WO2008096721A1 - 液体材料の充填方法、装置およびプログラム - Google Patents

液体材料の充填方法、装置およびプログラム Download PDF

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Publication number
WO2008096721A1
WO2008096721A1 PCT/JP2008/051802 JP2008051802W WO2008096721A1 WO 2008096721 A1 WO2008096721 A1 WO 2008096721A1 JP 2008051802 W JP2008051802 W JP 2008051802W WO 2008096721 A1 WO2008096721 A1 WO 2008096721A1
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WIPO (PCT)
Prior art keywords
liquid material
application pattern
correcting
application
program
Prior art date
Application number
PCT/JP2008/051802
Other languages
English (en)
French (fr)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering, Inc. filed Critical Musashi Engineering, Inc.
Priority to KR1020097016816A priority Critical patent/KR101463488B1/ko
Priority to CN2008800044604A priority patent/CN101606238B/zh
Publication of WO2008096721A1 publication Critical patent/WO2008096721A1/ja
Priority to HK10101915.8A priority patent/HK1136088A1/xx

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

課題：複雑なパラメータの計算が不要であり、吐出量の変化に柔軟に対応することができる液体材料の充填方法、装置およびプログラムの提供。 解決手段：ワークの外周に沿った非補正塗布パターンと、非補正塗布パターンと重なる補正塗布パターンとから構成される全体塗布パターンを作成し、全体塗布パターンに基づき吐出部から液体材料を吐出し、基板とその上に載置されたワークとの間隙に毛細管現象を利用して液体材料を充填する液体材料の充填方法であって、補正塗布パターンを、塗布領域および非塗布領域から構成し、補正塗布パターンの塗布領域および非塗布領域を伸縮させることにより、液体材料の吐出量の補正を行うことを特徴とする液体材料の充填方法。
PCT/JP2008/051802 2007-02-08 2008-02-05 液体材料の充填方法、装置およびプログラム WO2008096721A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097016816A KR101463488B1 (ko) 2007-02-08 2008-02-05 액체 재료의 충전 방법, 장치 및 프로그램의 기억 매체
CN2008800044604A CN101606238B (zh) 2007-02-08 2008-02-05 液体材料的填充方法及装置
HK10101915.8A HK1136088A1 (en) 2007-02-08 2010-02-24 Method and apparatus for applying liquid material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-028753 2007-02-08
JP2007028753A JP5019900B2 (ja) 2007-02-08 2007-02-08 液体材料の充填方法、装置およびプログラム

Publications (1)

Publication Number Publication Date
WO2008096721A1 true WO2008096721A1 (ja) 2008-08-14

Family

ID=39681630

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Application Number Title Priority Date Filing Date
PCT/JP2008/051802 WO2008096721A1 (ja) 2007-02-08 2008-02-05 液体材料の充填方法、装置およびプログラム

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Country Link
JP (1) JP5019900B2 (ja)
KR (1) KR101463488B1 (ja)
CN (1) CN101606238B (ja)
HK (1) HK1136088A1 (ja)
TW (1) TWI433242B (ja)
WO (1) WO2008096721A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010147052A1 (ja) * 2009-06-15 2010-12-23 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
EP2466630A1 (en) * 2009-08-11 2012-06-20 Musashi Engineering, Inc. Method for applying liquid material, application device and programme

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040512A (ja) * 2009-08-10 2011-02-24 Murata Mfg Co Ltd 回路基板の製造方法
JP5368918B2 (ja) * 2009-09-11 2013-12-18 東レエンジニアリング株式会社 ディスペンス装置およびディスペンス方法
TWI491496B (zh) * 2014-05-08 2015-07-11 三緯國際立體列印科技股份有限公司 立體列印裝置及其列印校正板與立體列印校正方法
CN106094271A (zh) * 2016-06-22 2016-11-09 深圳市华星光电技术有限公司 一种显示面板切割方法
KR102686388B1 (ko) * 2017-02-01 2024-07-18 세메스 주식회사 액적 토출량 조절 방법, 액적 토출량 조절 장치 및 이를 포함하는 액적 토출 장치
CN108906508B (zh) * 2018-08-06 2020-11-27 Oppo（重庆）智能科技有限公司 胶量控制方法及胶量控制装置
US11521956B2 (en) 2020-03-31 2022-12-06 Nichia Corporation Method of manufacturing light-emitting device
CN114823370B (zh) * 2022-05-10 2022-10-14 山东汉旗科技有限公司 指纹识别芯片封装结构及其封装的方法

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JPH09232347A (ja) * 1996-02-22 1997-09-05 Matsushita Electric Ind Co Ltd Ｉｃチップの封止方法
JPH1050769A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージの製造装置および製造方法
JP2003007737A (ja) * 2001-06-26 2003-01-10 Matsushita Electric Ind Co Ltd Ｉｃチップの封止方法および封止装置

Family Cites Families (2)

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JP5093985B2 (ja) 2004-01-16 2012-12-12 株式会社半導体エネルギー研究所 膜パターンの形成方法
JP4701704B2 (ja) 2004-12-20 2011-06-15 ソニー株式会社 パターン形成方法、パターン形成装置および電子応用装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232347A (ja) * 1996-02-22 1997-09-05 Matsushita Electric Ind Co Ltd Ｉｃチップの封止方法
JPH1050769A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージの製造装置および製造方法
JP2003007737A (ja) * 2001-06-26 2003-01-10 Matsushita Electric Ind Co Ltd Ｉｃチップの封止方法および封止装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010147052A1 (ja) * 2009-06-15 2010-12-23 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
KR20120036974A (ko) * 2009-06-15 2012-04-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 도포 방법, 그 장치 및 그 프로그램을 기억한 기억 매체
EP2444164A1 (en) * 2009-06-15 2012-04-25 Musashi Engineering, Inc. Method for applying liquid material, and apparatus and program for same
CN102802813A (zh) * 2009-06-15 2012-11-28 武藏工业株式会社 液体材料的涂布方法、其装置及其程序
EP2444164A4 (en) * 2009-06-15 2013-10-23 Musashi Engineering Inc PROCESS FOR APPLYING LIQUID MATERIAL AND DEVICE AND PROGRAM THEREFOR
CN102802813B (zh) * 2009-06-15 2014-07-02 武藏工业株式会社 液体材料的涂布方法
US8809075B2 (en) 2009-06-15 2014-08-19 Musashi Engineering, Inc. Method for applying liquid material utilizing capillary phenomenon
JP5632838B2 (ja) * 2009-06-15 2014-11-26 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
KR101677487B1 (ko) * 2009-06-15 2016-11-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 도포 방법, 그 장치 및 그 프로그램이 기억된 기억 매체
EP2466630A1 (en) * 2009-08-11 2012-06-20 Musashi Engineering, Inc. Method for applying liquid material, application device and programme
EP2466630A4 (en) * 2009-08-11 2014-02-26 Musashi Engineering Inc PROCESS FOR APPLYING LIQUID MATERIAL, APPLYING DEVICE AND PROGRAM THEREFOR
US8703601B2 (en) 2009-08-11 2014-04-22 Musashi Engineering, Inc. Method for applying liquid material, application device and program

Also Published As

Publication number Publication date
JP5019900B2 (ja) 2012-09-05
CN101606238A (zh) 2009-12-16
KR20090108083A (ko) 2009-10-14
HK1136088A1 (en) 2010-06-18
TWI433242B (zh) 2014-04-01
KR101463488B1 (ko) 2014-11-19
TW200845240A (en) 2008-11-16
JP2008193016A (ja) 2008-08-21
CN101606238B (zh) 2012-05-23

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