WO2009028283A1 - 半導体歪みセンサー - Google Patents

半導体歪みセンサー Download PDF

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Publication number
WO2009028283A1
WO2009028283A1 PCT/JP2008/063354 JP2008063354W WO2009028283A1 WO 2009028283 A1 WO2009028283 A1 WO 2009028283A1 JP 2008063354 W JP2008063354 W JP 2008063354W WO 2009028283 A1 WO2009028283 A1 WO 2009028283A1
Authority
WO
WIPO (PCT)
Prior art keywords
strain sensor
strain
sensor chip
base board
metal base
Prior art date
Application number
PCT/JP2008/063354
Other languages
English (en)
French (fr)
Inventor
Atsushi Kazama
Ryoji Okada
Tetsurou Kawai
Original Assignee
Hitachi Metals, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007219342A external-priority patent/JP2009053005A/ja
Priority claimed from JP2007246695A external-priority patent/JP4566227B2/ja
Application filed by Hitachi Metals, Ltd. filed Critical Hitachi Metals, Ltd.
Priority to EP08828400.5A priority Critical patent/EP2184576B1/en
Priority to CN200880103012XA priority patent/CN101802541B/zh
Priority to US12/674,419 priority patent/US8438931B2/en
Publication of WO2009028283A1 publication Critical patent/WO2009028283A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type

Abstract

　歪み検出部としてピエゾ抵抗素子を持つ半導体基板からなる歪みセンサーチップを有する半導体歪みセンサーであって、特性が長期間安定し、測定対象物の歪みに応じて歪みセンサーチップに生じる歪みの変換係数が測定する大きさの歪み範囲において安定なもの。歪みセンサーチップが金属接合材で接合されている金属ベース板が歪みセンサーチップの側辺から突出して測定対象物に取り付けるための２個あるいは４個の張り出しメンバーを有する。好ましくは、歪みセンサーチップを金属ベース板に接合している接合領域に対応した金属ベース板下面領域と、張り出しメンバー下面との間に溝が設けられており、金属ベース板下面に溝で挟まれた突出部が設けられている。
PCT/JP2008/063354 2007-08-27 2008-07-25 半導体歪みセンサー WO2009028283A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08828400.5A EP2184576B1 (en) 2007-08-27 2008-07-25 Semiconductor strain sensor
CN200880103012XA CN101802541B (zh) 2007-08-27 2008-07-25 半导体应变传感器
US12/674,419 US8438931B2 (en) 2007-08-27 2008-07-25 Semiconductor strain sensor

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-219342 2007-08-27
JP2007219342A JP2009053005A (ja) 2007-08-27 2007-08-27 半導体歪センサーおよび半導体歪センサーの取付け方法
JP2007-246695 2007-09-25
JP2007246695A JP4566227B2 (ja) 2007-09-25 2007-09-25 半導体歪センサーおよび半導体歪センサーの取付け方法

Publications (1)

Publication Number Publication Date
WO2009028283A1 true WO2009028283A1 (ja) 2009-03-05

Family

ID=40387011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063354 WO2009028283A1 (ja) 2007-08-27 2008-07-25 半導体歪みセンサー

Country Status (6)

Country Link
US (1) US8438931B2 (ja)
EP (1) EP2184576B1 (ja)
KR (1) KR101151125B1 (ja)
CN (1) CN101802541B (ja)
TW (1) TW200914808A (ja)
WO (1) WO2009028283A1 (ja)

Cited By (7)

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Publication number Priority date Publication date Assignee Title
CN102934250A (zh) * 2010-03-17 2013-02-13 原子能及能源替代委员会 机械应力检测器
WO2013084294A1 (ja) * 2011-12-06 2013-06-13 株式会社日立製作所 力学量測定装置
JP2015064109A (ja) * 2007-06-26 2015-04-09 スウエイジロク・カンパニー 感知機能を有する導管接続
DE102015104410A1 (de) 2015-03-24 2016-09-29 Micronas Gmbh Drucksensor
US10295093B2 (en) 2007-06-26 2019-05-21 Swagelok Company Conduit connection with sensor on a threaded body
US10578503B2 (en) 2015-03-06 2020-03-03 Swagelok Company System and methods for strain detection in a coupling
US10976205B2 (en) 2015-09-30 2021-04-13 Hitachi Automotive Systems, Ltd. Dynamic quantity measuring apparatus having a strain sensor disposed in a groove

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DE102010002274A1 (de) * 2010-02-24 2011-08-25 Robert Bosch GmbH, 70469 Vorrichtung zur Messung von Torsionen, Biegungen und dergleichen sowie entsprechendes Herstellungsverfahren
US9121258B2 (en) 2010-11-08 2015-09-01 Baker Hughes Incorporated Sensor on a drilling apparatus
JP5843850B2 (ja) * 2011-04-21 2016-01-13 株式会社日立製作所 力学量測定装置、半導体装置、剥離検知装置およびモジュール
US9057247B2 (en) * 2012-02-21 2015-06-16 Baker Hughes Incorporated Measurement of downhole component stress and surface conditions
WO2013128643A1 (ja) * 2012-03-02 2013-09-06 株式会社日立製作所 力学量測定装置
EP2857816A4 (en) * 2012-05-25 2015-12-09 Hitachi Ltd DEVICE FOR MEASURING MECHANICAL QUANTITY
US9250146B2 (en) * 2013-02-12 2016-02-02 Western New England University Multidimensional strain gage
JP5975970B2 (ja) * 2013-11-20 2016-08-23 日立オートモティブシステムズ株式会社 圧力センサ
US20150296622A1 (en) * 2014-04-11 2015-10-15 Apple Inc. Flexible Printed Circuit With Semiconductor Strain Gauge
JP2015224903A (ja) * 2014-05-26 2015-12-14 株式会社東芝 圧力センサ、マイクロフォン、超音波センサ、血圧センサ及びタッチパネル
US9887165B2 (en) 2014-12-10 2018-02-06 Stmicroelectronics S.R.L. IC with insulating trench and related methods
US9726587B2 (en) * 2015-01-30 2017-08-08 Stmicroelectronics S.R.L. Tensile stress measurement device with attachment plates and related methods
CN107532953A (zh) * 2015-03-31 2018-01-02 株式会社ＮｅｊｉＬａｗ 带通电路径的部件和通电路径的图案化方法及部件变化测量方法
JP6344297B2 (ja) * 2015-04-16 2018-06-20 株式会社デンソー 撮像装置およびそれに用いられるプリント基板
KR102400529B1 (ko) * 2015-10-26 2022-05-20 삼성전자주식회사 금속 케이스를 구비한 전자기기 및 이에 사용되는 금속 케이스
JP2017150931A (ja) * 2016-02-24 2017-08-31 株式会社タニタ ひずみゲージ
CN105843295B (zh) * 2016-03-21 2018-02-16 安徽工程大学 冰箱温湿度检测调节装置
CN105843296B (zh) * 2016-03-21 2018-03-20 安徽工程大学 印刷机烘箱的温控装置
CN105786057B (zh) * 2016-03-21 2018-01-12 安徽工程大学 印刷车间温湿度调节系统
CN105759879B (zh) * 2016-03-21 2017-12-19 安徽科创新能源科技有限责任公司 一种印刷车间环境监测调控系统
KR102527317B1 (ko) * 2016-08-30 2023-05-03 삼성전자주식회사 금속 패드가 부착된 금속 케이스를 구비한 전자기기
US10203254B2 (en) * 2016-09-12 2019-02-12 Apple Inc. Strain sensor with thermally conductive element
JP6692762B2 (ja) * 2017-02-13 2020-05-13 日本電産コパル電子株式会社 トルクセンサ
CN107504927B (zh) * 2017-09-11 2024-04-19 重庆大学 一种基于金属薄板和压电薄膜的声表面波高温应变传感器芯片及其制备方法
US10797126B2 (en) 2018-01-29 2020-10-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display device and manufacturing method thereof, display panel
CN108155220B (zh) * 2018-01-29 2019-08-02 武汉华星光电半导体显示技术有限公司 显示装置的制造方法
IT201800003693A1 (it) * 2018-03-16 2019-09-16 St Microelectronics Srl Sensore di sforzi, sistema di monitoraggio di integrita' strutturale per costruzioni e processo di fabbricazione di un sensore di sforzi
WO2020008939A1 (ja) * 2018-07-06 2020-01-09 オムロン株式会社 ひずみセンサ、および引張特性測定方法
KR20200046282A (ko) 2018-10-24 2020-05-07 삼성전자주식회사 집적 회로 장치 및 고 대역폭 메모리 장치
DE102019129411A1 (de) * 2019-09-12 2021-03-18 Wika Alexander Wiegand Se & Co. Kg Aufnehmerkörper mit einem Messelement und Herstellungsverfahren für einen Aufnehmerkörper
DE102022118489A1 (de) 2022-07-25 2024-01-25 Schaeffler Technologies AG & Co. KG Sensoranordnung zur Messung von mechanischen Dehnungen in einem Bauteil

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JPS59132173A (ja) * 1982-10-04 1984-07-30 エンデブコ・コーポレーション 歪感応素子の製造方法
JPS59137503U (ja) * 1983-03-04 1984-09-13 株式会社オリエンテック 張力計用ロ−ドセル
JPH0735628A (ja) * 1993-07-16 1995-02-07 Kyowa Electron Instr Co Ltd ひずみゲージ添着個所被覆構造およびその被覆方法
JPH0781171A (ja) * 1993-04-30 1995-03-28 Canon Electron Inc 記録装置
JPH08139267A (ja) * 1994-11-07 1996-05-31 Nec Corp マルチチップモジュール
JP2001264188A (ja) 2000-03-21 2001-09-26 Olympus Optical Co Ltd 半導体歪ゲージおよび半導体歪ゲージの製造方法
JP2001272287A (ja) 2000-03-27 2001-10-05 Tadahiro Kato 歪み検出センサ
WO2003102601A1 (fr) * 2002-05-31 2003-12-11 Matsushita Electric Works, Ltd. Boitier capteur
JP2007059736A (ja) * 2005-08-26 2007-03-08 Citizen Watch Co Ltd 圧電振動子パッケージ及びその製造方法ならびに物理量センサ

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Patent Citations (10)

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Publication number Priority date Publication date Assignee Title
JPS54129889A (en) * 1978-03-31 1979-10-08 Hitachi Ltd Strain measuring unit
JPS59132173A (ja) * 1982-10-04 1984-07-30 エンデブコ・コーポレーション 歪感応素子の製造方法
JPS59137503U (ja) * 1983-03-04 1984-09-13 株式会社オリエンテック 張力計用ロ−ドセル
JPH0781171A (ja) * 1993-04-30 1995-03-28 Canon Electron Inc 記録装置
JPH0735628A (ja) * 1993-07-16 1995-02-07 Kyowa Electron Instr Co Ltd ひずみゲージ添着個所被覆構造およびその被覆方法
JPH08139267A (ja) * 1994-11-07 1996-05-31 Nec Corp マルチチップモジュール
JP2001264188A (ja) 2000-03-21 2001-09-26 Olympus Optical Co Ltd 半導体歪ゲージおよび半導体歪ゲージの製造方法
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JP2007059736A (ja) * 2005-08-26 2007-03-08 Citizen Watch Co Ltd 圧電振動子パッケージ及びその製造方法ならびに物理量センサ

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015064109A (ja) * 2007-06-26 2015-04-09 スウエイジロク・カンパニー 感知機能を有する導管接続
US9400070B2 (en) 2007-06-26 2016-07-26 Swagelok Company Conduit fitting with sensor on a threaded nut
US10295093B2 (en) 2007-06-26 2019-05-21 Swagelok Company Conduit connection with sensor on a threaded body
CN102934250A (zh) * 2010-03-17 2013-02-13 原子能及能源替代委员会 机械应力检测器
WO2013084294A1 (ja) * 2011-12-06 2013-06-13 株式会社日立製作所 力学量測定装置
JPWO2013084294A1 (ja) * 2011-12-06 2015-04-27 株式会社日立製作所 力学量測定装置
US9581427B2 (en) 2011-12-06 2017-02-28 Hitachi, Ltd. Mechanical quantity measuring device
US10578503B2 (en) 2015-03-06 2020-03-03 Swagelok Company System and methods for strain detection in a coupling
DE102015104410A1 (de) 2015-03-24 2016-09-29 Micronas Gmbh Drucksensor
DE102015104410B4 (de) 2015-03-24 2018-09-13 Tdk-Micronas Gmbh Drucksensor
US10571347B2 (en) 2015-03-24 2020-02-25 Micronas Gmbh Pressure sensor comprising a sensor element arranged between two longitudinal grooves
US10976205B2 (en) 2015-09-30 2021-04-13 Hitachi Automotive Systems, Ltd. Dynamic quantity measuring apparatus having a strain sensor disposed in a groove

Also Published As

Publication number Publication date
KR20100049071A (ko) 2010-05-11
US20110227178A1 (en) 2011-09-22
CN101802541B (zh) 2013-08-07
CN101802541A (zh) 2010-08-11
KR101151125B1 (ko) 2012-06-01
EP2184576A1 (en) 2010-05-12
TW200914808A (en) 2009-04-01
EP2184576A4 (en) 2014-10-01
EP2184576B1 (en) 2019-05-15
US8438931B2 (en) 2013-05-14

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