WO2009057612A1 - 回路接続材料及び回路部材の接続構造 - Google Patents

回路接続材料及び回路部材の接続構造 Download PDF

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Publication number
WO2009057612A1
WO2009057612A1 PCT/JP2008/069591 JP2008069591W WO2009057612A1 WO 2009057612 A1 WO2009057612 A1 WO 2009057612A1 JP 2008069591 W JP2008069591 W JP 2008069591W WO 2009057612 A1 WO2009057612 A1 WO 2009057612A1
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WIPO (PCT)
Prior art keywords
circuit
metal layer
nucleus
electroconductive particle
connecting material
Prior art date
Application number
PCT/JP2008/069591
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020097025895A priority Critical patent/KR101180571B1/ko
Priority to CN200880020091A priority patent/CN101682988A/zh
Priority to JP2009510627A priority patent/JP5051221B2/ja
Publication of WO2009057612A1 publication Critical patent/WO2009057612A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K9/02—Ingredients treated with inorganic substances
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
PCT/JP2008/069591 2007-10-31 2008-10-29 回路接続材料及び回路部材の接続構造 WO2009057612A1 (ja)

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CN200880020091A CN101682988A (zh) 2007-10-31 2008-10-29 电路连接材料及电路部件的连接结构
JP2009510627A JP5051221B2 (ja) 2007-10-31 2008-10-29 回路部材の接続構造及び回路部材の接続方法

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JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
WO2011059084A1 (ja) * 2009-11-16 2011-05-19 日立化成工業株式会社 回路接続材料及びそれを用いた回路部材の接続構造
WO2011083824A1 (ja) * 2010-01-08 2011-07-14 日立化成工業株式会社 回路接続用接着フィルム及び回路接続構造体
JP2012003917A (ja) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2012004034A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
WO2012157375A1 (ja) * 2011-05-18 2012-11-22 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
JP2016201364A (ja) * 2016-06-09 2016-12-01 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
JP2021036522A (ja) * 2020-10-07 2021-03-04 デクセリアルズ株式会社 接続材料

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CN102623197B (zh) * 2012-03-30 2015-04-01 南通万德科技有限公司 软态金属面与高分子材料复合导电粒
JP5636118B2 (ja) * 2012-10-02 2014-12-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JPWO2018230470A1 (ja) * 2017-06-12 2020-03-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
CN110783727A (zh) 2018-11-09 2020-02-11 广州方邦电子股份有限公司 一种连接器及制作方法
CN110783728A (zh) * 2018-11-09 2020-02-11 广州方邦电子股份有限公司 一种柔性连接器及制作方法
US11217557B2 (en) * 2019-05-14 2022-01-04 Innolux Corporation Electronic device having conductive particle between pads

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JP2007242307A (ja) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

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JP2005166438A (ja) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd 回路接続材料、及びこれを用いた回路部材の接続構造
JP2007242307A (ja) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Cited By (19)

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Publication number Priority date Publication date Assignee Title
JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
CN102598419A (zh) * 2009-11-16 2012-07-18 日立化成工业株式会社 电路连接材料以及使用其的电路构件的连接结构
WO2011059084A1 (ja) * 2009-11-16 2011-05-19 日立化成工業株式会社 回路接続材料及びそれを用いた回路部材の接続構造
JP5518747B2 (ja) * 2009-11-16 2014-06-11 日立化成株式会社 回路接続材料及びそれを用いた回路部材の接続構造
KR101342255B1 (ko) * 2009-11-16 2013-12-16 히타치가세이가부시끼가이샤 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조
JP2013138013A (ja) * 2009-11-16 2013-07-11 Hitachi Chemical Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
KR101223350B1 (ko) 2010-01-08 2013-01-16 히다치 가세고교 가부시끼가이샤 회로 접속용 접착 필름 및 회로 접속 구조체
JP4752986B1 (ja) * 2010-01-08 2011-08-17 日立化成工業株式会社 回路接続用接着フィルム及び回路接続構造体
WO2011083824A1 (ja) * 2010-01-08 2011-07-14 日立化成工業株式会社 回路接続用接着フィルム及び回路接続構造体
JP2012003917A (ja) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2012004034A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
WO2012157375A1 (ja) * 2011-05-18 2012-11-22 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
KR20140019380A (ko) * 2011-05-18 2014-02-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
JPWO2012157375A1 (ja) * 2011-05-18 2014-07-31 日立化成株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
CN107254264A (zh) * 2011-05-18 2017-10-17 日立化成株式会社 电路连接材料、电路部件的连接结构及其制造方法
KR101899185B1 (ko) 2011-05-18 2018-09-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
JP2016201364A (ja) * 2016-06-09 2016-12-01 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
JP2021036522A (ja) * 2020-10-07 2021-03-04 デクセリアルズ株式会社 接続材料
JP7193512B2 (ja) 2020-10-07 2022-12-20 デクセリアルズ株式会社 接続材料

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KR101180571B1 (ko) 2012-09-06
JP5051221B2 (ja) 2012-10-17
TW201334327A (zh) 2013-08-16
TWI456852B (zh) 2014-10-11
JPWO2009057612A1 (ja) 2011-03-10
TW200939583A (en) 2009-09-16
KR20100008372A (ko) 2010-01-25
CN101682988A (zh) 2010-03-24
CN105778815A (zh) 2016-07-20

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