WO2008142769A1 - 半導体装置の試験装置及び試験方法 - Google Patents

半導体装置の試験装置及び試験方法 Download PDF

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Publication number
WO2008142769A1
WO2008142769A1 PCT/JP2007/060358 JP2007060358W WO2008142769A1 WO 2008142769 A1 WO2008142769 A1 WO 2008142769A1 JP 2007060358 W JP2007060358 W JP 2007060358W WO 2008142769 A1 WO2008142769 A1 WO 2008142769A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
semiconductor device
temperatures
solution
testing
Prior art date
Application number
PCT/JP2007/060358
Other languages
English (en)
French (fr)
Inventor
Hideaki Nakamura
Original Assignee
Fujitsu Microelectronics Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Microelectronics Limited filed Critical Fujitsu Microelectronics Limited
Priority to CN2007800530152A priority Critical patent/CN101675347B/zh
Priority to PCT/JP2007/060358 priority patent/WO2008142769A1/ja
Priority to KR1020097023397A priority patent/KR101106608B1/ko
Priority to JP2009515038A priority patent/JP5051224B2/ja
Publication of WO2008142769A1 publication Critical patent/WO2008142769A1/ja
Priority to US12/606,609 priority patent/US8395400B2/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Ink Jet (AREA)

Abstract

　試験ボードに搭載された複数の半導体装置の温度を検出する温度検出部と、その検出結果に基づいて半導体装置の温度を制御する温度制御ユニットとを備え、かつ温度制御ユニットは、半導体装置を冷却又は加熱するサーマルヘッドと、異なる温度に設定した複数の溶液が並列に流通される複数の溶液用配管と、溶液用配管を流通する溶液をサーマルヘッドに流通させるか否かを切り替える流路切替部とを備え、発熱量が大きい半導体装置の温度を規定温度範囲内に収めるような溶液温度では規定温度に到達できない発熱量が小さい半導体装置に対しては、流路切替部によりサーマルヘッドに流通させる溶液をより高温のものに切り替えるようにして、発熱量の差にかかわらず、半導体装置の温度を規定温度範囲内に制御できるようにする。
PCT/JP2007/060358 2007-05-21 2007-05-21 半導体装置の試験装置及び試験方法 WO2008142769A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2007800530152A CN101675347B (zh) 2007-05-21 2007-05-21 半导体装置的测试装置及测试方法
PCT/JP2007/060358 WO2008142769A1 (ja) 2007-05-21 2007-05-21 半導体装置の試験装置及び試験方法
KR1020097023397A KR101106608B1 (ko) 2007-05-21 2007-05-21 반도체장치의 시험장치 및 시험방법
JP2009515038A JP5051224B2 (ja) 2007-05-21 2007-05-21 半導体装置の試験装置及び試験方法
US12/606,609 US8395400B2 (en) 2007-05-21 2009-10-27 Testing device and testing method of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060358 WO2008142769A1 (ja) 2007-05-21 2007-05-21 半導体装置の試験装置及び試験方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/606,609 Continuation US8395400B2 (en) 2007-05-21 2009-10-27 Testing device and testing method of semiconductor devices

Publications (1)

Publication Number Publication Date
WO2008142769A1 true WO2008142769A1 (ja) 2008-11-27

Family

ID=40031496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/060358 WO2008142769A1 (ja) 2007-05-21 2007-05-21 半導体装置の試験装置及び試験方法

Country Status (5)

Country Link
US (1) US8395400B2 (ja)
JP (1) JP5051224B2 (ja)
KR (1) KR101106608B1 (ja)
CN (1) CN101675347B (ja)
WO (1) WO2008142769A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013167458A (ja) * 2012-02-14 2013-08-29 Seiko Epson Corp ハンドラー、及び部品検査装置
JP2017219414A (ja) * 2016-06-07 2017-12-14 富士通株式会社 熱試験方法および熱試験プログラム
CN107680635A (zh) * 2017-11-04 2018-02-09 深圳市时创意电子有限公司 一种应用于固态硬盘可靠性测试的大型高温测试设备

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JP4153513B2 (ja) * 2005-09-28 2008-09-24 関西電力株式会社 半導体装置の温度測定方法および半導体装置の温度測定装置
US8573836B2 (en) * 2006-10-26 2013-11-05 Tokyo Electron Limited Apparatus and method for evaluating a substrate mounting device
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
US8704542B2 (en) * 2011-07-08 2014-04-22 Titan Semiconductor Tool, LLC Thermal chamber for IC chip testing
TW201316144A (zh) * 2011-10-07 2013-04-16 Hon Tech Inc 溫度控制模式之建構方法
JP5938932B2 (ja) * 2012-02-14 2016-06-22 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
US9791501B2 (en) * 2012-09-24 2017-10-17 Intel Corporation Compliant thermal contact device and method
CN104977517A (zh) * 2014-04-03 2015-10-14 江苏物联网研究发展中心 功率半导体器件的高温测试方法
TW201715241A (zh) * 2015-10-23 2017-05-01 Hon Tech Inc 電子元件作業裝置及其應用之測試分類設備
JP7316799B2 (ja) 2019-01-30 2023-07-28 株式会社アドバンテスト 電子部品ハンドリング装置及び電子部品試験装置
CN110850259B (zh) * 2018-07-26 2022-07-08 株式会社爱德万测试 电子部件处理装置及电子部件测试装置
JP7361624B2 (ja) * 2020-02-12 2023-10-16 東京エレクトロン株式会社 加熱源の寿命推定システム、寿命推定方法、および検査装置
CN111289881A (zh) * 2020-03-30 2020-06-16 上海菲莱测试技术有限公司 一种芯片可靠性测试方法、设备、装置、系统和存储介质
CN111522324B (zh) * 2020-04-08 2021-06-22 北京京仪自动化装备技术股份有限公司 半导体温控装置的测试方法、装置、电子设备及存储介质
KR102427629B1 (ko) * 2020-08-28 2022-08-01 한화시스템 주식회사 시험장치 및 시험방법
CN115291650A (zh) * 2022-08-18 2022-11-04 皇虎测试科技(深圳)有限公司 一种半导体被测器件的温控系统、方法和设备

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JPH0536793A (ja) * 1991-07-31 1993-02-12 Sumitomo Electric Ind Ltd バーンイン方法および装置
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JP2005265665A (ja) * 2004-03-19 2005-09-29 Advantest Corp バーンイン装置

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JPH0536793A (ja) * 1991-07-31 1993-02-12 Sumitomo Electric Ind Ltd バーンイン方法および装置
JPH0964128A (ja) * 1995-08-28 1997-03-07 Hitachi Ltd バーンイン方法および装置
JP2005156172A (ja) * 2003-11-20 2005-06-16 Nippon Eng Kk ミドルパワー及びハイパワーｉｃ用テストバーンイン装置
JP2005265665A (ja) * 2004-03-19 2005-09-29 Advantest Corp バーンイン装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013167458A (ja) * 2012-02-14 2013-08-29 Seiko Epson Corp ハンドラー、及び部品検査装置
JP2017219414A (ja) * 2016-06-07 2017-12-14 富士通株式会社 熱試験方法および熱試験プログラム
CN107680635A (zh) * 2017-11-04 2018-02-09 深圳市时创意电子有限公司 一种应用于固态硬盘可靠性测试的大型高温测试设备
CN107680635B (zh) * 2017-11-04 2023-12-08 深圳市时创意电子有限公司 一种应用于固态硬盘可靠性测试的大型高温测试设备

Also Published As

Publication number Publication date
CN101675347A (zh) 2010-03-17
US8395400B2 (en) 2013-03-12
JPWO2008142769A1 (ja) 2010-08-05
JP5051224B2 (ja) 2012-10-17
US20100040107A1 (en) 2010-02-18
KR101106608B1 (ko) 2012-01-20
CN101675347B (zh) 2012-08-22
KR20100005114A (ko) 2010-01-13

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