WO2008018285A1 - Appareil de transfert de substrat, appareil de traitement de substrat, bras de transfert de substrat et procédé de transfert de substrat - Google Patents
Appareil de transfert de substrat, appareil de traitement de substrat, bras de transfert de substrat et procédé de transfert de substrat Download PDFInfo
- Publication number
- WO2008018285A1 WO2008018285A1 PCT/JP2007/064402 JP2007064402W WO2008018285A1 WO 2008018285 A1 WO2008018285 A1 WO 2008018285A1 JP 2007064402 W JP2007064402 W JP 2007064402W WO 2008018285 A1 WO2008018285 A1 WO 2008018285A1
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- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- plate
- holding
- arm
- lifting mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/025—Arms extensible telescopic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Definitions
- Substrate transfer device substrate processing device, substrate transfer arm, substrate transfer method
- the present invention relates to a substrate transfer apparatus, a substrate processing apparatus, a substrate transfer arm, and a substrate transfer method.
- various heat treatment apparatuses are used to perform processes such as oxidation, diffusion, CVD, and annealing on the surface of a substrate to be processed such as a semiconductor wafer (hereinafter simply referred to as "wafer") or a glass substrate. Used.
- a heat treatment apparatus for example, a vertical heat treatment apparatus capable of processing many wafers at once is known.
- a vertical heat treatment apparatus is provided with a wafer holding boat in which a plurality of holding plates for holding wafers, for example, are arranged in a vertical direction at a predetermined pitch in a vertical heat treatment furnace.
- the wafer placed on the plate can be heat-treated at once.
- a substrate transfer device having a transfer arm that can be swung, moved up and down, and moved back and forth is used.
- each holding plate of a wafer holding boat is formed in a ring shape, and the support pins are fixed so as to protrude upward. It is known that a push-up plate is provided so that the center of each holding plate can be moved up and down, and a wafer from the transfer arm is received by this push-up plate and placed on the holding plate.
- Patent Document 2 a second substrate support arm in which the push-up plate is formed in an arm shape is provided, and a wafer from the first substrate support arm, which is a transfer arm, is provided in a second state. Some are received by the substrate support arm and placed on the holding plate. Further, as described in Patent Document 3, for example, each holding plate of the wafer holding boat is provided with a claw portion protruding upward, and the wafer is loaded on the claw portion of each holding plate by the transfer arm. Some are allowed to be placed. Patent Document 1: JP-A-8-330318
- Patent Document 2 Japanese Patent Laid-Open No. 10-242067
- Patent Document 3 Japanese Patent Laid-Open No. 10-242237 Disclosure of the invention
- the holding plate pitch when the holding plate pitch must be wide, the number of holding plates provided in the wafer holding boat is reduced correspondingly, and the number of wafers that can be transferred to the wafer holding boat is also reduced. Less. For this reason, the number of wafers that can be heat-treated at a time decreases, and throughput decreases. Conversely, if the number of holding plates provided on the wafer holding boat is not reduced in order to suppress a decrease in throughput, the height of the wafer holding boat must be increased, and the length of the heat treatment furnace is increased accordingly. I have to.
- the present invention has been made in view of such problems, and the object of the present invention is to allow substrates to be exchanged with an arbitrary holding plate in the substrate holding boat, and the pitch of the holding plates. It is an object to provide a substrate transfer apparatus and the like that can be made narrower than ever. Means for solving the problem
- a substrate transfer device for transferring the substrate to a substrate holding boat in which a number of holding plates for holding the substrate are arranged in the vertical direction.
- a mounting device that is configured to be capable of turning and moving up and down, and to advance and retract to the base.
- a lifting fork provided with a transfer fork portion for mounting and transferring the substrate, and a substrate lifting mechanism that can be moved forward and backward on the base and can be tilted up and down.
- a substrate transfer apparatus comprising a second arm having a portion is provided. In this case, when the substrate is exchanged with respect to the holding plate, the second arm is preferably moved in and out of the holding plate with the substrate lifting mechanism tilted down.
- a substrate holding boat in which a number of holding plates for holding a substrate are arranged in the vertical direction, and a substrate is transferred to the substrate holding boat.
- a substrate processing apparatus for performing predetermined processing on a plurality of substrates transferred to the substrate holding boat at a time, wherein the substrate transfer apparatus is rotated and lifted A base configured to be able to move forward and backward on the base, and a first arm having a transport fork for transporting the substrate on the base; A second arm having a lifting fork portion provided with a tiltable substrate lifting mechanism, wherein the second arm is in a state in which the substrate lifting mechanism is tilted when the substrate is exchanged with the holding plate.
- the substrate processing apparatus is provided, characterized in that the work.
- a substrate transfer arm comprising a fork portion provided with a substrate lifting mechanism that can be moved up and down on a base that can be swung and raised and lowered.
- a substrate is transported by providing a second arm (substrate transfer arm) including a lifting fork portion provided with a tiltable substrate lifting mechanism.
- the substrate can be transferred by inserting the first arm to lift the substrate and the second arm to lift the substrate above and below any holding plate.
- the second arm can be inserted and removed from the lower side of the holding plate while the substrate lifting mechanism is tilted, so the pitch of each holding plate is narrower than before. The power S to do.
- the second arm includes a frame plate that forms an outer frame of the second arm, and a movable plate that is provided inside the frame plate so as to be movable back and forth with respect to the frame plate.
- a substrate lifting plate comprising a raising plate provided with a substrate supporting portion and a supporting plate hinged to the raising plate, and this substrate lifting plate is interposed between the frame plate and the movable plate.
- the hinge plate is configured to be tilted up and down in accordance with the horizontal movement of the movable plate by connecting with a hinge. According to this, since the raising and lowering plate can be raised and lowered simply by moving the movable plate, the force S can be easily lifted and lowered.
- the substrate lifting mechanism adjusts the position of each hinge portion and the length between the hinge portions to adjust the position of the substrate support portion according to the horizontal movement of the movable plate.
- the board support part of the raising and lowering plate is moved vertically to lift the board. Can do. This prevents the board from shifting horizontally when the board is lifted or lowered.
- a substrate transfer apparatus for transferring the substrate to a substrate holding boat in which a number of holding plates for holding the substrate are arranged in the vertical direction.
- a substrate transfer method using the substrate transfer device wherein the substrate transfer device is configured to be capable of turning and moving up and down, and is provided so as to be able to advance and retreat on the base, and is used for transferring and transferring the substrate.
- a first arm having a fork portion; and a second arm having a lifting fork portion provided on the base so as to be able to move forward and backward and having a substrate lifting mechanism that can be turned up and down.
- the second arm With the substrate placed on the top of the holding plate to which the substrate is to be transferred, the second arm is inserted below the holding plate with the substrate lifting mechanism tilted. And the substrate lifting mechanism Erecting and lifting the substrate on the first arm; pulling out the first arm from the upper side of the holding plate; tilting the substrate lifting mechanism to lower the substrate on the holding plate; And a step of pulling out the second arm from the lower side of the holding plate in a state where the substrate lifting mechanism is tilted.
- the second arm can be inserted into or pulled out from the lower side of the holding plate, so that the substrate can be reliably placed on the desired holding plate.
- a substrate transfer device for transferring the substrate to a substrate holding boat in which a number of holding plates for holding the substrate are arranged in the vertical direction.
- a substrate transfer method using the substrate transfer device wherein the substrate transfer device is configured to be capable of turning and moving up and down, and is provided so as to be able to advance and retreat on the base, and is used for transferring and transferring the substrate.
- a first arm having a fork portion; and a second arm having a lifting fork portion provided on the base so as to be able to move forward and backward, and having a substrate lifting mechanism that can be tilted up and down.
- a step of inserting the substrate to be transferred onto the lower side of the holding plate on which the substrate to be transferred is placed, and a step of lifting the substrate on the holding plate by raising the substrate lifting mechanism.
- a lifted substrate and the holding plate Inserting the first arm in between, depressing the substrate lifting mechanism to lower the substrate on the holding plate onto the transfer fork portion of the first arm, and the second arm to the substrate Withdrawing from the lower side of the holding plate in a state where the lifting mechanism is tilted, and pulling out the first arm from the upper side of the holding plate with the substrate placed on the transfer fork portion.
- a featured substrate transfer method is provided. As a result, even if the pitch of each holding plate is narrow, the second arm can be inserted and removed from the lower side of the holding plate, so that the substrate can be reliably removed from the desired holding plate.
- substrates can be exchanged with an arbitrary holding plate in the substrate holding boat, and the pitch of the holding plates can be made narrower than before.
- FIG. 1 is a cross-sectional view showing a schematic configuration of a vertical heat treatment apparatus according to an embodiment of the present invention.
- FIG. 2 is a perspective view for explaining the wafer holding boat shown in FIG. 1.
- FIG. 3 is a perspective view showing a configuration example of a substrate transfer apparatus according to the embodiment.
- FIG. 4A is a perspective view showing a configuration example of a second arm, and shows a state in which the substrate lifting mechanism is tilted.
- 4B] is a perspective view showing a configuration example of the second arm, and shows a state in which the substrate lifting mechanism is erected.
- 5A is a perspective view showing a configuration example of the substrate lifting mechanism, and shows a state in which the substrate lifting mechanism is tilted.
- 5B is a perspective view showing a configuration example of the board lifting mechanism, and shows a state in which the board lifting mechanism is raised.
- FIG. 6B A perspective view showing another configuration example of the second arm, showing a state in which the substrate lifting mechanism is raised.
- Fig. 7A is a perspective view showing another configuration example of the substrate lifting mechanism, and shows a state in which the substrate lifting mechanism is tilted.
- FIG. 7B A perspective view showing another configuration example of the substrate lifting mechanism, showing the state where the substrate lifting mechanism is raised.
- FIG. 7B is a side view of the substrate lifting mechanism shown in FIG. 7A.
- FIG. 7B is a side view of the substrate lifting mechanism shown in FIG. 7B.
- FIG. 9A A diagram for explaining the operation of the substrate transfer device when setting a wafer on the holding plate of the wafer holding boat.
- FIG. 9B is a diagram for explaining the operation following FIG. 9A.
- FIG. 9C is a diagram for explaining the operation following FIG. 9B.
- FIG. 9D is a diagram for explaining the operation following FIG. 9C.
- FIG. 9E is a diagram for explaining the operation following FIG. 9D.
- FIG. 9F is a diagram for explaining the operation following FIG. 9E.
- FIG. 10A is a diagram for explaining the operation of the substrate transfer device when a wafer is taken out from the holding plate of the wafer holding boat.
- FIG. 10B is a diagram for explaining the operation following FIG. 10A.
- FIG. 10C is a diagram for explaining the operation following FIG. 10B.
- FIG. 10D is a diagram for explaining the operation following FIG. 10C.
- FIG. 10E is a diagram for explaining the operation following FIG. 10D.
- FIG. 10F] is a diagram for explaining the operation following FIG. 10E.
- FIG. 11 A perspective view showing another configuration example of the wafer holding boat. Explanation of symbols
- FIG. 1 It is sectional drawing which shows the vertical heat processing apparatus concerning this embodiment.
- the vertical heat treatment apparatus 100 includes a processing vessel 118 made of high-purity quartz having an open lower end.
- a processing vessel (heat treatment furnace) 118 accommodates a wafer holding boat 200 as an example of a substrate holding boat that holds a number of substrates, for example, semiconductor wafers (hereinafter also simply referred to as “wafers”) W.
- a lid 122 is detachably and detachably provided at the lower end opening of the processing vessel 118.
- a hollow cylindrical quartz heat insulating cylinder 124 is rotatably provided.
- the wafer holding boat 200 is placed on the lid 122 via a heat insulating cylinder 124.
- the lid 122 is connected to a lifting mechanism (not shown). By this elevating mechanism, the lid 122 is opened and closed, and the wafer holding boat 200 is loaded into and unloaded from the processing vessel 118.
- a processing gas introduction nozzle 126 for introducing a processing gas into the processing container 118 is provided at the ceiling in the processing container 118.
- an exhaust nozzle 128 connected to an exhaust pump (not shown) is provided on the lower side wall of the processing vessel 118, and the inside of the processing vessel 118 is exhausted through the exhaust nozzle 128.
- a heat insulating material 130 is provided outside the processing container 118 so as to cover the entire processing container 118.
- a heater 132 for heating the processing vessel 118 is provided over the entire surface.
- the calorie heater 132 is made of, for example, double-coated molybdenum (trade name: Kanthal Super Heating Element). According to this, the heat generation per unit area can be set very high, for example, about 10 to 30 watts / cm 2, and the wafer can be heated at high speed.
- a ring-shaped blower header 136 connected to the blower fan 134 is provided at the lower end of the heat insulating material 130.
- a blowing nozzle 138 is disposed from an appropriate portion of the blowing header 136 toward a space between the processing vessel 118 and the heat insulating material 130.
- An exhaust passage 140 for discharging cooling air is connected to the ceiling portion of the heat insulating material 130.
- the wafer holding boat 200 is provided with a number of holding plates 210 for holding wafers W arranged in a vertical direction at a predetermined pitch.
- the holding plate 210 is attached to a plurality of support columns 220 arranged on the heat insulating cylinder 124.
- the support column 220 is provided so as to surround the periphery of the holding plate 210, and the support plate 210 is supported so that the periphery of the support plate 210 is horizontal inside the plurality of support columns 220.
- One side of the wafer holding boat 200 is opened as a transfer loading / unloading port 222 by increasing the interval between the columns 220.
- the wafer W can be easily transferred by the substrate transfer device 300 from the transfer port 222 on the side to each holding plate 210 of the wafer holding boat 200.
- the holding plate 210 is formed in a continuous ring shape that is larger than the diameter of the wafer W and has no notches, for example, as shown in FIG. According to this, when the film is formed on the wafer W, the film thickness tends to be thicker in the peripheral portion than in the central portion, but the film is formed on the wafer W placed on the holding plate 210. When this is done, the film is formed as if the peripheral edge of the wafer W is extended, so that a uniform film can be formed over the entire surface including the peripheral edge of the wafer W.
- the inner diameter, that is, the diameter of the hollow portion is preferably a size (diameter) that can stably hold the lower edge of the wafer W. .
- a recess (not shown) that prevents horizontal movement of the wafer W is preferably formed on the upper surface of the holding plate 210. This prevents the wafer W from slipping off and falling off the holding plate 210.
- the holding plate 210 and the support column 220 are made of a material (for example, a quartz material, a silicon carbide (SiC) material, etc.) that has heat resistance and does not become a contamination source for the wafer.
- a material for example, a quartz material, a silicon carbide (SiC) material, etc.
- the upper end and the lower end of the column 220 are fixed by an upper end ring member 204 and a lower end ring member 206 made of, for example, a transparent quartz material or a silicon bite material.
- the light shielding plate 202 is fitted into the hollow portion of the upper end ring member 204.
- the light shielding plate 202 is made of, for example, high-purity opaque quartz or opaque silicon carbide that does not contain impurities, and blocks heat rays (light) from a heater or the like. As a result, direct light from the heater 132 is blocked near the upper end of the wafer holding boat 200. Since the wafer W located near the upper end of the wafer holding boat 200 can be brought into the same thermal environment as the wafer located in the middle part of the boat, the result of the heat treatment varies depending on the position of the wafer W. Attaching force S Can prevent the occurrence of S.
- a wafer cassette 150 is disposed in the vicinity of the wafer holding boat 200 as described above.
- the wafer cassette 150 is configured by a substrate storage container formed of, for example, resin.
- a plurality of grooves are formed on the inner wall surface of the substrate storage container, and the peripheral portions of the plurality of wafers W are supported by the grooves.
- the wafer cassette 150 is configured to store, for example, 25 wafers W! /.
- the wafer holding boat 200 and the wafer cassette 150 are arranged on substantially the same circumference, and the wafer is transferred between the wafer holding boat 200 and the wafer cassette 150 at the center thereof.
- a substrate transfer device 300 is provided.
- Fig. 3 is an enlarged view of the substrate transfer device shown in Fig. 2.
- the substrate transfer apparatus 300 includes a base 310 configured to be capable of turning and raising and lowering, and first and second arms 320 and 330 as substrate transfer arms provided on the base 310.
- the base 310 is formed in, for example, a substantially box shape extending in one direction, and a base drive mechanism 302 for turning and raising / lowering the base 310 is connected below the base 310.
- the base drive mechanism 302 is configured as follows, for example. That is, the base drive mechanism 302 includes a turning motor (not shown), and the turning motor can turn the base 310 horizontally.
- the base drive mechanism 302 includes a lifting motor (not shown), and the base 310 can be lifted and lowered by a ball screw driven by the lifting motor. From this, the first and second arms 320 and 330 on the base 310 can be turned and moved up and down horizontally via the base 310.
- the structure of the base drive mechanism 302 is as described above. It is not limited to.
- a groove 312 is provided along the longitudinal direction of the upper surface of the base 310, and the slider portions 321 and 331 of the first and second arms 320 and 330 can advance and retreat independently along the groove 312. It is structured as follows. Of these substrate transfer arms, the first arm 320 is the tip side.
- the transport fork unit 322 has a wafer fork on the transport fork unit 322.
- the transport fork 322 is preferably formed in a fork shape that does not interfere with the operation of the substrate lifting mechanism 340 of the second arm 330 described later.
- the transport fork 322 shown in Fig. 3 has a fork shape with a notch from the middle to the tip.
- the second arm 330 has a lifting fork portion 332 provided with a substrate lifting mechanism 340 that can be tilted on the tip side, and the lifting fork portion 332 holds and holds the wafer on the transfer fork portion 322. The wafers on the plate 210 and the wafers in the wafer cassette 150 are lifted.
- the second arm 330 is provided with a frame plate 334 constituting an outer frame, and provided inside the frame plate 334 so as to be able to advance and retreat with respect to the frame plate 334.
- the movable plate 336 is provided.
- the frame plate 334 is fixed to the slider portion 331.
- the movable plate 336 can be driven horizontally with respect to the frame plate 334 in the advancing and retracting direction by a cylinder mechanism 338 provided in the slider portion 331 as shown in FIG. 4A, for example.
- the lifting mechanism 340 is constituted by, for example, a base plate lifting plate configured to be bent by hinge connection of a plate material.
- the board lifting plate is hinged between the frame plate 334 and the movable plate 336, and is tilted up and down in accordance with the forward / backward movement of the movable plate 336.
- the movable plate 336 is moved in the advancing direction by the cylinder mechanism 338 from the state in which the lifting mechanism 340 is tilted. This raises the lifting mechanism 340 as shown in Fig. 4B.
- the wafer W can be lifted from the lower surface by the raising / lowering operation of the lifting mechanism 340.
- at least three lifting mechanisms 340 can be attached to the lifting fork 332 so that the lower surface of the wafer W can be lifted horizontally.
- the lifting mechanism 340 includes a tilting plate 342 provided with a substrate support portion 346 that supports the lower surface of the wafer W, and a tilting plate 342 for supporting and tilting the tilting plate 342. And a substrate lifting plate formed by a support plate 344 connected to the hinge. [0043] The substrate lifting plate is hinged between the frame plate 334 and the movable plate 336 as described above.
- the base end of the support plate 344 is hinge-connected to the frame plate 334 and the base end of the raising / lowering plate 342 is hinge-connected to the movable plate 336.
- the connection state of the board lifting plate is not necessarily limited to this, and although not shown, for example, the base end of the support plate 344 is hinge-connected to the movable plate 336 and the raising and lowering plate is connected to the frame plate 334. Make sure that the base end of 342 is hinged.
- the substrate support 346 is formed integrally with the raising and lowering plate 342 as shown in FIGS. 5A and 5B, for example. That is, the substrate support portion 346 is provided on a part of the tip surface of the raising / lowering plate 342 so as to extend from the tip surface.
- 5A and 5B exemplify the case where the substrate support portion 346 is provided near one side of the front end surface of the tilting plate 342, but the present invention is not necessarily limited to this.
- the substrate support portion 346 346 may be provided near the other side surface of the tip surface of the tilting plate 342, or may be provided at the center of the tip surface of the tilting plate 342. It is preferable to form the tip of the substrate support 346 so that the same part always contacts the wafer W by obliquely cutting or chamfering!
- the lifting mechanism 340 is made of, for example, a material having an inertial restoring force (eg, polypropylene, piano wire).
- the raising and lowering plate 342 and the support plate 344 of the lifting mechanism 340 are integrally formed of a polypropylene plate material.
- the hinge part between the raising and lowering plate 342 and the support plate 344 is constituted by, for example, a portion of the polypropylene plate material that is notched and left thin.
- Fig. 5A and Fig. 5B the upper part of the polypropylene plate is cut out, and the hinge part is formed by the part where the lower surface remains thin!
- the frame plate 334 and the movable plate 336 are also composed of, for example, polypropylene plate material, and the hinge between the movable plate 336 and the stool J plate 342]
- the hinge between the frame plate 334 and the support plate 344 [3] Also, for example, the surface of a polypropylene plate material is cut out and formed by a thin portion.
- 5A and 5B show the hinge part between the movable plate 336 and the raising and lowering plate 342 and the hinge part between the frame plate 334 and the support plate 344, respectively. It is composed.
- each hinge part of the lifting mechanism 340 is not limited to the above, and may be constituted by a coil spring, for example.
- the lifting mechanism 340 having such a configuration, as shown in FIG.
- the raising and lowering plate 342 rises together with the substrate support portion 346 around the hinge portion.
- the tip of the substrate support 346 protrudes upward from the upper surfaces of the frame plate 334 and the movable plate 336.
- the tilting plate 342 collapses together with its substrate support 346 by the inertial restoring force of each member. Return to the state shown in 5A.
- the tilting plate 342 when the lifting mechanism 340 is configured to be able to be tilted by the hinge portion, the tilting plate 342 is in a state where the tilting plate 342 is tilted. It is also possible that a thought point that could move either above or below the arm 330 could be reached.
- a hinge portion between the raising and lowering plate 342 and the support plate 344 is provided on the lower surface thereof, and the raising and lowering plate 342 rotates around the hinge portion on the lower surface. The falling plate 342 rises above the second arm 330.
- the raising / lowering plate 342 when the raising / lowering plate 342 is brought down, it may not be pushed down to the state of the thought point. As a result, even if the hinge part is not provided on the lower surface of the raising and lowering plate 342 and the support plate 344, the raising and lowering plate 342 must rise up above the second arm 330 whenever the movable plate 336 is moved in the forward direction. Touch with force S.
- the movable plate 336 may be moved in the forward / backward direction by a cam mechanism 339 as shown in FIG. 6A.
- the cam shape of the cam mechanism 339 is elliptical and the cam is rotated, as shown in FIG. 6A, the raising / lowering plate 342 of the lifting mechanism 340 is shown in FIG. 6B.
- FIG. 6A when the cam shape of the cam mechanism 339 is elliptical and the cam is rotated, as shown in FIG. 6A, the raising / lowering plate 342 of the lifting mechanism 340 is shown in FIG. 6B.
- the lifting mechanism 340 shown in FIGS. 5A and 5B extends from the front end surface of the raising and lowering plate 342 to form the substrate support portion 346, but is not necessarily limited thereto.
- the plate material that constitutes the board support 346 may be attached to the lower side of the raising and lowering plate 342 to form a single unit.
- the lifting mechanism 340 having such a configuration, as shown in FIG.
- the raising and lowering plate 342 is turned up with the substrate support portion 346 around the hinge portion.
- the tip of the substrate support 346 protrudes upward from the upper surfaces of the frame plate 334 and the movable plate 336.
- the upright plate 342 is tilted together with the substrate support 346 by the inertial restoring force of each member. People are in such a state.
- the second arm 330 can be moved in and out from the lower side of the holding plate 210 with the substrate lifting mechanism 340 tilted down. Therefore, the pitch of each holding plate 210 can be made narrower than before.
- the lifting mechanism 340 is configured to adjust the position of each hinge part and the length between the hinge parts so that the tip of the substrate support part 346 linearly moves along the vertical direction.
- S can. For example, by adjusting the position of each hinge and the length between each hinge under the same conditions as the Scott Russell mechanism that converts horizontal movement into vertical linear movement, the tip of the substrate support 346 is moved vertically. The wafer can be lifted by movement.
- FIGS. 7A and 7B are views seen from the side when the lifting mechanism 340 is in the state of FIGS. 7A and 7B, respectively.
- the hinge portion between the movable plate 336 and the raising and lowering plate 342 is a
- the hinge portion between the raising and lowering plate 342 and the supporting plate 344 is b
- the tip of the substrate support portion 346 is Let c be the hinge between the support plate 344 and the frame plate 334.
- the hinge part b overlaps the midpoint of the straight line connecting the hinge part a and the tip c
- the length of the straight line connecting the hinge part b and the hinge part d is determined by the hinge part a and the hinge part b. It should be equal to the length of the straight line connecting (the midpoint of the straight line connecting hinge part a and tip c).
- the lifting mechanism 340 shown in FIG. 8B adjusts the position of each hinge part and the length between the hinge parts by using the thickness of the plate so that the conditions are the same as those of the Scott Russell mechanism.
- the tip c of the substrate support 346 passes vertically through the tip c and the hinge portion d. Move along a straight line.
- the lower surface of the wafer W is moved at the tip c of the substrate support 346 Since the wafer W moves vertically (in the direction of the vertical arrow shown in FIG. 8B) by lifting, the force that prevents the wafer W from shifting in the horizontal direction due to the lifting operation by the lifting mechanism 340 is used.
- each hinge portion and the length between the hinge portions can be adjusted under the same conditions as the Scott Russell mechanism.
- the hinge part b of the raising and lowering plate 342 and the support plate 344 so as to pass through the center of these plate thicknesses, the hinge is connected to the midpoint of the straight line connecting the hinge part a and the tip c of the board support part 346.
- Part b can be overlapped.
- the length of the straight line connecting hinge part b and hinge part d is the length of the straight line connecting hinge part a and hinge part b (the midpoint of the straight line connecting hinge part a and tip c of substrate support part 346). Is equal to the Scott Russell mechanism.
- the tip c of the substrate support 346 can be moved vertically to lift the wafer.
- the base 310 is rotated and moved up and down in accordance with the position of the target wafer W to adjust the position of the base 310, and the first and second arms 320 and 330 are mounted. Operate to move wafer W in and out of wafer cassette 150 and wafer holding boat 200
- FIGS. 9A to 9F A specific example of the operation of the substrate transfer apparatus 300 will be described.
- the first arm 320 is advanced from the base 310, and the wafer W is transferred. Insert the transfer fork 322 into the upper side of the holding plate 210 to be loaded.
- the second arm 330 is advanced from the base 310 with the substrate lifting mechanism 340 of the second arm 330 tilted down, and the lifting fork 332 is inserted below the holding plate 210. This results in the state shown in Figure 9B.
- the substrate lifting mechanism 340 is raised to lift the wafer W on the first arm 320. At this time, the wafer W moves away from the first arm 320. In this state, the first arm 320 is pulled out from the upper side of the holding plate 210 as shown in FIG. 9D. Subsequently, as shown in FIG. 9E, the substrate lifting mechanism 340 of the second arm 330 is tilted to lower the wafer W onto the holding plate 210. Then, as shown in FIG. 9F, the second arm 330 is pulled out from the lower side of the holding plate 210 while the substrate lifting mechanism 340 is tilted. Thus, the wafer W can be set on the holding plate 210.
- FIGS. 10A to 10F a case where the wafer W on the arbitrary holding plate 210 in the wafer holding boat 200 is transferred will be described with reference to FIGS. 10A to 10F.
- the lifting fork 332 is inserted below the holding plate 210 on which the wafer W to be transferred is placed. To do. This results in the state shown in Figure 10B.
- the substrate lifting mechanism 340 is raised to lift the wafer W on the holding plate 210.
- the wafer W is separated from the holding plate 210.
- the transfer fork 322 of the first arm 320 is inserted between the lifted wafer W and the holding plate 210 as shown in FIG. 10D.
- the substrate lifting mechanism 340 is tilted down and the wafer W on the holding plate 210 is lowered onto the transfer fork portion 322 of the first arm 320.
- the second arm 330 is pulled down with the lower force of the holding plate 210 while the substrate lifting mechanism 340 is tilted, and the lifting fork 332 is pulled out, and the first arm 320 is moved to the fork. With the wafer W placed, the wafer W is pulled out from the upper side. In this way, the force S for taking out the weno and W from the holding plate 210 can be obtained.
- the first arm 320 having the transfer fork portion 322 for loading and transferring the wafer W, and the up and down supportable substrate lift.
- a second arm 330 having a lifting fork 332 provided with a bald mechanism 340
- the wafer can be transferred by inserting the first and second arms 320 and 330 above and below the arbitrary holding plate 210, respectively.
- the wafer S can be exchanged with the arbitrary holding plate 210 in the wafer holding boat 200 (the setting or removal of the wafer W) with the force S.
- the pitch of the holding plates 210 can be made narrower than before.
- the number of holding plates 210 provided in the wafer holding boat 200 can be increased, and the number of wafers W that can be transferred to the wafer holding boat 200 can also be increased.
- the number of wafers W that can be heat-treated at one time can be increased, which can improve throughput.
- the height of the wafer holding boat 200 can be reduced, and the furnace length can be shortened accordingly.
- a wafer holding boat 200 may be provided with a holding plate 250 formed in a disk shape.
- the holding plate 250 is provided with a hole 252 into which the substrate lifting mechanism 340 of the second arm 330 can be inserted.
- the wafer can be transferred to the disc-shaped holding plate 250 by the substrate transfer apparatus 300 according to this embodiment.
- the substrate processing apparatus is applied to a rapid thermal processing apparatus (FT P)
- FT P rapid thermal processing apparatus
- the present invention is not limited to this, and a plurality of substrates are not necessarily limited to this.
- the substrate processing equipment transfers the substrate to the substrate holding boat that holds the substrates arranged in the vertical direction, it can be applied to any heat treatment equipment, and it can also be applied to substrate processing equipment other than the heat treatment equipment. Is possible.
- the present invention is applicable to a substrate transfer apparatus, a substrate processing apparatus, a substrate transfer arm, and a substrate transfer method.
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007800016559A CN101361177B (zh) | 2006-08-11 | 2007-07-23 | 基板移载装置、基板处理装置、基板移载用臂、基板移载方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006220506A JP4854427B2 (ja) | 2006-08-11 | 2006-08-11 | 基板移載装置,基板処理装置,基板移載用アーム |
| JP2006-220506 | 2006-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008018285A1 true WO2008018285A1 (fr) | 2008-02-14 |
Family
ID=39032819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/064402 Ceased WO2008018285A1 (fr) | 2006-08-11 | 2007-07-23 | Appareil de transfert de substrat, appareil de traitement de substrat, bras de transfert de substrat et procédé de transfert de substrat |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4854427B2 (ja) |
| KR (1) | KR100979615B1 (ja) |
| CN (1) | CN101361177B (ja) |
| TW (1) | TW200814226A (ja) |
| WO (1) | WO2008018285A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2763161A4 (en) * | 2011-09-29 | 2015-04-15 | Kawasaki Heavy Ind Ltd | TRANSPORT SYSTEM |
| CN109531620A (zh) * | 2018-12-12 | 2019-03-29 | 福州麦辽自动化设备有限公司 | 一种自动机器人手臂 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5364769B2 (ja) * | 2011-09-26 | 2013-12-11 | 株式会社安川電機 | 搬送ロボットおよび基板処理装置 |
| KR101360611B1 (ko) * | 2012-10-23 | 2014-02-11 | 한용현 | 웨이퍼 트레이 교환 장치 및 방법 |
| KR101990533B1 (ko) * | 2012-11-06 | 2019-09-30 | 주식회사 원익아이피에스 | 배치식 기판처리장치 |
| JP6425408B2 (ja) * | 2014-04-21 | 2018-11-21 | キヤノン株式会社 | ロボットハンドの制御方法、ロボットハンド、プログラム及び記録媒体 |
| CN106538089B (zh) * | 2014-07-28 | 2019-08-06 | 株式会社富士 | 吸嘴收纳库 |
| US9640418B2 (en) | 2015-05-15 | 2017-05-02 | Suss Microtec Lithography Gmbh | Apparatus, system, and method for handling aligned wafer pairs |
| US11183401B2 (en) | 2015-05-15 | 2021-11-23 | Suss Microtec Lithography Gmbh | System and related techniques for handling aligned substrate pairs |
| CN106313098A (zh) * | 2015-06-23 | 2017-01-11 | 致茂电子(苏州)有限公司 | 铰炼模块及具有此铰炼模块的机械手臂 |
| CN106313029A (zh) * | 2015-06-23 | 2017-01-11 | 致茂电子(苏州)有限公司 | 铰炼结构及具有此铰炼结构的机械手臂 |
| CN106625585A (zh) * | 2016-11-29 | 2017-05-10 | 武汉华星光电技术有限公司 | 一种液晶玻璃基板搬运机器人 |
| DE102019217033B4 (de) * | 2019-11-05 | 2022-06-30 | Asys Automatisierungssysteme Gmbh | Be- und Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem |
| CN119365969A (zh) | 2022-10-17 | 2025-01-24 | 平田机工株式会社 | 机械手、基板搬送装置、保持单元及基板取出方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08135749A (ja) * | 1994-11-07 | 1996-05-31 | Onkyo Corp | 水平垂直変換運動機構 |
| JPH10163297A (ja) * | 1996-12-04 | 1998-06-19 | Koyo Lindberg Ltd | 縦型熱処理炉内への薄板状被処理物の搬入出装置およびこれを用いた薄板状被処理物の搬入出方法 |
-
2006
- 2006-08-11 JP JP2006220506A patent/JP4854427B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-23 KR KR1020087009129A patent/KR100979615B1/ko not_active Expired - Fee Related
- 2007-07-23 CN CN2007800016559A patent/CN101361177B/zh not_active Expired - Fee Related
- 2007-07-23 WO PCT/JP2007/064402 patent/WO2008018285A1/ja not_active Ceased
- 2007-08-10 TW TW096129714A patent/TW200814226A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08135749A (ja) * | 1994-11-07 | 1996-05-31 | Onkyo Corp | 水平垂直変換運動機構 |
| JPH10163297A (ja) * | 1996-12-04 | 1998-06-19 | Koyo Lindberg Ltd | 縦型熱処理炉内への薄板状被処理物の搬入出装置およびこれを用いた薄板状被処理物の搬入出方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2763161A4 (en) * | 2011-09-29 | 2015-04-15 | Kawasaki Heavy Ind Ltd | TRANSPORT SYSTEM |
| CN109531620A (zh) * | 2018-12-12 | 2019-03-29 | 福州麦辽自动化设备有限公司 | 一种自动机器人手臂 |
| CN109531620B (zh) * | 2018-12-12 | 2021-09-07 | 北京洪泰智造工场运营管理有限公司 | 一种自动机器人手臂 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080050496A (ko) | 2008-06-05 |
| CN101361177B (zh) | 2011-04-06 |
| TW200814226A (en) | 2008-03-16 |
| KR100979615B1 (ko) | 2010-09-01 |
| CN101361177A (zh) | 2009-02-04 |
| JP2008047650A (ja) | 2008-02-28 |
| JP4854427B2 (ja) | 2012-01-18 |
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