WO2008129923A1 - 高周波回路基板、高周波回路モジュールおよびレーダ装置 - Google Patents

高周波回路基板、高周波回路モジュールおよびレーダ装置 Download PDF

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Publication number
WO2008129923A1
WO2008129923A1 PCT/JP2008/056441 JP2008056441W WO2008129923A1 WO 2008129923 A1 WO2008129923 A1 WO 2008129923A1 JP 2008056441 W JP2008056441 W JP 2008056441W WO 2008129923 A1 WO2008129923 A1 WO 2008129923A1
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WIPO (PCT)
Prior art keywords
high frequency
frequency circuit
circuit board
radar device
circuit module
Prior art date
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PCT/JP2008/056441
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English (en)
French (fr)
Inventor
Hajime Sasaki
Kazuki Hayata
Original Assignee
Kyocera Corporation
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Filing date
Publication date
Application filed by Kyocera Corporation filed Critical Kyocera Corporation
Priority to US12/595,820 priority Critical patent/US8179306B2/en
Priority to DE112008000985T priority patent/DE112008000985T5/de
Priority to JP2009510811A priority patent/JP5209610B2/ja
Publication of WO2008129923A1 publication Critical patent/WO2008129923A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02—Waveguide horns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • G01S7/032—Constructional details for solid-state radar subsystems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H—ELECTRICITY
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    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H01L2223/6633—Transition between different waveguide types
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H01L2924/19038—Structure including wave guides being a hybrid line type
    • H01L2924/19039—Structure including wave guides being a hybrid line type impedance transition between different types of wave guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias

Abstract

　本発明は、設計の自由度が低下することなく、実装される電子部品に生じる熱を効率的に放熱することができる高周波回路基板、およびこの高周波回路基板を備える高周波回路モジュールならびにこの高周波回路モジュールを備えるレーダ装置に関する。誘電体基板（３）には、前記誘電体基板（３）の一表面（３ａ）に設けられ、電子部品（２）が搭載される搭載部（４）と、前記誘電体基板（３）に形成される導波管（５）とが設けられる。この搭載部（４）と導波管（５）とは、誘電体基板（３）の熱伝導率よりも高い熱伝導率を有する熱伝導体（６）によって接続される。
PCT/JP2008/056441 2007-04-13 2008-03-31 高周波回路基板、高周波回路モジュールおよびレーダ装置 WO2008129923A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/595,820 US8179306B2 (en) 2007-04-13 2008-03-31 High-frequency circuit board, high-frequency circuit module, and radar apparatus
DE112008000985T DE112008000985T5 (de) 2007-04-13 2008-03-31 Hochfrequenz-Leiterplatte, Hochfrequenz-Schaltmodul und Radargerät
JP2009510811A JP5209610B2 (ja) 2007-04-13 2008-03-31 高周波回路基板、高周波回路モジュールおよびレーダ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-106564 2007-04-13
JP2007106564 2007-04-13

Publications (1)

Publication Number Publication Date
WO2008129923A1 true WO2008129923A1 (ja) 2008-10-30

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ID=39875451

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PCT/JP2008/056441 WO2008129923A1 (ja) 2007-04-13 2008-03-31 高周波回路基板、高周波回路モジュールおよびレーダ装置

Country Status (4)

Country Link
US (1) US8179306B2 (ja)
JP (1) JP5209610B2 (ja)
DE (1) DE112008000985T5 (ja)
WO (1) WO2008129923A1 (ja)

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WO2011059582A1 (en) * 2009-11-12 2011-05-19 Sensis Corporation Light-weight, air-cooled transmit/receive unit and active phased array including same
JP2012089590A (ja) * 2010-10-18 2012-05-10 Hitachi Metals Ltd 電子部品
JP2013247495A (ja) * 2012-05-25 2013-12-09 Nippon Telegr & Teleph Corp <Ntt> ホーンアンテナ一体型ｍｍｉｃパッケージ
JP2015012161A (ja) * 2013-06-28 2015-01-19 株式会社デンソー 電子装置
CN107017310B (zh) * 2017-03-17 2020-01-07 山东大学 一种高功率低噪音的平面耿氏二极管及其制备方法
WO2021240861A1 (ja) * 2020-05-26 2021-12-02 株式会社フジクラ 無線通信モジュール

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JP5209610B2 (ja) * 2007-04-13 2013-06-12 京セラ株式会社 高周波回路基板、高周波回路モジュールおよびレーダ装置
DE102007034329A1 (de) * 2007-07-24 2009-01-29 Robert Bosch Gmbh Radarvorrichtung
KR101070022B1 (ko) * 2009-09-16 2011-10-04 삼성전기주식회사 다층 세라믹 회로 기판, 다층 세라믹 회로 기판 제조방법 및 이를 이용한 전자 디바이스 모듈
GB2499792B (en) * 2012-02-28 2016-05-04 Canon Kk Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package
KR101442475B1 (ko) * 2012-03-08 2014-09-23 주식회사 한라홀딩스 레이더 장치
US9219041B2 (en) * 2012-03-29 2015-12-22 International Business Machines Corporation Electronic package for millimeter wave semiconductor dies
US9620854B2 (en) 2013-01-09 2017-04-11 Nxp Usa, Inc. Electronic high frequency device and manufacturing method
ITMI20130872A1 (it) * 2013-05-29 2013-08-28 Mavel Srl Dispositivo elettronico comprendente un circuito stampato
US9667290B2 (en) * 2015-04-17 2017-05-30 Apple Inc. Electronic device with millimeter wave antennas
CN108293295B (zh) * 2015-10-01 2020-09-04 奥特斯奥地利科技与系统技术有限公司 用于发热电子部件的承载和散热的电子部件载体
US11830831B2 (en) * 2016-09-23 2023-11-28 Intel Corporation Semiconductor package including a modular side radiating waveguide launcher
US10782388B2 (en) * 2017-02-16 2020-09-22 Magna Electronics Inc. Vehicle radar system with copper PCB
US10516207B2 (en) 2017-05-17 2019-12-24 Nxp B.V. High frequency system, communication link
US11031699B2 (en) * 2018-02-09 2021-06-08 Intel IP Corporation Antenna with graded dielectirc and method of making the same

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JP5209610B2 (ja) 2013-06-12

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