WO2008107983A1 - 解析装置、解析方法及び解析プログラム - Google Patents

解析装置、解析方法及び解析プログラム Download PDF

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Publication number
WO2008107983A1
WO2008107983A1 PCT/JP2007/054445 JP2007054445W WO2008107983A1 WO 2008107983 A1 WO2008107983 A1 WO 2008107983A1 JP 2007054445 W JP2007054445 W JP 2007054445W WO 2008107983 A1 WO2008107983 A1 WO 2008107983A1
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WO
WIPO (PCT)
Prior art keywords
analyzed
analysis
computing section
simulation
conductive material
Prior art date
Application number
PCT/JP2007/054445
Other languages
English (en)
French (fr)
Inventor
Daisuke Mizutani
Nobutaka Itoh
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2009502399A priority Critical patent/JP5062249B2/ja
Priority to CN2007800519878A priority patent/CN101641699B/zh
Priority to KR1020097016877A priority patent/KR101142881B1/ko
Priority to PCT/JP2007/054445 priority patent/WO2008107983A1/ja
Publication of WO2008107983A1 publication Critical patent/WO2008107983A1/ja
Priority to US12/553,326 priority patent/US7996196B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/26—Composites
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

　第１生成部（３１１）は、解析対象物を複数の有限要素に分割し、要素分割データ（３３４）を生成する。第１算出部（３１２）は、有限要素よりも大きな単位で解析対象物を分割するメッシュを複数定義し算出する。第２生成部（３１３）は、導電材と複合材との界面に、厚さが「０」であり、導電材と複合材との間の摩擦係数を１未満の所定の値にする摩擦層が存在すると擬制した上で、メッシュデータ（３３５）を生成する。第２算出部（３１４）は、種々のソルバーを利用し、メッシュデータ（３３５）に基づいて解析対象物に生じる物理量を算出し、解析結果を出力する。つまり、第２算出部（３１４）は、解析対象物の挙動のシミュレーションを行う。このシミュレーションは、ユーザにより設定された任意の温度範囲内におけるものである。
PCT/JP2007/054445 2007-03-07 2007-03-07 解析装置、解析方法及び解析プログラム WO2008107983A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009502399A JP5062249B2 (ja) 2007-03-07 2007-03-07 解析装置、解析方法及び解析プログラム
CN2007800519878A CN101641699B (zh) 2007-03-07 2007-03-07 分析装置、分析方法
KR1020097016877A KR101142881B1 (ko) 2007-03-07 2007-03-07 해석 장치, 해석 방법 및 해석 프로그램을 기록한 컴퓨터로 판독가능한 기록 매체
PCT/JP2007/054445 WO2008107983A1 (ja) 2007-03-07 2007-03-07 解析装置、解析方法及び解析プログラム
US12/553,326 US7996196B2 (en) 2007-03-07 2009-09-03 Structural analysis of a printed wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/054445 WO2008107983A1 (ja) 2007-03-07 2007-03-07 解析装置、解析方法及び解析プログラム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/553,326 Continuation US7996196B2 (en) 2007-03-07 2009-09-03 Structural analysis of a printed wiring substrate

Publications (1)

Publication Number Publication Date
WO2008107983A1 true WO2008107983A1 (ja) 2008-09-12

Family

ID=39737888

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/054445 WO2008107983A1 (ja) 2007-03-07 2007-03-07 解析装置、解析方法及び解析プログラム

Country Status (5)

Country Link
US (1) US7996196B2 (ja)
JP (1) JP5062249B2 (ja)
KR (1) KR101142881B1 (ja)
CN (1) CN101641699B (ja)
WO (1) WO2008107983A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
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CN102693345A (zh) * 2012-06-08 2012-09-26 机械科学研究总院先进制造技术研究中心 具有仿生结构的复合材料预制体的建模方法
WO2013181912A1 (zh) * 2012-06-08 2013-12-12 机械科学研究总院先进制造技术研究中心 具有仿生结构的复合材料及其制备方法和建模方法
CN115157679A (zh) * 2021-04-03 2022-10-11 嘉兴学院 一种柔性复杂增/减材混合制造零件混合分层系统的框架

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WO2011091229A2 (en) * 2010-01-21 2011-07-28 Firehole Technologies Automated method to determine composite material constituent properties
US8494819B2 (en) * 2010-08-25 2013-07-23 Livermore Software Technology Corp. Efficient data management for shell finite elements representing layered composite materials
US8855977B2 (en) * 2012-01-17 2014-10-07 Livermore Software Technology Corp. Numerically simulating structural behaviors of a product using explicit finite element analysis with a combined technique of mass scaling and subcycling
US8855976B2 (en) * 2012-01-17 2014-10-07 Livermore Software Technology Corp. Numerically simulating structural behaviors of a product using explicit finite element analysis with a mass scaling enhanced subcycling technique
WO2017077610A1 (ja) * 2015-11-04 2017-05-11 富士通株式会社 構造解析方法、及び構造解析プログラム
KR102236268B1 (ko) * 2016-02-01 2021-04-05 한화에어로스페이스 주식회사 구조 해석 방법 및 이를 실행시키기 위한 프로그램을 기록한 컴퓨터로 읽을 수 있는 매체
US10489525B2 (en) * 2016-02-17 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and methods for composite thermal interface material microstructure property prediction
US10108753B2 (en) 2016-06-07 2018-10-23 International Business Machines Corporation Laminate substrate thermal warpage prediction for designing a laminate substrate
US11817359B2 (en) 2020-09-01 2023-11-14 International Business Machines Corporation Warp mitigation using pattern-matched metal layers in organic substrates
JP6908904B1 (ja) * 2021-02-10 2021-07-28 株式会社Ｈａｓｌ 多層流体解析用プログラム、多層流体解析システム、及び多層流体解析方法

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JPH10111879A (ja) * 1996-10-04 1998-04-28 Hitachi Ltd Ｃａｄ／ｃａｅ装置、解析モデル生成方法
JP2006072893A (ja) * 2004-09-06 2006-03-16 Yokohama Rubber Co Ltd:The タイヤモデル作成方法およびそのタイヤモデルを用いたシミュレーション方法
JP2006261381A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd プリント配線基板設計支援装置、プリント配線基板設計支援方法、及びプリント配線基板設計支援プログラム
JP2006339423A (ja) * 2005-06-02 2006-12-14 Nec Corp 基板反り解析方法そのシステム、プログラム及び記録媒体
JP2007027152A (ja) * 2005-07-12 2007-02-01 Matsushita Electric Ind Co Ltd プリント基板の設計方法

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JP3329667B2 (ja) 1996-09-17 2002-09-30 株式会社東芝 補強部位置決定方法、多面取りプリント基板の製造方法、及び多面取りプリント基板
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JPH10111879A (ja) * 1996-10-04 1998-04-28 Hitachi Ltd Ｃａｄ／ｃａｅ装置、解析モデル生成方法
JP2006072893A (ja) * 2004-09-06 2006-03-16 Yokohama Rubber Co Ltd:The タイヤモデル作成方法およびそのタイヤモデルを用いたシミュレーション方法
JP2006261381A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd プリント配線基板設計支援装置、プリント配線基板設計支援方法、及びプリント配線基板設計支援プログラム
JP2006339423A (ja) * 2005-06-02 2006-12-14 Nec Corp 基板反り解析方法そのシステム、プログラム及び記録媒体
JP2007027152A (ja) * 2005-07-12 2007-02-01 Matsushita Electric Ind Co Ltd プリント基板の設計方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102693345A (zh) * 2012-06-08 2012-09-26 机械科学研究总院先进制造技术研究中心 具有仿生结构的复合材料预制体的建模方法
WO2013181912A1 (zh) * 2012-06-08 2013-12-12 机械科学研究总院先进制造技术研究中心 具有仿生结构的复合材料及其制备方法和建模方法
CN115157679A (zh) * 2021-04-03 2022-10-11 嘉兴学院 一种柔性复杂增/减材混合制造零件混合分层系统的框架

Also Published As

Publication number Publication date
KR101142881B1 (ko) 2012-05-10
JP5062249B2 (ja) 2012-10-31
CN101641699B (zh) 2013-03-06
US7996196B2 (en) 2011-08-09
US20090326883A1 (en) 2009-12-31
JPWO2008107983A1 (ja) 2010-06-10
KR20100004962A (ko) 2010-01-13
CN101641699A (zh) 2010-02-03

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