WO2008096716A1 - 半導体サブモジュール、コネクタと半導体サブモジュールとの接続方法、および、光モジュール - Google Patents
半導体サブモジュール、コネクタと半導体サブモジュールとの接続方法、および、光モジュール Download PDFInfo
- Publication number
- WO2008096716A1 WO2008096716A1 PCT/JP2008/051791 JP2008051791W WO2008096716A1 WO 2008096716 A1 WO2008096716 A1 WO 2008096716A1 JP 2008051791 W JP2008051791 W JP 2008051791W WO 2008096716 A1 WO2008096716 A1 WO 2008096716A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- semiconductor submodule
- semiconductor element
- optical module
- connecting connector
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 230000003287 optical effect Effects 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 5
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008557106A JPWO2008096716A1 (ja) | 2007-02-05 | 2008-02-04 | 半導体サブモジュール、コネクタと半導体サブモジュールとの接続方法、および、光モジュール |
US12/525,797 US8333517B2 (en) | 2007-02-05 | 2008-02-04 | Semiconductor submodule, method for connecting connector and semiconductor submodule, and optical module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-025986 | 2007-02-05 | ||
JP2007025986 | 2007-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008096716A1 true WO2008096716A1 (ja) | 2008-08-14 |
Family
ID=39681625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/051791 WO2008096716A1 (ja) | 2007-02-05 | 2008-02-04 | 半導体サブモジュール、コネクタと半導体サブモジュールとの接続方法、および、光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US8333517B2 (ja) |
JP (2) | JPWO2008096716A1 (ja) |
WO (1) | WO2008096716A1 (ja) |
Cited By (13)
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JP2012003148A (ja) * | 2010-06-18 | 2012-01-05 | Hochiki Corp | 可動型光受信端子 |
WO2014002616A1 (ja) * | 2012-06-29 | 2014-01-03 | オリンパス株式会社 | 光ファイバーケーブル接続構造 |
KR101370390B1 (ko) * | 2013-08-09 | 2014-03-06 | 주식회사 피피아이 | 광 패키징 모듈 |
JP2014089395A (ja) * | 2012-10-31 | 2014-05-15 | Kyocera Corp | 光装置用基板および光装置 |
US8761558B2 (en) | 2011-03-02 | 2014-06-24 | Hitachi Metals, Ltd. | Photoelectric transmission module |
JP2014132365A (ja) * | 2014-04-09 | 2014-07-17 | Hitachi Metals Ltd | 光伝送モジュール |
JP2015031801A (ja) * | 2013-08-01 | 2015-02-16 | 富士通株式会社 | 光モジュールおよび光ファイバの実装方法 |
US9325418B2 (en) | 2011-10-31 | 2016-04-26 | Mellanox Technologies, Ltd. | Optical module with flexible wiring board |
US9329349B2 (en) | 2013-06-13 | 2016-05-03 | Mellanox Technologies Ltd. | Integrated optical cooling core for optoelectronic interconnect modules |
WO2016185537A1 (ja) * | 2015-05-18 | 2016-11-24 | オリンパス株式会社 | 内視鏡、および光伝送モジュール |
JP6200552B1 (ja) * | 2016-06-07 | 2017-09-20 | 株式会社フジクラ | コネクタ付きケーブル |
WO2019207650A1 (ja) * | 2018-04-24 | 2019-10-31 | オリンパス株式会社 | 内視鏡用撮像装置、内視鏡、および内視鏡用撮像装置の製造方法 |
JP2021015176A (ja) * | 2019-07-11 | 2021-02-12 | 日本電気株式会社 | 光モジュールおよび光モジュールの製造方法 |
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JP4477677B2 (ja) * | 2008-01-16 | 2010-06-09 | 古河電気工業株式会社 | 光モジュールおよびその作製方法 |
US9192778B2 (en) * | 2009-01-30 | 2015-11-24 | Medizinische Hochschule Hannover | Cochlea stimulator |
JP5075944B2 (ja) * | 2010-06-10 | 2012-11-21 | 株式会社東芝 | 電子機器 |
GB201011324D0 (en) * | 2010-07-06 | 2010-08-18 | Airbus Operations Ltd | Apparatus for providing support for an optical fibre |
JP5608125B2 (ja) * | 2011-03-29 | 2014-10-15 | 日東電工株式会社 | 光電気混載基板およびその製法 |
US9364925B2 (en) * | 2012-04-30 | 2016-06-14 | Globalfoundries Inc. | Assembly of electronic and optical devices |
JP6300442B2 (ja) * | 2013-01-18 | 2018-03-28 | オリンパス株式会社 | 光伝送モジュールおよび撮像装置 |
EP3049839B1 (en) * | 2013-09-26 | 2020-04-01 | TE Connectivity Corporation | Optical connections system and methods for positioning an optical fiber within an alignment device |
JP5806343B2 (ja) * | 2014-01-16 | 2015-11-10 | ソニー・オリンパスメディカルソリューションズ株式会社 | 光電複合モジュール、カメラヘッド、及び内視鏡装置 |
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US10054375B2 (en) | 2016-06-15 | 2018-08-21 | Mellanox Technologies, Ltd. | Self-adjusting cooling module |
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JPH08136767A (ja) * | 1994-11-09 | 1996-05-31 | Sumitomo Electric Ind Ltd | 光モジュール |
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WO2005121855A1 (ja) * | 2004-06-09 | 2005-12-22 | Nec Corporation | 光導波路型モジュール |
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JP3532456B2 (ja) | 1999-05-19 | 2004-05-31 | 日本電信電話株式会社 | 光学的信号の入出力機構を有する半導体装置 |
JP2003207694A (ja) | 2002-01-15 | 2003-07-25 | Nec Corp | 光モジュール |
US6995318B2 (en) * | 2003-09-12 | 2006-02-07 | International Business Machines Corporation | Method for testing integrity of electrical connection of a flat cable multiple connector assembly |
JPWO2005057262A1 (ja) | 2003-12-15 | 2007-08-23 | 日本電気株式会社 | 光モジュールおよびその製造方法 |
JP2006128214A (ja) * | 2004-10-26 | 2006-05-18 | Harison Toshiba Lighting Corp | 光半導体照明装置 |
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2008
- 2008-02-04 JP JP2008557106A patent/JPWO2008096716A1/ja active Pending
- 2008-02-04 US US12/525,797 patent/US8333517B2/en active Active
- 2008-02-04 WO PCT/JP2008/051791 patent/WO2008096716A1/ja active Application Filing
-
2012
- 2012-09-18 JP JP2012204684A patent/JP5608202B2/ja active Active
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JPH08136767A (ja) * | 1994-11-09 | 1996-05-31 | Sumitomo Electric Ind Ltd | 光モジュール |
JPH09159860A (ja) * | 1995-06-19 | 1997-06-20 | Nippon Telegr & Teleph Corp <Ntt> | 光ファイバコネクタ |
JP2000304966A (ja) * | 1999-04-21 | 2000-11-02 | Nippon Telegr & Teleph Corp <Ntt> | 光導波路用コネクタ及び光結合装置 |
JP2002189137A (ja) * | 2000-12-20 | 2002-07-05 | Nippon Telegr & Teleph Corp <Ntt> | 光配線基板 |
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Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012003148A (ja) * | 2010-06-18 | 2012-01-05 | Hochiki Corp | 可動型光受信端子 |
US8761558B2 (en) | 2011-03-02 | 2014-06-24 | Hitachi Metals, Ltd. | Photoelectric transmission module |
US9325418B2 (en) | 2011-10-31 | 2016-04-26 | Mellanox Technologies, Ltd. | Optical module with flexible wiring board |
WO2014002616A1 (ja) * | 2012-06-29 | 2014-01-03 | オリンパス株式会社 | 光ファイバーケーブル接続構造 |
JP2014010329A (ja) * | 2012-06-29 | 2014-01-20 | Olympus Corp | 光ファイバーケーブル接続構造 |
US9435925B2 (en) | 2012-06-29 | 2016-09-06 | Olympus Corporation | Optical fiber cable connecting structure |
JP2014089395A (ja) * | 2012-10-31 | 2014-05-15 | Kyocera Corp | 光装置用基板および光装置 |
US9329349B2 (en) | 2013-06-13 | 2016-05-03 | Mellanox Technologies Ltd. | Integrated optical cooling core for optoelectronic interconnect modules |
JP2015031801A (ja) * | 2013-08-01 | 2015-02-16 | 富士通株式会社 | 光モジュールおよび光ファイバの実装方法 |
KR101370390B1 (ko) * | 2013-08-09 | 2014-03-06 | 주식회사 피피아이 | 광 패키징 모듈 |
JP2014132365A (ja) * | 2014-04-09 | 2014-07-17 | Hitachi Metals Ltd | 光伝送モジュール |
WO2016185537A1 (ja) * | 2015-05-18 | 2016-11-24 | オリンパス株式会社 | 内視鏡、および光伝送モジュール |
JPWO2016185537A1 (ja) * | 2015-05-18 | 2018-03-01 | オリンパス株式会社 | 内視鏡、および光伝送モジュール |
JP6200552B1 (ja) * | 2016-06-07 | 2017-09-20 | 株式会社フジクラ | コネクタ付きケーブル |
JP2017220541A (ja) * | 2016-06-07 | 2017-12-14 | 株式会社フジクラ | コネクタ付きケーブル |
WO2019207650A1 (ja) * | 2018-04-24 | 2019-10-31 | オリンパス株式会社 | 内視鏡用撮像装置、内視鏡、および内視鏡用撮像装置の製造方法 |
US11435570B2 (en) | 2018-04-24 | 2022-09-06 | Olympus Corporation | Image pickup apparatus for endoscope, endoscope, and manufacturing method of image pickup apparatus for endoscope |
JP2021015176A (ja) * | 2019-07-11 | 2021-02-12 | 日本電気株式会社 | 光モジュールおよび光モジュールの製造方法 |
JP7331508B2 (ja) | 2019-07-11 | 2023-08-23 | 日本電気株式会社 | 光モジュールおよび光モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8333517B2 (en) | 2012-12-18 |
JP2013015859A (ja) | 2013-01-24 |
US20100074581A1 (en) | 2010-03-25 |
JP5608202B2 (ja) | 2014-10-15 |
JPWO2008096716A1 (ja) | 2010-05-20 |
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