WO2009017200A1 - 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 - Google Patents

回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 Download PDF

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Publication number
WO2009017200A1
WO2009017200A1 PCT/JP2008/063781 JP2008063781W WO2009017200A1 WO 2009017200 A1 WO2009017200 A1 WO 2009017200A1 JP 2008063781 W JP2008063781 W JP 2008063781W WO 2009017200 A1 WO2009017200 A1 WO 2009017200A1
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WIPO (PCT)
Prior art keywords
circuit
connection
connection material
circuit member
electroconductive particles
Prior art date
Application number
PCT/JP2008/063781
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English (en)
French (fr)
Inventor
Katsuhiko Tomisaka
Kouji Kobayashi
Jun Taketatsu
Motohiro Arifuku
Kazuyoshi Kojima
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Company, Ltd.
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Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020137016319A priority Critical patent/KR20130088187A/ko
Priority to US12/671,804 priority patent/US20110267791A1/en
Priority to KR1020107004375A priority patent/KR101302778B1/ko
Priority to JP2009525451A priority patent/JP5316410B2/ja
Priority to CN2008800220733A priority patent/CN101689410B/zh
Priority to EP08791996A priority patent/EP2178094A4/en
Publication of WO2009017200A1 publication Critical patent/WO2009017200A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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Abstract

　接着剤組成物１１と導電粒子１２とを含有する回路接続材料１０であって、導電粒子１２は、核体２１上に１又は２以上の金属層２２を備えて成る、突起１４を有する導電粒子１２であり、少なくとも突起１４の表面には金属層２２が形成され、該金属層２２はニッケル又はニッケル合金から構成され、導電粒子１２の２０％圧縮時の圧縮弾性率は、１００～８００ｋｇｆ／ｍｍ２である、回路接続材料１０。
PCT/JP2008/063781 2007-08-02 2008-07-31 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法 WO2009017200A1 (ja)

Priority Applications (6)

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KR1020137016319A KR20130088187A (ko) 2007-08-02 2008-07-31 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법
US12/671,804 US20110267791A1 (en) 2007-08-02 2008-07-31 Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
KR1020107004375A KR101302778B1 (ko) 2007-08-02 2008-07-31 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법
JP2009525451A JP5316410B2 (ja) 2007-08-02 2008-07-31 回路部材の接続構造
CN2008800220733A CN101689410B (zh) 2007-08-02 2008-07-31 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法
EP08791996A EP2178094A4 (en) 2007-08-02 2008-07-31 SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL

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JP2007-201800 2007-08-02
JP2007201800 2007-08-02

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US (1) US20110267791A1 (ja)
EP (1) EP2178094A4 (ja)
JP (2) JP5316410B2 (ja)
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CN (2) CN101689410B (ja)
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JP2015057757A (ja) * 2013-08-09 2015-03-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2017126463A (ja) * 2016-01-13 2017-07-20 株式会社山王 導電性微粒子及び導電性微粒子の製造方法
WO2017142086A1 (ja) * 2016-02-18 2017-08-24 積水化学工業株式会社 電気モジュール及び電気モジュールの製造方法
JP2021509526A (ja) * 2017-12-29 2021-03-25 ククド ケミカル カンパニー リミテッド 異方導電性フィルム、これを含むディスプレイ装置及び／又はこれを含む半導体装置

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JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
KR101151366B1 (ko) 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
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JP2016009087A (ja) * 2014-06-24 2016-01-18 セイコーエプソン株式会社 表示装置および表示装置の製造方法
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CN101689410A (zh) 2010-03-31
US20110267791A1 (en) 2011-11-03
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TW200929266A (en) 2009-07-01
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CN103484035A (zh) 2014-01-01
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TWI396205B (zh) 2013-05-11
EP2178094A1 (en) 2010-04-21

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