WO2009090776A1 - Dispositif à semi-conducteur et son procédé de production - Google Patents

Dispositif à semi-conducteur et son procédé de production Download PDF

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Publication number
WO2009090776A1
WO2009090776A1 PCT/JP2008/066928 JP2008066928W WO2009090776A1 WO 2009090776 A1 WO2009090776 A1 WO 2009090776A1 JP 2008066928 W JP2008066928 W JP 2008066928W WO 2009090776 A1 WO2009090776 A1 WO 2009090776A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
nickel
semiconductor device
lead
cobalt
Prior art date
Application number
PCT/JP2008/066928
Other languages
English (en)
Japanese (ja)
Inventor
Hisao Ishikawa
Masanori Yokoyama
Masao Kojima
Original Assignee
Horizon Technology Laboratory Co., Ltd.
Oosaki Seikou Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horizon Technology Laboratory Co., Ltd., Oosaki Seikou Ltd. filed Critical Horizon Technology Laboratory Co., Ltd.
Priority to JP2008558575A priority Critical patent/JP4389112B2/ja
Publication of WO2009090776A1 publication Critical patent/WO2009090776A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Definitions

  • Patent Document 6 JP-A-2005-169495
  • Comparative Example 2 the same solder flux as in Comparative Example 1 above was used, with sharp free solder consisting of 0.05% by weight of nickel, 3% by weight of silver, 0.5% by weight of copper, and the balance being tin. Then, soldering was performed under the conditions described below.
  • FIG. 6 A cross-sectional photograph of a junction after high temperature aging in Comparative Example 3 in a semiconductor device, (a) is an SEM photograph, and (b) to (e) are EPMA mapping photographs of elements contained in that part. (B) Sn, (c) Cu, (d) Ag, (e) Ni Ni EPMA mapping photo. In addition, (f) is a cross-sectional SEM photograph of another part of Comparative Example 3 where the microvoids are scattered.
  • Copper-tin-nickel alloy layer (Cu-Sn-Ni intermetallic compound layer) • 1 8 Copper-tin-nickel-cobalt alloy layer (Cu-Sn-Ni-Co intermetallic compound layer)

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

Dispositif à semi-conducteur comprenant un tableau de connexion imprimé et un élément, par exemple, un ensemble à semi-conducteur ou élément électronique, monté sur le tableau de connexion par brasage avec une brasure sans plomb. La partie de brasage ne peut pas développer de microvides lorsque le dispositif à semi-conducteur est exposé à une température élevée pendant une longue durée (vieillissement à température élevée). La partie de brasage a de ce fait une meilleure résistance à une fracture due à un impact. Il est également décrit un procédé de production du dispositif. Dans l'étape d'assemblage d'une partie électronique, par exemple, un dispositif à semi-conducteur, une brasure sans plomb est utilisée pour lier un élément à monter, par exemple, un ensemble à semi-conducteur ou élément électronique, à un tableau de connexion imprimé de la manière suivante. Une brasure sans plomb contenant au moins 0,01 à 0,2 % en poids de nickel ou la brasure sans plomb contenant en outre 0,001 à 0,01 % en poids de germanium est utilisée en combinaison à un flux de brasure comprenant un ou plusieurs éléments choisis parmi les sels de nickel d'acides gras organiques, et les sels de cobalt organiques pour souder un ensemble à semi-conducteur, un élément électronique, etc. sur une terre de cuivre d'une carte de circuit imprimé pour amener une couche d'alliage contenant du nickel et/ou du cobalt à être régulièrement interposée à une épaisseur donnée au niveau de la surface de brasage. Ainsi, la partie de brasage ne peut pas développer de microvides lorsque le dispositif à semi-conducteur est vieilli à une température élevée. La partie de brasage dans le dispositif à semi-conducteur a de ce fait une meilleure résistance à une fracture due à un impact.
PCT/JP2008/066928 2008-01-17 2008-09-12 Dispositif à semi-conducteur et son procédé de production WO2009090776A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008558575A JP4389112B2 (ja) 2008-01-17 2008-09-12 半導体装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008032385 2008-01-17
JP2008-32385 2008-01-17

Publications (1)

Publication Number Publication Date
WO2009090776A1 true WO2009090776A1 (fr) 2009-07-23

Family

ID=40885182

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066928 WO2009090776A1 (fr) 2008-01-17 2008-09-12 Dispositif à semi-conducteur et son procédé de production

Country Status (2)

Country Link
JP (1) JP4389112B2 (fr)
WO (1) WO2009090776A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009110458A1 (ja) * 2008-03-05 2011-07-14 千住金属工業株式会社 鉛フリーはんだ接続構造体およびはんだボール
JP2013065728A (ja) * 2011-09-17 2013-04-11 Nippon Joint Kk セラミック電子部品及びその製造方法
US20140212678A1 (en) * 2012-04-16 2014-07-31 Tanigurogumi Corporation Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
JP5846341B1 (ja) * 2014-11-05 2016-01-20 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ、はんだ継手、およびはんだ材料の管理方法
JP5850199B1 (ja) * 2015-06-29 2016-02-03 千住金属工業株式会社 はんだ材料、はんだ継手およびはんだ材料の検査方法
JP2017136629A (ja) * 2016-02-05 2017-08-10 株式会社リソー技研 無鉛はんだ
US10780530B2 (en) 2018-05-25 2020-09-22 Senju Metal Industry Co., Ltd. Solder ball, solder joint, and joining method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012060022A1 (ja) * 2010-11-05 2014-05-12 ホライゾン技術研究所株式会社 錫またははんだ皮膜の形成方法及びその装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306092A (ja) * 2003-04-08 2004-11-04 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及びソルダーペースト
JP2005026579A (ja) * 2003-07-04 2005-01-27 Fujitsu Ltd ハンダバンプ付き電子部品の実装方法およびこれに用いるフラックスフィル
JP2005169495A (ja) * 2003-11-18 2005-06-30 Yoshihiro Miyano プリフラックス、フラックス、ソルダーペースト及び鉛フリーはんだ付け体の製造方法
JP2005288490A (ja) * 2004-03-31 2005-10-20 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2007209999A (ja) * 2006-02-08 2007-08-23 Fujitsu Ltd 半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306092A (ja) * 2003-04-08 2004-11-04 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及びソルダーペースト
JP2005026579A (ja) * 2003-07-04 2005-01-27 Fujitsu Ltd ハンダバンプ付き電子部品の実装方法およびこれに用いるフラックスフィル
JP2005169495A (ja) * 2003-11-18 2005-06-30 Yoshihiro Miyano プリフラックス、フラックス、ソルダーペースト及び鉛フリーはんだ付け体の製造方法
JP2005288490A (ja) * 2004-03-31 2005-10-20 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2007209999A (ja) * 2006-02-08 2007-08-23 Fujitsu Ltd 半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009110458A1 (ja) * 2008-03-05 2011-07-14 千住金属工業株式会社 鉛フリーはんだ接続構造体およびはんだボール
JP2013065728A (ja) * 2011-09-17 2013-04-11 Nippon Joint Kk セラミック電子部品及びその製造方法
US9289841B2 (en) * 2012-04-16 2016-03-22 Tanigurogumi Corporation Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
US20140212678A1 (en) * 2012-04-16 2014-07-31 Tanigurogumi Corporation Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
WO2016071971A1 (fr) * 2014-11-05 2016-05-12 千住金属工業株式会社 Matériau de soudure, pâte de soudure, soudure en mousse, joint de soudure, et procédé pour contrôler un matériau de soudure
JP5846341B1 (ja) * 2014-11-05 2016-01-20 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ、はんだ継手、およびはんだ材料の管理方法
TWI616265B (zh) * 2014-11-05 2018-03-01 千住金屬工業股份有限公司 焊接材料、焊膏、泡沫焊料、焊料接頭及焊接材料的管理方法
US10717157B2 (en) 2014-11-05 2020-07-21 Senju Metal Industry Co., Ltd. Solder material, solder paste, solder preform, solder joint and method of managing the solder material
JP5850199B1 (ja) * 2015-06-29 2016-02-03 千住金属工業株式会社 はんだ材料、はんだ継手およびはんだ材料の検査方法
WO2017002704A1 (fr) * 2015-06-29 2017-01-05 千住金属工業株式会社 Matériau de soudage, raccord soudé, et procédé pour inspecter un matériau de soudage
CN107735212A (zh) * 2015-06-29 2018-02-23 千住金属工业株式会社 软钎料材料、焊接接头和软钎料材料的检查方法
CN107735212B (zh) * 2015-06-29 2019-03-08 千住金属工业株式会社 软钎料材料、焊接接头和软钎料材料的检查方法
US10888957B2 (en) 2015-06-29 2021-01-12 Senju Metal Industry Co., Ltd. Soldering material
JP2017136629A (ja) * 2016-02-05 2017-08-10 株式会社リソー技研 無鉛はんだ
US10780530B2 (en) 2018-05-25 2020-09-22 Senju Metal Industry Co., Ltd. Solder ball, solder joint, and joining method

Also Published As

Publication number Publication date
JP4389112B2 (ja) 2009-12-24
JPWO2009090776A1 (ja) 2011-05-26

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