WO2009028241A1 - 異方性導電フィルム及びそれを用いた接続構造体の製造方法 - Google Patents

異方性導電フィルム及びそれを用いた接続構造体の製造方法 Download PDF

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Publication number
WO2009028241A1
WO2009028241A1 PCT/JP2008/059187 JP2008059187W WO2009028241A1 WO 2009028241 A1 WO2009028241 A1 WO 2009028241A1 JP 2008059187 W JP2008059187 W JP 2008059187W WO 2009028241 A1 WO2009028241 A1 WO 2009028241A1
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WO
WIPO (PCT)
Prior art keywords
electroconductive film
anisotropic electroconductive
connection structure
anisotropic
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059187
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English (en)
French (fr)
Inventor
Daisuke Sato
Hiroki Ozeki
Tomoyuki Ishimatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to KR1020107006307A priority Critical patent/KR101488050B1/ko
Priority to US12/674,987 priority patent/US20110120767A1/en
Priority to CN2008801128683A priority patent/CN101836334B/zh
Priority to HK10110474.2A priority patent/HK1143896B/xx
Publication of WO2009028241A1 publication Critical patent/WO2009028241A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

　高い接続信頼性を得ることができる異方性導電フィルム及びそれを用いた接続構造体の製造方法を提供する。ポリブタジエン粒子と、カチオン重合性樹脂と、カチオン硬化剤とを配合した絶縁性接着樹脂に導電性粒子が分散されてなり、最低溶融粘度が３００～１０００Ｐａ・ｓである異方性導電フィルム（２）をガラス基板（１）の端子電極上に配置し、異方性導電フィルム（２）上に、フレキシブルプリント基板（３）の端子電極を配置し、当該フレキシブルプリント基板側から加熱ツールを用いて押圧し、端子電極間を電気的に接続させる。
PCT/JP2008/059187 2007-08-24 2008-05-20 異方性導電フィルム及びそれを用いた接続構造体の製造方法 Ceased WO2009028241A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107006307A KR101488050B1 (ko) 2007-08-24 2008-05-20 이방성 도전 필름 및 그것을 이용한 접속 구조체의 제조 방법
US12/674,987 US20110120767A1 (en) 2007-08-24 2008-05-20 Anisotropic electrically conductive film and method for manufacturing connection assembly using the same
CN2008801128683A CN101836334B (zh) 2007-08-24 2008-05-20 各向异性导电膜及使用其的连接结构体的制造方法
HK10110474.2A HK1143896B (en) 2007-08-24 2008-05-20 Anisotropic electroconductive film, and process for producing connection structure using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007218863A JP5186157B2 (ja) 2007-08-24 2007-08-24 異方性導電フィルム及びそれを用いた接続構造体の製造方法
JP2007-218863 2007-08-24

Publications (1)

Publication Number Publication Date
WO2009028241A1 true WO2009028241A1 (ja) 2009-03-05

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ID=40386971

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059187 Ceased WO2009028241A1 (ja) 2007-08-24 2008-05-20 異方性導電フィルム及びそれを用いた接続構造体の製造方法

Country Status (6)

Country Link
US (1) US20110120767A1 (ja)
JP (1) JP5186157B2 (ja)
KR (1) KR101488050B1 (ja)
CN (1) CN101836334B (ja)
TW (1) TW200910488A (ja)
WO (1) WO2009028241A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102379166A (zh) * 2009-03-31 2012-03-14 索尼化学&信息部件株式会社 接合体及其制造方法
WO2013157378A1 (ja) * 2012-04-19 2013-10-24 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001910A1 (ja) * 2009-06-30 2011-01-06 東海ゴム工業株式会社 柔軟導電材料およびトランスデューサ
JP2011175846A (ja) * 2010-02-24 2011-09-08 Hitachi Chem Co Ltd 回路部材接続用接着フィルム、回路部材接続構造体及び回路部材接続構造体の製造方法
KR101362868B1 (ko) * 2010-12-29 2014-02-14 제일모직주식회사 이중층 이방성 도전성 필름
JP5596767B2 (ja) * 2011-11-02 2014-09-24 積水化学工業株式会社 異方性導電材料及び接続構造体
JP2013118181A (ja) * 2011-11-02 2013-06-13 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
KR101355855B1 (ko) * 2011-12-19 2014-01-29 제일모직주식회사 이방성 도전 필름
CN104541417B (zh) * 2012-08-29 2017-09-26 迪睿合电子材料有限公司 各向异性导电膜及其制备方法
KR101535600B1 (ko) * 2012-11-06 2015-07-09 제일모직주식회사 이방성 도전 필름 및 반도체 장치
JP6143552B2 (ja) * 2013-05-27 2017-06-07 デクセリアルズ株式会社 タッチパネル、及びタッチパネルの製造方法
WO2015046277A1 (ja) * 2013-09-25 2015-04-02 旭化成イーマテリアルズ株式会社 オニウム塩及びそれを含む組成物
JP6505423B2 (ja) * 2013-12-16 2019-04-24 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JP6661997B2 (ja) * 2015-11-26 2020-03-11 デクセリアルズ株式会社 異方性導電フィルム
WO2018180685A1 (ja) * 2017-03-30 2018-10-04 デクセリアルズ株式会社 異方性導電接着剤及び接続体の製造方法
CN107359426B (zh) * 2017-06-29 2021-12-07 业成科技（成都）有限公司 电连接结构及软性电路板
CN109389903B (zh) * 2017-08-04 2021-01-29 京东方科技集团股份有限公司 柔性基板及其加工方法、加工系统
JP7159626B2 (ja) 2018-06-07 2022-10-25 Tdk株式会社 超音波接合装置および超音波接合方法
JP7273283B2 (ja) * 2018-09-10 2023-05-15 デクセリアルズ株式会社 接着剤組成物
KR102229483B1 (ko) * 2020-11-17 2021-03-17 신종천 신호 전송 커넥터

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345517A (ja) * 1998-06-02 1999-12-14 Toshiba Chem Corp 異方性導電接着剤
JP2001267369A (ja) * 2000-03-17 2001-09-28 Hitachi Cable Ltd 異方性導電シートおよびこれを用いた半導体装置ならびに異方性導電シートの製造方法
JP2001266669A (ja) * 2000-03-17 2001-09-28 Hitachi Cable Ltd 異方性導電シートの製造方法
JP2004241489A (ja) * 2003-02-04 2004-08-26 Sekisui Chem Co Ltd 異方導電性光後硬化型ペースト、それを用いた電気部品の接合方法及び電気部品
JP2005056736A (ja) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd 異方導電性膜の製造方法、それにより得られる異方導電性膜及びそれを用いた回路接続方法
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
JP2006127956A (ja) * 2004-10-29 2006-05-18 Hitachi Chem Co Ltd 異方導電フィルム、異方導電フィルムの製造方法、これを用いた接続体および半導体装置
JP2006328359A (ja) * 2005-04-15 2006-12-07 Dainippon Ink & Chem Inc エポキシ樹脂組成物、その硬化物、半導体封止材料、新規エポキシ樹脂、新規多価ヒドロキシ化合物、及びその製造方法
JP2007080522A (ja) * 2005-09-09 2007-03-29 Sumitomo Bakelite Co Ltd 異方導電性フィルムおよび電子・電機機器
JP2007204652A (ja) * 2006-02-03 2007-08-16 Sony Chemical & Information Device Corp 熱硬化型接着剤
JP2007217503A (ja) * 2006-02-15 2007-08-30 Asahi Kasei Electronics Co Ltd 異方導電性接着フィルム
WO2007123003A1 (ja) * 2006-04-12 2007-11-01 Hitachi Chemical Company, Ltd. 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法
WO2007125993A1 (ja) * 2006-04-27 2007-11-08 Asahi Kasei Emd Corporation 導電粒子配置シート及び異方導電性フィルム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4690957A (en) * 1986-02-27 1987-09-01 Mitsubishi Denki Kabushiki Kaisha Ultra-violet ray curing type resin composition
JP3477367B2 (ja) * 1998-05-12 2003-12-10 ソニーケミカル株式会社 異方導電性接着フィルム
JP3372511B2 (ja) * 1999-08-09 2003-02-04 ソニーケミカル株式会社 半導体素子の実装方法及び実装装置
TW200516126A (en) * 2003-06-23 2005-05-16 Toray Industries Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345517A (ja) * 1998-06-02 1999-12-14 Toshiba Chem Corp 異方性導電接着剤
JP2001267369A (ja) * 2000-03-17 2001-09-28 Hitachi Cable Ltd 異方性導電シートおよびこれを用いた半導体装置ならびに異方性導電シートの製造方法
JP2001266669A (ja) * 2000-03-17 2001-09-28 Hitachi Cable Ltd 異方性導電シートの製造方法
JP2004241489A (ja) * 2003-02-04 2004-08-26 Sekisui Chem Co Ltd 異方導電性光後硬化型ペースト、それを用いた電気部品の接合方法及び電気部品
JP2005056736A (ja) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd 異方導電性膜の製造方法、それにより得られる異方導電性膜及びそれを用いた回路接続方法
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
JP2006127956A (ja) * 2004-10-29 2006-05-18 Hitachi Chem Co Ltd 異方導電フィルム、異方導電フィルムの製造方法、これを用いた接続体および半導体装置
JP2006328359A (ja) * 2005-04-15 2006-12-07 Dainippon Ink & Chem Inc エポキシ樹脂組成物、その硬化物、半導体封止材料、新規エポキシ樹脂、新規多価ヒドロキシ化合物、及びその製造方法
JP2007080522A (ja) * 2005-09-09 2007-03-29 Sumitomo Bakelite Co Ltd 異方導電性フィルムおよび電子・電機機器
JP2007204652A (ja) * 2006-02-03 2007-08-16 Sony Chemical & Information Device Corp 熱硬化型接着剤
JP2007217503A (ja) * 2006-02-15 2007-08-30 Asahi Kasei Electronics Co Ltd 異方導電性接着フィルム
WO2007123003A1 (ja) * 2006-04-12 2007-11-01 Hitachi Chemical Company, Ltd. 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法
WO2007125993A1 (ja) * 2006-04-27 2007-11-08 Asahi Kasei Emd Corporation 導電粒子配置シート及び異方導電性フィルム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102379166A (zh) * 2009-03-31 2012-03-14 索尼化学&信息部件株式会社 接合体及其制造方法
CN105282994A (zh) * 2009-03-31 2016-01-27 迪睿合电子材料有限公司 接合体及其制造方法
CN105282994B (zh) * 2009-03-31 2021-05-11 迪睿合电子材料有限公司 接合体及其制造方法
WO2013157378A1 (ja) * 2012-04-19 2013-10-24 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
JP2013221144A (ja) * 2012-04-19 2013-10-28 Dexerials Corp 回路接続材料、及びこれを用いた実装体の製造方法

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CN101836334A (zh) 2010-09-15
HK1143896A1 (en) 2011-01-14
JP5186157B2 (ja) 2013-04-17
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CN101836334B (zh) 2013-07-10
JP2009054377A (ja) 2009-03-12

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