WO2008117711A1 - 金属張り積層板と多層積層板並びにその製造方法 - Google Patents

金属張り積層板と多層積層板並びにその製造方法 Download PDF

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Publication number
WO2008117711A1
WO2008117711A1 PCT/JP2008/055065 JP2008055065W WO2008117711A1 WO 2008117711 A1 WO2008117711 A1 WO 2008117711A1 JP 2008055065 W JP2008055065 W JP 2008055065W WO 2008117711 A1 WO2008117711 A1 WO 2008117711A1
Authority
WO
WIPO (PCT)
Prior art keywords
laminated board
laminated body
manufacturing
prepreg
metal
Prior art date
Application number
PCT/JP2008/055065
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Chikara Hamatsu
Shouichi Yosida
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Publication of WO2008117711A1 publication Critical patent/WO2008117711A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Moulding By Coating Moulds (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
PCT/JP2008/055065 2007-03-27 2008-03-19 金属張り積層板と多層積層板並びにその製造方法 WO2008117711A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007082937 2007-03-27
JP2007-082937 2007-03-27
JP2007-130132 2007-05-16
JP2007130132 2007-05-16

Publications (1)

Publication Number Publication Date
WO2008117711A1 true WO2008117711A1 (ja) 2008-10-02

Family

ID=39788447

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055065 WO2008117711A1 (ja) 2007-03-27 2008-03-19 金属張り積層板と多層積層板並びにその製造方法

Country Status (3)

Country Link
JP (1) JP5017158B2 (enrdf_load_stackoverflow)
TW (1) TW200843608A (enrdf_load_stackoverflow)
WO (1) WO2008117711A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2489508A (en) * 2011-03-31 2012-10-03 Plasyl Ltd Flexible circuit board interconnects
JP2015145115A (ja) * 2014-02-04 2015-08-13 日立化成株式会社 金属張り積層板の製造方法及び金属張り積層板
JP2018027625A (ja) * 2016-08-17 2018-02-22 株式会社日本製鋼所 繊維強化樹脂を成形する成形加工方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5163279B2 (ja) * 2008-05-20 2013-03-13 住友ベークライト株式会社 積層板の製造方法、積層板、回路板、半導体パッケージ用基板および半導体装置
KR102097847B1 (ko) 2012-12-11 2020-04-06 미쓰이금속광업주식회사 다층 프린트 배선판 및 그 제조 방법
CN104080281B (zh) * 2014-07-04 2017-01-25 华进半导体封装先导技术研发中心有限公司 一种印刷电路板的压合方法
CN105228374B (zh) * 2015-08-13 2018-01-19 江苏博敏电子有限公司 一种印制电路板混合压合的方法
JP6368874B1 (ja) * 2017-07-25 2018-08-01 アイティテクノ 株式会社 成形品の製造方法
US11524495B2 (en) 2019-03-20 2022-12-13 Nike, Inc. Closed loop feedback press
EP4081005A1 (en) 2021-04-23 2022-10-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5751423A (en) * 1980-09-12 1982-03-26 Hitachi Chem Co Ltd Preparation of thermosetting resin laminated plate
JPS59131426A (ja) * 1983-01-17 1984-07-28 Hitachi Chem Co Ltd 積層板の製造法
JPS6228245A (ja) * 1985-07-30 1987-02-06 新神戸電機株式会社 積層板の製造法
JP2000156566A (ja) * 1998-11-20 2000-06-06 Matsushita Electric Ind Co Ltd プリント配線基板の製造方法および電子部品実装配線基板の製造方法
JP2001030279A (ja) * 1999-07-27 2001-02-06 Matsushita Electric Works Ltd 積層板の製造方法
JP2002067061A (ja) * 2000-08-29 2002-03-05 Matsushita Electric Works Ltd 金属張り積層板の製造方法
JP2002079538A (ja) * 2000-09-08 2002-03-19 Matsushita Electric Works Ltd 金属張り積層板の製造方法
JP2002264157A (ja) * 2001-03-09 2002-09-18 Risho Kogyo Co Ltd 積層板の製造方法
JP2002314250A (ja) * 2001-04-13 2002-10-25 Matsushita Electric Works Ltd 多層積層板の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5751423A (en) * 1980-09-12 1982-03-26 Hitachi Chem Co Ltd Preparation of thermosetting resin laminated plate
JPS59131426A (ja) * 1983-01-17 1984-07-28 Hitachi Chem Co Ltd 積層板の製造法
JPS6228245A (ja) * 1985-07-30 1987-02-06 新神戸電機株式会社 積層板の製造法
JP2000156566A (ja) * 1998-11-20 2000-06-06 Matsushita Electric Ind Co Ltd プリント配線基板の製造方法および電子部品実装配線基板の製造方法
JP2001030279A (ja) * 1999-07-27 2001-02-06 Matsushita Electric Works Ltd 積層板の製造方法
JP2002067061A (ja) * 2000-08-29 2002-03-05 Matsushita Electric Works Ltd 金属張り積層板の製造方法
JP2002079538A (ja) * 2000-09-08 2002-03-19 Matsushita Electric Works Ltd 金属張り積層板の製造方法
JP2002264157A (ja) * 2001-03-09 2002-09-18 Risho Kogyo Co Ltd 積層板の製造方法
JP2002314250A (ja) * 2001-04-13 2002-10-25 Matsushita Electric Works Ltd 多層積層板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2489508A (en) * 2011-03-31 2012-10-03 Plasyl Ltd Flexible circuit board interconnects
GB2489508B (en) * 2011-03-31 2016-02-17 Plasyl Ltd Improvements for electrical circuits
JP2015145115A (ja) * 2014-02-04 2015-08-13 日立化成株式会社 金属張り積層板の製造方法及び金属張り積層板
JP2018027625A (ja) * 2016-08-17 2018-02-22 株式会社日本製鋼所 繊維強化樹脂を成形する成形加工方法

Also Published As

Publication number Publication date
TWI377891B (enrdf_load_stackoverflow) 2012-11-21
JP5017158B2 (ja) 2012-09-05
JP2008307886A (ja) 2008-12-25
TW200843608A (en) 2008-11-01

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