not be obtained. If it exceeds 400 ° C., the solvent may suddenly boil and a good laminate may not be obtained, and the resin may be deteriorated. Since the temperature is higher than 150 ° C. during the secondary heat treatment, discoloration of metal foil and changes in physical properties may occur. If necessary, it is necessary to lower the oxygen concentration. When copper foil is used, it is desirable to reduce the oxygen concentration to 5% or less, preferably 0.5% or less.
  • the laminate may be heat-treated or solvent-removed in a roll shape.
  • the heat treatment in the form of a scroll is preferably performed under reduced pressure or in an inert gas.
  • Residual solvent Residue in polyimide resin layer due to weight reduction from 150 ° C to 350 ° C (heating rate 30 ° C / min) using differential thermal and thermogravimetric simultaneous measurement device EXSTAR6000TG / DTA manufactured by Seiko Instruments Inc.
  • the solvent concentration was determined. It is preferably 0.7% by weight or less, particularly preferably 0.5% by weight or less.
  • Solder heat resistance The copper foil of the copper foil laminate was etched by a subtractive method to create a circuit pattern having a width of 1 mm. After humidity conditioning at 40 ° C. and 65% RH for 24 hours and flux cleaning, the sample was immersed in a jet solder bath at 320 ° C. for 20 seconds, and the presence or absence of peeling or swelling was observed with a microscope. The thing in which abnormality was not seen was set as (circle), and the thing in which peeling or swelling was seen was set as x.
  • Adhesive strength The above-mentioned sample having a 1 mm wide circuit pattern was measured at a pulling speed of 50 mm / min, a measurement temperature of 20 ° C., and a peeling angle of 90 degrees.
  • Synthesis example 1 In a reaction vessel, 192 g of trimellitic anhydride, 211 g of 3,3′-dimethyl-4,4′-biphenyl diisocyanate, 35 g of 2,4-tolylene diisocyanate, 0.5 g of sodium methylate and N-methyl-2-pyrrolidone 5 kg was added, and the temperature was raised to 150 ° C. over 1 hour, and further reacted at 150 ° C. for 5 hours.
  • the obtained polyamideimide resin had a logarithmic viscosity of 1.6 dl / g and a glass transition temperature of 320 ° C.
  • Synthesis example 2 850 g of N, N-dimethylacetamide, 47.7 g of 4,4′-diamino-2,2′-dimethylbiphenyl and 20.7 g of 4,4′-bis (3-aminophenoxy) biphenyl are put into a reaction vessel and stirred. And dissolved. Next, 80.4 g of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride was added, and stirring was continued at room temperature for 5 hours to obtain a polyimide precursor.
  • Example 1 Using an applicator, the polyamideimide solution prepared in Synthesis Example 1 is applied by hand to a copper foil (35 ⁇ m electrolytic copper foil manufactured by Mitsui Mining & Mining Co., Ltd.) so that the thickness after drying is 25 ⁇ m. Primary dried. Further, a steam superheater (“DHF Super-Hi 10” manufactured by Daiichi High Frequency Industrial Co., Ltd.) was used as a generator for generating normal pressure superheated steam, and heat treatment was performed with superheated steam. As evaluation of the obtained copper-clad laminate, the amount of residual solvent, solder heat resistance, adhesive strength, and dimensional stability were measured. The results are shown in Table-1.
  • DHF Super-Hi 10 manufactured by Daiichi High Frequency Industrial Co., Ltd.
  • Example 2 Using an applicator, the polyimide precursor solution prepared in Synthesis Example 2 was applied by hand to a copper foil (35 ⁇ m electrolytic copper foil manufactured by Mitsui Mining & Mining Co., Ltd.) so that the thickness after dry ring closure was 25 ⁇ m. Primary drying for 5 minutes. Further, heat treatment was performed for 30 minutes from 100 ° C. to 310 ° C. at a heating rate of 7 ° C./min. Further, a steam superheater (“DHF Super-Hi 10” manufactured by Daiichi High Frequency Industrial Co., Ltd.) was used as a generator for generating normal pressure superheated steam, and heat treatment was performed with superheated steam. As evaluation of the obtained copper-clad laminate, the amount of residual solvent, solder heat resistance, adhesive strength, and dimensional stability were measured. The results are shown in Table-1.
  • the present invention relates to a simple method for producing a metal laminate, and by using this production method, the productivity can be improved, and a metal laminate excellent in heat resistance, durability and dimensional stability is provided. be able to.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne un procédé de fabrication simple pour un corps de métal stratifié. Le procédé permet une production efficace d'un corps stratifié comprenant une feuille de métal et une couche isolante résistante à la chaleur. De plus, pour le corps stratifié obtenu à l'aide de ce procédé, les effets négatifs provoqués par du solvant restant sur la couche isolante résistante à la chaleur, tels qu'une plus faible résistance à la chaleur ou des dimensions moins stables, peuvent être améliorés. En outre, les effets négatifs dus à un chauffage excessif, tels qu'une plus faible résistance au pelage entre le métal et la couche de résine ou de moins bonnes propriétés de résine, peuvent être simultanément améliorés. Ce procédé pour fabriquer un corps stratifié ayant une couche de résine isolante, par enduction d'une feuille de métal avec une solution de résine contenant une résine de polyimide et séchage du produit résultant, est caractérisé en ce qu'il comprend un procédé de traitement thermique utilisant de la vapeur surchauffée.
PCT/JP2009/053254 2008-02-28 2009-02-24 Procédé de fabrication pour un corps stratifié WO2009107599A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010500687A JP5447365B2 (ja) 2008-02-28 2009-02-24 積層体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008047443 2008-02-28
JP2008-047443 2008-02-28

Publications (1)

Publication Number Publication Date
WO2009107599A1 true WO2009107599A1 (fr) 2009-09-03

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ID=41015993

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Application Number Title Priority Date Filing Date
PCT/JP2009/053254 WO2009107599A1 (fr) 2008-02-28 2009-02-24 Procédé de fabrication pour un corps stratifié

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JP (1) JP5447365B2 (fr)
TW (1) TW200945988A (fr)
WO (1) WO2009107599A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011060653A (ja) * 2009-09-11 2011-03-24 Toyobo Co Ltd 金属薄膜製造方法および金属薄膜
JP2011076789A (ja) * 2009-09-29 2011-04-14 Fujifilm Corp 導電膜の製造方法
WO2016006264A1 (fr) * 2014-07-10 2016-01-14 太陽インキ製造株式会社 Procédé de formation de couche isolante en résine, couche isolante en résine et carte de circuit imprimé
WO2019043952A1 (fr) * 2017-09-04 2019-03-07 シライ電子工業株式会社 Procédé de séchage d'encre et dispositif de séchage d'encre
JP2020158743A (ja) * 2019-03-28 2020-10-01 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及び金属張積層板の製造方法

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Publication number Priority date Publication date Assignee Title
JP2003080630A (ja) * 2001-09-11 2003-03-19 Mitsui Chemicals Inc ポリイミド金属箔積層体
JP2004292793A (ja) * 2003-03-13 2004-10-21 Jsr Corp フィルムまたはシートの処理方法
JP2007163639A (ja) * 2005-12-12 2007-06-28 Shin Etsu Polymer Co Ltd 無端ベルトとその製造方法、およびこれを備えた電子写真装置

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JPS56148987A (en) * 1980-04-18 1981-11-18 Modookemechitsukusu Ab Purification of cellulose pulp
JP2006245286A (ja) * 2005-03-03 2006-09-14 Shin Etsu Chem Co Ltd フレキシブルプリント回路基板及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003080630A (ja) * 2001-09-11 2003-03-19 Mitsui Chemicals Inc ポリイミド金属箔積層体
JP2004292793A (ja) * 2003-03-13 2004-10-21 Jsr Corp フィルムまたはシートの処理方法
JP2007163639A (ja) * 2005-12-12 2007-06-28 Shin Etsu Polymer Co Ltd 無端ベルトとその製造方法、およびこれを備えた電子写真装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011060653A (ja) * 2009-09-11 2011-03-24 Toyobo Co Ltd 金属薄膜製造方法および金属薄膜
JP2011076789A (ja) * 2009-09-29 2011-04-14 Fujifilm Corp 導電膜の製造方法
WO2016006264A1 (fr) * 2014-07-10 2016-01-14 太陽インキ製造株式会社 Procédé de formation de couche isolante en résine, couche isolante en résine et carte de circuit imprimé
JPWO2016006264A1 (ja) * 2014-07-10 2017-04-27 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板
WO2019043952A1 (fr) * 2017-09-04 2019-03-07 シライ電子工業株式会社 Procédé de séchage d'encre et dispositif de séchage d'encre
JP2020158743A (ja) * 2019-03-28 2020-10-01 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及び金属張積層板の製造方法
JP7277208B2 (ja) 2019-03-28 2023-05-18 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及び金属張積層板の製造方法

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JP5447365B2 (ja) 2014-03-19
JPWO2009107599A1 (ja) 2011-06-30

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