WO2009078336A1 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
WO2009078336A1
WO2009078336A1 PCT/JP2008/072537 JP2008072537W WO2009078336A1 WO 2009078336 A1 WO2009078336 A1 WO 2009078336A1 JP 2008072537 W JP2008072537 W JP 2008072537W WO 2009078336 A1 WO2009078336 A1 WO 2009078336A1
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mass
parts
groups
formula
resin composition
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PCT/JP2008/072537
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English (en)
French (fr)
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Natsumi Aoai
Takaaki Kobayashi
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Asahi Kasei E-Materials Corporation
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Priority to EP08862231A priority Critical patent/EP2221326A4/en
Priority to CN2008801070555A priority patent/CN101802033B/zh
Priority to KR1020107005445A priority patent/KR101408573B1/ko
Priority to JP2009546235A priority patent/JP5525821B2/ja
Priority to US12/678,974 priority patent/US8475996B2/en
Publication of WO2009078336A1 publication Critical patent/WO2009078336A1/ja

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14Polymers provided for in subclass C08G
    • C08F290/148Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C08F283/122Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes on to saturated polysiloxanes containing hydrolysable groups, e.g. alkoxy-, thio-, hydroxy-
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041Lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)

Abstract

 下記(a)下記一般式(1): R12Si(OH)2 (1)  {式中の基は特許請求の範囲に定義する}で表される少なくとも1種のシラノール化合物、下記一般式(2): R2aR3bSi(OR4)4-a-b (2)  {式中の基は特許請求の範囲に定義する}で表される少なくとも1種のアルコキシシラン化合物、及び触媒を混合し、積極的に水を添加することなく重合させる方法で得られるポリオルガノシロキサン100質量部;(b)光重合開始剤1~50質量部;(c)下記一般式(3): {式中の基は特許請求の範囲に定義する}で表されるフルオレン化合物40~600質量部;及び(d)1分子内に1つ又は2つの(メタ)アクリロイル基を有する(c)成分以外の化合物20~300質量部;を含む感光性樹脂組成物が提供される。
PCT/JP2008/072537 2007-12-14 2008-12-11 感光性樹脂組成物 WO2009078336A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP08862231A EP2221326A4 (en) 2007-12-14 2008-12-11 PHOTOSENSITIVE RESIN COMPOSITION
CN2008801070555A CN101802033B (zh) 2007-12-14 2008-12-11 感光性树脂组合物
KR1020107005445A KR101408573B1 (ko) 2007-12-14 2008-12-11 감광성 수지 조성물
JP2009546235A JP5525821B2 (ja) 2007-12-14 2008-12-11 感光性樹脂組成物
US12/678,974 US8475996B2 (en) 2007-12-14 2008-12-11 Photosensitive resin composition

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-323311 2007-12-14
JP2007323311 2007-12-14
JP2008172463 2008-07-01
JP2008172451 2008-07-01
JP2008-172451 2008-07-01
JP2008-172463 2008-07-01

Publications (1)

Publication Number Publication Date
WO2009078336A1 true WO2009078336A1 (ja) 2009-06-25

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US (1) US8475996B2 (ja)
EP (1) EP2221326A4 (ja)
JP (1) JP5525821B2 (ja)
KR (1) KR101408573B1 (ja)
CN (2) CN102902162A (ja)
TW (1) TWI390354B (ja)
WO (1) WO2009078336A1 (ja)

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JP2011006564A (ja) * 2009-06-25 2011-01-13 Nippon Steel Chem Co Ltd 耐熱性樹脂及びこれを含んだ樹脂組成物
JP2011202127A (ja) * 2010-03-26 2011-10-13 Asahi Kasei E-Materials Corp 感光性樹脂組成物及び硬化物
JP2011253035A (ja) * 2010-06-02 2011-12-15 Toray Ind Inc 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
WO2015152154A1 (ja) * 2014-03-31 2015-10-08 日産化学工業株式会社 反応性含フッ素シリコーン化合物を含む重合性組成物
WO2015159972A1 (ja) * 2014-04-18 2015-10-22 日産化学工業株式会社 反応性シリコーン化合物を含む重合性樹脂組成物
WO2017030090A1 (ja) * 2015-08-18 2017-02-23 日産化学工業株式会社 反応性シルセスキオキサン化合物及び芳香族ビニル化合物を含む重合性組成物

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CN102902162A (zh) * 2007-12-14 2013-01-30 旭化成电子材料株式会社 感光性树脂组合物
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WO2017188047A1 (ja) * 2016-04-25 2017-11-02 東レ株式会社 樹脂組成物、その硬化膜およびその製造方法ならびに固体撮像素子
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KR101922300B1 (ko) * 2016-08-09 2018-11-26 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물, 이로부터 형성된 유기발광소자 봉지층 및 이를 포함하는 유기발광소자 표시장치
JP2018080309A (ja) * 2016-11-18 2018-05-24 株式会社ダイセル レプリカモールド形成用樹脂組成物、レプリカモールド、及び前記レプリカモールドを用いたパターン形成方法
KR102071112B1 (ko) * 2017-10-11 2020-01-29 타코마테크놀러지 주식회사 바인더 수지 및 이를 포함하는 감광성 수지 조성물 또는 코팅 용액
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JP5525821B2 (ja) 2014-06-18
EP2221326A1 (en) 2010-08-25
CN102902162A (zh) 2013-01-30
EP2221326A4 (en) 2011-04-13
KR101408573B1 (ko) 2014-06-17
CN101802033A (zh) 2010-08-11
KR20100039454A (ko) 2010-04-15
CN101802033B (zh) 2013-03-13
US20100209669A1 (en) 2010-08-19
JPWO2009078336A1 (ja) 2011-04-28
US8475996B2 (en) 2013-07-02
TW200947131A (en) 2009-11-16

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