CN101836334A - 各向异性导电膜及使用其的连接结构体的制造方法 - Google Patents
各向异性导电膜及使用其的连接结构体的制造方法 Download PDFInfo
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- CN101836334A CN101836334A CN200880112868A CN200880112868A CN101836334A CN 101836334 A CN101836334 A CN 101836334A CN 200880112868 A CN200880112868 A CN 200880112868A CN 200880112868 A CN200880112868 A CN 200880112868A CN 101836334 A CN101836334 A CN 101836334A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
样品 | 最低熔融粘度(Pa·s) | 达到最低熔融粘度的温度(℃) | DSC的峰温度(℃) |
实施例1 | 700 | 100 | 115 |
实施例2 | 700 | 100 | 115 |
实施例3 | 700 | 100 | 115 |
实施例4 | 300 | 100 | 115 |
实施例5 | 350 | 97 | 114 |
实施例6 | 1000 | 100 | 115 |
实施例7 | 800 | 100 | 115 |
样品 | 最低熔融粘度(Pa·s) | 达到最低熔融粘度的温度(℃) | DSC的峰温度(℃) |
比较例1 | 1100 | 100 | 115 |
比较例2 | 90 | 100 | 115 |
比较例3 | 200 | 107 | 121 |
比较例4 | 800 | 100 | 115 |
比较例5 | - | - | - |
样品 | 导通电阻(Ω) | 粘接强度(N/cm) |
实施例1 | 3.3 | 5 |
实施例2 | 3.2 | 5 |
实施例3 | 3.3 | 5 |
实施例4 | 3.5 | 5 |
实施例5 | 3.2 | 5 |
实施例6 | 3.2 | 5 |
实施例7 | 5.2 | 5 |
比较例1 | 3.8 | 3以下 |
比较例2 | 30 | 5 |
比较例3 | 50 | 3以下 |
样品 | 导通电阻(Ω) | 粘接强度(N/cm) |
比较例4 | 3.5 | 3以下 |
比较例5 | 50 | 3以下 |
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-218863 | 2007-08-24 | ||
JP2007218863A JP5186157B2 (ja) | 2007-08-24 | 2007-08-24 | 異方性導電フィルム及びそれを用いた接続構造体の製造方法 |
PCT/JP2008/059187 WO2009028241A1 (ja) | 2007-08-24 | 2008-05-20 | 異方性導電フィルム及びそれを用いた接続構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101836334A true CN101836334A (zh) | 2010-09-15 |
CN101836334B CN101836334B (zh) | 2013-07-10 |
Family
ID=40386971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008801128683A Active CN101836334B (zh) | 2007-08-24 | 2008-05-20 | 各向异性导电膜及使用其的连接结构体的制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110120767A1 (zh) |
JP (1) | JP5186157B2 (zh) |
KR (1) | KR101488050B1 (zh) |
CN (1) | CN101836334B (zh) |
HK (1) | HK1143896A1 (zh) |
TW (1) | TW200910488A (zh) |
WO (1) | WO2009028241A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103160221A (zh) * | 2011-12-19 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜和通过该膜结合的半导体装置 |
CN103160219A (zh) * | 2011-12-14 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜组合物、各向异性导电膜和半导体装置 |
CN104508062B (zh) * | 2012-04-19 | 2017-02-22 | 迪睿合电子材料有限公司 | 电路连接材料及使用其的安装体的制备方法 |
CN107189562A (zh) * | 2012-08-29 | 2017-09-22 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制备方法 |
CN107359426A (zh) * | 2017-06-29 | 2017-11-17 | 业成科技(成都)有限公司 | 电连接结构及软性电路板 |
TWI703585B (zh) * | 2015-07-13 | 2020-09-01 | 日商迪睿合股份有限公司 | 異向性導電膜及連接構造體 |
CN112566995A (zh) * | 2018-09-10 | 2021-03-26 | 迪睿合株式会社 | 粘接剂组合物 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5140816B2 (ja) * | 2009-03-31 | 2013-02-13 | デクセリアルズ株式会社 | 接合体及びその製造方法 |
WO2011001910A1 (ja) * | 2009-06-30 | 2011-01-06 | 東海ゴム工業株式会社 | 柔軟導電材料およびトランスデューサ |
JP2011175846A (ja) * | 2010-02-24 | 2011-09-08 | Hitachi Chem Co Ltd | 回路部材接続用接着フィルム、回路部材接続構造体及び回路部材接続構造体の製造方法 |
KR101362868B1 (ko) * | 2010-12-29 | 2014-02-14 | 제일모직주식회사 | 이중층 이방성 도전성 필름 |
JP5596767B2 (ja) * | 2011-11-02 | 2014-09-24 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
JP2013118181A (ja) * | 2011-11-02 | 2013-06-13 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
KR101535600B1 (ko) * | 2012-11-06 | 2015-07-09 | 제일모직주식회사 | 이방성 도전 필름 및 반도체 장치 |
JP6143552B2 (ja) * | 2013-05-27 | 2017-06-07 | デクセリアルズ株式会社 | タッチパネル、及びタッチパネルの製造方法 |
WO2015046277A1 (ja) * | 2013-09-25 | 2015-04-02 | 旭化成イーマテリアルズ株式会社 | オニウム塩及びそれを含む組成物 |
JP6505423B2 (ja) * | 2013-12-16 | 2019-04-24 | デクセリアルズ株式会社 | 実装体の製造方法、及び異方性導電フィルム |
WO2018180685A1 (ja) * | 2017-03-30 | 2018-10-04 | デクセリアルズ株式会社 | 異方性導電接着剤及び接続体の製造方法 |
CN109389903B (zh) * | 2017-08-04 | 2021-01-29 | 京东方科技集团股份有限公司 | 柔性基板及其加工方法、加工系统 |
JP7159626B2 (ja) | 2018-06-07 | 2022-10-25 | Tdk株式会社 | 超音波接合装置および超音波接合方法 |
KR102229483B1 (ko) * | 2020-11-17 | 2021-03-17 | 신종천 | 신호 전송 커넥터 |
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US4690957A (en) * | 1986-02-27 | 1987-09-01 | Mitsubishi Denki Kabushiki Kaisha | Ultra-violet ray curing type resin composition |
JP3477367B2 (ja) * | 1998-05-12 | 2003-12-10 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
JPH11345517A (ja) * | 1998-06-02 | 1999-12-14 | Toshiba Chem Corp | 異方性導電接着剤 |
JP3372511B2 (ja) * | 1999-08-09 | 2003-02-04 | ソニーケミカル株式会社 | 半導体素子の実装方法及び実装装置 |
JP2001266669A (ja) * | 2000-03-17 | 2001-09-28 | Hitachi Cable Ltd | 異方性導電シートの製造方法 |
JP2001267369A (ja) * | 2000-03-17 | 2001-09-28 | Hitachi Cable Ltd | 異方性導電シートおよびこれを用いた半導体装置ならびに異方性導電シートの製造方法 |
JP2004241489A (ja) * | 2003-02-04 | 2004-08-26 | Sekisui Chem Co Ltd | 異方導電性光後硬化型ペースト、それを用いた電気部品の接合方法及び電気部品 |
TW200516126A (en) * | 2003-06-23 | 2005-05-16 | Toray Industries | Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition |
JP4281457B2 (ja) * | 2003-08-06 | 2009-06-17 | 日立化成工業株式会社 | 異方導電性膜の製造方法、それにより得られる異方導電性膜及びそれを用いた回路接続方法 |
JP2005194413A (ja) * | 2004-01-08 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
JP2006024751A (ja) * | 2004-07-08 | 2006-01-26 | Three M Innovative Properties Co | 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 |
JP4555943B2 (ja) * | 2004-10-29 | 2010-10-06 | 日立化成工業株式会社 | 異方導電フィルム、異方導電フィルムの製造方法、これを用いた接続体および半導体装置 |
JP5354237B2 (ja) * | 2005-04-15 | 2013-11-27 | Dic株式会社 | エポキシ樹脂組成物、その硬化物、半導体封止材料、新規エポキシ樹脂、新規多価ヒドロキシ化合物、及びその製造方法 |
JP4887700B2 (ja) * | 2005-09-09 | 2012-02-29 | 住友ベークライト株式会社 | 異方導電性フィルムおよび電子・電機機器 |
JP5099289B2 (ja) * | 2006-02-03 | 2012-12-19 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱硬化型接着剤 |
JP2007217503A (ja) * | 2006-02-15 | 2007-08-30 | Asahi Kasei Electronics Co Ltd | 異方導電性接着フィルム |
CN101901972B (zh) * | 2006-04-12 | 2012-07-04 | 日立化成工业株式会社 | 电路连接用粘接膜、电路部件的连接结构以及电路部件的连接方法 |
KR101115271B1 (ko) * | 2006-04-27 | 2012-07-12 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 도전 입자 배치 시트 및 이방성 도전 필름 |
-
2007
- 2007-08-24 JP JP2007218863A patent/JP5186157B2/ja active Active
-
2008
- 2008-05-20 US US12/674,987 patent/US20110120767A1/en not_active Abandoned
- 2008-05-20 KR KR1020107006307A patent/KR101488050B1/ko active IP Right Grant
- 2008-05-20 WO PCT/JP2008/059187 patent/WO2009028241A1/ja active Application Filing
- 2008-05-20 CN CN2008801128683A patent/CN101836334B/zh active Active
- 2008-05-23 TW TW097119111A patent/TW200910488A/zh not_active IP Right Cessation
-
2010
- 2010-11-10 HK HK10110474.2A patent/HK1143896A1/xx unknown
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103160219A (zh) * | 2011-12-14 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜组合物、各向异性导电膜和半导体装置 |
TWI482793B (zh) * | 2011-12-14 | 2015-05-01 | Cheil Ind Inc | 各向異性導電膜及半導體裝置 |
CN103160219B (zh) * | 2011-12-14 | 2015-09-23 | 第一毛织株式会社 | 各向异性导电膜组合物、各向异性导电膜和半导体装置 |
CN103160221A (zh) * | 2011-12-19 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜和通过该膜结合的半导体装置 |
CN103160221B (zh) * | 2011-12-19 | 2015-04-08 | 第一毛织株式会社 | 各向异性导电膜和通过该膜结合的半导体装置 |
CN104508062B (zh) * | 2012-04-19 | 2017-02-22 | 迪睿合电子材料有限公司 | 电路连接材料及使用其的安装体的制备方法 |
CN107189562A (zh) * | 2012-08-29 | 2017-09-22 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制备方法 |
CN107189562B (zh) * | 2012-08-29 | 2021-01-19 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制备方法 |
TWI703585B (zh) * | 2015-07-13 | 2020-09-01 | 日商迪睿合股份有限公司 | 異向性導電膜及連接構造體 |
CN107359426A (zh) * | 2017-06-29 | 2017-11-17 | 业成科技(成都)有限公司 | 电连接结构及软性电路板 |
CN107359426B (zh) * | 2017-06-29 | 2021-12-07 | 业成科技(成都)有限公司 | 电连接结构及软性电路板 |
CN112566995A (zh) * | 2018-09-10 | 2021-03-26 | 迪睿合株式会社 | 粘接剂组合物 |
Also Published As
Publication number | Publication date |
---|---|
TW200910488A (en) | 2009-03-01 |
KR101488050B1 (ko) | 2015-01-29 |
US20110120767A1 (en) | 2011-05-26 |
KR20100044916A (ko) | 2010-04-30 |
CN101836334B (zh) | 2013-07-10 |
TWI371810B (zh) | 2012-09-01 |
HK1143896A1 (en) | 2011-01-14 |
WO2009028241A1 (ja) | 2009-03-05 |
JP5186157B2 (ja) | 2013-04-17 |
JP2009054377A (ja) | 2009-03-12 |
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