WO2008053673A1 - Dispositif de collecte de puce à semiconducteur - Google Patents

Dispositif de collecte de puce à semiconducteur Download PDF

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Publication number
WO2008053673A1
WO2008053673A1 PCT/JP2007/069698 JP2007069698W WO2008053673A1 WO 2008053673 A1 WO2008053673 A1 WO 2008053673A1 JP 2007069698 W JP2007069698 W JP 2007069698W WO 2008053673 A1 WO2008053673 A1 WO 2008053673A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor chip
push
adhesive sheet
picked
pick
Prior art date
Application number
PCT/JP2007/069698
Other languages
English (en)
Japanese (ja)
Inventor
Makoto Oota
Nobuaki Konishi
Koichi Shiga
Yasuo Iwaki
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Publication of WO2008053673A1 publication Critical patent/WO2008053673A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Definitions

  • the present invention relates to a pickup device that picks up a semiconductor chip attached to an adhesive sheet.
  • Patent Document 1 Japanese Patent Laid-Open No. 2002-100644
  • the thickness of a semiconductor chip may be as thin as 50 m or less.
  • stress is concentrated at the point where the tip hits.
  • the semiconductor chip may be damaged by the stress received from the push-up pin.
  • the present invention reliably picks up an adhesive sheet without damaging the semiconductor chip. It is to provide a pick-up device that can perform the power S.
  • the present invention provides a semiconductor chip pick-up device for picking up a semiconductor chip attached to the upper surface of an adhesive sheet,
  • a back-up body formed on an adsorption surface that adsorbs and holds a portion corresponding to the peripheral portion of the semiconductor chip to be picked up on the lower surface of the adhesive sheet;
  • a push-up body that is provided in the backup body so as to be driven in the vertical direction and pushes down the lower surface of the portion to which the semiconductor chip to be picked up of the adhesive sheet is stuck to push up the semiconductor chip from the upper surface of the backup body;
  • Pickup means for picking up the semiconductor chip picked up by the push-up body from the adhesive sheet by sucking and holding the upper surface of the semiconductor chip to be picked up
  • the push-up body When the semiconductor chip is pushed up through the pressure-sensitive adhesive sheet, the push-up body is formed of a soft elastic material whose peripheral portion is elastically deformed downward by tension generated in the pressure-sensitive adhesive sheet. .
  • FIG. 1 is a schematic configuration diagram of a pickup device showing an embodiment of the present invention.
  • FIG. 2 is a longitudinal sectional view of the backup body.
  • FIG. 3A is a perspective view of a push-up body.
  • FIG. 3B is a longitudinal sectional view of the push-up body.
  • FIG. 4 is a plan view showing the suction surface of the backup body.
  • FIG. 5A is an explanatory view when the suction nozzle body is lowered to pick up a semiconductor chip.
  • FIG. 5B is an explanatory diagram when the push-up shaft is raised to pick up the semiconductor chip.
  • FIG. 5C is an explanatory diagram when the push-up shaft is further raised to pick up the semiconductor chip.
  • FIG. 5D is an explanatory view when the semiconductor nozzle is picked up by raising the suction nozzle body.
  • FIG. 6 is an enlarged cross-sectional view showing a state in which a semiconductor chip to be picked up is pushed up by a lower suction nozzle.
  • This backup unit 10 has a backup body 1.
  • This backup body 1 is provided opposite to the lower surface side of the adhesive sheet 2 stretched on the wafer ring (not shown), and the upper surface of the backup body 1 is placed in the Z direction by the Z drive source (not shown) as described later. It is driven between a position in contact with the lower surface of 2 and a position away from the adhesive sheet 2.
  • a plurality of rectangular semiconductor chips 3 obtained by dividing a semiconductor wafer into dice-like shapes are attached to the upper surface of the pressure-sensitive adhesive sheet 2!
  • the wafer ring is driven in the horizontal direction by the X / Y drive source (not shown).
  • the semiconductor chip 3 attached to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the backup unit 10.
  • the wafer ring may be driven in the Z direction.
  • the wafer ring and the backup unit 10 are relatively driven in the X, Y, and Z directions. That's fine.
  • a suction nozzle body 4 constituting pickup means On the upper surface side of the pressure-sensitive adhesive sheet 2 and above the backup unit 10, a suction nozzle body 4 constituting pickup means is provided.
  • the suction nozzle body 4 has a pickup shaft 5 that is driven in the X, ⁇ , and ⁇ directions by an X, ⁇ , and ⁇ drive source (not shown).
  • a convex portion 6 is provided on the lower end surface of the pickup shaft 5.
  • the pickup shaft 5 is formed with a suction hole 7 whose tip is opened at the end face of the convex portion 6 along the axial direction.
  • the suction hole 7 is connected to a suction pump (not shown).
  • An upper suction nozzle 8 made of an elastic material such as rubber or soft synthetic resin is detachably attached to the convex portion 6.
  • the upper suction nozzle 8 has a nozzle hole 9 having one end communicating with the suction hole 7 and the other end opened to the tip surface, and further having a lower surface formed on the flat surface 8a.
  • a voice coil motor is used as a Z drive source for driving the pickup shaft 5 in the Z direction. It is preferable that the pressure load applied by the suction nozzle body 4 can be controlled constantly.
  • the backup body 1 has a cylindrical shape in which a lower end surface is opened and a rectangular opening 12 is formed on the upper surface.
  • the opening 12 is formed in a rectangular shape slightly smaller than the rectangular semiconductor chip 3 to be picked up, which is indicated by a chain line in FIG. That is, the opening 12 is formed in a similar shape to the semiconductor chip 3.
  • Three annular grooves 14a and 14c surrounding the opening 12 are concentrically formed on the upper surface of the backup body 1.
  • the three annular grooves 14a and 14c are communicated with each other by two communicating grooves 15 formed along the radial direction of the backup body 1.
  • the communication groove 15 is formed so as to be parallel to and opposite to the two opposite sides (ends) of the semiconductor chip 3 to be picked up.
  • a communication groove 15 may be further formed on the upper surface of the backup body 1 so as to be parallel to the other two opposite sides of the semiconductor chip 3 and outside the side. .
  • annular groove 14a located on the innermost side, four suction holes 16a are formed through the upper wall of the backup body 1 in the thickness direction at intervals of 90 degrees in the circumferential direction. Further, the diameter of the annular groove 14a is set to be larger than the diagonal length of the semiconductor chip 3 to be picked up! /
  • Two suction holes 16b are formed in the second annular groove 14b at intervals of 180 degrees in the circumferential direction.
  • a suction force acts on each annular groove 14a 14c and the communication groove 15 through the suction holes 16a and 16b as described later.
  • the annular grooves 14a and 14c and the suction holes 16a and 16b are shown only in FIG. 4, and are omitted in other drawings.
  • a cylindrical blocking member 21 is provided at the lower end opening of the backup body 1 with the end portion fitted in an airtight manner.
  • a through hole 22 penetrating in the axial direction is formed in the central portion of the closing member 21.
  • a push-up shaft 23 that constitutes a push-up means is slidable in the through-hole 22 and is airtightly held by an O-ring 24 provided at the lower end of the through-hole 22.
  • the upper end of the push-up shaft 23 protruding from the upper end surface of the closing member 21 has a rectangular shape.
  • a mounting board 25 is provided.
  • a columnar convex portion 26 is provided at the center of the upper surface of the mounting plate 25.
  • a push-up body 27 made of a soft elastic material such as rubber or synthetic resin is detachably attached to the convex portion 26. The softness of the push-up body 27 will be described later.
  • a suction hole 28 is formed in the push-up shaft 23 along the axial direction. This suction hole 2
  • the upper end of 8 opens to the upper surface of the convex portion 26 provided on the mounting plate 25, and the lower end opens to the side surface of the push-up shaft 23.
  • the push-up body 27 is formed with a nozzle hole 29 penetrating in the vertical direction.
  • the nose hole 29 communicates with the suction hole 28 of the convex portion 26 at the lower end when the push-up body 27 is attached to the convex portion 26.
  • the planar shape of the push-up body 27 is a rectangular shape, and a concave portion 32 surrounded by a rectangular annular wall 31 smaller than the planar shape of the push-up body 27 is formed on the upper surface.
  • the rectangle formed by the annular wall 31 is smaller than the semiconductor chip 3.
  • a portion of the upper surface of the push-up body 27 outside the annular wall 31 is formed on an inclined surface 33 inclined downward.
  • the surfaces of the inclined surface 33, the recess 32, and the annular wall 31 that are the upper surface of the push-up body 27 are formed on a low friction surface by coating a resin with a low coefficient of friction or forming a skin layer during forming. Has been.
  • an elliptical or circular support plate 35 in this embodiment is held and fixed.
  • the support plate 35 is harder than the push-up body 27 such as a fluororesin, for example, and is formed by an elastic material so as to be equal to or thinner than the depth dimension of the recess 32, and is A communication hole 36 penetrating in the thickness direction is formed in a portion corresponding to the nozzle hole 29 formed in the push-up body 27. Further, the upper edge of the support plate 35 is chamfered as shown in FIGS. 3B and 6 to form a tapered surface 35a.
  • suction holes 41 are formed in the closing member 21 that closes the lower opening of the backup body 1.
  • One end of the suction hole 41 is opened to the upper end surface of the closing member 21, that is, the internal space of the backup body 1, and the other end is opened to the outer peripheral surface of the closing member 21.
  • a suction hole 41 formed in the closing member 21 and a suction hole 28 formed in the push-up shaft 23 are connected to a suction pump 42 via a pipe 43.
  • suction pump 42 operates, suction force is generated in the annular grooves 14a to 14c through the suction holes 16a and 16b and the communication groove 15 opened on the upper surface of the backup body 1, and the suction formed on the push-up shaft 23 is generated.
  • a suction force is also generated in the nozzle hole 29 of the push-up body 27 through the hole 28.
  • the upper surface of the backup body 1 becomes an adsorption surface that adsorbs and holds the lower surface of the adhesive sheet 2 to which the semiconductor chip 3 is adhered.
  • the upper surface of the backup body 1 is the portion located around the semiconductor chip 3 to be picked up by the adhesive sheet 2, and the portion located around the opening 12 of the adhesive sheet 2 is sucked and held. To do.
  • the suction force acts on the nozzle hole 29 of the push-up body 27, the inside of the recess 32 surrounded by the annular wall 31 becomes negative pressure, so the push-up body 27 is the back-up body of the pressure-sensitive adhesive sheet 2.
  • the lower surface of the portion facing the opening 12 of 1 is sucked and held. That is, the adhesive sheet 2 is adapted to adsorb and hold the portion corresponding to the lower surface of the semiconductor chip 3 to be picked up and the portion located around the opening 12.
  • a cam follower 45 is rotatably provided at the lower end portion of the push-up shaft 23 protruding from the lower end surface of the closing member 21.
  • the cam follower 45 is in contact with the outer peripheral surface of the cam 46 that is rotationally driven in the direction of the arrow by a drive source (not shown). Therefore, when the cam 46 is driven to rotate, the push-up shaft 23 is driven in the vertical direction, and the push-up body 27 is interlocked with the movement in the vertical direction.
  • the push-up body 27 has the upper end surface of the annular wall 31 away from the suction surface of the backup body 1. It is set to protrude upward by a predetermined dimension, for example, about 0.5 mm.
  • the drive control for the suction nozzle body 4 and the backup unit 10 is not shown. The operation is controlled by the apparatus as will be described later.
  • the adhesive sheet 2 is driven in the X and Y directions by a wafer ring (not shown) and picked up.
  • the semiconductor chip 3 is positioned above the opening 12 of the backup body 1. That is, positioning is performed so that the center of the semiconductor chip 3 coincides with the center of the opening 12.
  • the suction nozzle body 4 is lowered as shown in FIG. 5A and picked up by the flat surface 8a at the lower end of the upper suction nozzle 8 provided at the lower end thereof. Adsorb the upper surface of the semiconductor chip 3. At this time, the suction nozzle body 4 presses the semiconductor chip 3 with a predetermined load. In addition, the upper surface of the push-up body 27 is positioned slightly below the lower surface of the adhesive sheet 2! /.
  • the upper suction nozzle 8 is lowered to suck and hold the upper surface of the semiconductor chip 3, and at the same time, the suction pump 42 is operated.
  • the internal space of the backup body 1 is depressurized, and suction force is generated in the annular grooves 14a to 14c and the communication groove 15 on the upper surface thereof, so that the semiconductor chip 3 on which the adhesive sheet 2 is picked up by the suction force
  • the portion located around the surface is sucked and held on the suction surface (upper surface) of the backup body 1.
  • the semiconductor chip 3 has a rectangular shape slightly larger than the opening 12. Therefore, even if a suction force is generated in the opening 12 of the backup body 1 before the lower surface of the semiconductor chip 3 is sucked and held by the push-up body 27, the semiconductor chip 3 facing the opening 12 is not The peripheral portion engages and is held by the peripheral portion of the opening 12 on the upper surface of the backup body 1. Therefore, the semiconductor chip 3 is prevented from being deformed by being sucked into the opening 12 together with the adhesive sheet 2 by the suction force generated in the knock-up body 1.
  • the push-up shaft 23 is raised as shown in FIG. 5B. Therefore, the push-up shaft
  • the lower surface of the semiconductor chip 3 to be picked up is adsorbed and held via the adhesive sheet 2 by the recess 32 of the push-up body 27 provided at the upper end of 23 and applied with the suction force of the suction pump 42. That is, the upper and lower surfaces of the semiconductor chip 3 to be picked up are sandwiched between the upper suction nozzle 8 and the push-up body 27 that are each formed of an elastic material via the adhesive sheet 2.
  • the timing at which the lower surface of the pressure-sensitive adhesive sheet 2 is sucked and held by the push-up body 27 may be sucked and held when the semiconductor chip 3 picked up by the upper suction nozzle 8 is lifted. It is not limited.
  • the push-up shaft 23 is raised as shown in FIG. 5C.
  • the push-up body 27 provided at the upper end of the push-up shaft 23 stretches the adhesive sheet 2 and deforms it into a trapezoidal mountain shape as shown in FIG. Push up from 1 suction surface.
  • the suction nozzle body 4 rises in conjunction with the rise of the push-up shaft 23.
  • the push-up body 27 is made of a soft elastic material.
  • the pressure-sensitive adhesive sheet 2 is smoothly and reliably peeled from the lower surface of the semiconductor chip 3 by the tension generated in the pressure-sensitive adhesive sheet 2 and the elastic deformation of the push-up body 27 due to the tension.
  • the peripheral portion of the push-up body 27 is elastically deformed with a predetermined time delay from the generation of the tension.
  • the push-up body 27 is gently elastically deformed while pushing up the semiconductor chip 3. Therefore, when the semiconductor chip 3 is pushed up, the pressure-sensitive adhesive sheet 2 is gently peeled off without the peripheral force of the semiconductor chip 3 being peeled off rapidly. It is possible to prevent the peripheral portion of 3 from being shocked and damaged.
  • the annular wall 31 provided on the upper surface of the push-up body 27 has a rectangular shape smaller than that of the semiconductor chip 3. Therefore, the pressure-sensitive adhesive sheet 2 is peeled almost uniformly over the entire length of the peripheral portion of the semiconductor chip 3.
  • the recess 32 of the push-up body 27 is provided with a support plate 35 formed of an elastic material harder than the push-up body 27. Therefore, the peeling of the pressure-sensitive adhesive sheet 2 is completed when it reaches the periphery of the support plate 35 from the periphery of the lower surface of the semiconductor chip 3.
  • the elastic deformation of the push-up body 27 due to the tension of the pressure-sensitive adhesive sheet 2 is relatively easily generated in the peripheral portion of the support plate 35.
  • the portion where the support plate 35 is provided is caused by the hardness of the support plate 35. Be blocked.
  • the push-up body 27 is formed of a soft elastic material that is compressed and deformed by the tension of the adhesive sheet 2. Even in this case, it is possible to prevent the semiconductor chip 3 from being greatly deformed and damaged as a whole.
  • the mounting plate 25 with the push-up body 27 attached to the upper end of the push-up shaft 23 is pushed up so that the peripheral portion of the lower surface of the push-up body 27 protrudes outward from the peripheral portion of the mounting plate 25. It is formed in an area smaller than the lower end surface of the body 27.
  • the upper surface of the push-up body 27 is formed as a low friction surface. Therefore, when the peripheral portion of the push-up body 27 is elastically deformed by the tension of the adhesive sheet 2, the push-up body 27 The pressure-sensitive adhesive sheet 2 slides smoothly against the inclined surface 33 and the upper end surface of the annular wall 31. As a result, the peripheral portion of the push-up body 27 is smoothly and reliably elastically deformed by the pressure-sensitive adhesive sheet 2, so that the pressure-sensitive adhesive sheet 2 can be smoothly peeled from the semiconductor chip 3.
  • the support plate 35 has a thickness dimension equal to or less than the depth dimension of the recess 32 formed in the push-up body 27, and is formed in an elliptical shape. Is chamfered into a tapered surface 35a!
  • the support plate 35 strongly presses the lower surface of the semiconductor chip 3 through the adhesive sheet 2 with a sharp portion. Therefore, even if the support plate 35 is harder than the push-up body 27 and is formed of an elastic material, the support plate 35 can prevent the semiconductor chip 3 from being damaged.
  • the semiconductor chip 3 is naturally sandwiched between the upper suction nozzle 8 and the push-up body 27 formed of an elastic material, the stress applied to the pushed-up semiconductor chip 3 is relieved, so that the semiconductor chip 3 3 may be difficult to damage.
  • the upper suction nozzle 8 is raised as shown in FIG. 5D.
  • the push-up body 27 sucks and holds the portion corresponding to the lower surface of the semiconductor chip 3 picked up by the adhesive sheet 2 by the suction force acting on the nozzle hole 29.
  • the suction force of the upper suction nozzle 8 that rises and the suction force of the push-up body 27 act as forces for separating the adhesive sheet 2 from the semiconductor chip 3 that is picked up, respectively.
  • the planar shape of the upper suction nozzle and the push-up body is not limited to a rectangular shape, but the point may be a circular shape or the like.
  • the opening of the backup body has a rectangular shape slightly smaller than the semiconductor chip, there is no limitation to the point that the opening may be formed larger than the semiconductor chip.
  • a nozzle hole is formed in the push-up body, a communication hole is formed in the support plate, and a suction hole is formed in the push-up shaft, and when the semiconductor chip is picked up, the lower surface of the part to which the semiconductor chip is attached is sucked. I did it.
  • the pressure-sensitive adhesive sheet is not separated from the upper surface of the push-up body! /, And the semiconductor chip is displaced on the upper face of the push-up body. If not, the pressure-sensitive adhesive sheet may not be sucked by the push-up body. That is, it is not necessary to form a nozzle hole in the push-up body, a communication hole in the support plate, and a suction hole in the push-up shaft.
  • the semiconductor chip when a semiconductor chip is picked up from the pressure-sensitive adhesive sheet, a portion of the pressure-sensitive adhesive sheet located in the periphery of the semiconductor chip is sucked and held, and the semiconductor chip is elastically deformed by the tension generated in the pressure-sensitive adhesive sheet. It was pushed up by a soft push-up body.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un dispositif de collecte de puce à semiconducteur, possédant un corps de soutien (1) dont la surface supérieure est formée comme une surface d'aspiration destinée à aspirer et maintenir une feuille adhérente (2) sur la partie de son côté inférieur qui correspond à la périphérie d'une puce à semiconducteur (3) à collecter, un corps pousseur (27) qui est prévu avec une possibilité de mouvement vertical à l'intérieur du corps de soutien (1) et comprimant la feuille adhérente sur son côté inférieur au niveau d'une partie sur laquelle est collée la puce à semiconducteur devant être collectée, et poussant la puce à semiconducteur depuis la surface supérieure du corps de soutien, ainsi qu'une buse (8) d'aspiration supérieure destinée à aspirer et maintenir la face supérieure de la puce à semiconducteur à collecter et qui collecte la puce à semiconducteur, laquelle est poussée et remontée par le corps pousseur depuis la feuille adhérente. Le corps pousseur (27) est constitué d'un matériau élastique présentant une élasticité qui permet de déformer élastiquement vers le bas la périphérie du corps pousseur grâce à une tension apparaissant dans la feuille adhérente lorsque le corps pousseur (27) pousse la puce à semiconducteur (3) par l'intermédiaire de la feuille adhérente (2).
PCT/JP2007/069698 2006-10-31 2007-10-09 Dispositif de collecte de puce à semiconducteur WO2008053673A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006296927A JP4825637B2 (ja) 2006-10-31 2006-10-31 半導体チップのピックアップ装置
JP2006-296927 2006-10-31

Publications (1)

Publication Number Publication Date
WO2008053673A1 true WO2008053673A1 (fr) 2008-05-08

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PCT/JP2007/069698 WO2008053673A1 (fr) 2006-10-31 2007-10-09 Dispositif de collecte de puce à semiconducteur

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JP (1) JP4825637B2 (fr)
TW (1) TWI423349B (fr)
WO (1) WO2008053673A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690038B (zh) * 2017-07-26 2020-04-01 日商芝浦機械電子裝置股份有限公司 半導體晶片的拾取裝置、半導體晶片的封裝裝置
TWI720667B (zh) * 2018-10-29 2021-03-01 日商芝浦機械電子裝置股份有限公司 電子零件的拾取裝置以及安裝裝置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101683398B1 (ko) * 2015-10-02 2016-12-07 주식회사 프로텍 칩 디테칭 장치 및 칩 디테칭 방법
KR102635493B1 (ko) 2020-11-04 2024-02-07 세메스 주식회사 본딩 설비에서 다이를 이송하기 위한 장치 및 방법
JP2023147018A (ja) * 2022-03-29 2023-10-12 東レエンジニアリング株式会社 突き上げヘッド及び突き上げ装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2003133391A (ja) * 2001-10-23 2003-05-09 Fujitsu Ltd 半導体チップの剥離方法及び装置
JP2004186352A (ja) * 2002-12-03 2004-07-02 Renesas Technology Corp 半導体装置及び半導体装置の製造方法
JP2005302932A (ja) * 2004-04-09 2005-10-27 M Tec Kk チップの分離装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283906B (en) * 2001-12-21 2007-07-11 Esec Trading Sa Pick-up tool for mounting semiconductor chips

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133391A (ja) * 2001-10-23 2003-05-09 Fujitsu Ltd 半導体チップの剥離方法及び装置
JP2004186352A (ja) * 2002-12-03 2004-07-02 Renesas Technology Corp 半導体装置及び半導体装置の製造方法
JP2005302932A (ja) * 2004-04-09 2005-10-27 M Tec Kk チップの分離装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690038B (zh) * 2017-07-26 2020-04-01 日商芝浦機械電子裝置股份有限公司 半導體晶片的拾取裝置、半導體晶片的封裝裝置
TWI720667B (zh) * 2018-10-29 2021-03-01 日商芝浦機械電子裝置股份有限公司 電子零件的拾取裝置以及安裝裝置

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TW200832568A (en) 2008-08-01
TWI423349B (zh) 2014-01-11
JP4825637B2 (ja) 2011-11-30
JP2008117806A (ja) 2008-05-22

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