WO2008117711A1 - Carte de circuit imprimé stratifiée revêtue de métal, carte de circuit imprimé stratifiée multicouche et procédé de fabrication de celle-ci - Google Patents
Carte de circuit imprimé stratifiée revêtue de métal, carte de circuit imprimé stratifiée multicouche et procédé de fabrication de celle-ci Download PDFInfo
- Publication number
- WO2008117711A1 WO2008117711A1 PCT/JP2008/055065 JP2008055065W WO2008117711A1 WO 2008117711 A1 WO2008117711 A1 WO 2008117711A1 JP 2008055065 W JP2008055065 W JP 2008055065W WO 2008117711 A1 WO2008117711 A1 WO 2008117711A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laminated board
- laminated body
- manufacturing
- prepreg
- metal
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
- B29C43/203—Making multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Moulding By Coating Moulds (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
L'invention concerne un corps stratifié (5) qui est formé en stratifiant un préimprégné (2) sur les deux surfaces d'une carte de circuit imprimé de couche intérieure (1) et en agençant des feuilles métalliques (4) sur les surfaces extérieures du préimprégné. Dans un procédé pour fabriquer une carte de circuit imprimé stratifiée multicouche, le corps stratifié est formé en chauffant et mettant sous pression le corps stratifié à une température prescrite sous une pression de formage (P1), et en refroidissant le corps stratifié. Le corps stratifié est maintenu en dessous d'une pression de formage (P2) d'au plus 0,4 de la pression de formage (P1) en rapport de pression, pendant au moins 5 minutes à partir d'un point 30 minutes avant le démarrage du refroidissement, à une température d'au moins 5°C inférieure à une température à laquelle le préimprégné (2) a une viscosité minimale à l'état fondu.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-082937 | 2007-03-27 | ||
JP2007082937 | 2007-03-27 | ||
JP2007130132 | 2007-05-16 | ||
JP2007-130132 | 2007-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008117711A1 true WO2008117711A1 (fr) | 2008-10-02 |
Family
ID=39788447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/055065 WO2008117711A1 (fr) | 2007-03-27 | 2008-03-19 | Carte de circuit imprimé stratifiée revêtue de métal, carte de circuit imprimé stratifiée multicouche et procédé de fabrication de celle-ci |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5017158B2 (fr) |
TW (1) | TW200843608A (fr) |
WO (1) | WO2008117711A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2489508A (en) * | 2011-03-31 | 2012-10-03 | Plasyl Ltd | Flexible circuit board interconnects |
JP2015145115A (ja) * | 2014-02-04 | 2015-08-13 | 日立化成株式会社 | 金属張り積層板の製造方法及び金属張り積層板 |
JP2018027625A (ja) * | 2016-08-17 | 2018-02-22 | 株式会社日本製鋼所 | 繊維強化樹脂を成形する成形加工方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5163279B2 (ja) * | 2008-05-20 | 2013-03-13 | 住友ベークライト株式会社 | 積層板の製造方法、積層板、回路板、半導体パッケージ用基板および半導体装置 |
KR102097847B1 (ko) | 2012-12-11 | 2020-04-06 | 미쓰이금속광업주식회사 | 다층 프린트 배선판 및 그 제조 방법 |
CN104080281B (zh) * | 2014-07-04 | 2017-01-25 | 华进半导体封装先导技术研发中心有限公司 | 一种印刷电路板的压合方法 |
CN105228374B (zh) * | 2015-08-13 | 2018-01-19 | 江苏博敏电子有限公司 | 一种印制电路板混合压合的方法 |
JP6368874B1 (ja) * | 2017-07-25 | 2018-08-01 | アイティテクノ 株式会社 | 成形品の製造方法 |
US11524495B2 (en) | 2019-03-20 | 2022-12-13 | Nike, Inc. | Closed loop feedback press |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5751423A (en) * | 1980-09-12 | 1982-03-26 | Hitachi Chem Co Ltd | Preparation of thermosetting resin laminated plate |
JPS59131426A (ja) * | 1983-01-17 | 1984-07-28 | Hitachi Chem Co Ltd | 積層板の製造法 |
JPS6228245A (ja) * | 1985-07-30 | 1987-02-06 | 新神戸電機株式会社 | 積層板の製造法 |
JP2000156566A (ja) * | 1998-11-20 | 2000-06-06 | Matsushita Electric Ind Co Ltd | プリント配線基板の製造方法および電子部品実装配線基板の製造方法 |
JP2001030279A (ja) * | 1999-07-27 | 2001-02-06 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2002067061A (ja) * | 2000-08-29 | 2002-03-05 | Matsushita Electric Works Ltd | 金属張り積層板の製造方法 |
JP2002079538A (ja) * | 2000-09-08 | 2002-03-19 | Matsushita Electric Works Ltd | 金属張り積層板の製造方法 |
JP2002264157A (ja) * | 2001-03-09 | 2002-09-18 | Risho Kogyo Co Ltd | 積層板の製造方法 |
JP2002314250A (ja) * | 2001-04-13 | 2002-10-25 | Matsushita Electric Works Ltd | 多層積層板の製造方法 |
-
2008
- 2008-03-19 WO PCT/JP2008/055065 patent/WO2008117711A1/fr active Application Filing
- 2008-03-24 JP JP2008076745A patent/JP5017158B2/ja active Active
- 2008-03-24 TW TW97110355A patent/TW200843608A/zh unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5751423A (en) * | 1980-09-12 | 1982-03-26 | Hitachi Chem Co Ltd | Preparation of thermosetting resin laminated plate |
JPS59131426A (ja) * | 1983-01-17 | 1984-07-28 | Hitachi Chem Co Ltd | 積層板の製造法 |
JPS6228245A (ja) * | 1985-07-30 | 1987-02-06 | 新神戸電機株式会社 | 積層板の製造法 |
JP2000156566A (ja) * | 1998-11-20 | 2000-06-06 | Matsushita Electric Ind Co Ltd | プリント配線基板の製造方法および電子部品実装配線基板の製造方法 |
JP2001030279A (ja) * | 1999-07-27 | 2001-02-06 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2002067061A (ja) * | 2000-08-29 | 2002-03-05 | Matsushita Electric Works Ltd | 金属張り積層板の製造方法 |
JP2002079538A (ja) * | 2000-09-08 | 2002-03-19 | Matsushita Electric Works Ltd | 金属張り積層板の製造方法 |
JP2002264157A (ja) * | 2001-03-09 | 2002-09-18 | Risho Kogyo Co Ltd | 積層板の製造方法 |
JP2002314250A (ja) * | 2001-04-13 | 2002-10-25 | Matsushita Electric Works Ltd | 多層積層板の製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2489508A (en) * | 2011-03-31 | 2012-10-03 | Plasyl Ltd | Flexible circuit board interconnects |
GB2489508B (en) * | 2011-03-31 | 2016-02-17 | Plasyl Ltd | Improvements for electrical circuits |
JP2015145115A (ja) * | 2014-02-04 | 2015-08-13 | 日立化成株式会社 | 金属張り積層板の製造方法及び金属張り積層板 |
JP2018027625A (ja) * | 2016-08-17 | 2018-02-22 | 株式会社日本製鋼所 | 繊維強化樹脂を成形する成形加工方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI377891B (fr) | 2012-11-21 |
JP5017158B2 (ja) | 2012-09-05 |
JP2008307886A (ja) | 2008-12-25 |
TW200843608A (en) | 2008-11-01 |
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