WO2008140094A1 - 回路接続材料及び回路部材の接続構造 - Google Patents

回路接続材料及び回路部材の接続構造 Download PDF

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Publication number
WO2008140094A1
WO2008140094A1 PCT/JP2008/058815 JP2008058815W WO2008140094A1 WO 2008140094 A1 WO2008140094 A1 WO 2008140094A1 JP 2008058815 W JP2008058815 W JP 2008058815W WO 2008140094 A1 WO2008140094 A1 WO 2008140094A1
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WO
WIPO (PCT)
Prior art keywords
circuit
connecting material
core
connection structure
metal layer
Prior art date
Application number
PCT/JP2008/058815
Other languages
English (en)
French (fr)
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020127005654A priority Critical patent/KR101410108B1/ko
Priority to JP2009514170A priority patent/JP4743322B2/ja
Priority to EP08752686A priority patent/EP2148393A4/en
Priority to US12/600,181 priority patent/US20100139947A1/en
Priority to CN2008800084372A priority patent/CN101632199B/zh
Publication of WO2008140094A1 publication Critical patent/WO2008140094A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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Abstract

　回路電極が形成された２つの回路部材を、回路電極を対抗させて電気的に接続するための回路接続材料であって、回路接続材料は、接着剤組成物と導電粒子とを含有し、導電粒子は、有機高分子化合物からなる核体がニッケル又はニッケル合金からなる金属層で被覆された、表面に複数の突起部を有する導電粒子であり、核体の平均粒径が１～４μｍ、金属層の厚みが６５～１２５ｎｍである回路接続材料。
PCT/JP2008/058815 2007-05-15 2008-05-14 回路接続材料及び回路部材の接続構造 WO2008140094A1 (ja)

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JP2009514170A JP4743322B2 (ja) 2007-05-15 2008-05-14 回路接続材料及び回路部材の接続構造
EP08752686A EP2148393A4 (en) 2007-05-15 2008-05-14 CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE FOR A CIRCUIT ELEMENT
US12/600,181 US20100139947A1 (en) 2007-05-15 2008-05-14 Circuit-connecting material, and connection structure for circuit member
CN2008800084372A CN101632199B (zh) 2007-05-15 2008-05-14 电路连接材料和电路部件的连接结构

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JPWO2008140094A1 (ja) 2010-08-05
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KR20100009540A (ko) 2010-01-27
CN102174299B (zh) 2014-01-29
KR20100119830A (ko) 2010-11-10
US20100139947A1 (en) 2010-06-10
TW201122078A (en) 2011-07-01
KR20120043044A (ko) 2012-05-03

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