DE602007013484D1 - Spannungsisolierter Drucksensorchip - Google Patents

Spannungsisolierter Drucksensorchip

Info

Publication number
DE602007013484D1
DE602007013484D1 DE602007013484T DE602007013484T DE602007013484D1 DE 602007013484 D1 DE602007013484 D1 DE 602007013484D1 DE 602007013484 T DE602007013484 T DE 602007013484T DE 602007013484 T DE602007013484 T DE 602007013484T DE 602007013484 D1 DE602007013484 D1 DE 602007013484D1
Authority
DE
Germany
Prior art keywords
sensing
base
diaphragm
pedestal
linking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007013484T
Other languages
English (en)
Inventor
Amnon Brosh
Sebastiano Brida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auxitrol SA
Original Assignee
Auxitrol SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auxitrol SA filed Critical Auxitrol SA
Publication of DE602007013484D1 publication Critical patent/DE602007013484D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support

Landscapes

  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE602007013484T 2006-02-27 2007-02-27 Spannungsisolierter Drucksensorchip Active DE602007013484D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77683306P 2006-02-27 2006-02-27

Publications (1)

Publication Number Publication Date
DE602007013484D1 true DE602007013484D1 (de) 2011-05-12

Family

ID=38180344

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007013484T Active DE602007013484D1 (de) 2006-02-27 2007-02-27 Spannungsisolierter Drucksensorchip

Country Status (4)

Country Link
US (1) US7475597B2 (de)
EP (1) EP1826543B1 (de)
AT (1) ATE503988T1 (de)
DE (1) DE602007013484D1 (de)

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US20080277747A1 (en) * 2007-05-08 2008-11-13 Nazir Ahmad MEMS device support structure for sensor packaging
CN101960276B (zh) * 2007-10-30 2013-07-03 阿自倍尔株式会社 压力传感器及其制造方法
WO2009108230A1 (en) * 2007-12-13 2009-09-03 The Timken Company Sensor module with stress isolated temperature compensation and method of manufacture
JP5291979B2 (ja) 2008-04-24 2013-09-18 株式会社フジクラ 圧力センサ及びその製造方法と、該圧力センサを備えた電子部品
JP5331546B2 (ja) 2008-04-24 2013-10-30 株式会社フジクラ 圧力センサモジュール及び電子部品
US8643127B2 (en) * 2008-08-21 2014-02-04 S3C, Inc. Sensor device packaging
US9354132B2 (en) 2009-02-12 2016-05-31 Continental Automotive Systems, Inc. Jointless pressure sensor port
US8365605B2 (en) * 2009-02-12 2013-02-05 Continental Automotive Systems, Inc. Jointless pressure sensor port
US7775119B1 (en) * 2009-03-03 2010-08-17 S3C, Inc. Media-compatible electrically isolated pressure sensor for high temperature applications
US8614491B2 (en) * 2009-04-07 2013-12-24 Honeywell International Inc. Package interface plate for package isolation structures
DE102010001711A1 (de) * 2010-02-09 2011-08-11 Robert Bosch GmbH, 70469 Halbleiter-Bauelement und entsprechendes Herstellungsverfahren
JP2012018049A (ja) * 2010-07-07 2012-01-26 Yamatake Corp 圧力測定器
US9258634B2 (en) * 2010-07-30 2016-02-09 Invensense, Inc. Microphone system with offset apertures
US9131325B2 (en) 2010-08-31 2015-09-08 Freescale Semiconductor, Inc. MEMS device assembly and method of packaging same
US8304275B2 (en) 2010-08-31 2012-11-06 Freescale Semiconductor, Inc. MEMS device assembly and method of packaging same
US8171800B1 (en) * 2011-01-25 2012-05-08 Continental Automotive Systems, Inc. Differential pressure sensor using dual backside absolute pressure sensing
JP5915103B2 (ja) * 2011-11-11 2016-05-11 セイコーエプソン株式会社 物理量検出器
US8889451B2 (en) 2012-02-21 2014-11-18 Freescale Semiconductor, Inc. MEMS pressure transducer assembly and method of packaging same
US8516897B1 (en) 2012-02-21 2013-08-27 Honeywell International Inc. Pressure sensor
US8813580B2 (en) * 2012-03-05 2014-08-26 Honeywell International Inc. Apparatus and processes for silicon on insulator MEMS pressure sensors
US9010190B2 (en) * 2012-04-20 2015-04-21 Rosemount Aerospace Inc. Stress isolated MEMS structures and methods of manufacture
US8820170B2 (en) 2012-09-14 2014-09-02 Sensata Technologies, Inc. Pressure sensor
US9027410B2 (en) 2012-09-14 2015-05-12 Sensata Technologies, Inc. Hermetically glass sealed pressure sensor
US9402138B2 (en) 2012-10-12 2016-07-26 Infineon Technologies Ag MEMS device and method of manufacturing a MEMS device
US8701496B1 (en) 2013-02-27 2014-04-22 Honeywell International Inc. Systems and methods for a pressure sensor having a two layer die structure
US10151647B2 (en) 2013-06-19 2018-12-11 Honeywell International Inc. Integrated SOI pressure sensor having silicon stress isolation member
TW201507735A (zh) 2013-08-16 2015-03-01 Ind Tech Res Inst 電漿產生裝置、應用其之表面處理方法與生物組織表面處理方法
US9470593B2 (en) 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
US9316552B2 (en) * 2014-02-28 2016-04-19 Measurement Specialties, Inc. Differential pressure sensing die
US9506827B2 (en) * 2014-10-15 2016-11-29 Dunan Sensing Llc Pressure sensors and methods of making the same
DE102015117736A1 (de) * 2015-10-19 2017-04-20 Endress+Hauser Gmbh+Co. Kg Druckmesseinrichtung
DE102015121401A1 (de) * 2015-12-09 2017-06-14 ETO SENSORIC GmbH Drucksensorvorrichtung
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (de) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Verfahren zur herstellung eines drucksensors
DE102017203384B3 (de) * 2017-03-02 2018-01-18 Robert Bosch Gmbh Mikromechanischer Drucksensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10444090B2 (en) 2017-05-15 2019-10-15 Honeywell International Inc. System and method for securing sense die in force sensor
US10323998B2 (en) 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
US10781094B2 (en) * 2017-10-23 2020-09-22 Te Connectivity Corporation Pressure sensor assembly mounted to a ceramic substrate
US11015994B2 (en) * 2018-08-22 2021-05-25 Rosemount Aerospace Inc. Differential MEMS pressure sensors with a ceramic header body and methods of making differential MEMS pressure sensors
US11118992B2 (en) * 2019-06-06 2021-09-14 Measurement Specialties, Inc. Pressure sensor assemblies with protective pressure feature
US11656138B2 (en) 2020-06-19 2023-05-23 Rosemount Inc. Pressure sensor assembly
CN115235515B (zh) * 2022-09-20 2023-04-14 冰零智能科技(常州)有限公司 一种传感器及其制备方法

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US4237775A (en) * 1978-08-21 1980-12-09 Gould Inc. Diaphragm for pressure sensors
US4800758A (en) * 1986-06-23 1989-01-31 Rosemount Inc. Pressure transducer with stress isolation for hard mounting
US4930929A (en) * 1989-09-26 1990-06-05 Honeywell Inc. Glass tube/stainless steel header interface for pressure sensor
US5587601A (en) * 1995-06-05 1996-12-24 Kulite Semiconductor Products, Inc. Support structure for a semiconductor pressure transducer
WO1997039320A1 (de) 1996-04-13 1997-10-23 Robert Bosch Gmbh Drucksensor
US5945605A (en) * 1997-11-19 1999-08-31 Sensym, Inc. Sensor assembly with sensor boss mounted on substrate
US6093579A (en) * 1998-06-01 2000-07-25 Exar Corporation Low pressure sensor with a thin boss and method of manufacture
EP1269136A1 (de) 2000-03-14 2003-01-02 Austria Wirtschaftsservice Gesellschaft mit beschränkter Haftung Differenzdruck-messzelle
US6528340B2 (en) * 2001-01-03 2003-03-04 Honeywell International Inc. Pressure transducer with composite diaphragm
US6822318B2 (en) * 2001-05-14 2004-11-23 Lightconnect, Inc. Stress isolating die attach structure and method
DE10349540A1 (de) 2003-10-22 2005-05-25 Endress + Hauser Gmbh + Co. Kg Halbleiterdrucksensor und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
EP1826543A3 (de) 2008-05-14
US20080006092A1 (en) 2008-01-10
US7475597B2 (en) 2009-01-13
EP1826543A2 (de) 2007-08-29
ATE503988T1 (de) 2011-04-15
EP1826543B1 (de) 2011-03-30

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