WO2010050759A3 - Flexible metal-clad laminate and a method of manufacturing the same - Google Patents

Flexible metal-clad laminate and a method of manufacturing the same Download PDF

Info

Publication number
WO2010050759A3
WO2010050759A3 PCT/KR2009/006295 KR2009006295W WO2010050759A3 WO 2010050759 A3 WO2010050759 A3 WO 2010050759A3 KR 2009006295 W KR2009006295 W KR 2009006295W WO 2010050759 A3 WO2010050759 A3 WO 2010050759A3
Authority
WO
WIPO (PCT)
Prior art keywords
clad laminate
polyimide layer
flexible metal
manufacturing
same
Prior art date
Application number
PCT/KR2009/006295
Other languages
French (fr)
Other versions
WO2010050759A2 (en
Inventor
Weonjung Choi
Seunghoon Jung
Byoungwook Jo
Daenyoun Kim
Original Assignee
Sk Energy Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sk Energy Co., Ltd. filed Critical Sk Energy Co., Ltd.
Publication of WO2010050759A2 publication Critical patent/WO2010050759A2/en
Publication of WO2010050759A3 publication Critical patent/WO2010050759A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed is a flexible metal-clad laminate. More specifically, disclosed is a flexible metal clad laminate including'- a first polyimide layer that is positioned on one surface of a metal foil and has glass transition temperature of 300 to 500 °C; a second polyimide layer that is positioned on one surface of the first polyimide layer and has a linear thermal expansion coefficient of 1 to 20 ppm/K; and a thermoplastic polyimide layer that is positioned on one surface of the second polyimide layer, whereby the flexible metal-clad laminate has an excellent exterior after imidization, is not curled after and before etching, and has excellent adhesive strength with a metal foil and excellent dimensional stability after etching.
PCT/KR2009/006295 2008-10-31 2009-10-29 Flexible metal-clad laminate and a method of manufacturing the same WO2010050759A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080107653A KR20100048474A (en) 2008-10-31 2008-10-31 Flexible metal-clad laminate and a method of manufacturing the same
KR10-2008-0107653 2008-10-31

Publications (2)

Publication Number Publication Date
WO2010050759A2 WO2010050759A2 (en) 2010-05-06
WO2010050759A3 true WO2010050759A3 (en) 2010-07-08

Family

ID=42129471

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/006295 WO2010050759A2 (en) 2008-10-31 2009-10-29 Flexible metal-clad laminate and a method of manufacturing the same

Country Status (3)

Country Link
KR (1) KR20100048474A (en)
TW (1) TWI494214B (en)
WO (1) WO2010050759A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5615253B2 (en) 2010-12-20 2014-10-29 エスケー イノベーション シーオー．， エルティーディー． Method for producing thick film polyimide flexible metal laminate
KR101437612B1 (en) * 2010-12-20 2014-09-15 에스케이이노베이션 주식회사 manufacturing method of thick polyimide flexible metal-clad laminate
KR102038135B1 (en) 2011-12-28 2019-10-30 주식회사 넥스플렉스 Flexible metal-clad laminate manufacturing method thereof
WO2013100627A1 (en) * 2011-12-28 2013-07-04 에스케이이노베이션 주식회사 Flexible metal clad laminate and preparation method thereof
KR101865725B1 (en) * 2016-02-24 2018-06-08 현대자동차 주식회사 Flexible copper clad laminate for vehicle led lamp, flexible printed circuit board comprisisng the same and manufacturing method of the same
KR101865723B1 (en) * 2016-02-24 2018-06-08 현대자동차 주식회사 Flexible copper clad laminate, flexible printed circuit board comprisisng the same and manufacturing method of the same
JP6917987B2 (en) * 2016-06-03 2021-08-11 株式会社有沢製作所 Manufacturing method of flexible metal-clad laminate
CN110925636A (en) * 2019-12-03 2020-03-27 深圳市腾鑫精密胶粘制品有限公司 Energy-saving lamp strip capable of being cut at will and preparation method thereof
CN111559135A (en) * 2020-06-10 2020-08-21 浙江福斯特新材料研究院有限公司 Polyimide lamination, preparation method thereof and copper-clad plate comprising polyimide lamination

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004085146A1 (en) * 2003-03-26 2004-10-07 Lg Chem Ltd Double-sided metallic laminate and method for manufacturing the same
US20040265609A1 (en) * 2003-05-06 2004-12-30 Shuta Kihara Metal-clad laminate
US20070218277A1 (en) * 2004-05-13 2007-09-20 Kaneka Corporation Adhesive Film, Flexible Metal-Clad Laminate, and Processes for Producing These

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022288A (en) * 1998-06-29 2000-01-21 Sony Chem Corp Flexible printed board and its manufacture
JP4619860B2 (en) * 2004-07-13 2011-01-26 新日鐵化学株式会社 Flexible laminate and method for manufacturing the same
JP4757645B2 (en) * 2006-01-31 2011-08-24 新日鐵化学株式会社 Method for producing double-sided metal-clad laminate
JP4777206B2 (en) * 2006-09-29 2011-09-21 新日鐵化学株式会社 Method for producing flexible copper-clad laminate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004085146A1 (en) * 2003-03-26 2004-10-07 Lg Chem Ltd Double-sided metallic laminate and method for manufacturing the same
US20040265609A1 (en) * 2003-05-06 2004-12-30 Shuta Kihara Metal-clad laminate
US20070218277A1 (en) * 2004-05-13 2007-09-20 Kaneka Corporation Adhesive Film, Flexible Metal-Clad Laminate, and Processes for Producing These

Also Published As

Publication number Publication date
WO2010050759A2 (en) 2010-05-06
TWI494214B (en) 2015-08-01
TW201032999A (en) 2010-09-16
KR20100048474A (en) 2010-05-11

Similar Documents

Publication Publication Date Title
WO2010050759A3 (en) Flexible metal-clad laminate and a method of manufacturing the same
WO2008108255A1 (en) Transparent conductive film with adhesive layer and method for producing the same
WO2009120311A3 (en) Biolaminate composite assembly and related methods
WO2009082101A3 (en) Metal-clad laminate
TW200724583A (en) Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board
WO2008010982A3 (en) Thermally imageable dielectric layers, thermal transfer donors and receivers
WO2007075586A3 (en) Flexible circuit
JP2009083498A5 (en)
WO2008087972A1 (en) Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies
WO2010132422A3 (en) Structured-core laminate panels and methods of forming the same
WO2009035014A1 (en) Process for producing multilayer printed wiring board
TW200603687A (en) Flexible laminate board and process
TW200606015A (en) Adhesive film and production method therefor and flexible metal-clad laminate and production method therefor
WO2009019968A1 (en) Multilayer polyimide film, laminate and metal-clad laminate
EP1422055A4 (en) Capacitor layer forming both-side copper-clad laminated heet and production method therefor
TW200729443A (en) Metal core, package board, and fabricating method thereof
WO2008146793A1 (en) Electric device, connecting method and adhesive film
WO2012099358A3 (en) Multilayer film
WO2009092506A3 (en) A method of fabricating a composite structure with a stable bonding layer of oxide
WO2010137832A3 (en) Flexible metal-clad laminate and manufacturing method thereof
WO2013013128A3 (en) Thermally expanding adhesive sheet and manufacturing method thereof
MY153947A (en) Laminate, circuit board and semiconductor device
EP1881748A3 (en) Multi-layer laminate substrates useful in electronic type appliactions
MY155884A (en) Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board
WO2007109533A3 (en) Composite insulation

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09823839

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09823839

Country of ref document: EP

Kind code of ref document: A2