WO2009078503A1 - Auto plasma continuous treatment apparatus of pcb - Google Patents

Auto plasma continuous treatment apparatus of pcb Download PDF

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Publication number
WO2009078503A1
WO2009078503A1 PCT/KR2008/001060 KR2008001060W WO2009078503A1 WO 2009078503 A1 WO2009078503 A1 WO 2009078503A1 KR 2008001060 W KR2008001060 W KR 2008001060W WO 2009078503 A1 WO2009078503 A1 WO 2009078503A1
Authority
WO
WIPO (PCT)
Prior art keywords
guide
magazine
treatment apparatus
plasma treatment
guide table
Prior art date
Application number
PCT/KR2008/001060
Other languages
English (en)
French (fr)
Inventor
Tae-Il Baek
Jin-Myoung No
Bae-Jin Lee
Yun-Cheol Park
Nam-Son Park
Ki-Suk Kwon
Original Assignee
Jesagi Hankook Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jesagi Hankook Ltd. filed Critical Jesagi Hankook Ltd.
Publication of WO2009078503A1 publication Critical patent/WO2009078503A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Definitions

  • the present invention relates, in general, to an automatic continuous plasma treatment apparatus for a substrate such as PCB, packaging substrate, or ball grid array (BGA) substrate, etc. and, more particularly, to an automatic continuous plasma treatment apparatus for a substrate, which is improved to permit the easy separation from and combination with a window frame during the plasma treatment of the substrate and to have an automatic loading or unloading function, thus preventing a substrate from being wrinkled during the treatment of the thin substrate or burnt due to contact with an electrode, therefore lowering a defective ratio.
  • a substrate such as PCB, packaging substrate, or ball grid array (BGA) substrate, etc.
  • BGA ball grid array
  • the plasma chamber 100 has receiving slots 110 which are formed in multiple stages in a vertical direction, so that objects to be treated, for example, a plurality of substrates are received in the receiving slots in multiple stages.
  • a width varying cylinder 128 coupled to the stopper 125 is secured to the moving plate 122.
  • a plurality of loading bars 130 which are arranged to be spaced apart from each other in a vertical direction and simultaneously treat 15 to 20 substrates at one time, are installed to the loading-bar support plate 124 in such a way as to face the plasma chamber 100.
  • a catching groove 214 is formed in the front of each window frame 210, that is, the center on a side which is located in the opening of the 'U' -shaped magazine 200.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/KR2008/001060 2007-12-18 2008-02-22 Auto plasma continuous treatment apparatus of pcb WO2009078503A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0133325 2007-12-18
KR1020070133325A KR100941447B1 (ko) 2007-12-18 2007-12-18 Ｐｃｂ의 플라즈마 연속 자동 처리장치

Publications (1)

Publication Number Publication Date
WO2009078503A1 true WO2009078503A1 (en) 2009-06-25

Family

ID=40795612

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/001060 WO2009078503A1 (en) 2007-12-18 2008-02-22 Auto plasma continuous treatment apparatus of pcb

Country Status (2)

Country Link
KR (1) KR100941447B1 (ko)
WO (1) WO2009078503A1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104619159A (zh) * 2015-02-03 2015-05-13 苏州博众精工科技有限公司 一种拨排线机构
CN106024686A (zh) * 2014-10-17 2016-10-12 华开朗 一种晶片盘推送装置
CN113753495A (zh) * 2021-09-28 2021-12-07 昆山振顺电子科技有限公司 一种载板缓存全自动智能输送机及输送方法
WO2022165615A1 (zh) * 2021-02-08 2022-08-11 柏承科技股份有限公司 具有连续制程的舱体系统
US11955359B2 (en) 2020-06-10 2024-04-09 Samsung Electronics Co., Ltd. Magazine supporting equipment and semiconductor manufacturing apparatus including the same

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102699749B (zh) * 2012-06-19 2014-03-19 河北工业大学 一种自动上下料装置
KR101354062B1 (ko) * 2012-07-20 2014-01-24 주식회사제4기한국 인쇄회로기판용 플라즈마 처리장치의 윈도우프레임 공급장치
KR101380865B1 (ko) * 2012-09-13 2014-04-02 주식회사 테크아이 비젼프레스의 클램프 이동구조
KR101479766B1 (ko) * 2013-08-23 2015-01-07 비전세미콘 주식회사 반도체 패키지 제조용 플라즈마 세정장치
CN105129354B (zh) * 2015-09-16 2017-08-04 苏州听毅华自动化设备有限公司 一种左右移载机构
KR102446066B1 (ko) * 2021-04-22 2022-09-23 주식회사 삼에스코리아 패널 수납용기에 설치되는 트레이
CN113492425B (zh) * 2021-07-15 2022-09-20 深圳信测标准技术服务有限公司 一种食品检测用可定型交替式辅助切割装置
CN114430621B (zh) * 2021-12-01 2023-06-27 珠海安普特科技有限公司 Pcb等离子体处理设备及其控制方法
CN114056945B (zh) * 2021-12-10 2024-05-28 苏州策林智能科技有限公司 一种物料盘堆码设备
CN116072576B (zh) * 2023-03-24 2023-08-08 广州雅量商业智能技术有限公司 一种集成电路板封装装置及其封装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010109401A (ko) * 2000-05-31 2001-12-10 백태일 연속식 플라즈마 세정방법
KR20030039400A (ko) * 2001-11-13 2003-05-22 주식회사 선비테크 피씨비 기판의 공급, 반출 및 검사장치
KR20060125301A (ko) * 2005-06-02 2006-12-06 비전세미콘 주식회사 반도체용 플라즈마 세정장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318518A (ja) 2002-04-26 2003-11-07 Hitachi High-Tech Instruments Co Ltd フィルム基板の移載機構、及びこれを備えたプラズマ洗浄装置
KR100688948B1 (ko) * 2005-07-27 2007-03-02 주식회사 아이피에스 클러스터 타입의 플라즈마 처리 시스템 및 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010109401A (ko) * 2000-05-31 2001-12-10 백태일 연속식 플라즈마 세정방법
KR20030039400A (ko) * 2001-11-13 2003-05-22 주식회사 선비테크 피씨비 기판의 공급, 반출 및 검사장치
KR20060125301A (ko) * 2005-06-02 2006-12-06 비전세미콘 주식회사 반도체용 플라즈마 세정장치

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106024686A (zh) * 2014-10-17 2016-10-12 华开朗 一种晶片盘推送装置
CN104619159A (zh) * 2015-02-03 2015-05-13 苏州博众精工科技有限公司 一种拨排线机构
US11955359B2 (en) 2020-06-10 2024-04-09 Samsung Electronics Co., Ltd. Magazine supporting equipment and semiconductor manufacturing apparatus including the same
WO2022165615A1 (zh) * 2021-02-08 2022-08-11 柏承科技股份有限公司 具有连续制程的舱体系统
CN113753495A (zh) * 2021-09-28 2021-12-07 昆山振顺电子科技有限公司 一种载板缓存全自动智能输送机及输送方法

Also Published As

Publication number Publication date
KR20090065819A (ko) 2009-06-23
KR100941447B1 (ko) 2010-02-11

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