WO2009041526A1 - 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール - Google Patents

導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール Download PDF

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Publication number
WO2009041526A1
WO2009041526A1 PCT/JP2008/067333 JP2008067333W WO2009041526A1 WO 2009041526 A1 WO2009041526 A1 WO 2009041526A1 JP 2008067333 W JP2008067333 W JP 2008067333W WO 2009041526 A1 WO2009041526 A1 WO 2009041526A1
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WO
WIPO (PCT)
Prior art keywords
conductor
connecting member
producing
solar cell
same
Prior art date
Application number
PCT/JP2008/067333
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English (en)
French (fr)
Inventor
Naoki Fukushima
Isao Tsukagoshi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020097014261A priority Critical patent/KR101108862B1/ko
Priority to EP08833301A priority patent/EP2200046A1/en
Priority to JP2009534376A priority patent/JP5029695B2/ja
Priority to CN2008800256330A priority patent/CN101779255B/zh
Priority to US12/680,263 priority patent/US20100288328A1/en
Publication of WO2009041526A1 publication Critical patent/WO2009041526A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022433—Particular geometry of the grid contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/16—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by bending
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/206—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer comprising non-adhesive protrusions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina

Abstract

本発明の導電体接続用部材は、金属箔１の少なくとも一方の面上に接着剤層３が形成されてなる導電体接続用部材であって、金属箔１は、接着剤層３が形成されている面に、金属箔１と一体化された実質的に高さの等しい複数の突起２を有し、接着剤層３は、突起２を埋め、金属箔１と反対側の表面が実質的に平滑に形成されている。
PCT/JP2008/067333 2007-09-26 2008-09-25 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール WO2009041526A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020097014261A KR101108862B1 (ko) 2007-09-26 2008-09-25 도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈
EP08833301A EP2200046A1 (en) 2007-09-26 2008-09-25 Conductor-connecting member, method for producing the same, connection structure, and solar cell module
JP2009534376A JP5029695B2 (ja) 2007-09-26 2008-09-25 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
CN2008800256330A CN101779255B (zh) 2007-09-26 2008-09-25 导电体连接用部件及其制造方法、连接结构和太阳能电池模块
US12/680,263 US20100288328A1 (en) 2007-09-26 2008-09-25 Conductor-connecting member, method for producing the same, connection structure, and solar cell module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007249064 2007-09-26
JP2007-249064 2007-09-26

Publications (1)

Publication Number Publication Date
WO2009041526A1 true WO2009041526A1 (ja) 2009-04-02

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PCT/JP2008/067333 WO2009041526A1 (ja) 2007-09-26 2008-09-25 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール

Country Status (7)

Country Link
US (1) US20100288328A1 (ja)
EP (1) EP2200046A1 (ja)
JP (2) JP5029695B2 (ja)
KR (1) KR101108862B1 (ja)
CN (1) CN101779255B (ja)
TW (1) TWI391955B (ja)
WO (1) WO2009041526A1 (ja)

Cited By (13)

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US20110146748A1 (en) * 2009-12-22 2011-06-23 Kioto Photovoltaics Gmbh Solar cell-string
JP2011151246A (ja) * 2010-01-22 2011-08-04 Hitachi Chem Co Ltd 太陽電池モジュールの製造方法
WO2012073675A1 (ja) * 2010-12-01 2012-06-07 ソニーケミカル＆インフォメーションデバイス株式会社 薄膜系太陽電池モジュール、及び薄膜系太陽電池モジュールの製造方法
EP2494855A1 (en) * 2009-10-30 2012-09-05 Research Frontiers Incorporated Spd films and light valve laminates with improved bus-bar connections
JPWO2010122875A1 (ja) * 2009-04-21 2012-10-25 三洋電機株式会社 太陽電池モジュール
WO2013080324A1 (ja) * 2011-11-30 2013-06-06 三洋電機株式会社 光起電力モジュール及びその製造方法
WO2014045335A1 (ja) * 2012-09-18 2014-03-27 三洋電機株式会社 太陽電池モジュール
WO2015008610A1 (ja) * 2013-07-19 2015-01-22 三洋電機株式会社 太陽電池モジュール
JP2015065366A (ja) * 2013-09-26 2015-04-09 デクセリアルズ株式会社 導電性接着剤、太陽電池モジュール及びその製造方法
JPWO2013080324A1 (ja) * 2011-11-30 2015-04-27 三洋電機株式会社 光起電力モジュール及びその製造方法
JP2015515029A (ja) * 2012-04-25 2015-05-21 エイチピーオー アセッツ エルエルシー 導電性レンズ接続部及びその作製方法
US9390829B2 (en) 2010-01-25 2016-07-12 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
JP2018051898A (ja) * 2016-09-28 2018-04-05 ブラザー工業株式会社 アクチュエータ装置、液体吐出装置、及び、配線部材の接続構造

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TWI433331B (zh) 2011-05-17 2014-04-01 Neo Solar Power Corp 電極膠帶之製作機台
JP2013116929A (ja) * 2011-12-01 2013-06-13 Nitto Denko Corp 導電性接着シート、その製造方法、集電電極および太陽電池モジュール
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KR102107209B1 (ko) * 2013-03-18 2020-05-06 엘지전자 주식회사 인터커넥터 및 이를 구비한 태양전지 모듈
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JP6907493B2 (ja) 2016-09-28 2021-07-21 ブラザー工業株式会社 アクチュエータ装置、配線部材の接続構造、液体吐出装置、及び、アクチュエータ装置の製造方法
KR102120662B1 (ko) * 2018-06-08 2020-06-11 대산전자(주) 버스바용 클래드와 버스바용 클래드 제조 방법
CN110416178A (zh) * 2019-07-12 2019-11-05 南通沃特光电科技有限公司 一种集成电路封装结构及其封装方法
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CN112852328A (zh) * 2021-01-11 2021-05-28 常州威斯双联科技有限公司 一种超导电膜及其制备工艺
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