WO2009001665A1 - 金属表面粗化層を有する金属層積層体及びその製造方法 - Google Patents

金属表面粗化層を有する金属層積層体及びその製造方法 Download PDF

Info

Publication number
WO2009001665A1
WO2009001665A1 PCT/JP2008/060554 JP2008060554W WO2009001665A1 WO 2009001665 A1 WO2009001665 A1 WO 2009001665A1 JP 2008060554 W JP2008060554 W JP 2008060554W WO 2009001665 A1 WO2009001665 A1 WO 2009001665A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal layer
metal
layer laminate
resin
thin film
Prior art date
Application number
PCT/JP2008/060554
Other languages
English (en)
French (fr)
Inventor
Shiki Ueki
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Priority to KR1020107000551A priority Critical patent/KR101506226B1/ko
Priority to CN2008800221115A priority patent/CN101687390B/zh
Priority to US12/666,807 priority patent/US20100190029A1/en
Publication of WO2009001665A1 publication Critical patent/WO2009001665A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/704—Crystalline
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

　表面粗さが小さい場合であっても樹脂材料との密着性の高い表面性状を有する金属表面粗化層を備えた金属層積層体、並びに、金属層と樹脂基板又は樹脂絶縁膜等の樹脂材料との密着性に優れた金属層積層体の簡易な製造方法を提供する。 　金属層表面に樹脂薄膜及び金属表面粗化層を形成してなる金属層積層体であって、該金属積層体をその法線方向に割断した際に現れる樹脂薄膜と金属表面粗化層の界面構造がフラクタル状であり、測定対象領域を５０ｎｍ～５μｍ、且つ、ボックスサイズ（ピクセル・サイズ）を該測定対象領域の１/１００以下に設定したボックスカウント法を適用して算出した該界面構造のフラクタル次元が１．０５以上１．５０以下である金属層積層体である。該金属層積層体は、金属層表面に樹脂薄膜を形成する工程と、該樹脂薄膜付き金属層にめっき処理を行う工程とを有する製造方法により得ることができる。
PCT/JP2008/060554 2007-06-27 2008-06-09 金属表面粗化層を有する金属層積層体及びその製造方法 WO2009001665A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107000551A KR101506226B1 (ko) 2007-06-27 2008-06-09 금속 표면 조화층을 갖는 금속층 적층체 및 그 제조 방법
CN2008800221115A CN101687390B (zh) 2007-06-27 2008-06-09 具有金属表面粗糙化层的金属层叠层体制造方法
US12/666,807 US20100190029A1 (en) 2007-06-27 2008-06-09 Metal layer laminate having roughened metal surface layer and method for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007169204A JP5178064B2 (ja) 2007-06-27 2007-06-27 金属表面粗化層を有する金属層積層体及びその製造方法
JP2007-169204 2007-06-27

Publications (1)

Publication Number Publication Date
WO2009001665A1 true WO2009001665A1 (ja) 2008-12-31

Family

ID=40185486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060554 WO2009001665A1 (ja) 2007-06-27 2008-06-09 金属表面粗化層を有する金属層積層体及びその製造方法

Country Status (5)

Country Link
US (1) US20100190029A1 (ja)
JP (1) JP5178064B2 (ja)
KR (1) KR101506226B1 (ja)
CN (1) CN101687390B (ja)
WO (1) WO2009001665A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013047056A1 (ja) * 2011-09-30 2013-04-04 富士フイルム株式会社 貼り付け用銅箔
TWI605814B (zh) * 2010-03-11 2017-11-21 惠氏有限責任公司 甲基拿淬松（ｍｅｔｈｙｌｎａｌｔｒｅｘｏｎｅ）之口服製劑及親脂性鹽

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6144003B2 (ja) * 2011-08-29 2017-06-07 富士通株式会社 配線構造及びその製造方法並びに電子装置及びその製造方法
CN103287009B (zh) 2012-02-24 2015-03-25 比亚迪股份有限公司 一种铝合金树脂复合体的制备方法及其制备的铝合金树脂复合体
CN103286909B (zh) 2012-02-24 2015-09-30 比亚迪股份有限公司 一种金属树脂一体化成型方法和一种金属树脂复合体
CN103286908B (zh) 2012-02-24 2015-09-30 比亚迪股份有限公司 一种金属树脂一体化成型方法和一种金属树脂复合体
CN103286910B (zh) 2012-02-24 2015-09-30 比亚迪股份有限公司 一种金属树脂一体化成型方法和一种金属树脂复合体
CN103286996B (zh) 2012-02-24 2015-03-25 比亚迪股份有限公司 一种铝合金树脂复合体的制备方法及其制备的铝合金树脂复合体
CN103297565B (zh) 2012-02-24 2015-07-22 比亚迪股份有限公司 一种手机壳体及其制备方法
CN103286995B (zh) 2012-02-24 2015-06-24 比亚迪股份有限公司 一种铝合金树脂复合体的制备方法及其制备的铝合金树脂复合体
WO2013178057A1 (en) 2012-05-28 2013-12-05 Shenzhen Byd Auto R&D Company Limited Metal composite and method of preparing the same, metal-resin composite and method of preparing the same
JP5914286B2 (ja) * 2012-09-28 2016-05-11 富士フイルム株式会社 電子モジュール
CN104746066B (zh) 2013-12-31 2017-07-04 比亚迪股份有限公司 一种金属与塑料的结合材料及其制备方法及制备的结合材料
JP6362337B2 (ja) * 2014-01-21 2018-07-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9679940B2 (en) * 2014-07-03 2017-06-13 Omnivision Technologies, Inc. Fractal-edge thin film and method of manufacture
US9382995B2 (en) * 2014-12-01 2016-07-05 Extreme Industrial Coatings, LLC Pulley for use with a non-synchronous drive belt
US12112896B2 (en) * 2019-02-20 2024-10-08 Panasonic Intellectual Property Management Co., Ltd. Film production method and electrode foil production method for producing layer containing metal oxide
JP7328671B2 (ja) * 2019-05-09 2023-08-17 ナミックス株式会社 積層体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0690087A (ja) * 1992-07-23 1994-03-29 Sony Corp 多層プリント配線板の製造方法
JPH08125337A (ja) * 1994-10-28 1996-05-17 Sony Corp 多層プリント配線板の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4752499A (en) 1985-05-16 1988-06-21 Ibiden Co. Ltd. Adhesive for electroless plating and method of preparation of circuit board using this adhesive
JPH0738215A (ja) * 1993-07-23 1995-02-07 Nippon Pillar Packing Co Ltd プリント配線板用基板
TW341022B (en) * 1995-11-29 1998-09-21 Nippon Electric Co Interconnection structures and method of making same
JP3735485B2 (ja) * 1998-09-09 2006-01-18 古河電気工業株式会社 樹脂フィルム付き銅箔、およびそれを用いた樹脂付き銅箔
CN100376386C (zh) * 2001-11-01 2008-03-26 荒川化学工业株式会社 聚酰亚胺-金属层压体和聚酰胺酰亚胺-金属层压体
JP4323308B2 (ja) 2002-12-27 2009-09-02 イーメックス株式会社 積層体の製造方法
AU2003296142A1 (en) * 2002-12-27 2004-07-29 Eamex Corporation Method for electroless plating
JP4226927B2 (ja) * 2003-02-18 2009-02-18 三井金属鉱業株式会社 キャパシタ層形成用の両面銅張積層板の製造方法
JP4872185B2 (ja) * 2003-05-06 2012-02-08 三菱瓦斯化学株式会社 金属張り積層体
JP4161904B2 (ja) * 2003-12-26 2008-10-08 松下電工株式会社 銅箔付き樹脂フィルム、銅箔付き樹脂シート、銅張り積層板
EP1975309B1 (en) * 2005-12-13 2012-01-11 Sumitomo Rubber Industries, Ltd. Rubber/cord composite and pneumatic tire using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0690087A (ja) * 1992-07-23 1994-03-29 Sony Corp 多層プリント配線板の製造方法
JPH08125337A (ja) * 1994-10-28 1996-05-17 Sony Corp 多層プリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI605814B (zh) * 2010-03-11 2017-11-21 惠氏有限責任公司 甲基拿淬松（ｍｅｔｈｙｌｎａｌｔｒｅｘｏｎｅ）之口服製劑及親脂性鹽
WO2013047056A1 (ja) * 2011-09-30 2013-04-04 富士フイルム株式会社 貼り付け用銅箔

Also Published As

Publication number Publication date
CN101687390A (zh) 2010-03-31
CN101687390B (zh) 2013-01-23
JP2009006557A (ja) 2009-01-15
JP5178064B2 (ja) 2013-04-10
KR101506226B1 (ko) 2015-03-26
KR20100035646A (ko) 2010-04-05
US20100190029A1 (en) 2010-07-29

Similar Documents

Publication Publication Date Title
WO2009001665A1 (ja) 金属表面粗化層を有する金属層積層体及びその製造方法
WO2008108255A1 (ja) 粘着剤層付き透明導電性フィルムおよびその製造方法
WO2011065796A3 (ko) 안티 글레어 글래스 제조 방법
EP2341566A3 (en) Barrier film composite, display apparatus including the barrier film composite, and method of manufacturing display apparatus including the barrier film composite
WO2009041659A1 (ja) 太陽電池
WO2007001977A3 (en) Systems and methods for roll-to-roll patterning
TW200708395A (en) Laminated body and process for producing the same
WO2005108108A3 (de) Sicherheitselement und Verfahren zu seiner Herstellung
WO2008054833A3 (en) Systems and methods for forming magnetic nanocomposite materials
JP2009006557A5 (ja)
WO2009061353A3 (en) Production of free-standing solid state layers by thermal processing of substrates with a polymer
WO2010027231A3 (ko) 리드 프레임 및 그 제조방법
TW200951499A (en) Anti-glare film, method of manufacturing the same, and display device
TW200603705A (en) Wiring board and method for producing the same
MY158913A (en) Material for electric contact and method of producing the same
WO2008093579A1 (ja) 積層体、基板の製造方法、基板および半導体装置
WO2009002644A3 (en) Methods of making hierarchical articles
JP2015509260A5 (ja)
WO2011090704A3 (en) Method for producing microstructured templates and their use in providing pinning enhancements in superconducting films deposited thereon
WO2010132522A3 (en) Multi-layer article for flexible printed circuits
WO2008114539A1 (ja) 無接着剤フレキシブルラミネート及びその製造方法
TW200746456A (en) Nitride-based semiconductor device and production method thereof
MY194439A (en) Copper terminal material having excellent insertion/removal properties and method for producing same
WO2009031276A1 (ja) Ｉｉｉ族窒化物構造体およびｉｉｉ族窒化物半導体微細柱状結晶の製造方法
WO2008111309A1 (ja) 認識マークおよび回路基板の製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880022111.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08765344

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12666807

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20107000551

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08765344

Country of ref document: EP

Kind code of ref document: A1