WO2009041397A1 - 原料ガスの供給システム及び成膜装置 - Google Patents

原料ガスの供給システム及び成膜装置 Download PDF

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Publication number
WO2009041397A1
WO2009041397A1 PCT/JP2008/067118 JP2008067118W WO2009041397A1 WO 2009041397 A1 WO2009041397 A1 WO 2009041397A1 JP 2008067118 W JP2008067118 W JP 2008067118W WO 2009041397 A1 WO2009041397 A1 WO 2009041397A1
Authority
WO
WIPO (PCT)
Prior art keywords
gas supply
raw gas
supply system
valves
filming apparatus
Prior art date
Application number
PCT/JP2008/067118
Other languages
English (en)
French (fr)
Inventor
Masamichi Hara
Atsushi Gomi
Shinji Maekawa
Kaoru Yamamoto
Satoshi Taga
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to CN200880100433A priority Critical patent/CN101772590A/zh
Priority to US12/680,041 priority patent/US20100236480A1/en
Publication of WO2009041397A1 publication Critical patent/WO2009041397A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8158—With indicator, register, recorder, alarm or inspection means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8376—Combined

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

　原料ガス供給システム６は、減圧雰囲気になされたガス使用系２に対して原料ガスを供給する。システムは、液体原料または固体原料を貯留する原料タンク４０と、原料タンクに一端が接続されガス使用系に他端が接続された原料通路４６と、原料タンク内へキャリアガスを供給するキャリアガス供給機構５４と、原料通路の途中に介設された開閉弁４８，５０と、原料通路および開閉弁を加熱するヒータ６４と、ヒータを制御する温度制御部９２と、を有する。原料通路および前記開閉弁は、良好な熱伝導性を有した金属材料を用いて、形成されている。
PCT/JP2008/067118 2007-09-28 2008-09-22 原料ガスの供給システム及び成膜装置 WO2009041397A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880100433A CN101772590A (zh) 2007-09-28 2008-09-22 原料气体的供给系统以及成膜装置
US12/680,041 US20100236480A1 (en) 2007-09-28 2008-09-22 Raw material gas supply system and film forming apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-255059 2007-09-28
JP2007255059A JP2009084625A (ja) 2007-09-28 2007-09-28 原料ガスの供給システム及び成膜装置

Publications (1)

Publication Number Publication Date
WO2009041397A1 true WO2009041397A1 (ja) 2009-04-02

Family

ID=40511282

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067118 WO2009041397A1 (ja) 2007-09-28 2008-09-22 原料ガスの供給システム及び成膜装置

Country Status (6)

Country Link
US (1) US20100236480A1 (ja)
JP (1) JP2009084625A (ja)
KR (1) KR20100063694A (ja)
CN (1) CN101772590A (ja)
TW (1) TW200932943A (ja)
WO (1) WO2009041397A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281148B2 (ja) * 2009-04-03 2013-09-04 東京エレクトロン株式会社 蒸着ヘッドおよび成膜装置

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JP5659041B2 (ja) * 2011-02-24 2015-01-28 東京エレクトロン株式会社 成膜方法および記憶媒体
WO2012117888A1 (ja) * 2011-03-03 2012-09-07 三洋電機株式会社 触媒化学気相成膜装置、それを用いた成膜方法及び触媒体の表面処理方法
CN102312222A (zh) * 2011-09-30 2012-01-11 上海宏力半导体制造有限公司 输气装置
JP2013115208A (ja) * 2011-11-28 2013-06-10 Tokyo Electron Ltd 気化原料供給装置、これを備える基板処理装置、及び気化原料供給方法
JP5766647B2 (ja) * 2012-03-28 2015-08-19 東京エレクトロン株式会社 熱処理システム、熱処理方法、及び、プログラム
US20130312663A1 (en) * 2012-05-22 2013-11-28 Applied Microstructures, Inc. Vapor Delivery Apparatus
KR101214051B1 (ko) 2012-08-24 2012-12-20 한국세라믹기술원 전계방출용 ｃｎｔ-금속 혼합막 제조 방법 및 에어로졸 증착장치
JP5837869B2 (ja) * 2012-12-06 2015-12-24 株式会社フジキン 原料気化供給装置
KR101412507B1 (ko) * 2013-02-06 2014-06-26 공주대학교 산학협력단 유기금속화합물 가스 공급 장치
JP2015160963A (ja) * 2014-02-26 2015-09-07 東京エレクトロン株式会社 ルテニウム膜の成膜方法および成膜装置、ならびに半導体装置の製造方法
US9431238B2 (en) * 2014-06-05 2016-08-30 Asm Ip Holding B.V. Reactive curing process for semiconductor substrates
JP6409021B2 (ja) * 2016-05-20 2018-10-17 日本エア・リキード株式会社 昇華ガス供給システムおよび昇華ガス供給方法
KR102344996B1 (ko) 2017-08-18 2021-12-30 삼성전자주식회사 전구체 공급 유닛, 기판 처리 장치 및 그를 이용한 반도체 소자의 제조방법
JP6425850B1 (ja) * 2017-11-22 2018-11-21 日本エア・リキード株式会社 固体材料容器およびその固体材料容器に固体材料が充填されている固体材料製品
JP7080115B2 (ja) * 2018-06-28 2022-06-03 信越化学工業株式会社 成膜装置及び成膜方法
JP7094172B2 (ja) * 2018-07-20 2022-07-01 東京エレクトロン株式会社 成膜装置、原料供給装置及び成膜方法
JP6875336B2 (ja) * 2018-08-27 2021-05-26 信越化学工業株式会社 成膜方法
US11162174B2 (en) * 2018-09-20 2021-11-02 Taiwan Semiconductor Manufacturing Co, Ltd. Liquid delivery and vaporization apparatus and method
JP6887688B2 (ja) * 2019-02-07 2021-06-16 株式会社高純度化学研究所 蒸発原料用容器、及びその蒸発原料用容器を用いた固体気化供給システム
JP6901153B2 (ja) * 2019-02-07 2021-07-14 株式会社高純度化学研究所 薄膜形成用金属ハロゲン化合物の固体気化供給システム。
JP7493389B2 (ja) * 2020-06-10 2024-05-31 東京エレクトロン株式会社 成膜装置および成膜方法
JP2022002246A (ja) * 2020-06-19 2022-01-06 東京エレクトロン株式会社 成膜方法およびプラズマ処理装置
KR20230129187A (ko) * 2021-01-15 2023-09-06 어플라이드 머티어리얼스, 인코포레이티드 액화된 재료를 제공하기 위한 장치, 액화된 재료를투입하기 위한 투입 시스템 및 방법
CN115715424A (zh) * 2021-06-21 2023-02-24 株式会社日立高新技术 等离子体处理装置

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JP2000226667A (ja) * 1998-11-30 2000-08-15 Anelva Corp Ｃｖｄ装置
WO2004007797A1 (ja) * 2002-07-10 2004-01-22 Tokyo Electron Limited 成膜装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281148B2 (ja) * 2009-04-03 2013-09-04 東京エレクトロン株式会社 蒸着ヘッドおよび成膜装置

Also Published As

Publication number Publication date
US20100236480A1 (en) 2010-09-23
JP2009084625A (ja) 2009-04-23
CN101772590A (zh) 2010-07-07
TW200932943A (en) 2009-08-01
KR20100063694A (ko) 2010-06-11

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