WO2008032674A1 - Composition de résine photosensible, élément photosensible, procédé servant à former une impression de réserve et procédé servant à produire des cartes de câblage imprimé - Google Patents
Composition de résine photosensible, élément photosensible, procédé servant à former une impression de réserve et procédé servant à produire des cartes de câblage imprimé Download PDFInfo
- Publication number
- WO2008032674A1 WO2008032674A1 PCT/JP2007/067591 JP2007067591W WO2008032674A1 WO 2008032674 A1 WO2008032674 A1 WO 2008032674A1 JP 2007067591 W JP2007067591 W JP 2007067591W WO 2008032674 A1 WO2008032674 A1 WO 2008032674A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- photosensitive resin
- group
- meth
- resist pattern
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 102
- 238000000034 method Methods 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 45
- 239000011230 binding agent Substances 0.000 claims abstract description 22
- 125000000962 organic group Chemical group 0.000 claims abstract description 22
- 229920000642 polymer Polymers 0.000 claims abstract description 22
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 19
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 15
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 77
- 239000010410 layer Substances 0.000 description 60
- 239000001294 propane Substances 0.000 description 38
- -1 acryl Chemical group 0.000 description 35
- 239000000243 solution Substances 0.000 description 27
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 25
- 230000001681 protective effect Effects 0.000 description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 18
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 18
- 239000007864 aqueous solution Substances 0.000 description 17
- 239000000178 monomer Substances 0.000 description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 238000011161 development Methods 0.000 description 15
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- 238000007747 plating Methods 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 11
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 8
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 239000003513 alkali Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 206010034972 Photosensitivity reaction Diseases 0.000 description 6
- 239000002202 Polyethylene glycol Substances 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 6
- 230000036211 photosensitivity Effects 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 5
- 235000019441 ethanol Nutrition 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 235000000126 Styrax benzoin Nutrition 0.000 description 4
- 244000028419 Styrax benzoin Species 0.000 description 4
- 235000008411 Sumatra benzointree Nutrition 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 229960002130 benzoin Drugs 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 235000019382 gum benzoic Nutrition 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 150000003440 styrenes Chemical group 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 150000003673 urethanes Chemical class 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical group CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000012661 block copolymerization Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 3
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 2
- 229910021538 borax Inorganic materials 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 229940114081 cinnamate Drugs 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- WMFOQBRAJBCJND-UHFFFAOYSA-M lithium hydroxide Inorganic materials [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 2
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 2
- 229940107698 malachite green Drugs 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 235000010339 sodium tetraborate Nutrition 0.000 description 2
- 239000004328 sodium tetraborate Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- CZWMFYUHOQKUFL-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound [CH2]C(Cl)(Cl)Cl CZWMFYUHOQKUFL-UHFFFAOYSA-N 0.000 description 1
- SCEFCWXRXJZWHE-UHFFFAOYSA-N 1,2,3-tribromo-4-(2,3,4-tribromophenyl)sulfonylbenzene Chemical compound BrC1=C(Br)C(Br)=CC=C1S(=O)(=O)C1=CC=C(Br)C(Br)=C1Br SCEFCWXRXJZWHE-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- LMGYOBQJBQAZKC-UHFFFAOYSA-N 1-(2-ethylphenyl)-2-hydroxy-2-phenylethanone Chemical compound CCC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 LMGYOBQJBQAZKC-UHFFFAOYSA-N 0.000 description 1
- JKVSAZTYCZKNDX-UHFFFAOYSA-N 1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C1=CC(C(=O)CCC)=CC=C1N1CCOCC1 JKVSAZTYCZKNDX-UHFFFAOYSA-N 0.000 description 1
- RHDYQUZYHZWTCI-UHFFFAOYSA-N 1-methoxy-4-phenylbenzene Chemical compound C1=CC(OC)=CC=C1C1=CC=CC=C1 RHDYQUZYHZWTCI-UHFFFAOYSA-N 0.000 description 1
- LOBSVGRXQAHJDT-UHFFFAOYSA-N 1-morpholin-4-ylpropan-2-one Chemical compound CC(=O)CN1CCOCC1 LOBSVGRXQAHJDT-UHFFFAOYSA-N 0.000 description 1
- WAXMTENYNOYEBU-UHFFFAOYSA-N 1-phenylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C1=CC=CC=C1 WAXMTENYNOYEBU-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- LZWVPGJPVCYAOC-UHFFFAOYSA-N 2,3-diphenylanthracene-9,10-dione Chemical compound C=1C=CC=CC=1C=1C=C2C(=O)C3=CC=CC=C3C(=O)C2=CC=1C1=CC=CC=C1 LZWVPGJPVCYAOC-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- 125000004198 2-fluorophenyl group Chemical group [H]C1=C([H])C(F)=C(*)C([H])=C1[H] 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical class N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- BEUGBYXJXMVRFO-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=CC=C1 BEUGBYXJXMVRFO-UHFFFAOYSA-N 0.000 description 1
- CULWTPQTPMEUMN-UHFFFAOYSA-J [Ni](Cl)Cl.S(=O)(=O)([O-])[O-].[Ni+2] Chemical compound [Ni](Cl)Cl.S(=O)(=O)([O-])[O-].[Ni+2] CULWTPQTPMEUMN-UHFFFAOYSA-J 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- DTPCFIHYWYONMD-UHFFFAOYSA-N decaethylene glycol Chemical compound OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO DTPCFIHYWYONMD-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Natural products CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- MKVYSRNJLWTVIK-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical class CCOC(N)=O.CC(=C)C(O)=O.CC(=C)C(O)=O MKVYSRNJLWTVIK-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- XLSMFKSTNGKWQX-UHFFFAOYSA-N hydroxyacetone Chemical compound CC(=O)CO XLSMFKSTNGKWQX-UHFFFAOYSA-N 0.000 description 1
- 239000012216 imaging agent Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- GPKUICFDWYEPTK-UHFFFAOYSA-N methoxycyclohexatriene Chemical group COC1=CC=C=C[CH]1 GPKUICFDWYEPTK-UHFFFAOYSA-N 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003385 sodium Chemical class 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical class O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/061—Polyesters; Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
Definitions
- Photosensitive resin composition photosensitive element, resist pattern forming method, and printed wiring board manufacturing method
- the present invention relates to a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern, and a method for producing a printed wiring board.
- a printed wiring board is manufactured as follows, for example. First, the photosensitive resin composition layer of the photosensitive element is laminated on the circuit forming substrate. At this time, the surface of the photosensitive resin composition layer opposite to the surface in contact with the support film is brought into close contact with the surface of the circuit forming substrate on which the circuit is to be formed. Therefore, it is done while peeling off the protective film. Next, after exposing in an image form (pattern form) through a mask film or the like, the unexposed part is removed with a developer to form a resist pattern. Next, the resist pattern is used as a mask for etching or clinging to form a circuit pattern, and finally the cured portion is peeled off from the substrate.
- Patent Document 2 Japanese Patent Laid-Open No. 2000-214583
- Patent Document 3 Japanese Patent No. 3251446
- Patent Document 4 Japanese Patent Laid-Open No. 2005-31639
- Patent Document 5 Japanese Patent No. 3199600
- the photosensitive resin composition containing a bifunctional monomer does not always have sufficient tent reliability.
- the resulting cured film is hard. Tend to be brittle.
- the present invention has been made in view of the above circumstances, and is capable of forming a cured film having sufficient mechanical strength and flexibility, and is a photosensitive resin composition that is sufficiently excellent in tent reliability. It is an object to provide a product, a photosensitive element using the same, a method of forming a resist pattern, and a method of manufacturing a printed wiring board.
- the present invention is a photosensitive resin composition
- a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator,
- a photosensitive resin composition in which the component contains a photopolymerizable compound having an organic group represented by the following general formula (1).
- R 1 and R 2 each independently represent a hydrogen atom or a methyl group
- L 1 and L 2 each independently represent an alkylene group having 1 to 6 carbon atoms
- m and n are Each represents an integer of 0 to 50 selected such that the sum of m and n is 0 to 50.
- the components (A), (B) and (C) are essential components. And a cured film having sufficient mechanical strength and flexibility can be formed by including a photopolymerizable compound having an organic group represented by the general formula (1) as component (B). Sufficiently good tent reliability can be achieved.
- the present inventors presume that the presence of the organic group represented by the general formula (1) has an influence. However, the factor is not limited to this.
- the photopolymerizable compound having an organic group represented by the general formula (1) is preferably a photopolymerizable compound represented by the following general formula (2)!
- R 2 and R 3 each independently represent a hydrogen atom or a methyl group
- L 1 and L 2 each independently represent an alkylene group having 1 to 6 carbon atoms
- Z represents a single bond or a divalent organic group
- m and n each independently represents an integer of 0 to 50 selected so that the sum of m and n is 0 to 50.
- Such a photosensitive resin composition can form a cured film that is further excellent in mechanical strength and flexibility, and can further improve tent reliability.
- the Z force is preferably a divalent organic group represented by the following general formula (3) or (4).
- R 4 represents a hydrogen atom or a methyl group, represents an alkylene group having 1 to 6 carbon atoms, and p represents an integer of 0 to 25.
- L represents an alkylene group having 1 to 6 carbon atoms, r represents an integer of 1 to 25, and s represents an integer of 0 to 25.
- the present invention provides a photosensitive element comprising a support film and a photosensitive resin composition layer made of the above-described photosensitive resin composition formed on the support film.
- Such a photosensitive element includes the photosensitive resin composition layer made of the photosensitive resin composition of the present invention, whereby the mechanical strength and flexibility of the cured film made of the photosensitive resin composition layer. And sufficient tent reliability can be achieved.
- a photosensitive resin composition layer of the photosensitive element described above is laminated on a circuit forming substrate, and the photosensitive resin composition layer is irradiated with actinic rays in an image form to form an exposed portion.
- a resist pattern forming method for photocuring and removing portions other than the exposed portion is provided.
- a high-density resist pattern can be formed on a circuit forming substrate with high productivity.
- the present invention provides a method for manufacturing a printed wiring board comprising a step of forming a circuit pattern by etching or sticking a circuit forming substrate on which a resist pattern has been formed by the resist pattern forming method. To do.
- a good resist pattern can be formed on the circuit forming substrate by the above-described resist pattern forming method, and thus a printed wiring board with a high density is produced. It can be manufactured with good performance.
- FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of the photosensitive element of the present invention.
- FIG. 2 A plan view showing a substrate for measuring the number of hole breakage used to evaluate the deformed tent tear rate.
- FIG. 3 is an enlarged view of a triple hole in a region indicated by A in FIG.
- the photosensitive resin composition of the present invention comprises (i) a binder polymer (hereinafter sometimes referred to as “(ii) component”), (ii) a photopolymerizable compound having an ethylenically unsaturated bond (hereinafter sometimes referred to as “A photosensitive resin composition containing ( ⁇ ) component ”and ⁇ ) and (C) a photopolymerization initiator (hereinafter sometimes referred to as“ (C) component ”and! /, U). And a photopolymerizable compound having an organic group represented by the general formula (1) as a component.
- a binder polymer hereinafter sometimes referred to as “(ii) component”
- a photopolymerizable compound having an ethylenically unsaturated bond hereinafter sometimes referred to as “A photosensitive resin composition containing ( ⁇ ) component ”and ⁇ ) and (C) a photopolymerization initiator (hereinafter sometimes referred to as“ (C) component ”and!
- binder polymer as the component (ii) examples include acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, and phenol resins. From the viewpoint of excellent alkali developability, it is preferable to use an acrylic resin. . These can be used alone or in combination of two or more.
- Such a (A) binder polymer can be produced, for example, by radical polymerization of a polymerizable monomer.
- the polymerizable monomer include polymerizable styrene derivatives substituted at the ⁇ -position or aromatic ring such as styrene, vinyltoluene, a -methylstyrene, acrylamide such as diacetone acrylamide, talylonitrile, and the like.
- Bulle Esters of butyl alcohol such as ⁇ -butyl ether, (meth) acrylic acid alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid Jetylaminoethyl ester, (meth) acrylic acid glycidyl ester, 2, 2, 2-trifluoroethyl (meth) acrylate, 2, 2, 3, 3-tetrafluoropropyl (meth) acrylate, ( (Meth) acrylic acid, ⁇ -bromo (meth) acrylic acid, ⁇ -chloro ( Males such as (meth) acrylic acid, / 3-furyl (meth) acrylic acid, ⁇ -styryl (meth) acrylic acid, maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, monoisopropino maleate Examples include acid monoestenoles, fumarole acids,
- Examples of the (meth) acrylic acid alkyl ester include compounds represented by the following general formula (5), and compounds in which the alkyl group of these compounds is substituted with a hydroxyl group, an epoxy group, a halogen group, or the like. It is done.
- R 6 represents a hydrogen atom or a methyl group
- R 7 represents an alkyl group having 1 to 12 carbon atoms.
- the alkyl group having 1 to 12 carbon atoms include, for example, methyl group, ethyl group, propylene group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group and undecyl group. , Dodecyl groups and structural isomers thereof.
- Examples of the compound represented by the general formula (5) include methyl (meth) acrylate, (meth) acrylic acid ethyl ester, (meth) acrylic acid propyl ester, and (meth) butyl acrylate.
- Ester (meth) acrylic acid pentyl ester, (meth) acrylic acid hexyl ester, (meth) acrylic acid heptyl ester, (meth) acrylic acid octyl ester, (meth) acrylic acid 2-ethylhexyl ester, ( (Meth) acrylic acid nonyl ester, (meth) Examples include acrylic acid decyl ester, (meth) acrylic acid undecyl ester, and (meth) acrylic acid dodecyl ester. These can be used alone or in combination of two or more.
- the (A) binder polymer used in the present invention preferably has a carboxyl group from the viewpoint of improving the alkali developability.
- a (A) binder polymer can be produced, for example, by radical polymerization of a polymerizable monomer having a carboxyl group and another polymerizable monomer.
- the polymerizable monomer having a carboxyl group (meth) acrylic acid as described above is preferred!
- the ratio of the carboxyl group of the binder polymer is the ratio of the polymerizable monomer having a carboxyl group to the total polymerizable monomer to be used from the viewpoint of balancing alkali developability and alkali resistance. It is preferable to be 12 to 40% by mass, and it is particularly preferable to be 15 to 25% by mass, particularly preferably 15 to 30% by mass. ! / If the ratio force of the polymerizable monomer having a carboxyl group is less than 12% by mass, the alkali developability tends to be inferior, and if it exceeds 50% by mass, the Al strength resistance tends to be inferior.
- the binder polymer preferably contains styrene or a styrene derivative as a polymerizable monomer from the viewpoint of further improving the flexibility.
- styrene or a styrene derivative as the polymerizable monomer, both the adhesiveness and the release characteristics of the photosensitive resin composition are improved.
- the content of the styrene or styrene derivative is based on the total amount of the polymerizable monomer constituting the binder polymer, from the viewpoint of more reliably improving the adhesion and peeling properties of the photosensitive resin composition. It is preferable that it is 0 to 30% by mass; preferably it is 28 to 28% by mass, and particularly preferably 1.5 to 27% by mass. If this content is less than 0.1% by mass, the adhesion tends to decrease, and if it exceeds 30% by mass, the peel piece tends to be large and the peel time tends to be long.
- the “styrene derivative” refers to a compound in which a hydrogen atom in styrene is substituted with a substituent (an organic group such as an alkyl group or a halogen atom).
- the weight average molecular weight of the binder polymer is a balance between mechanical strength and alkali developability.
- the force is preferably 20000 to 300000, more preferably 40000 to 150000, more preferably force S, and more preferably 50000 to 100000.
- the weight average molecular weight in the present invention is a value measured by a gel permeation chromatography method (GPC) and converted by a calibration curve created using standard polystyrene.
- binder polymers are used singly or in combination of two or more.
- binder polymers used in combination of two or more types include, for example, two or more binder polymers composed of different copolymerization components, two or more binder polymers having different weight average molecular weights, and two or more types having different dispersities. And a binder polymer.
- Component (B) in the present invention is a photopolymerizable compound having an ethylenically unsaturated group, and includes a photopolymerizable compound having an organic group represented by the following general formula (1).
- R 1 and R 2 each independently represent a hydrogen atom or a methyl group
- L 1 and L 2 each independently represent an alkylene group having 1 to 6 carbon atoms
- m and n Represents an integer of 0 to 50 which is independently selected so that the sum of m and n is 0 to 50.
- the photosensitive resin composition of the present invention contains a photopolymerizable compound having an organic group represented by the above general formula (1) as the component (B), so that it has excellent mechanical strength and flexibility. In addition to being able to form a film and sufficiently improving the tent reliability, it also has excellent hydrophilicity and developer resistance.
- the photopolymerizable compound having an organic group represented by the general formula (1) is represented by the following general formula (2). ), which is preferably a compound represented by [Chemical 6]
- R 2 and R 3 each independently represent a hydrogen atom or a methyl group
- L 1 and L 2 each independently represent an alkylene group having 1 to 6 carbon atoms
- Z represents a single bond or a divalent organic group
- m and n each independently represents an integer of 0 to 50 that is selected so that the total power of m and n is S0 to 50.
- examples of the alkylene group having 1 to 6 carbon atoms in L 1 and L 2 include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, An isobutylene group, a pentylene group, a neopentylene group, and a hexylene group are exemplified, and an ethylene group is preferable.
- L 1 and / or L 2 is an isopropylene group [—CH (CH) CH—], and is divalent
- the bond direction of the isopropylene group is bonded to the case where the methylene group is bonded to oxygen in the divalent group.
- the bond direction of the isoprene group may be one kind of bond direction, or two kinds of bond directions may be mixed.
- L 1 and / or L 2 may be the same or different.
- L 1 and / or L 2 is composed of two or more types of alkylene groups, the bonding form of two or more types of — (L 1 O) — and / or — (L 2 — 0) —
- m and n are each independently a total force of m and n, which is ⁇ 50, S. From the viewpoint of hydrophilicity and developer resistance, the sum of m and n is preferably 1-40. 10 to 40 is more preferable, and 15 to 35 is particularly preferable.
- Z is preferably a divalent organic group represented by the following general formula (3) or general formula (4).
- R 4 represents a hydrogen atom or a methyl group
- L 3 represents an alkylene group having 1 to 6 carbon atoms.
- p is a force indicating an integer of 0 to 25. From the viewpoint of hydrophilicity and developer resistance, an integer of 1 to 20 is preferable, and an integer of 5 to 15 is more preferable.
- Examples of the alkylene group having 1 to 6 carbon atoms in L 3 include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a pentylene group, a neopentylene group, and a hexylene group. Force to be produced Ethylene group is preferred.
- L 3 is an isopropylene group and there are multiple divalent groups (L 3 O)
- the methylene group is bonded to oxygen in the divalent group in the direction of bonding of the isopropylene group! /
- the bond direction of the isoprene group may be one kind of bond direction, or two kinds of bond directions may be mixed.
- L 3 of 2 or more may be the same or different.
- the bonding form of two or more types of one (L 3 O) — is either random copolymerization or block copolymerization.
- L 4 represents an alkylene group having 1 to 6 carbon atoms.
- r represents an integer of 1 to 25. From the viewpoint of further improving hydrophilicity, developer resistance, mechanical strength and flexibility of the resulting cured film, r is preferably an integer of 2 to 10; more preferably an integer of 4 to 8 preferable.
- s represents an integer of 0 to 25. From the viewpoint of hydrophilicity and developer resistance, s is an integer of !!-20, preferably S, and more preferably an integer of 5-15! /.
- Examples of the alkylene group having 1 to 6 carbon atoms in L 4 include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a pentylene group, a neopentylene group, and a hexylene group. Force to be produced Ethylene group is preferred.
- L 4 is an isopropylene group and there are multiple divalent groups (L 4 O)
- the methylene group is bonded to oxygen in the divalent group in the direction of bonding of the isopropylene group! /
- the bonding direction of this isoprene group may be one bonding direction or two bonding directions.
- the coupling directions may be mixed.
- L 4 of 2 or more may be the same or different.
- the bonding form of two or more one (L 4 O) — may be either random copolymerization or block copolymerization.
- the photopolymerizable compound having an organic group represented by the general formula (1) is, for example, a compound containing a (meth) attalyloyl group to a compound having an ⁇ , ⁇ -unsaturated carbonyl group. It can be produced by 1, 4 addition reaction.
- Examples of the compound having an ⁇ / 3-unsaturated carbonyl group include a, / 3-unsaturated ketone, ⁇ , / 3-unsaturated ester, a, / 3-unsaturated amide and the like.
- Examples of the compound containing a (meth) atalyloyl group include a compound represented by R—H R—X R—OH R—SH R—M R—O—M R—S—M.
- R represents an organic group having a (meth) atalyloyl group
- X represents a halogen atom
- M represents a metal atom, and may be two or more metal salts or a salt of a metal and a nonmetal! /, .
- the component (B) may contain another photopolymerizable compound having an ethylenically unsaturated bond. it can .
- another photopolymerizable compound having an ethylenically unsaturated bond for example, a compound obtained by reacting a polyhydric alcohol with ⁇ , / 3-unsaturated carboxylic acid, 2, 2 bis (4 ((1 ) Bisphenols such as Atalyloxypolyethoxy) phenyl) propane, 2, 2 bis (4 — ((((meth)) talyloxypolypropoxy) phenyl) propane, 2, 2 bis (4 (((meth)) talixoxypolyethoxypolypropoxy) phenyl) propane (Meth) acrylate compounds, compounds obtained by reacting glycidyl group-containing compounds with ⁇ , ⁇ unsaturated carboxylic acids, urethane monomers such as
- the ( ⁇ ⁇ ⁇ ⁇ ) component preferably includes a bisphenol-based (meth) acrylate compound or a (meth) acrylate compound having a urethane bond.
- a bisphenol A-based (meth) acrylate compound it is preferable to include a bisphenol A-based (meth) acrylate compound. . These may be used alone or in combination of two or more.
- Examples of the 2, 2 bis (4 (((meth)) aryloxypolyethoxy) phenyl) propane include, for example, 2, 2 bis (4 — (((meth) atalyoxydiethoxy) phenyl) propane, 2, 2 bis (4 — (((Meth) Ataryloxytriethoxy) phenyl) propane, 2, 2 bis (4 — (((meth) acryloxytetraethoxy) phenol) propane, 2,2 bis (4 ((meth) Atalyloxypentaethoxy) phenyl) propane, 2, 2 bis (4 ((meth) atalyloxyhexaethoxy) phenenole) propane, 2, 2 bis (4 (((meth) atalyloxyheptaethoxy) phenenole) propane, 2, 2 bis (4 ((meth) atarioxyxytaethoxy) phenole) propane, 2, 2—bis (4 (((meth) atalyloxynonaeth
- B PE-500J (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.)
- BPE— 1300 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
- Examples of the 2,2bis (4 ((meth) atalyloxypolypropoxy) phenole) propane include, for example, 2,2bis (4 ((meth) atalyoxydipropoxy) phenyl) propane, 2 , 2 Bis (4 (((meth) Ataryloxytripropoxy) phenenole) propane, 2, 2 Bis (4 (((Meth) Atarioxytetrapropoxy) feninole) propane, 2, 2 Bis (4 ((Metal ) Atari mouth Xipentapropoxy) Phenol) Propane, 2, 2 bis (4 ((Meth) Atalyloxyhexapropoxy) Phenyl) Propane, 2, 2 bis (4 ((Meth) Ataloxy Heptapropoxy) Phenol) Propane, 2, 2 bis (4 ((meth) talix oxyta propoxy) phenyl) pronone, 2, 2 bis (4 ((meth) atalyloxy nonapropoxy) phenyl) propane,
- Examples of the 2,2bis (4 ((meth) ataryloxypolyethoxypolypropoxy) phenyl) propan include 2,2bis (4-((meth) atarioxydiethoxyoctapropoxy). Si) phenyl) propane, 2,2bis (4 ((meth) atarioxytetraethoxytetrapropoxy) phenyl) propane, 2,2bis (4 ((meth) atalyoxyhexaethoxyhexapropoxy) phenyl) propane, etc. Is mentioned. These may be used alone or in combination of two or more.
- Examples of the compound obtained by reacting the polyhydric alcohol with an ⁇ , / 3-unsaturated carboxylic acid include, for example, polyethylene glycol di (meth) acrylate having 2 to 14 ethylene groups.
- Polypropylene glycol di (meth) acrylate having 2 to 14 propylene groups, 2 to 14 ethylene groups, and polyethylene polypropylene glycol di (meth) having 14 to 14 propylene groups Atalylate, trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylol propane ethoxytri (meth) acrylate, trimethylololepropane methoxytri (meth) acrylate, trimethylolone Rep Mouth pantriethoxytri (meth) atarylate, trimethylolpropanthate Ethoxytri (meth) acrylate, trimethylolpropane pentaethoxytri (meth) acrylate, polypropylene glycol
- Examples of the urethane monomer include, for example, a (meth) atally having a hydroxyl group at the 0-position.
- Addition reaction product of triisocyanate and diisocyanate compounds such as isophorone diisocyanate, 2,6 toluene diisocyanate, 2,4 tolylene diisocyanate, 1,6-hexamethylene diisocyanate, tris [(Meth) attaxytetraethylene glycol isocyanate] hexamethylene isocyanurate, EO-modified urethane di (meth) acrylate, EO, PO-modified urethane di (meth) acrylate, and the like.
- EO represents ethylene oxide
- an EO-modified compound has a block structure of an ethylene oxide group.
- POJ indicates propylene oxide
- the PO-modified compound has a block structure of propylene oxide group.
- EO-modified urethane di (meth) acrylate for example,“ UA-11 ”(Shin Nakamura Chemical Co., Ltd.) ), Product name).
- Examples of EO and PO-modified urethane (meth) acrylates include “UA-13” (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
- photopolymerization initiator that is component (C) include benzophenone, N, N'-tetramethylol 4,4'-diaminobenzophenone (Michler ketone), N, N, -tetraethinole 4,4 'diaminobenzophenone , 4 methoxy 1 4'-dimethylaminobenzophenone, 2 benzanol 1 dimethylamino 1 1- (4 morpholinophenyl) 1 butanone 1, 2 methylinole 1
- Quinones such as phenyl anthraquinone, 2,3 diphenyl anthraquinone, 1 black anthraquinone, 2 methyl anthraquinone, 1,4 naphthoquinone, 9,10 phenantharaquinone, 2 methinore 1,4 naphthoquinone, 2,3 dimethylanthraquinone
- Benzoin ether compounds such as benzoin methyl ethereole, benzoin ethyleno ethereol, benzoin phenylenole ethere, benzoin compounds such as benzoin, methylbenzoin and ethylbenzoin, benzyl derivatives such as benzyldimethyl ketal, 2- ( o Clophenyl) -4,5-diphenylimidazo dimer, 2- (o Clophenyl) 4,5 di (methoxyphenolinole) imidazole dimer, 2- (o fluorophenyl)
- substituents of the aryl groups of the two 2, 4, 5 triaryl imidazoles may be the same to give the target compound, or differently give an asymmetric compound.
- a thixanthone compound and a tertiary amine compound may be combined, such as a combination of jetylthioxanthone and dimethylolaminobenzoic acid.
- 2,4,5 triarylimidazole dimer is more preferable from the viewpoint of adhesion and sensitivity. These may be used alone or in combination of two or more.
- the content ratio of the (A) binder polymer is preferably 50 to 70 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferable. If this content is less than 30 parts by mass, the photocured product tends to become brittle, and the coating properties tend to be insufficient when forming a photosensitive element, and if it exceeds 80 parts by mass, the photosensitivity becomes insufficient. Tend.
- the content of the (B) photopolymerizable compound is preferably 20 to 60 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). Is more preferred. If this content is less than 20 parts by mass, the photosensitivity tends to be insufficient, and if it exceeds 60 parts by mass, the photocured product tends to be brittle, and the coating property when forming the photosensitive element tends to be insufficient. There is.
- the content of the photopolymerizable compound having the organic group represented by the general formula (1) is preferably from! To 95% by mass from the viewpoint of tent reliability and resolution. It is particularly preferably 5 to 80% by mass, more preferably 15 to 50% by mass.
- the content of the (C) photopolymerization initiator is preferably 0.0;! To 20 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferably 2 to 5 parts by mass, and particularly preferably 1 to 4.5 parts by mass. If this content is less than 0.01 parts by weight, the photosensitivity tends to be insufficient, and if it exceeds 20 parts by weight, the absorption at the surface of the composition increases during exposure and the internal photocuring is not good. There is a tendency to be sufficient.
- the photosensitive resin composition of the present invention may contain a dye such as malachite green as necessary.
- a dye such as malachite green as necessary.
- Photochromic agents such as tribromophenylsulfone and leucocrystal violet
- thermochromic inhibitors such as tribromophenylsulfone and leucocrystal violet
- plasticizers such as p-toluenesulfonamide
- pigments such as p-toluenesulfonamide
- pigments such as an imparting agent, a leveling agent, a peeling accelerator, an antioxidant, a fragrance, an imaging agent, and a thermal crosslinking agent
- the addition amount of these additives is preferably 0.0;! To 20 parts by mass with respect to 100 parts by mass of the total amount of component (A) and component (B).
- the photosensitive resin composition of the present invention may contain, as necessary, methanol, ethanol, acetone, methyl ethyl ketone, methyl ethyl solve, ethyl ethyl sorb, toluene, N, N-dimethylformamide. It can be dissolved in a solvent such as propylene glycol monomethyl ether or a mixed solvent thereof and applied as a solution having a solid content of about 30 to 60% by mass.
- a solvent such as propylene glycol monomethyl ether or a mixed solvent thereof
- the photosensitive resin composition of the present invention is not particularly limited, but a metal surface, for example, an iron-based alloy such as copper, copper-based alloy, nickel, chromium, iron, stainless steel, preferably copper, copper-based It is preferable to apply it as a liquid resist on the surface of an alloy or an iron-based alloy and dry it, and then cover it with a protective film if necessary, or use it in the form of a photosensitive element.
- an iron-based alloy such as copper, copper-based alloy, nickel, chromium, iron, stainless steel, preferably copper, copper-based It is preferable to apply it as a liquid resist on the surface of an alloy or an iron-based alloy and dry it, and then cover it with a protective film if necessary, or use it in the form of a photosensitive element.
- the thickness of the photosensitive resin composition layer formed from the photosensitive resin composition of the present invention is preferably 1 to 200 m in thickness after drying depending on the application; It is more preferable that If this thickness is less than 1 m, coating tends to be difficult industrially. If it exceeds 200 m, the tent reliability will improve, but the sensitivity will be insufficient and the photocurability at the bottom of the resist will decrease. There is.
- the photosensitive element of the present invention includes a support film and a photosensitive resin composition layer formed of the photosensitive resin composition of the present invention formed on the support film. Moreover, it is preferable that the photosensitive element of this invention is further equipped with the protective film laminated
- FIG. 1 is a diagram schematically showing a cross-sectional configuration of a photosensitive element according to a preferred embodiment.
- the photosensitive element 1 includes a support film 10, a photosensitive resin composition layer 20 provided on the support film 10, and a protection provided on the photosensitive resin composition layer 20. Film 30.
- the photosensitive resin composition layer 20 is formed from the above-described present invention. It is a layer formed using a bright photosensitive resin composition.
- Examples of the support film 10 include polymer films having heat resistance and solvent resistance, such as polyethylene terephthalate film, polypropylene film, polyethylene film, and polyester film. Among these, it is preferable to use a polyethylene terephthalate film from the viewpoint of transparency. Since these polymer films must be removable from the photosensitive resin composition layer 20 later, they may be subjected to a surface treatment or a material that makes removal impossible. should not be done.
- the thickness of the support film 10 is preferably 1 to 100 111; more preferably! To 30 m. If the thickness of the support film is less than 1 m, the mechanical strength decreases, and the support film tends to be easily torn when the photosensitive resin composition is applied or when the support film is peeled off before development. . On the other hand, when the thickness exceeds 100 m, the resolution tends to decrease and the price tends to increase.
- the photosensitive resin composition layer 20 can be formed by, for example, applying the photosensitive resin composition of the present invention on the support film 10 and then drying it.
- the coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a slee coating method.
- the drying can be performed at 70 to 150 ° C. for about 5 to 30 minutes.
- the photosensitive resin composition When the photosensitive resin composition is applied onto the support film 10, methanol, ethanol, acetone, methyl ethyl ketone, methyl ethyl solve, ethyl ethyl sorb, toluene, N, N— It is preferable to apply a solution having a solid content of about 30 to 60% by mass in which a photosensitive resin composition is dissolved in a solvent such as dimethylformamide and propylene glycol monomethyl ether or a mixed solvent thereof.
- the amount of the remaining organic solvent in the photosensitive resin composition layer 20 after drying is preferably 2% by mass or less in order to prevent diffusion of the organic solvent in the subsequent step.
- the thickness of the photosensitive resin composition layer 20 varies depending on the application.
- the protective film 30 for example, a polymer film having heat resistance and solvent resistance such as a polyethylene terephthalate film, a polypropylene film, a polyethylene film, and a polyester film can be used. In the photosensitive element 1, a polymer film similar to the above support film 10 may be used as the protective film 30.
- the adhesive force between the protective film 30 and the photosensitive resin composition layer 20 is such that the protective film 30 is easily separated from the photosensitive resin composition layer 20, It is preferable that the adhesive strength between the supporting film 10 and the support film 10 is smaller.
- the protective film is preferably a low fish eye film.
- “Fish-ai” means that foreign materials, undissolved materials, oxidatively deteriorated materials, etc. of a material are produced when the film is manufactured by heat melting, kneading, extruding, biaxial stretching, casting method, etc. It was taken in.
- the thickness of the protective film 30 is preferably 1 to 100 111, more preferably 5 to 50 111, more preferably 5 to 30 111, and further preferably 15 to 30 111. It is particularly preferred. When the thickness of the protective film is less than 1 a m, the protective film tends to be easily broken during lamination, and when it exceeds 100 m, the price tends to increase.
- the photosensitive element 1 may further include an intermediate layer such as a cushion layer, an adhesive layer, a light absorption layer, or a gas barrier layer.
- an intermediate layer such as a cushion layer, an adhesive layer, a light absorption layer, or a gas barrier layer.
- the photosensitive element 1 can be stored, for example, in the form of a flat plate as it is, or in the form of a roll wound around a cylindrical core. In this case, it is preferable that the support film 10 is wound up so as to be the outermost side.
- the photosensitive element 1 when the photosensitive element 1 has a two-layer structure not having the protective film 30, the photosensitive element can be in the form of a flat plate as it is or the photosensitive resin composition layer.
- a protective film can be further laminated on the surface opposite to the support film side of 20 and wound around a cylindrical core, and stored in a roll form.
- the core is not particularly limited as long as it is conventionally used.
- plastic polyethylene resin, polypropylene resin, polystyrene resin, polychlorinated bur resin, ABS resin (acrylonitrile butadiene styrene copolymer), etc.
- an end face separator from the viewpoint of protecting the end face on the end face of the photosensitive element (photosensitive element roll) wound in a roll shape, and a moisture-proof end face separator from the viewpoint of resistance to edge fusion. It is preferable to install.
- the resist pattern forming method of the present invention comprises laminating a photosensitive resin composition layer comprising the photosensitive resin composition of the present invention or a photosensitive resin composition layer of the photosensitive element of the present invention on a circuit forming substrate.
- a predetermined portion of the photosensitive resin composition layer is irradiated with an actinic ray to photocur the exposed portion, and then the portion other than the exposed portion is removed.
- the “circuit forming substrate” means a substrate including an insulating layer and a conductor layer formed on the insulating layer.
- the protective film 30 of the photosensitive element 1 is gradually peeled off from the photosensitive resin composition layer 20.
- the surface of the photosensitive resin composition layer 20 that is gradually exposed is brought into close contact with the surface of the circuit forming substrate on which the circuit is to be formed.
- a resist pattern is formed by a method including a developing step for removing the unexposed portion of the substrate.
- the photosensitive resin composition layer on the circuit forming substrate in the laminating step after removing the protective film, the photosensitive resin composition layer is heated while heating the photosensitive resin composition layer.
- the lamination of the photosensitive element is preferably performed by heating the photosensitive resin composition layer and / or the circuit-forming substrate to 70 to 130 ° C, and the pressure is preferably about 0 ⁇ ;! to 1 ⁇ OMPa (1 To about 10 kgf / cm 2 ).
- these conditions are not particularly limited.
- the photosensitive resin composition layer is heated to 70 to 130 ° C. as described above, a circuit-forming substrate is previously formed. It is not necessary to preheat. In addition, in order to further improve the stackability, a pre-heat treatment of the circuit forming substrate can be performed.
- the surface of the circuit forming substrate on which the photosensitive resin composition layer is laminated is usually a metal surface, but is not particularly limited.
- Examples of a method for forming an exposed portion in the exposure step include a method of irradiating an actinic ray in an image form through a negative or positive mask pattern called an artwork (mask exposure method).
- an artwork mask exposure method
- the support film present on the photosensitive resin composition layer is transparent to the active light, the active light can be irradiated through the support film.
- the support film is light-shielding, the photosensitive resin composition layer is irradiated with actinic rays after the support film is removed.
- a method of irradiating actinic rays in an image form by a direct drawing method using a laser exposure method or the like may be employed.
- the light source of actinic light a known light source, for example, a carbon arc lamp, a mercury vapor arc lamp, an ultra-high pressure mercury lamp, a high-pressure mercury lamp, a xenon lamp, or the like that effectively radiates ultraviolet rays, visible light, etc. Used. Also, an Ar ion laser, a semiconductor laser, or the like that effectively emits ultraviolet light, visible light, or the like is used. Further, those that effectively radiate visible light, such as photographic flood bulbs and solar lamps, are also used.
- a method for removing portions other than the exposed portion in the development step when a support film is present on the photosensitive resin composition layer, the support film is first removed, and then wet development, dry drying is performed.
- An example is a method in which a part other than the exposed part is removed by development or the like. Thereby, a resist pattern is formed.
- a safe and stable developer having good operability such as an alkaline aqueous solution
- examples of the base of the alkaline aqueous solution include alkali hydroxides such as lithium, sodium or potassium hydroxide, alkali carbonates such as lithium, sodium, potassium or ammonium carbonate or bicarbonate, potassium phosphate, Alkali metal phosphates such as sodium phosphate and alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate are used.
- the alkaline aqueous solution used for development includes: 0.;! To 5% by weight of dilute solution of sodium carbonate, 0.;!
- the pH of the alkaline aqueous solution used in the present image is preferably in the range of 9 to 11; the temperature is adjusted according to the developability of the photosensitive resin composition layer.
- a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating development, and the like may be mixed.
- Examples of the aqueous developer include a developer composed of water or an alkaline aqueous solution and one or more organic solvents.
- the base contained in the alkaline aqueous solution in addition to the above-mentioned bases, for example, borax sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxy
- examples include methyl-1,3-propanediol, 1,3-daminopropanol-2, and morpholine.
- organic solvent examples include 3 acetone alcohol, acetone, ethyl acetate, alkoxy ethanol having an alkoxy group of 4 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butinoreanol alcohol, diethylene glycol monoremonomethylolate.
- examples include tenole, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether. These are used alone or in combination of two or more.
- the temperature of the aqueous developer is preferably 2 to 90% by mass of the organic solvent, and the temperature can be adjusted according to the developability. Furthermore, the pH of the aqueous developer is preferably as low as possible within the range where the resist can be sufficiently developed. PH8 to 12; more preferably pH 9 to 10 is more preferable. In addition, a small amount of a surfactant, an antifoaming agent or the like can be added to the aqueous developer.
- Examples of the organic solvent-based developer include 1,1,1,1-trichloroethane, N-methylpyrrolidone, N, N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and ⁇ -butylolatone. It is done.
- organic solvents it is preferable to add water in the range of 1-20% by mass to prevent ignition!
- Examples of the development method include a dip method, a battle method, a spray method, and brushing. And slapping. Among these, it is preferable to use a high-pressure spray system from the viewpoint of improving the resolution.
- a resist is obtained by performing heating at about 60 to 250 ° C. or exposure at about 0.2 to 10 mj / cm 2 as necessary. You can further cure the strike pattern! /
- the method for producing a printed wiring board of the present invention includes a step of etching or sticking a circuit forming substrate on which a resist pattern is formed by the resist pattern forming method of the present invention.
- Etching and mating of the circuit forming substrate are performed on the conductor layer of the circuit forming substrate using the formed resist pattern as a mask.
- the etching solution used for etching include cupric chloride solution, ferric chloride solution, alkaline etching solution, and hydrogen peroxide-based etching solution. Among these, from the viewpoint of good etch factor, it is preferable to use a ferric chloride solution.
- plating methods for plating for example, copper sulfate plating, copper pyrophosphate plating, etc., soldering such as high-throw solder plating, watt bath (nickel sulfate nickel chloride) plating , Nickel plating such as nickel sulfamate plating, gold plating such as hard metal plating, and soft gold plating.
- soldering such as high-throw solder plating, watt bath (nickel sulfate nickel chloride) plating , Nickel plating such as nickel sulfamate plating, gold plating such as hard metal plating, and soft gold plating.
- the resist pattern can be peeled off with a stronger alkaline aqueous solution than the alkaline aqueous solution used for development, for example.
- a stronger alkaline aqueous solution examples include:! ⁇ 10 mass% sodium hydroxide aqueous solution;! ⁇ 10 mass% potassium hydroxide aqueous solution.
- the peeling method examples include an immersion method and a spray one-side method. These may be used alone or in combination.
- the power to obtain a printed wiring board as described above The method for manufacturing a printed wiring board of the present embodiment can be applied not only to the manufacture of a single-layer printed wiring board but also to the manufacture of a multilayer printed wiring board.
- the production method of the present invention can be employed to suitably produce a multilayer printed wiring board having a small diameter through hole.
- solution a a solution in which 100 g of methacrylic acid, 250 g of methyl methacrylate, 10 g of ethynole acrylate and 50 g of styrene, and 0.8 g of azobisisobutyronitrile were mixed as monomers.
- solution a 100 g of methacrylic acid, 250 g of methyl methacrylate, 10 g of ethynole acrylate and 50 g of styrene, and 0.8 g of azobisisobutyronitrile were mixed as monomers.
- the solution a was added dropwise to the solution s heated to 80 ° C. over 4 hours, and then kept at 80 ° C. with stirring for 2 hours.
- a solution prepared by dissolving 1.2 g of azobisisobutyronitrile in lOOg solution s was dropped into the flask over 10 minutes. The solution after dropping was kept at 80 ° C.
- the resulting binder polymer had a weight average molecular weight of 80000.
- the conditions of GPC are as follows.
- Hitachi L-6000 product name, manufactured by Hitachi, Ltd.
- Hitachi L Type 3300 RI (trade name, manufactured by Hitachi, Ltd.)
- a component (B2) was obtained in the same manner as in Synthesis Example 2, except that the amount of polyethylene glycol # 400 ditalylate was changed to 5.2 g.
- Component BPE- 500 1) 1 5 1 5 15 1 5 15 1 5
- a 6 mm thick copper clad laminate (made by Hitachi Chemical Co., Ltd., trade name “MCL-E67”) with a diameter of 4 mm, Die-cutting machines were used to make 3 hole holes with 5 mm and 6 mm hole diameters and 3 hole holes with 3 circle holes.
- a burr with a brush equivalent to # 600 is used to remove burrs generated when the round hole 41 and the triple hole 42 are made ( This was removed using Sankei Co., Ltd. and used as a substrate 40 for measuring the number of broken holes.
- the obtained substrate for hole breakage number measurement 40 was heated to 80 ° C, and the photosensitive element obtained in Examples and Comparative Examples was exposed on the copper surface while peeling off the protective film.
- the resin composition layer was laminated so as to face the hole tearing number measurement substrate 40 under the conditions of 120 ° C. and 0.4 MPa. After laminating, the hole breakage measurement substrate 40 is cooled, and when the hole breakage measurement substrate temperature reaches 23 ° C, a 41-step tablet (made by Fuji Photo Film Co., Ltd. "Hitachi 41-step tablet”) is in close contact with an exposure machine (trade name "HMW-201B", manufactured by Oak Co., Ltd.) with a high-pressure mercury lamp lamp. The photosensitive resin composition layer was photocured.
- the film was allowed to stand at room temperature (25 ° C) for 15 minutes, and then the PET film as a support was peeled off and developed by spraying a 1% by weight aqueous sodium carbonate solution at 30 ° C for 60 seconds. . After development, the number of hole tears in the cured film (resist) formed on the triple hole 42 was measured, and the deformed tent tear rate was calculated. The smaller the deformed tent tear rate, the better the tent reliability.
- a photosensitive resin composition layer was laminated on a copper-clad laminate by the following method to obtain a laminate.
- the copper surface of a copper-clad laminate (made by Hitachi Chemical Co., Ltd., product name “MCL-E-67”), which is a glass epoxy agent with copper foil (thickness 35 mm) laminated on both sides, is # 600 Polishing was performed using a polishing machine (manufactured by Sankei Co., Ltd.) having an appropriate brush, washed with water, and then dried with an air flow.
- the obtained copper-clad laminate was heated to 80 ° C., and the photosensitive resin composition layer was placed on the copper-clad laminate while peeling off the protective film of the photosensitive element from the photosensitive resin composition layer.
- a laminate was obtained by laminating at a speed of 1.5 m / min using a heat roll at 110 ° C.
- a laminate was produced under the same conditions as in the above evaluation of “photosensitivity”.
- a phototool with Hitachi 41-step tablet and a phototool with a wiring pattern with a line width / space width force of Sl0 / 10 to 47/47 (unit: in) as a negative for resolution evaluation are stacked PET. It was made to adhere on the film. Subsequently, using an exposure machine with a high-pressure mercury lamp, the exposure was performed with an irradiation energy amount of 23 steps after development of the Hitachi 41-step tablet. Next, the PET film was peeled off, and a 1 mass% sodium carbonate aqueous solution at 30 ° C. was sprayed for 60 seconds to remove the unexposed portion and develop.
- the resolution was evaluated based on the smallest value (unit: in) of the space width between the line widths in which the unexposed portion could be removed cleanly by the development process. The results are shown in Table 2. The smaller the value, the better the resolution.
- a photosensitive resin composition capable of forming a cured film having sufficient mechanical strength and flexibility and sufficiently excellent in tent reliability, and a photosensitive element using the same, We can provide a resist pattern forming method and a printed wiring board manufacturing method.
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008534328A JP4569700B2 (ja) | 2006-09-13 | 2007-09-10 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
EP07807001A EP2063318A4 (en) | 2006-09-13 | 2007-09-10 | A LIGHT-SENSITIVE RESIN COMPOSITION, A LIGHT-SENSITIVE ELEMENT, A METHOD FOR FORMING A RESISTANCE STRUCTURE, AND A METHOD FOR PRODUCING A LADDER PLATE |
CN2007800327986A CN101512437B (zh) | 2006-09-13 | 2007-09-10 | 感光性树脂组合物、感光性元件、抗蚀图的形成方法及印刷电路板的制造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006247966 | 2006-09-13 | ||
JP2006-247966 | 2006-09-13 | ||
JP2007-165303 | 2007-06-22 | ||
JP2007165303 | 2007-06-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008032674A1 true WO2008032674A1 (fr) | 2008-03-20 |
Family
ID=39183733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/067591 WO2008032674A1 (fr) | 2006-09-13 | 2007-09-10 | Composition de résine photosensible, élément photosensible, procédé servant à former une impression de réserve et procédé servant à produire des cartes de câblage imprimé |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2063318A4 (ja) |
JP (1) | JP4569700B2 (ja) |
KR (1) | KR100994311B1 (ja) |
CN (2) | CN102393604B (ja) |
TW (1) | TW200837497A (ja) |
WO (1) | WO2008032674A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011114593A1 (ja) * | 2010-03-19 | 2011-09-22 | 日立化成工業株式会社 | 感光性樹脂組成物並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63184744A (ja) * | 1986-09-09 | 1988-07-30 | Asahi Chem Ind Co Ltd | 光重合性積層体 |
JP2000010278A (ja) * | 1998-06-19 | 2000-01-14 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP2000214583A (ja) | 1999-01-22 | 2000-08-04 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパタ―ンの製造法及びプリント配線板の製造法 |
JP3199600B2 (ja) | 1995-04-19 | 2001-08-20 | 日立化成工業株式会社 | 感光性樹脂組成物及びこれを用いた感光性エレメント |
WO2001092958A1 (fr) | 2000-05-29 | 2001-12-06 | Hitachi Chemical Co., Ltd. | Composition de resine photosensible, element photosensible, procede de production de motif de resist et procede de production de carte a circuit imprime |
JP3251446B2 (ja) | 1994-12-21 | 2002-01-28 | 日立化成工業株式会社 | 感光性樹脂組成物及び感光性エレメント |
JP2002162737A (ja) * | 2001-09-10 | 2002-06-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP2005031639A (ja) | 2003-06-16 | 2005-02-03 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法、プリント配線板の製造法、並びにプリント配線板、及びそれを用いた電子部品 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4610951A (en) * | 1983-06-06 | 1986-09-09 | Dynachem Corporation | Process of using a flexible, fast processing photopolymerizable composition |
US4539286A (en) * | 1983-06-06 | 1985-09-03 | Dynachem Corporation | Flexible, fast processing, photopolymerizable composition |
KR100485853B1 (ko) * | 1999-03-03 | 2005-04-28 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물, 이를 사용한 감광성 소자, 레지스트패턴의 제조 방법 및 프린트 배선판의 제조 방법 |
TWI258634B (en) * | 1999-10-22 | 2006-07-21 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element using the same, a process for producing resist pattern and resist pattern laminate |
JPWO2002025377A1 (ja) | 2000-09-20 | 2004-01-29 | 日立化成工業株式会社 | 感光性エレメント、レジストパターンの形成法及びプリント配線板の製造法 |
JP3855998B2 (ja) * | 2002-02-28 | 2006-12-13 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2005221743A (ja) * | 2004-02-05 | 2005-08-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
-
2007
- 2007-09-10 CN CN2011103494599A patent/CN102393604B/zh active Active
- 2007-09-10 JP JP2008534328A patent/JP4569700B2/ja active Active
- 2007-09-10 WO PCT/JP2007/067591 patent/WO2008032674A1/ja active Application Filing
- 2007-09-10 CN CN2007800327986A patent/CN101512437B/zh active Active
- 2007-09-10 EP EP07807001A patent/EP2063318A4/en not_active Withdrawn
- 2007-09-10 KR KR1020097002118A patent/KR100994311B1/ko active IP Right Grant
- 2007-09-12 TW TW096134106A patent/TW200837497A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63184744A (ja) * | 1986-09-09 | 1988-07-30 | Asahi Chem Ind Co Ltd | 光重合性積層体 |
JP3251446B2 (ja) | 1994-12-21 | 2002-01-28 | 日立化成工業株式会社 | 感光性樹脂組成物及び感光性エレメント |
JP3199600B2 (ja) | 1995-04-19 | 2001-08-20 | 日立化成工業株式会社 | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP2000010278A (ja) * | 1998-06-19 | 2000-01-14 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP2000214583A (ja) | 1999-01-22 | 2000-08-04 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパタ―ンの製造法及びプリント配線板の製造法 |
WO2001092958A1 (fr) | 2000-05-29 | 2001-12-06 | Hitachi Chemical Co., Ltd. | Composition de resine photosensible, element photosensible, procede de production de motif de resist et procede de production de carte a circuit imprime |
JP2002162737A (ja) * | 2001-09-10 | 2002-06-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP2005031639A (ja) | 2003-06-16 | 2005-02-03 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法、プリント配線板の製造法、並びにプリント配線板、及びそれを用いた電子部品 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2063318A4 * |
Also Published As
Publication number | Publication date |
---|---|
KR100994311B1 (ko) | 2010-11-12 |
TWI347494B (ja) | 2011-08-21 |
CN102393604A (zh) | 2012-03-28 |
JP4569700B2 (ja) | 2010-10-27 |
CN102393604B (zh) | 2013-06-12 |
CN101512437A (zh) | 2009-08-19 |
JPWO2008032674A1 (ja) | 2010-01-28 |
EP2063318A4 (en) | 2010-06-23 |
KR20090016639A (ko) | 2009-02-16 |
CN101512437B (zh) | 2011-12-14 |
EP2063318A1 (en) | 2009-05-27 |
TW200837497A (en) | 2008-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5126359B2 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
WO2007049519A1 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP4645776B2 (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法 | |
JP2007102184A (ja) | 感光性樹脂組成物、感光性エレメント、これらを用いたレジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2009003000A (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及び光硬化物の除去方法 | |
JP4697303B2 (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP5793924B2 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法 | |
WO2008075531A1 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
WO2006129469A1 (ja) | 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
KR101775206B1 (ko) | 감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법 | |
JP4240282B2 (ja) | 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 | |
JP2008304527A (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
WO2008032674A1 (fr) | Composition de résine photosensible, élément photosensible, procédé servant à former une impression de réserve et procédé servant à produire des cartes de câblage imprimé | |
JP4147920B2 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2008286852A (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2006317542A (ja) | 感光性フィルム、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2008102257A (ja) | 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 | |
JP4134574B2 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP4172248B2 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2010060891A (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2010160417A (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法 | |
JP4191354B2 (ja) | プリント配線板の製造法 | |
JP3775142B2 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 | |
JP2004301871A (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2005128300A (ja) | 感光性樹脂組成物及びこれを用いた感光性エレメント、レジストパターンの製造方法、プリント配線板、ディスプレイ板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780032798.6 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07807001 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008534328 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020097002118 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007807001 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |