WO2009008217A1 - 層間接続導体用孔の形成方法、樹脂基板及び部品内蔵基板の製造方法、並びに樹脂基板及び部品内蔵基板 - Google Patents

層間接続導体用孔の形成方法、樹脂基板及び部品内蔵基板の製造方法、並びに樹脂基板及び部品内蔵基板 Download PDF

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Publication number
WO2009008217A1
WO2009008217A1 PCT/JP2008/059107 JP2008059107W WO2009008217A1 WO 2009008217 A1 WO2009008217 A1 WO 2009008217A1 JP 2008059107 W JP2008059107 W JP 2008059107W WO 2009008217 A1 WO2009008217 A1 WO 2009008217A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
built
components
interlayer connection
resin substrate
Prior art date
Application number
PCT/JP2008/059107
Other languages
English (en)
French (fr)
Inventor
Yasuyuki Sekimoto
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2009522551A priority Critical patent/JP4840508B2/ja
Publication of WO2009008217A1 publication Critical patent/WO2009008217A1/ja
Priority to US12/647,566 priority patent/US8570763B2/en
Priority to US13/597,289 priority patent/US20120321814A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82035—Reshaping, e.g. forming vias by heating means
    • H01L2224/82039—Reshaping, e.g. forming vias by heating means using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

【課題】面内電極と層間接続導体との接続が十分確保された品質の高い部品内蔵基板を安価に製造する。 【解決手段】コア基板１１に面内電極１２を形成する工程と、面内電極１２上に後工程で施されるレーザ光を反射するための光反射導体１６を形成する工程と、コア基板１１、面内電極１２及び光反射導体１６を覆うように樹脂層１５を形成する工程と、光反射導体１６上の樹脂層１５をレーザ光で除去することにより層間接続導体用孔１７を形成する工程と、を有する樹脂基板の層間接続導体用孔の形成方法である。
PCT/JP2008/059107 2007-07-06 2008-05-19 層間接続導体用孔の形成方法、樹脂基板及び部品内蔵基板の製造方法、並びに樹脂基板及び部品内蔵基板 WO2009008217A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009522551A JP4840508B2 (ja) 2007-07-06 2008-05-19 樹脂基板及び部品内蔵基板の製造方法、並びに樹脂基板及び部品内蔵基板
US12/647,566 US8570763B2 (en) 2007-07-06 2009-12-28 Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate
US13/597,289 US20120321814A1 (en) 2007-07-06 2012-08-29 Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-178437 2007-07-06
JP2007178437 2007-07-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/647,566 Continuation US8570763B2 (en) 2007-07-06 2009-12-28 Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate

Publications (1)

Publication Number Publication Date
WO2009008217A1 true WO2009008217A1 (ja) 2009-01-15

Family

ID=40228398

Family Applications (1)

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PCT/JP2008/059107 WO2009008217A1 (ja) 2007-07-06 2008-05-19 層間接続導体用孔の形成方法、樹脂基板及び部品内蔵基板の製造方法、並びに樹脂基板及び部品内蔵基板

Country Status (4)

Country Link
US (2) US8570763B2 (ja)
JP (1) JP4840508B2 (ja)
TW (1) TWI455672B (ja)
WO (1) WO2009008217A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134262A1 (ja) * 2009-05-20 2010-11-25 株式会社村田製作所 部品内蔵層を有する電子部品モジュールの製造方法
WO2011062252A1 (ja) * 2009-11-19 2011-05-26 株式会社村田製作所 部品内蔵モジュールの製造方法および部品内蔵モジュール
US8637892B2 (en) 2010-01-29 2014-01-28 Kabushiki Kaisha Toshiba LED package and method for manufacturing same

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JP5405339B2 (ja) * 2010-02-03 2014-02-05 日本メクトロン株式会社 配線回路基板及びその製造方法
JP5692217B2 (ja) * 2010-03-16 2015-04-01 日本電気株式会社 機能素子内蔵基板
US9576873B2 (en) * 2011-12-14 2017-02-21 STATS ChipPAC Pte. Ltd. Integrated circuit packaging system with routable trace and method of manufacture thereof
KR101497192B1 (ko) 2012-12-27 2015-02-27 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
KR101983168B1 (ko) 2014-04-08 2019-05-28 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US10356911B2 (en) * 2014-07-04 2019-07-16 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing the same
KR20160010246A (ko) 2014-07-17 2016-01-27 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
KR20160010960A (ko) * 2014-07-21 2016-01-29 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP6863244B2 (ja) * 2017-11-20 2021-04-21 株式会社村田製作所 電子部品および電子部品の製造方法

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JP2002271039A (ja) * 2001-03-13 2002-09-20 Canon Inc 多層基板及びその加工方法
JP2003188538A (ja) * 2001-12-18 2003-07-04 Murata Mfg Co Ltd 多層基板、および多層モジュール
JP2003243839A (ja) * 2002-02-14 2003-08-29 Sumitomo Heavy Ind Ltd レーザ加工方法及び多層配線基板
JP2006108163A (ja) * 2004-09-30 2006-04-20 Toppan Printing Co Ltd プリント配線板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134262A1 (ja) * 2009-05-20 2010-11-25 株式会社村田製作所 部品内蔵層を有する電子部品モジュールの製造方法
WO2011062252A1 (ja) * 2009-11-19 2011-05-26 株式会社村田製作所 部品内蔵モジュールの製造方法および部品内蔵モジュール
JP5354224B2 (ja) * 2009-11-19 2013-11-27 株式会社村田製作所 部品内蔵モジュールの製造方法
US8637892B2 (en) 2010-01-29 2014-01-28 Kabushiki Kaisha Toshiba LED package and method for manufacturing same

Also Published As

Publication number Publication date
US8570763B2 (en) 2013-10-29
US20100101836A1 (en) 2010-04-29
TW200904290A (en) 2009-01-16
TWI455672B (zh) 2014-10-01
US20120321814A1 (en) 2012-12-20
JPWO2009008217A1 (ja) 2010-09-02
JP4840508B2 (ja) 2011-12-21

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