WO2009069783A1 - 回路部材接続用接着剤及び半導体装置 - Google Patents

回路部材接続用接着剤及び半導体装置 Download PDF

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Publication number
WO2009069783A1
WO2009069783A1 PCT/JP2008/071727 JP2008071727W WO2009069783A1 WO 2009069783 A1 WO2009069783 A1 WO 2009069783A1 JP 2008071727 W JP2008071727 W JP 2008071727W WO 2009069783 A1 WO2009069783 A1 WO 2009069783A1
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WO
WIPO (PCT)
Prior art keywords
circuit member
member connecting
connecting adhesive
semiconductor device
substrate
Prior art date
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Ceased
Application number
PCT/JP2008/071727
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English (en)
French (fr)
Inventor
Akira Nagai
Yasunori Kawabata
Shigeki Katogi
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN2008801131597A priority Critical patent/CN101835866B/zh
Priority to JP2009543887A priority patent/JP5088376B2/ja
Priority to KR1020107011780A priority patent/KR101302933B1/ko
Publication of WO2009069783A1 publication Critical patent/WO2009069783A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　本発明は、相対向する回路基板を接続するための回路部材接続用接着剤であって、熱可塑性樹脂、熱硬化性樹脂及び硬化剤を含む樹脂組成物と、該組成物中に分散された金属水酸化物粒子とからなる、回路部材接続用接着剤を提供する。本発明の回路部材接続用接着剤は、半導体チップと基板との接続信頼性に優れると共に、半導体チップと基板の位置合わせに用いられるアライメントマークの認識性を実用上十分なレベルまで向上させることを可能とするものである。
PCT/JP2008/071727 2007-11-29 2008-11-28 回路部材接続用接着剤及び半導体装置 Ceased WO2009069783A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801131597A CN101835866B (zh) 2007-11-29 2008-11-28 电路部件连接用粘接剂以及半导体装置
JP2009543887A JP5088376B2 (ja) 2007-11-29 2008-11-28 回路部材接続用接着剤及び半導体装置
KR1020107011780A KR101302933B1 (ko) 2007-11-29 2008-11-28 회로 부재 접속용 접착제 및 반도체 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007308668 2007-11-29
JP2007-308668 2007-11-29

Publications (1)

Publication Number Publication Date
WO2009069783A1 true WO2009069783A1 (ja) 2009-06-04

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PCT/JP2008/071727 Ceased WO2009069783A1 (ja) 2007-11-29 2008-11-28 回路部材接続用接着剤及び半導体装置

Country Status (5)

Country Link
JP (1) JP5088376B2 (ja)
KR (1) KR101302933B1 (ja)
CN (2) CN101835866B (ja)
TW (1) TWI419954B (ja)
WO (1) WO2009069783A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052033A (ja) * 2009-08-31 2011-03-17 Hitachi Media Electoronics Co Ltd 光硬化型接着剤、光ピックアップ装置及びその製造方法
JP2011165758A (ja) * 2010-02-05 2011-08-25 Hitachi Chem Co Ltd 回路部材接続用接着剤及びこれを用いた半導体装置
JP2011202073A (ja) * 2010-03-26 2011-10-13 Namics Corp 先供給型液状半導体封止樹脂組成物
JP2014045013A (ja) * 2012-08-24 2014-03-13 Bondtech Inc 基板上への対象物の位置決め方法及び装置
JP2014074181A (ja) * 2013-12-25 2014-04-24 Hitachi Chemical Co Ltd 半導体装置の製造方法及びこれを用いて製造されてなる半導体装置
WO2014156882A1 (ja) * 2013-03-26 2014-10-02 日東電工株式会社 アンダーフィル材、封止シート及び半導体装置の製造方法
WO2014162973A1 (ja) * 2013-04-04 2014-10-09 日東電工株式会社 アンダーフィルフィルム、封止シート、半導体装置の製造方法及び半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104312471A (zh) * 2014-11-10 2015-01-28 深圳市飞世尔实业有限公司 一种含苯并恶嗪的异方性导电膜及其制备方法
TWI756311B (zh) * 2016-11-29 2022-03-01 新加坡商Ｐｅｐ創新私人有限公司 晶片封裝方法及封裝結構
US12506055B2 (en) 2017-11-29 2025-12-23 Pep Innovation Pte. Ltd. Chip packaging method and chip structure
KR102869788B1 (ko) * 2025-03-14 2025-10-14 주식회사 우진이디엠 다축가공을 이용하여 금형결합에 사용되는 슬라이드 코어를 가공하는 방법

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JP2002371263A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp 多層フレキシブルプリント回路板用接着剤組成物およびそれを用いた多層フレキシブルプリント回路板
JP2003073641A (ja) * 2001-08-31 2003-03-12 Hitachi Chem Co Ltd 難燃性接着フィルム、半導体搭載用配線基板、半導体装置及び半導体装置の製造方法
JP2003206452A (ja) * 2002-01-10 2003-07-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP2007016088A (ja) * 2005-07-06 2007-01-25 Asahi Kasei Electronics Co Ltd 異方導電性接着シート及び微細接続構造体

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JPS60117572A (ja) * 1983-11-28 1985-06-25 日立化成工業株式会社 回路の接続方法
JP2698528B2 (ja) * 1993-03-26 1998-01-19 日本碍子株式会社 ノンセラミック碍子のハウジングに用いられる電気絶縁物
KR20030001231A (ko) * 2001-06-25 2003-01-06 텔레포스 주식회사 증가된 점성을 가지는 이방성 전도성 접착제, 이를 이용한본딩 방법 및 집적 회로 패키지
JP4240460B2 (ja) * 2003-03-06 2009-03-18 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤、接着剤の製造方法及び電気装置
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CN102051141B (zh) * 2007-01-10 2014-12-17 日立化成株式会社 电路部件连接用粘接剂及使用该粘接剂的半导体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997029490A1 (fr) * 1996-02-08 1997-08-14 Asahi Kasei Kogyo Kabushiki Kaisha Composition anisotrope conductrice
JP2002371263A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp 多層フレキシブルプリント回路板用接着剤組成物およびそれを用いた多層フレキシブルプリント回路板
JP2003073641A (ja) * 2001-08-31 2003-03-12 Hitachi Chem Co Ltd 難燃性接着フィルム、半導体搭載用配線基板、半導体装置及び半導体装置の製造方法
JP2003206452A (ja) * 2002-01-10 2003-07-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP2007016088A (ja) * 2005-07-06 2007-01-25 Asahi Kasei Electronics Co Ltd 異方導電性接着シート及び微細接続構造体

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052033A (ja) * 2009-08-31 2011-03-17 Hitachi Media Electoronics Co Ltd 光硬化型接着剤、光ピックアップ装置及びその製造方法
JP2011165758A (ja) * 2010-02-05 2011-08-25 Hitachi Chem Co Ltd 回路部材接続用接着剤及びこれを用いた半導体装置
JP2011202073A (ja) * 2010-03-26 2011-10-13 Namics Corp 先供給型液状半導体封止樹脂組成物
JP2014045013A (ja) * 2012-08-24 2014-03-13 Bondtech Inc 基板上への対象物の位置決め方法及び装置
WO2014156882A1 (ja) * 2013-03-26 2014-10-02 日東電工株式会社 アンダーフィル材、封止シート及び半導体装置の製造方法
JP2014192238A (ja) * 2013-03-26 2014-10-06 Nitto Denko Corp アンダーフィル材、封止シート及び半導体装置の製造方法
WO2014162973A1 (ja) * 2013-04-04 2014-10-09 日東電工株式会社 アンダーフィルフィルム、封止シート、半導体装置の製造方法及び半導体装置
JP2014203971A (ja) * 2013-04-04 2014-10-27 日東電工株式会社 アンダーフィルフィルム、封止シート、半導体装置の製造方法及び半導体装置
JP2014074181A (ja) * 2013-12-25 2014-04-24 Hitachi Chemical Co Ltd 半導体装置の製造方法及びこれを用いて製造されてなる半導体装置

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KR101302933B1 (ko) 2013-09-06
CN102977809A (zh) 2013-03-20
TW200934851A (en) 2009-08-16
JP5088376B2 (ja) 2012-12-05
TWI419954B (zh) 2013-12-21
KR20100074312A (ko) 2010-07-01
CN101835866B (zh) 2013-01-02
JPWO2009069783A1 (ja) 2011-04-21
CN101835866A (zh) 2010-09-15

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