WO2008146542A1 - モールド、その製造方法および転写微細パターンを有する基材の製造方法 - Google Patents
モールド、その製造方法および転写微細パターンを有する基材の製造方法 Download PDFInfo
- Publication number
- WO2008146542A1 WO2008146542A1 PCT/JP2008/056984 JP2008056984W WO2008146542A1 WO 2008146542 A1 WO2008146542 A1 WO 2008146542A1 JP 2008056984 W JP2008056984 W JP 2008056984W WO 2008146542 A1 WO2008146542 A1 WO 2008146542A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fine pattern
- mold
- transparent substrate
- intermediate layer
- production
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/005—Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Micromachines (AREA)
Abstract
光透過性、離型性、機械的強度、寸法安定性、高精度な微細パターンを有し、微細パターンの変形が少ないモールド;モールドの微細パターンを寸法精度よく転写でき、転写微細パターンの変形が少ない転写微細パターンを有する基材の製造方法を提供する。 中間層(C)14が形成された表面に官能基(x)に基づく化学結合を有し、含フッ素重合体(I)の線膨張係数との線膨張係数の差(絶対値)が30ppm/°C未満であり、熱変形温度が100~300°Cである透明基体(A)12、主鎖に含フッ素脂肪族環構造を有し、官能基(x)と反応性の反応性基(y)を有する含フッ素重合体(II)からなる中間層(C)14、主鎖に含フッ素脂肪族環構造を有し、反応性基(y)を実質的に有しない含フッ素重合体(I)からなり、表面に微細パターン18を有する表面層(B)16を有するモールド10。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880017133A CN101678572A (zh) | 2007-05-24 | 2008-04-09 | 模具、其制造方法及具有转印微细图案的基材的制造方法 |
EP08740087A EP2172320A4 (en) | 2007-05-24 | 2008-04-09 | MOLDING TOOL, METHOD FOR PRODUCING THE MOLDING TOOL AND METHOD FOR PRODUCING A SUBSTRATE WITH REPRODUCTION OF A FINE PATTERN |
US12/542,810 US20090302507A1 (en) | 2007-05-24 | 2009-08-18 | Mold, process for its production, and process for producing base material having transferred micropattern |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007137699 | 2007-05-24 | ||
JP2007-137699 | 2007-05-24 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/542,810 Continuation US20090302507A1 (en) | 2007-05-24 | 2009-08-18 | Mold, process for its production, and process for producing base material having transferred micropattern |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008146542A1 true WO2008146542A1 (ja) | 2008-12-04 |
Family
ID=40074813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056984 WO2008146542A1 (ja) | 2007-05-24 | 2008-04-09 | モールド、その製造方法および転写微細パターンを有する基材の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090302507A1 (ja) |
EP (1) | EP2172320A4 (ja) |
JP (1) | JP2009001002A (ja) |
KR (1) | KR20100014832A (ja) |
CN (1) | CN101678572A (ja) |
TW (1) | TW200911498A (ja) |
WO (1) | WO2008146542A1 (ja) |
Cited By (3)
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KR101061555B1 (ko) | 2009-08-25 | 2011-09-01 | 한국기계연구원 | 나노 임프린트용 템플릿 및 이의 제조 방법 |
WO2012108409A1 (ja) * | 2011-02-10 | 2012-08-16 | 株式会社日立ハイテクノロジーズ | 微細構造転写装置及び微細構造転写方法 |
JP2013001091A (ja) * | 2011-06-21 | 2013-01-07 | Konica Minolta Advanced Layers Inc | 光学素子の製造方法 |
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KR101652680B1 (ko) * | 2008-05-29 | 2016-08-31 | 아사히 가라스 가부시키가이샤 | 광경화성 조성물 및 표면에 미세 패턴을 갖는 성형체의 제조 방법 |
JP2010267357A (ja) * | 2009-05-18 | 2010-11-25 | Hitachi High-Technologies Corp | パターンドメディアの製造方法及び製造装置 |
EP2439050B1 (en) * | 2009-06-05 | 2016-11-02 | Asahi Kasei Kabushiki Kaisha | Transfer mold and method for producing transfer mold |
JP5329661B2 (ja) * | 2009-06-08 | 2013-10-30 | ニッタ株式会社 | インプリント用モールドおよびその製造方法 |
JPWO2011016549A1 (ja) * | 2009-08-07 | 2013-01-17 | 綜研化学株式会社 | インプリント用樹脂製モールドおよびその製造方法 |
JP2011194721A (ja) * | 2010-03-19 | 2011-10-06 | Waseda Univ | 金型製造装置 |
JP5687857B2 (ja) | 2010-07-29 | 2015-03-25 | 株式会社日立ハイテクノロジーズ | ナノインプリント用樹脂スタンパ及びこれを使用したナノインプリント装置 |
JP5658001B2 (ja) * | 2010-11-11 | 2015-01-21 | 旭化成イーマテリアルズ株式会社 | 樹脂モールド |
JP2012143915A (ja) * | 2011-01-10 | 2012-08-02 | Scivax Kk | インプリント用型 |
CN102303841A (zh) * | 2011-07-11 | 2012-01-04 | 西安交通大学 | 一种微纳复合结构的微喷印与介电泳力压印成形方法 |
JP5772509B2 (ja) * | 2011-10-27 | 2015-09-02 | 住友ベークライト株式会社 | 成形体の製造方法 |
EP2596936B1 (en) * | 2011-11-24 | 2015-09-09 | ABB Research Ltd. | Mold and method for producing shaped articles from a UV-curable composition |
JP2013136181A (ja) * | 2011-12-28 | 2013-07-11 | Hoya Corp | インプリント用モールドブランクおよびインプリント用モールド |
CN104122747A (zh) * | 2014-08-08 | 2014-10-29 | 青岛理工大学 | 一种电渗驱动纳米压印装置及其工作方法 |
US10034519B2 (en) | 2016-06-16 | 2018-07-31 | Adidas Ag | UV curable lattice microstructure for footwear |
WO2018173930A1 (ja) * | 2017-03-23 | 2018-09-27 | Agc株式会社 | インプリント用硬化性組成物、レプリカモールドおよびその製造方法 |
US11122847B2 (en) | 2017-04-24 | 2021-09-21 | Nike, Inc. | Article with UV radiation curable material adhered to textile and method of making the same |
US20180304499A1 (en) | 2017-04-24 | 2018-10-25 | Nike, Inc. | Transparent tooling for uv radiation curable rubber |
US11136475B2 (en) | 2017-04-24 | 2021-10-05 | Nike, Inc. | Articles and components with UV radiation curable elastomeric materials and methods of making the same |
CN118283963A (zh) * | 2023-07-03 | 2024-07-02 | 荣耀终端有限公司 | 结构件、结构件的制备方法和电子设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60240713A (ja) | 1984-05-10 | 1985-11-29 | イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー | 溶融加工しうるテトラフルオロエチレン共重合体とその製法 |
JPH04226177A (ja) | 1990-06-01 | 1992-08-14 | Asahi Glass Co Ltd | コーティング用含フッ素重合体組成物およびその用途 |
JP2002539604A (ja) | 1999-03-11 | 2002-11-19 | ボード・オヴ・リージェンツ,ザ・ユニヴァーシティ・オヴ・テキサス・システム | 段付き鋳張り捺印式リソグラフィー |
JP2004504718A (ja) | 2000-07-18 | 2004-02-12 | ナノネックス コーポレーション | 流体圧力インプリント・リソグラフィ |
JP2005515617A (ja) | 2001-10-11 | 2005-05-26 | ブルーワー サイエンス アイ エヌ シー. | 非粘着性のモールドを使用する、パターン化された構造の複製 |
WO2006059580A1 (ja) | 2004-11-30 | 2006-06-08 | Asahi Glass Company, Limited | モールド、および転写微細パターンを有する基材の製造方法 |
JP2006297639A (ja) * | 2005-04-15 | 2006-11-02 | Ricoh Co Ltd | 光ディスク基板成形用スタンパ |
JP2007137699A (ja) | 2005-11-16 | 2007-06-07 | Epson Imaging Devices Corp | ガラス基板の切断方法 |
JP2007268831A (ja) * | 2006-03-31 | 2007-10-18 | Dainippon Printing Co Ltd | モールド及びモールドの作製方法 |
Family Cites Families (3)
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WO2004006019A1 (en) * | 2002-07-08 | 2004-01-15 | Obducat Ab | A method and a stamp for transferring a pattern to a substrate |
US20050167894A1 (en) * | 2002-10-08 | 2005-08-04 | Wu-Sheng Shih | Patterned structure reproduction using nonsticking mold |
CN101427182B (zh) * | 2004-04-27 | 2011-10-19 | 伊利诺伊大学评议会 | 用于软光刻法的复合构图设备 |
-
2008
- 2008-04-08 JP JP2008100641A patent/JP2009001002A/ja active Pending
- 2008-04-09 KR KR1020097017576A patent/KR20100014832A/ko not_active Application Discontinuation
- 2008-04-09 EP EP08740087A patent/EP2172320A4/en not_active Withdrawn
- 2008-04-09 WO PCT/JP2008/056984 patent/WO2008146542A1/ja active Application Filing
- 2008-04-09 CN CN200880017133A patent/CN101678572A/zh active Pending
- 2008-05-22 TW TW097118909A patent/TW200911498A/zh unknown
-
2009
- 2009-08-18 US US12/542,810 patent/US20090302507A1/en not_active Abandoned
Patent Citations (9)
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JPS60240713A (ja) | 1984-05-10 | 1985-11-29 | イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー | 溶融加工しうるテトラフルオロエチレン共重合体とその製法 |
JPH04226177A (ja) | 1990-06-01 | 1992-08-14 | Asahi Glass Co Ltd | コーティング用含フッ素重合体組成物およびその用途 |
JP2002539604A (ja) | 1999-03-11 | 2002-11-19 | ボード・オヴ・リージェンツ,ザ・ユニヴァーシティ・オヴ・テキサス・システム | 段付き鋳張り捺印式リソグラフィー |
JP2004504718A (ja) | 2000-07-18 | 2004-02-12 | ナノネックス コーポレーション | 流体圧力インプリント・リソグラフィ |
JP2005515617A (ja) | 2001-10-11 | 2005-05-26 | ブルーワー サイエンス アイ エヌ シー. | 非粘着性のモールドを使用する、パターン化された構造の複製 |
WO2006059580A1 (ja) | 2004-11-30 | 2006-06-08 | Asahi Glass Company, Limited | モールド、および転写微細パターンを有する基材の製造方法 |
JP2006297639A (ja) * | 2005-04-15 | 2006-11-02 | Ricoh Co Ltd | 光ディスク基板成形用スタンパ |
JP2007137699A (ja) | 2005-11-16 | 2007-06-07 | Epson Imaging Devices Corp | ガラス基板の切断方法 |
JP2007268831A (ja) * | 2006-03-31 | 2007-10-18 | Dainippon Printing Co Ltd | モールド及びモールドの作製方法 |
Non-Patent Citations (1)
Title |
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See also references of EP2172320A4 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101061555B1 (ko) | 2009-08-25 | 2011-09-01 | 한국기계연구원 | 나노 임프린트용 템플릿 및 이의 제조 방법 |
WO2012108409A1 (ja) * | 2011-02-10 | 2012-08-16 | 株式会社日立ハイテクノロジーズ | 微細構造転写装置及び微細構造転写方法 |
JP2012169313A (ja) * | 2011-02-10 | 2012-09-06 | Hitachi High-Technologies Corp | 微細構造転写装置及び微細構造転写方法 |
US8770965B2 (en) | 2011-02-10 | 2014-07-08 | Hitachi High-Technologies Corporation | Device and method for transferring micro structure |
JP2013001091A (ja) * | 2011-06-21 | 2013-01-07 | Konica Minolta Advanced Layers Inc | 光学素子の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101678572A (zh) | 2010-03-24 |
TW200911498A (en) | 2009-03-16 |
EP2172320A1 (en) | 2010-04-07 |
JP2009001002A (ja) | 2009-01-08 |
US20090302507A1 (en) | 2009-12-10 |
KR20100014832A (ko) | 2010-02-11 |
EP2172320A4 (en) | 2011-07-06 |
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