WO2009037796A1 - フレキシブル配線基板の固定構造 - Google Patents

フレキシブル配線基板の固定構造 Download PDF

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Publication number
WO2009037796A1
WO2009037796A1 PCT/JP2008/001389 JP2008001389W WO2009037796A1 WO 2009037796 A1 WO2009037796 A1 WO 2009037796A1 JP 2008001389 W JP2008001389 W JP 2008001389W WO 2009037796 A1 WO2009037796 A1 WO 2009037796A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
flexible wiring
fixing flexible
board
connector
Prior art date
Application number
PCT/JP2008/001389
Other languages
English (en)
French (fr)
Inventor
Tetsuro Nagami
Shinji Serizawa
Yoichi Yasui
Original Assignee
Mitsubishi Electric Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corporation filed Critical Mitsubishi Electric Corporation
Priority to CN2008801071149A priority Critical patent/CN101803475B/zh
Priority to DE112008002140.6T priority patent/DE112008002140B4/de
Priority to US12/668,835 priority patent/US20100202119A1/en
Priority to JP2009533025A priority patent/JP4827971B2/ja
Publication of WO2009037796A1 publication Critical patent/WO2009037796A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

フレキシブル配線基板１は導体１１が形成された絶縁部材１２と、フレキシブル配線基板１の接続端子部１１ａ近傍の絶縁部材１２を補強する補強板１３と、コネクタ２を有する基板３に係止する係止部材１４を有し、基板３は接続端子部１１ａをコネクタ２に接続固定した状態で係止部材１４を嵌合する開口部３１を有する。
PCT/JP2008/001389 2007-09-21 2008-06-02 フレキシブル配線基板の固定構造 WO2009037796A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801071149A CN101803475B (zh) 2007-09-21 2008-06-02 柔性布线基板的固定构造
DE112008002140.6T DE112008002140B4 (de) 2007-09-21 2008-06-02 Befestigungsstruktur und Befestigungsanordnung mit einer flexiblen Leiterplatte
US12/668,835 US20100202119A1 (en) 2007-09-21 2008-06-02 Structure for fixing flexible wiring board
JP2009533025A JP4827971B2 (ja) 2007-09-21 2008-06-02 フレキシブル配線基板の固定構造

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-245595 2007-09-21
JP2007245595 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009037796A1 true WO2009037796A1 (ja) 2009-03-26

Family

ID=40467626

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001389 WO2009037796A1 (ja) 2007-09-21 2008-06-02 フレキシブル配線基板の固定構造

Country Status (5)

Country Link
US (1) US20100202119A1 (ja)
JP (1) JP4827971B2 (ja)
CN (1) CN101803475B (ja)
DE (1) DE112008002140B4 (ja)
WO (1) WO2009037796A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011013605A (ja) * 2009-07-06 2011-01-20 Hitachi Displays Ltd 表示装置
JP2012209479A (ja) * 2011-03-30 2012-10-25 Nikon Corp フレキシブル基板および電子機器
WO2012161046A1 (ja) * 2011-05-23 2012-11-29 シャープ株式会社 フレキシブルプリント配線板の接続構造
JP2016100404A (ja) * 2014-11-19 2016-05-30 三菱電機株式会社 フラットケーブルの固定構造
KR20160093445A (ko) * 2015-01-29 2016-08-08 엘지디스플레이 주식회사 가요성 인쇄회로를 구비한 표시장치
JP2019009332A (ja) * 2017-06-27 2019-01-17 積水ポリマテック株式会社 回路シート
JP2020072247A (ja) * 2018-04-27 2020-05-07 キヤノン株式会社 プリント基板およびプリント基板を有する画像形成装置
WO2022044666A1 (ja) * 2020-08-27 2022-03-03 株式会社オートネットワーク技術研究所 車載用配線モジュールおよびフレキシブル基板

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM269683U (en) * 2005-01-03 2005-07-01 High Tech Comp Corp Flexible printed circuit board and reinforcing structure thereof
TWI402566B (zh) * 2008-12-18 2013-07-21 Chunghwa Picture Tubes Ltd 具有導線圖案之接墊區以及監控膜材貼附偏差之方法
TWI515573B (zh) * 2010-05-31 2016-01-01 緯創資通股份有限公司 伺服器系統
CN102570088B (zh) * 2010-12-29 2014-07-23 易鼎股份有限公司 软性电路排线的插接脱移防制结构
JP2012190722A (ja) * 2011-03-11 2012-10-04 Funai Electric Co Ltd フレキシブルフラットケーブル及びこれを用いた影像表示装置
JP5818516B2 (ja) * 2011-05-31 2015-11-18 キヤノン株式会社 コネクタ接続部を有するフレキシブルプリント配線基板
JP5866818B2 (ja) * 2011-06-27 2016-02-24 山一電機株式会社 補強板付きケーブルおよび補強板
JP5660076B2 (ja) 2012-04-26 2015-01-28 三菱電機株式会社 半導体装置とその製造方法
WO2015177060A1 (en) * 2014-05-22 2015-11-26 Koninklijke Philips N.V. Printed circuit board arrangement and method for mounting a product to a main printed circuit board
KR102237751B1 (ko) * 2014-12-08 2021-04-12 삼성디스플레이 주식회사 표시 장치
JP6562714B2 (ja) * 2015-05-25 2019-08-21 アズビル株式会社 電子機器
US10398377B2 (en) * 2015-09-04 2019-09-03 Japan Science And Technology Agency Connector substrate, sensor system, and wearable sensor system
KR20190133289A (ko) * 2015-09-28 2019-12-02 택토텍 오와이 다층 구조체 및 관련 전자 제품의 제조 방법
CN105376937B (zh) * 2015-11-10 2018-11-20 武汉华星光电技术有限公司 一种fpc结构
US10461467B2 (en) * 2017-01-20 2019-10-29 Fci Usa Llc Compact card edge connector
FI20175786A1 (en) 2017-09-01 2019-03-02 Teknologian Tutkimuskeskus Vtt Oy Electric membrane
CN207369413U (zh) * 2017-09-27 2018-05-15 京东方科技集团股份有限公司 一种线路板、显示驱动装置及显示装置
CN108042925B (zh) * 2017-12-29 2024-04-26 深圳市鑫君特智能医疗器械有限公司 一种光疗装置柔性连接器及光疗装置
CN108124380B (zh) * 2017-12-29 2019-10-25 惠州市华星光电技术有限公司 显示器及其电路板结构
JP2020057685A (ja) * 2018-10-01 2020-04-09 東芝テック株式会社 ヘッド用ボード及び処理装置
WO2020258295A1 (zh) * 2019-06-28 2020-12-30 京东方科技集团股份有限公司 柔性电路板、柔性装置及显示设备
US11483422B2 (en) * 2019-06-28 2022-10-25 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and electronic device comprising the same
CN114597707A (zh) 2020-12-04 2022-06-07 安费诺商用电子产品(成都)有限公司 带有锁定系统的卡边缘连接器
CN113270040A (zh) * 2021-05-26 2021-08-17 昆山工研院新型平板显示技术中心有限公司 电子元件邦定结构、电子元件邦定方法及显示面板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113674U (ja) * 1984-01-05 1985-08-01 株式会社東芝 フレキシブルプリント配線板の接続装置
JPS6228470U (ja) * 1985-08-05 1987-02-20
JPH0487675U (ja) * 1990-11-30 1992-07-30
JPH0645367U (ja) * 1992-11-26 1994-06-14 アイコム株式会社 フレキシブルプリント基板の取付構造
JPH10209594A (ja) * 1997-01-17 1998-08-07 Fuji Photo Optical Co Ltd フレキシブルプリント回路基板と硬質プリント回路基板との接続構造
JP2000277880A (ja) * 1999-03-23 2000-10-06 Funai Electric Co Ltd フレキシブル回路基板
JP2005183496A (ja) * 2003-12-17 2005-07-07 Canon Inc フレキシブルプリント基板の接続方法及び接続構造

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JPS6228470A (ja) * 1985-07-29 1987-02-06 三菱レイヨン株式会社 ポリエステルフイブリル繊維の製造法
JPH0669550B2 (ja) * 1990-07-30 1994-09-07 株式会社国際電気エルテック 超音波洗浄装置と被洗浄物保持具
US5777855A (en) * 1996-06-18 1998-07-07 Eastman Kodak Company Method and apparatus for connecting flexible circuits to printed circuit boards

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113674U (ja) * 1984-01-05 1985-08-01 株式会社東芝 フレキシブルプリント配線板の接続装置
JPS6228470U (ja) * 1985-08-05 1987-02-20
JPH0487675U (ja) * 1990-11-30 1992-07-30
JPH0645367U (ja) * 1992-11-26 1994-06-14 アイコム株式会社 フレキシブルプリント基板の取付構造
JPH10209594A (ja) * 1997-01-17 1998-08-07 Fuji Photo Optical Co Ltd フレキシブルプリント回路基板と硬質プリント回路基板との接続構造
JP2000277880A (ja) * 1999-03-23 2000-10-06 Funai Electric Co Ltd フレキシブル回路基板
JP2005183496A (ja) * 2003-12-17 2005-07-07 Canon Inc フレキシブルプリント基板の接続方法及び接続構造

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011013605A (ja) * 2009-07-06 2011-01-20 Hitachi Displays Ltd 表示装置
JP2012209479A (ja) * 2011-03-30 2012-10-25 Nikon Corp フレキシブル基板および電子機器
WO2012161046A1 (ja) * 2011-05-23 2012-11-29 シャープ株式会社 フレキシブルプリント配線板の接続構造
JP2016100404A (ja) * 2014-11-19 2016-05-30 三菱電機株式会社 フラットケーブルの固定構造
KR20160093445A (ko) * 2015-01-29 2016-08-08 엘지디스플레이 주식회사 가요성 인쇄회로를 구비한 표시장치
KR102247998B1 (ko) * 2015-01-29 2021-05-03 엘지디스플레이 주식회사 가요성 인쇄회로를 구비한 표시장치
JP2019009332A (ja) * 2017-06-27 2019-01-17 積水ポリマテック株式会社 回路シート
JP7062261B2 (ja) 2017-06-27 2022-05-06 積水ポリマテック株式会社 回路シート
JP2020072247A (ja) * 2018-04-27 2020-05-07 キヤノン株式会社 プリント基板およびプリント基板を有する画像形成装置
JP7336208B2 (ja) 2018-04-27 2023-08-31 キヤノン株式会社 プリント基板およびプリント基板を有する画像形成装置
WO2022044666A1 (ja) * 2020-08-27 2022-03-03 株式会社オートネットワーク技術研究所 車載用配線モジュールおよびフレキシブル基板
JP7463913B2 (ja) 2020-08-27 2024-04-09 株式会社オートネットワーク技術研究所 車載用配線モジュールおよびフレキシブル基板

Also Published As

Publication number Publication date
JP4827971B2 (ja) 2011-11-30
US20100202119A1 (en) 2010-08-12
CN101803475A (zh) 2010-08-11
CN101803475B (zh) 2012-03-21
DE112008002140T5 (de) 2010-06-17
DE112008002140B4 (de) 2014-01-30
JPWO2009037796A1 (ja) 2011-01-06

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