200814226 九、發明說明 【發明所屬之技術領域】 本發明係有關一種基板移載裝置、基板處理裝置、基 板移載用臂、基板移載方法。 【先前技術】 一般爲了對半導體晶圓（以下亦簡稱「晶圓」）和玻璃 基板等之被處理基板的表面，施行氧化、擴散、CVD、退 火等之處理，使用各種熱處理裝置。據知熱處理裝置例如 有可一次處理多數片晶圓的縱型熱處理裝置。 縱型熱處理裝置，係在縱型的熱處理爐內設置：沿上 下方向以既定間距排列用來保持晶圓的多數個保持板的晶 圓保持舟，以一次就熱處理被載置在該晶圓保持舟之各保 持板的晶圓。在將晶圓移載到晶圓保持舟之各保持板之際 ，例如使用具備可廻旋、昇降、進退動作之移載用臂的基 板移載裝置。 此種基板移載裝置，已知有例如：日本專利文獻1所 記載，將晶圓保持舟的各保持板作成環形，將朝上方突設 支承銷的頂起板，可昇降的設置在各保持板的中央，利用 該頂起板，接收來自移載用臂的晶圓’使其載置在保持板 〇 並且，例如··如日本專利文獻2所記載’設置將上述 頂起板作成臂狀的第2基板支承臂’以第2基板支承臂接收 來自移載用臂之第1基板支承臂的晶圓’並使其載置在保 .4 . 200814226 持板。此外，例如：如日本專利文獻3所記載，在晶圓保 持舟之各保持板設置朝其上方突出的爪部，利用移載用臂 使晶圓載置在各保持板的爪部上。 專利文獻1:日本特開平8-3 3 03 1 8號公報 專利文獻2:日本特開平1 0-242067號公報 專利文獻3:日本特開平1 0-24223 7號公報 【發明內容】 [發明所欲解決之課題] 可是，在使頂起板昇降來載置晶圓的裝置（參照日本 專利文獻1 )，一旦在某一保持板上載置晶圓後，頂起板將 無法移動到其上面的保持板。因此，例如：在使晶圓載置 在保持板之際，必須依從上面的保持板到下面的保持板之 順序載置晶圓，並且從保持板取出晶圓之際，必須依從下 面的保持板到上面的保持板之順序取出晶圓。在此，具有 所謂無法在任意的保持板之間交接晶圓的問題。 又，在將上述頂起板作成臂狀的裝置（參照日本專利 文獻2)，雖然可在任意的保持板之間交接晶圓，但因頂起 板的支承銷固定成直立狀態，故必須將保持板的間距擴大 成可插入突設有支持銷之臂。並且’在晶圓保持舟的各保 持板設置爪部的裝置（參照日本專利文獻3)，雖然可在任 意的保持板之間交接晶圓，但具有所謂必須將保持板的間 距擴大到移載用臂可插入到爪部上方的問題。 像這樣，在必須擴大保持板之間距的裝置，隨著間距 -5- 200814226 擴大，設置在晶圓保持舟之保持板的數量減少，可移載到 晶圓保持舟的晶圓數量也減少。因此，可一次熱處理的晶 圓數量減少，處理量下降。相反的，爲了抑制處理量下降 ，若不減少設置在晶圓保持舟之保持板的數量，就必須提 高晶圓保持舟的高度，也不得不加長熱處理爐的長度。 於是，本發明係爲有鑑於此種問題的發明，其目的在 於提供一種可在基板保持舟之任意的保持板之間交接基板 ，且可使保持板的間距比習知更窄的基板移載裝置等。 [用以解決課題的手段] 爲了解決上述課題，依據本發明之一觀點，係提供一 種基板移載裝置，係爲用以將前述基板移載到沿上下方向 排列著用來保持基板的多數個保持板的基板保持舟之基板 處理裝置，其特徵爲具備：可廻旋及昇降的基台；和可進 退的設置在前述基台，且具有用來載置搬運前述基板之搬 運叉部的第1臂；和可進退的設置在前述基台，且具備設 有可起倒的基板舉升機構之舉升叉部的第2臂。此時，上 述第2臂，在對前述保持板進行前述基板交接之際較佳爲 ，以前述基板舉升機構爲倒下的狀態，在前述保持板之下 側進行出入動作。 爲了解決上述課題，依據本發明之另一觀點，係提供 一種基板處理裝置，係爲具備：沿上下方向排列著用來保 持基板的多數個保持板的基板保持舟、和將基板移載到該 基板保持舟之基板移載裝置，對已移載到前述基板保持舟 -6 - 200814226 的複數個基板，一次施行既定之處理的基板處理裝置’其 特徵爲：前述基板移載裝置，係具備：可廻旋及昇降的基 台；和可進退的設置在前述基台，且具有用來載置搬運前 述基板之搬運叉部的第1臂；和可進退的設置在前述基台 ，且具備設有可起倒的基板舉升機構之舉升叉部的第2臂 ，前述第2臂，係在對前述保持板進行前述基板交接之際 ，以前述基板舉升機構爲倒下的狀態，在前述保持板之下 側進行出入動作。 爲了解決上述課題，依據本發明之另一觀點，係提供 一種基板移載用臂，係適用於將前述基板移載到沿上下方 向排列著用來保持基板的多數個保持板之基板保持舟的基 板移載用臂，其特徵爲具備：可進退的設置在能廻旋及昇 降的基台，且設置可起倒的基板舉升機構的叉部。 在本發明之基板移載裝置中，係設置第2臂（基板移載 用臂），該第2臂具備設有可起倒的基板舉升機構之舉升叉 部，藉此分別將用來搬運基板的第1臂、和用來舉升基板 的第2臂’插入到任意的保持板之上下，就能進行基板的 移載。藉此’就能在基板保持舟的任意保持板之間，進行 基板的交接（基板的裝設或取出）。並且，因能以基板舉升 機構爲倒下的狀態，讓第2臂在保持板之下側出入，故各 保持板的間距可比習知更窄。 並且’上述第2臂係具備：構成其外框的框板、以能 對該外框進行進退動作的方式設置在前述框板之內側的可 動板’前述基板舉升機構，係設有：設有基板支承部的起 200814226 倒板、和藉由鉸鏈連接在該起倒板的支承板所形成的基板 舉升板，且將該基板舉升板藉由鉸鏈連接在前述框板與前 述可動板之間，藉此因應前述可動板之水平方向的動作， 讓前述起倒板起倒。藉此，只要使可動板動作就能讓起倒 板進行起倒，因此可簡單的舉升或卸下基板。 此時，上述基板舉升機構，可藉由調整前述各鉸鏈部 的位置與前述各鉸鏈部間的長度，以因應前述可動板之水 平方向的動作，讓前述基板支承部的前端朝鉛垂方向動作 亦可。藉此，以與史格羅素（Scott-Russell)機構同樣的條 件，來調整各鉸鏈部的位置與各鉸鏈部間的長度，藉此能 讓起倒板的基板支承部鉛垂運動以舉升基板。藉此，在舉 升或卸下基板之際，能防止基板在水平方向偏移。 爲了解決上述課題，依據本發明之另一觀點，係提供 一種基板移載方法，係利用將前述基板移載到沿上下方向 排列著保持基板的多數個保持板的基板保持舟之基板移載 裝置的基板移載方法，其特徵爲：前述基板移載裝置，係 具備：可廻旋及昇降的基台、和可進退的設置在前述基台 ，且具有用來載置搬運前述基板之搬運叉部的第1臂、和 可進退的設置在前述基台，且具備設有可起倒的基板舉升 機構之舉升叉部的第2臂； 該方法具有以下步驟：將前述第丨臂，以將基板載置 在該搬運叉部的狀態，插入到待移載該基板的保持板之上 側’並且將前述第2臂，以該基板舉升機構爲倒下的狀態 ’插入到前述保持板之下側的步驟；使前述基板舉升機構 -8- 200814226 豎起，而舉升前述第1臂上之基板的步驟；從前述保持板 之上側拔出前述第1臂的步驟；讓前述基板舉升機構倒下 ，將基板卸到前述保持板上的步驟；以前述基板舉升機構 爲倒下的狀態，從前述保持板之下側拔出前述第2臂的步 驟。藉此，即使各保持板的間距變窄，仍可在保持板之下 側插入或拔出第2臂，而能確實的將基板載置在期望的保 持板。 爲了解決上述課題，依據本發明之另一觀點，係提供 一種基板移載方法，係利用將前述基板移載到沿上下方向 排列著保持基板的多數個保持板的基板保持舟之基板移載 裝置的基板移載方法，其特徵爲：前述基板移載裝置，係 具備：可廻旋及昇降的基台、和可進退的設置在前述基台 ，且具有用來載置搬運前述基板之搬運叉部的第1臂、和 可進退的設置在前述基台，且具備設有可起倒的基板舉升 機構之舉升叉部的第2臂； 該方法具有以下步驟：將前述第2臂，以該基板舉升 機構爲倒下的狀態，插入到載置有待移載之基板的保持板 之下側的步驟；使前述基板舉升機構豎起，而舉升前述保 持板上之基板的步驟；將前述第1臂插入到已舉升的基板 與前述保持板之間的步驟；讓前述基板舉升機構倒下，將 前述保持板上的基板卸到前述第1臂之搬運叉部上的步驟 ;將前述第2臂，以前述基板舉升機構爲倒下的狀態，從 前述保持板之下側拔出，並且將前述第1臂，以將基板載 置在該搬運叉部的狀態，從前述保持板之上側拔出的步驟 -9 - 200814226 ° _ lit ’即使各保持板的間距變窄，仍可在保持板之下側 _ A或拔出第2臂，而能確實的將基板載置在期望的保持 板。 [發明效果] ί衣據本發明，可在基板保持舟之任意的保持板之間交 接基板’且保持板的間距可比習知更窄。 【實施方式】 [用以實施發明的最佳形態] 以下參照所附圖式，針對本發明之最佳實施形態做詳 細說明。再者，在本詳細說明書及圖式中，有關實際上具 有同一功能的構成要素，係附上同一符號，藉此省略重複 說明。 (縱型熱處理裝置之構成例） 首先，邊參照圖式邊說明可應用有關本發明之基板移 載裝置之縱型熱處理裝置的實施形態。在本實施形態，係 舉適用於能以高速昇降爐內溫度之高速昇溫熱處理裝置 (FTP)的情形作爲縱型熱處理裝置。第丨圖是表示有關本實 施形態之縱型熱處理裝置之剖面圖。 如第1圖所示，縱型熱處理裝置1 00，係具備下端爲開 口的高純度石英製之處理容器118。在處理容器（熱處理爐 )1 1 8內，係收容有保持多數個基板例如半導體晶圓（以下 -10- 200814226 亦簡稱「晶圓」）W之作爲基板保持舟之一例的晶圓保持 舟200。在處理容器1 18之下端開口部，係氣密且拆裝自如 的設有蓋部122。在蓋部122上，係旋轉自如的設有中空圓 筒體狀之石英製的保溫筒124。晶圓保持舟200，係隔著保 溫筒124載置在蓋部122上。再者，蓋部122，係連結於未 圖示的昇降機構。藉由該昇降機構，進行蓋部1 22的開閉 、和對處理容器1 18之晶圓保持舟200的搬入、搬出。 在處理容器11 8內的頂部，係設有用來對該處理容器 118內導入處理氣體的處理氣體導入噴嘴126。另一方面， 在處理容器1 1 8之下部側壁，係設有連接於未圖示的排氣 泵之排氣噴嘴128，經由排氣噴嘴128在處理容器1 18內進 行排氣。 在處理容器1 1 8的外側，係以覆蓋該處理容器1 1 8整體 的方式設有隔熱材1 3 0。在隔熱材1 3 0的內側面，係設有將 處理容器1 1 8的全面予以加熱的加熱器1 3 2。該加熱器1 3 2 ，係例如藉由2矽化鉬（商品名：KANTHAL SUPER發熱體 )所構成。藉此，每單位面積的發熱量例如設定成非常高 之10〜30瓦特/^^cm2左右，以進行晶圓之局速昇溫。 在隔熱材1 3 0的下端部，係設有連結於送風扇1 3 4之環 狀的送風頭部136。從送風頭部136的適當處，向著處理容 器1 1 8與隔熱材1 3 0之間的空間配設有送風噴嘴1 3 8。在熱 處理後的晶圓溫度之降溫時，從送風噴嘴1 3 8吹出冷卻空 氣進行強制空冷，藉此就能高速降溫。 在隔熱材1 3 0的頂部，係連結有排出冷卻空氣的排氣 -11 - 200814226 通路140。在排氣通路140依序配設有：開閉器142、冷卻 排出空氣的冷卻機構144、排氣扇146。 晶圓保持舟2 0 0，係如第2圖所示，沿上下方向以既定 間距排列而設有用來保持晶圓W的多數個保持板2 1 0。保 持板210例如安裝於：配設在保溫筒124的複數個支柱220 。支柱220係設置成圍繞保持板210的周緣部，保持板210 之周緣部以水平方式被複數個支柱220之內側支承。 晶圓保持舟200之一側，係藉由加大支柱220的間隔， 以形成移載用搬出入口 222。藉此，對晶圓保持舟200的各 保持板210，從側邊的移載用搬出入口 222藉由基板移載裝 置3 00進行晶圓W的移載作業。 保持板2 1 0，例如第2圖所示係形成，大於晶圓 W的 直徑而沒有缺口連續環狀。藉此，在對晶圓W進行成膜 之際雖然周緣部的膜厚傾向比中心部還厚，但在對載置在 保持板2 1 0的晶圓W進行成膜時，由於是以宛如晶圓W的 周緣部延長的方式進行成膜，故可在包含晶圓W周緣部 的面內整區形成均勻的膜。並且，在將保持板2 1 0形成環 狀的情況下，其內側徑即中空部的直徑，最好是形成能安 定保持晶圓W之下面緣部程度的大小（直徑）。 再者，在保持板210的上面，係形成有阻止晶圓W之 水平移動的凹部（未圖示）爲佳。藉此，就能防止晶圓W因 偏滑而從保持板210上脫落。 上述保持板210及支柱220較佳爲，具有耐熱性，且不 會對晶圓造成污染源的材料（例如：石英材料、碳化矽 -12- 200814226 (SiC)材料等）。支柱220的上端及下端，如第1圖所示，藉 由例如透明石英材料或碳化矽材料所形成的上端環構件 2 04及下端環構件206而予以固定。 並且，在上端環構件204的中空部，宜嵌入遮光板202 。遮光板202，例如以不含雜質的高純度之不透明石英或 不透明碳化矽所製成，形成遮斷來自加熱器等的熱線（光） 。藉此，在晶圓保持舟200之上端附近，遮斷來自加熱器 132的直接光，而使位在晶圓保持舟200之上端附近的晶圓 W，與位在舟中段部分的晶圓形成相同的加熱環境狀態’ 故可防止依晶圓W的配置位置的不同而產生熱處理的結 果不均。 在上述的晶圓保持舟200之附近，係配設有晶圓匣150 。晶圓匣1 5 0，係藉由例如樹脂等所形成的基板收納容器 所構成。在基板收納容器的內壁面，係形成複數個未圖示 的溝槽，藉由該溝槽支承著複數片晶圓W的周緣部。晶 圓匣1 5 0，係構成例如可收納2 5片的晶圓W。 晶圓保持舟200與晶圓匣150，係大致配設在同一圓周 上，在其中心，係配設有在該等晶圓保持舟200與晶圓匣 15 0之間進行晶圓之移載的基板移載裝置3 00。 (基板移載裝置之具體的構成例） 其次，針對有關本實施形態的基板移載裝置，參照圖 式做說明。第3圖是放大第2圖所示之基板移載裝置的圖° 基板移載裝置3 00，係具備··可廻旋及昇降的基台3 1 0、和 作爲設置在基台310上的基板移載用臂的第1、第2臂320' -13- 200814226 3 3 0 ° 基台3 1 0，係例如形成朝單方向延伸出的略箱形狀’ 在其下方，係連接有用以使基台310廻旋及昇降的基台驅 動機構3 02。基台驅動機構3 02係例如採用以下構成。即， 基台驅動機構3 02係具備未圖示的廻旋用馬達，可藉由該 廻旋用馬達，使基台3 1 0於水平方向廻旋。並且，基台驅 動機構3 02係具備未圖示的昇降用馬達，可藉由以該昇降 用馬達所驅動的滾珠螺桿，使基台3 1 0昇降。藉此，基台 310上的第1、第2臂320、330，係可藉由基台310於水平方 向廻旋、昇降。再者，基台驅動機構3 02的構成，係不限 於上述者。 在基台3 1 0的上面係沿著其長軸方向設有溝槽3 1 2，構 成第1、第2臂3 20、3 3 0的滑動部321、331，可分別沿著該 溝槽312獨立的進退。該等基板移載用臂之中，第1臂320 係在其前端部具有搬運叉部3 22，將晶圓載置在該搬運叉 部3 22來搬運。該搬運叉部3 22較佳爲，爲了避免和後述之 第2臂3 3 0的基板舉升機構3 4 0之動作干涉而形成叉形。例 如：在第3圖所示的搬運叉部3 22，係從中間部至前端具有 缺口部的叉形者。 另一方面，第2臂3 3 0，係具有：在其前端側設置可豎 起、倒下的基板舉升機構3 4 0的舉升叉部3 3 2，藉由該舉升 叉部3 3 2，舉升搬運叉部3 22上的晶圓、保持板210上的晶 圓、晶圓匣1 5 0內的晶圓等。 第2臂330，例如第3圖、第4A圖所示，具備：構成外 -14- 200814226 框的框板3 3 4、和可對該框板3 3 4進退的設置在該框板3 3 4 之內側的可動板3 3 6。框板3 3 4，係固定在滑動部3 3 1。相 對於框板3 3 4，可動板3 3 6係如第4A圖所示，藉由設置在 滑動部3 3 1內的汽缸機構3 3 8朝進退方向水平的驅動。 舉升機構340，係使用例如將板材用鉸鏈連接成彎折 自如的基板舉升板。該基板舉升板，係藉由鉸鏈連接在框 板3 3 4與可動板3 3 6之間，配合可動板3 3 6的進退動作進行 豎起、倒下。具體上如第4A圖所示，由舉升機構340爲倒 下的狀態，藉由汽缸機構3 3 8使可動板3 3 6朝前進方向移動 。藉此，如第4B圖所示，舉升機構340就會豎起來。藉由 此種舉升機構340之豎起、倒下動作，就能從下面舉升晶 圓W。再者，舉升機構3 4 0，係以將晶圓W從下面進行水 平舉升的方式，在舉升叉部332至少安裝三個以上。 在此，針對舉升機構340的具體構成例，參照圖式做 說明。第5A圖、第5B圖是表示舉升機構之具體構成例的 立體圖。舉升機構340，例如第5A圖所示由基板舉升板所 構成，該基板舉升板係具備：設有支承晶圓W之下面的 基板支承部3 4 6的起倒板3 4 2、和用以支承起倒板3 4 2使其 豎起、倒下，藉由鉸鏈連接在起倒板342的支承部344。 基板舉升板，係如上所述，藉由鉸鏈連接在框板3 3 4 與可動板3 3 6之間。具體上例如：將支承板344的基端藉由 鉸鏈連接在框板3 3 4，並且將起倒板3 42的基端藉由鉸鏈連 接在可動板3 3 6。再者，基板舉升板的連接狀態，未必限 定於此，雖然未圖示，例如亦可爲：將支承板344的基端 -15- 200814226 藉由鉸鏈連接在可動板3 3 6，並且將起倒板342的基端藉由 鉸鏈連接在框板3 3 4 ° 基板支承部3 46，例如第5A圖、第5B圖所示，與起 倒板3 4 2 —體形成。即，基板支承部3 4 6，係在起倒板3 4 2 之前端面的一部分設置成從該前端面延伸出。在第5A圖 、第5B圖中，雖例舉在起倒板342之前端面的一側面附近 設置基板支承部346的情形，但未必限定於此，例如：亦 可在起倒板3 42之前端面的另一側面附近設置基板支承部 3 46，並且亦可設置在起倒板342之前端面的中央。再者， 基板支承部3 4 6的前端面較佳爲，藉由形成傾斜的缺口或 倒角，以持續藉用一部分接觸晶圓W。 舉升機構340，例如以具有彈性復原力的材料（例如： 聚丙烯、鋼琴線材）所構成。例如藉由聚丙烯的板材，以 一體構成舉升機構340之起倒板342與支承板344。此時， 起倒板342與支承板344的鉸鏈部，係例如切削聚丙烯之板 材的表面，藉由剩餘的薄形部分所構成。第5 A圖、第5 B 圖是切削聚丙烯之板材的上面，藉由下面之剩餘的薄形部 分構成鉸鏈部。 與此同樣的，框板334、可動板3 3 6例如亦以聚丙烯的 板材所構成，且可動板3 3 6與起倒板342的鉸鏈部、框板 3 34與支承板344的鉸鏈部，例如亦切削聚丙烯之板材的表 面，藉由剩餘的薄形部分所構成。第5A圖、第5B圖，係 可動板3 3 6與起倒板3 42的鉸鏈部、框板3 3 4與支承板344的 鉸鏈部，分別切削聚丙烯之板材的下面，藉由上面之剩餘 -16- 200814226 的薄形部分所構成。再者，舉升機構340之各鉸鏈部，並 不限於上述者，例如：以線圈彈簧等所構成亦可。 若藉由此種構成的舉升機構340，如第5A圖所示，由 起倒板342爲倒下的狀態，使可動板3 3 6朝第5B圖所示之 前進方向（箭頭方向）移動，藉此起倒板342(以及基板支承 部3 46)係以鉸鏈部爲中心轉動而豎起。藉此，基板支承部 346之前端，係自框板334、可動板336之上面朝上方突出 。在此狀態下，可動板3 3 6朝向與第5B圖所示之箭頭方向 相反的方向移動，藉此，起倒板342(以及基板支承部3 46) 利用各構件的彈性復原力倒下，而返回到如第5A圖所示 的狀態。 再者，如此般藉由鉸鏈部使舉升機構3 4 0能進行豎起 倒下的構造，在起倒板342爲倒下之狀態，只要可動板336 朝前進方向移動，起倒板342成爲可朝第2臂3 3 0之上側與 下側之任一側移動的死點之狀態。針對這點，在舉升機構 340，係將起倒板342與支承部3 44之間的鉸鏈部設在該等 之下面，起倒板3 4 2以該下面之鉸鏈部爲中心而轉動，故 起倒板3 42會朝第2臂3 3 0之上側豎起。 此外也能設計成，在起倒板342倒下之際，不會倒下 到死點之狀態。藉此，即使未在起倒板342與支承部344之 下面設置鉸鏈部，只要可動板3 3 6朝前進方向移動’起倒 板3 42就一定能朝第2臂3 3 0之上側豎起。 第4A圖、第4B圖所示的第2臂3 30之具體例，雖是例 舉藉由汽缸機構3 3 8，使可動板3 3 6朝進退方向移動之情形 -17- 200814226 來做說明，但未必限定於此’例如：藉由如第6A圖所示 的凸輪機構3 3 9，使可動板3 3 6朝進退方向移動亦可。此時 ，例如：凸輪機構3 3 9的凸輪形狀爲橢圓形，藉由使該凸 輪旋轉，如第6 A圖所示，就能由舉升機構3 40之起倒板 3 42爲倒下之狀態，如第6B圖所示，豎起起倒板342。 雖然第5A圖、第5B圖所示的舉升機構340，係自起 倒板3 42之前端面延伸而形成基板支承部3 46，但未必限定 於此，例如：如第7A圖、第7B圖所示，在起倒板342之 下側安裝構成基板支承部346的板材而形成一體亦可。 藉由此種構成的舉升機構340，如第7A圖所示，由起 倒板342爲倒下的狀態，使可動板3 3 6朝第7B圖所示之箭 頭方向移動，藉此起倒板3 42(以及基板支承部346)係以鉸 鏈部爲中心轉動而豎起。藉此，基板支承部346之前端， 係自框板3 3 4、可動板3 3 6之上面朝上方突出。在此狀態下 ，可動板3 3 6朝向與第7B圖所示之箭頭方向相反的方向移 動，藉此，起倒板342(以及基板支承部346)利用各構件的 彈性復原力倒下，返回到如第7A圖所示的狀態。 依據如此般本實施形態的第2臂320，在基板舉升機構 340爲倒下的狀態，能使第2臂3 3 0在保持板210之下側進行 出入動作，故各保持保2 1 0的間距可比習知更窄。 舉升機構340，藉由調整各鉸鏈部的位置與各鉸鏈部 間的長度，就能使基板支承部346的前端沿著鉛垂方向進 行直線運動。例如：在與將水平方向的運動轉換成鉛垂方 向之直線運動的史格羅素（S c 〇 11 - R u s s e 11)機構同樣的條件 -18- 200814226 下，藉由調整各鉸鏈部的位置與各鉸鏈部間的長度’就能 使基板支承部3 4 6的前端鉛垂運動而舉升晶圓。 以下，例舉第7A圖、第7B圖所示的舉升機構340， 參照圖式說明爲了使基板支承部3 4 6之前端鉛垂運動的條 件。第8A圖、第8B圖係分別爲由側面觀看舉升機構340 在第7A圖、第7B圖所示狀態時的圖。 如第8 B圖所示，可動板3 3 6與起倒板3 4 2的鉸鏈部爲a ，起倒板3 42與支承板3 44的鉸鏈部爲b，基板支承部3 46 的前端爲c，支承部344與框板3 3 4的鉸鏈部爲d。此時’ 鉸鏈部b重疊於連接鉸鏈部a與前端c之直線的中點，並 且連接鉸鏈部b與鉸鏈部d之直線的長度，等於連接鉸鏈 部a與鉸鏈部b(連接鉸鏈部a與前端c之直線的中點）之 直線的長度。 像這樣，第8B圖所示的舉升機構340，係與史格羅素 機構同樣的條件，利用板材的厚度，來調整各鉸鏈部的位 置與各鉸鏈部間的長度，藉由使可動板3 3 6相對於框板334 而朝進退方向（第8B圖所示之水平的箭頭方向）移動，基 板支承部3 46的前端c會沿著通過其前端c與鉸鏈部d的 鉛垂直線上而移動。藉此，利用基板支承部3 46的前端c 舉升晶圓W之下面，藉此，因晶圓W朝鉛垂（第8B圖所 示的鉛垂之箭頭方向）移動，故藉由舉升機構3 40所產生之 舉升動作，能防止晶圓W在水平方向偏移。 再者，如第5A圖、第5B圖所示的舉升機構340，亦 可在與史格羅素機構同樣的條件來調整各鉸鏈部的位置與 -19- 200814226 各鉸鏈部間的長度。藉由將起倒板3 4 2與支承板3 4 4的鉸鏈 部b設成通過該等之板厚的中心’能讓鉸鏈部b重疊於連 接鉸鏈部a與基板支承部3 4 6之前端c的直線之中點。連 接鉸鏈部b與鉸鏈部d之直線的長度’等於連接鉸鏈部a 與鉸鏈部b(連接鉸鏈部a與基板支承部3 46之前端c的直 線之中點）的直線之長度的話’即爲與史格羅素機構同樣 的條件。藉此，就能使基板支承部3 4 6的前端c進行鉛垂 運動而舉升晶圓。 在此種基板移載裝置300中，配合晶圓W之目的位置 使基台3 1 0旋轉、昇降來調整基台3 1 0的位置，且使第1、2 臂3 20、3 3 0動作，藉由相對於晶圓匣150和晶圓保持舟200 進行晶圓W的出入。 (基板移載裝置之動作） 針對此種基板移載裝置3 00之動作的具體例做說明。 首先，針對將晶圓W移載到晶圓保持舟200之任意保持板 2 10的情形，參照第9A圖〜第9F圖做說明。例如第9A圖 所示，在將從晶圓匣150所取出的晶圓W載置到第1臂320 之搬運叉部322的狀態下，從基台310使第1臂320行進，將 搬運叉部3 22插入到待移載該晶圓 W之保持板210的上側 。並且，以第2臂3 3 0之基板舉升機構3 40爲倒下的狀態， 從基台310使第2臂3 3 0行進，將舉升叉部3 3 2插入到上述保 持板210之下側。藉此，成爲第9B圖所示的狀態。 其次，如第9C圖所示，使基板舉升機構340豎起，舉 -20- 200814226 升第1臂3 20上的晶圓W。此時，晶圓W係自第1臂320離 開，在此狀態下，如第9D圖所示，從保持板21 0之上側拔 出第1臂320。 接著，如第9 E圖所示，倒下第2臂3 3 0的基板舉升機 構340，將晶圓W卸到保持板210上。而且，如第9F圖所 示，以基板舉升機構3 40維持倒下的狀態，從保持板210之 下側拔出第2臂3 3 0。如此就能將晶圓W裝設在保持板2 1 0 上。 藉此，即使各保持板2 1 0的間距變窄，亦可朝保持板 210之下側插入或拔出第2臂3 3 0，故能確實的將晶圓W裝 設在期望的保持板2 1 0。 其次，針對移載晶圓保持舟200之任意保持板210上之 晶圓W的情形，參照第10 A圖〜第10F圖做說明。如第 1 0 A圖所示，將第2臂3 3 0，以基板舉升機構3 40爲倒下的 狀態，將舉升叉部3 3 2插入到載置著待移載之晶圓W的保 持板2 1 0之下側。如此，成爲第1 〇 B圖所示的狀態。 其次，如第10C圖所示，使基板舉升機構340豎起’ 舉升保持板2 1 0上的晶圓W。此時，晶圓W係自保持板 2 10離開。在此狀態下，如第l〇D圖所示，將第1臂3 20的 搬運叉部3 2 2插入到舉升後的晶圓W與保持板2 1 0之間。 接著，如第10E圖所示，讓基板舉升機構3 40倒下’ 將保持板2 1 0上的晶圓W卸到第1臂3 2 0的搬運叉部3 2 2上 。而且，如第1 〇 F圖所示，將第2臂3 3 0 ’以基板舉升機構 3 40維持倒下的狀態，從保持板2 1 0之下側拔出舉升叉部 200814226 3 3 2，並且將第1臂3 20，以晶圓W載置在該叉部的狀態， 從保持板2 1 0的上側拔出。如此就能從保持板2丨〇取出晶圓 W。 藉此’即使各保持板2 1 0的間距變窄，亦可朝保持板 2 1 0之下側插入或拔出第2臂3 3 0，故能確實的從期望的保 持板2 1 0取出晶圓W。 像這樣’依據本實施形態的基板移載裝置3 00，係設 置：具有用來載置搬運晶圓W的搬運叉部322之第1臂320 、和具備設置著可豎起、倒下之基板舉升機構340的舉升 叉部332之第2臂330，藉此將該等第1、第2臂320、330分 別插入到任意的保持板2 1 0之上下，來進行晶圓的移載。 藉此，能在晶圓保持舟200之任意的保持板210之間，進行 晶圓W的交接（晶圓W的裝設或取出）。 此外，在基板舉升機構340爲倒下的狀態，能使第2臂 3 3 0朝保持板2 1 0的下側出入，故各保持保2 1 0的間距可比 習知更窄。藉此，可增加設置在晶圓保持舟2〇〇之保持板 2 10的數量，也可增加能移載到晶圓保持舟2〇〇之晶圓W的 數量。因此，可增加能一次熱處理的晶圓W之數量’故可 提昇處理量。並且，可降低晶圓保持舟200的高度’爐長 也能縮短。 再者，在上述實施形態中，雖例舉說明在晶圓保持舟 2 0 0設置形成環狀的保持板2 1 0的情形’但未必限定於此’ 例如：如第1 1圖所示，亦可在晶圓保持舟2 0 0設置形成圓 板狀的保持板25 0 ° -22- 200814226 在此情況下，在保持板250設置可插入第2臂3 3 0之基 板舉升機構340的孔252。藉此，對圓板狀的保持板250， 也能藉由本實施形態的基板移載裝置3 00來移載晶圓。 以上，雖參照所附圖式針對本發明之最佳實施形態做 說明，但本發明當然不限於相關之範例。熟習此技藝人士 ，在申請專利範圍所記載的範圍內得以想到各種變更例或 修正例，這些當然亦屬於本發明之技術範圍。 例如在上述實施形態中，雖是例舉應用於高速昇溫熱 處理裝置（FTP)作爲基板處理裝置之情形做說明，但未必 限定於此，只要是將基板移載到沿上下方向排列保持複數 個基板的基板保持舟的基板處理裝置，無論哪種熱處理裝 置都適用，並且也適用於熱處理裝置以外的基板處理裝置 [產業上的可利用性] 本發明係可應用於基板移載裝置、基板處理裝置、基 板移載用臂、基板移載方法。 【圖式簡單說明】 第1圖是表示本發明之實施形態的縱型熱處理裝置之 槪略構成的剖面圖。 第2圖是說明第1圖所示之晶圓保持舟之立體圖。 第3圖是表示同一實施形態的基板移載裝置之構成例 的立體圖。 -23- 200814226 第4A圖是表示第2臂之構成例的立體圖，表示基板舉 升機構爲倒下之狀態。 第4B圖是表示第2臂之構成例的立體圖，表示基板舉 升機構爲豎起之狀態。 第5A圖是表示基板舉升機構之構成例的立體圖，表 示基板舉升機構爲倒下之狀態。 第5B圖是表示基板舉升機構之構成例的立體圖，表 示基板舉升機構爲豎起之狀態。 第6A圖是表示第2臂之其他構成例的立體圖，表不基 板舉升機構爲倒下之狀態。 第6B圖是表示第2臂之其他構成例的立體圖，表示基 板舉升機構爲豎起之狀態。 第7A圖是表示基板舉升機構之其他構成例的立體圖 ，表示基板舉升機構爲倒下之狀態。 第7B圖是表示基板舉升機構之其他構成例的立體圖 ，表示基板舉升機構爲豎起之狀態。 第8 A圖是表示由側面觀看第7A圖所示之基板舉升機 構。 第8B圖是表示由側面觀看第7B圖所示之基板舉升機 構。 第9A圖是說明將晶圓裝設在晶圓保持舟之保持板的 情況下之基板移載裝置之動作。 第9B圖是說明接續第9A圖之動作。 第9C圖是說明接續第9B圖之動作。 -24- 200814226 第9D圖是說明接續第9C圖之動作。 第9E圖是說明接續第9D圖之動作。 第9F圖是說明接續第9E圖之動作。 第1 0 A圖是說明從晶圓保持舟之保持板取出晶圓裝的 情況下之基板移載裝置之動作。 第10B圖是說明接續第10A圖之動作。 第10C圖是說明接續第10B圖之動作。 第10D圖是說明接續第10C圖之動作。 第10E圖是說明接續第10D圖之動作。 第10F圖是說明接續第10E圖之動作。 第1 1圖是表示晶圓保持舟之其他構成例的立體圖。 【主要元件符號說明】 1〇〇 :縱型熱處理裝置 1 1 8 :處理容器 122 :蓋部 124 :保溫筒 126 :處理氣體導入噴嘴 1 2 8 :排氣噴嘴 1 3 0 :隔熱材 132 :加熱器 134 :送風扇 1 3 6 :送風頭部 1 3 8 :送風噴嘴 -25- 200814226 140 :排氣通路 142 :開閉器 144 :冷卻機構 1 4 6 :排氣扇 1 5 0 :晶圓匣 200 :晶圓保持舟 202 :遮光板 204 :上端環構件 206 :下端環構件 2 1 0 :保持板 2 2 0 :支柱 222 :移載用搬出入口[Technical Field] The present invention relates to a substrate transfer device, a substrate processing device, a substrate transfer arm, and a substrate transfer method. [Prior Art] Generally, various heat treatment apparatuses are used to perform treatments such as oxidation, diffusion, CVD, and annealing on the surface of a substrate to be processed such as a semiconductor wafer (hereinafter also referred to as "wafer") and a glass substrate. It is known that a heat treatment apparatus has, for example, a vertical heat treatment apparatus which can process a plurality of wafers at a time. The vertical heat treatment device is disposed in a vertical heat treatment furnace: a wafer holding boat for holding a plurality of holding plates of the wafer at a predetermined pitch in the up and down direction, is placed on the wafer at a time for heat treatment Each of the boats holds the wafer of the board. When the wafer is transferred to each of the holding plates of the wafer holding boat, for example, a substrate transfer device having a transfer arm that can be rotated, lifted, or moved forward and backward is used. In the above-described substrate transfer device, for example, as disclosed in Japanese Patent Laid-Open No. 1, the holding plate of the wafer holding boat is formed in a ring shape, and a lifting plate for supporting the pin is protruded upward, and the holding plate can be lifted and lowered. In the center of the plate, the wafer from the transfer arm is received by the lift-up plate and placed on the holding plate, and, for example, as described in Japanese Patent Laid-Open No. The second substrate supporting arm ' receives the wafer 'from the first substrate supporting arm of the transfer arm with the second substrate supporting arm and mounts it on the second substrate support arm'. 4 . 200814226 Holding the board. In addition, E.g: As described in Japanese Patent Document 3, Each of the holding plates of the wafer holding boat is provided with a claw portion that protrudes upward, The wafer is placed on the claw portions of the respective holding plates by the transfer arm. Patent Document 1: Japanese Patent Laid-Open No. Hei 8-3 3 03 1 8 Patent Document 2: Japanese Patent Publication No. 0-242067 (Patent Document 3) Japanese Patent Application Laid-Open No. Hei No. 0-24223 No. 7--A Summary of the Invention [Problems to be Solved by the Invention] However, A device for loading and lowering a lifting plate to mount a wafer (refer to Japanese Patent Laid-Open Publication No. 1) Once the wafer is placed on a holding plate, The jacking plate will not move to the retaining plate above it. therefore, E.g: When the wafer is placed on the holding plate, The wafer must be placed in the order of the upper retention plate to the lower retention plate. And when the wafer is removed from the holding plate, The wafer must be removed in the order of the lower holding plate to the upper holding plate. here, There is a problem that the wafer cannot be transferred between arbitrary holding plates. also, In the case where the above-mentioned jacking plate is formed into an arm shape (refer to Japanese Patent Literature 2), Although wafers can be transferred between any of the holding plates, However, since the support pin of the jacking plate is fixed in an upright state, Therefore, the spacing of the retaining plates must be enlarged to the arms that can be inserted into the support pins. Further, a device for providing a claw portion on each of the holding plates of the wafer holding boat (refer to Japanese Patent Laid-Open Publication No. 3) Although the wafer can be transferred between any of the holding plates, However, there is a problem that the distance between the holding plates must be enlarged until the transfer arm can be inserted above the claws. like this, In the case of having to enlarge the distance between the plates, With the spacing -5- 200814226 expanded, The number of holding plates set in the wafer holding boat is reduced, The number of wafers that can be transferred to the wafer holding boat is also reduced. therefore, The number of crystals that can be heat treated at one time is reduced, The amount of processing is reduced. The opposite of, In order to suppress the amount of processing, If you do not reduce the number of holding plates set on the wafer holding boat, It is necessary to increase the height of the wafer holding boat, It is also necessary to lengthen the length of the heat treatment furnace. then, The present invention is an invention in view of such a problem, The purpose is to provide a substrate that can be transferred between any of the holding plates of the substrate holding boat. Further, it is possible to make the pitch of the holding plate smaller than a conventional substrate transfer device or the like. [Means for Solving the Problem] In order to solve the above problems, According to one aspect of the present invention, Providing a substrate transfer device, And a substrate processing apparatus for transferring the substrate to a substrate holding boat in which a plurality of holding plates for holding the substrate are arranged in the vertical direction, It is characterized by: Abutment that can be hoisted and raised; And the reversible settings are on the aforementioned abutments, And having a first arm for carrying the transport fork portion for transporting the substrate; And the advance and retreat settings are on the aforementioned abutments, Further, the second arm is provided with a lifting fork portion provided with a substrate lifting mechanism that can be inverted. at this time, The second arm above, Preferably, when the substrate is transferred to the holding plate, The substrate lifting mechanism is in a fallen state. The access operation is performed on the lower side of the holding plate. In order to solve the above problems, According to another aspect of the present invention, Providing a substrate processing apparatus, Is equipped with: A substrate holding plate for holding a plurality of holding plates of the substrate is arranged in the up and down direction, And a substrate transfer device that transfers the substrate to the substrate to hold the boat, For a plurality of substrates that have been transferred to the aforementioned substrate holding boat -6 - 200814226, A substrate processing apparatus that performs a predetermined process once is characterized by: The aforementioned substrate transfer device, The system has: a platform that can be hovers and lifts; And the advance and retreat settings are on the aforementioned abutments, And having a first arm for carrying a transport fork portion for transporting the substrate; And the advance and retreat settings are on the aforementioned abutments, And a second arm having a lifting fork portion capable of lifting the substrate lifting mechanism, The aforementioned second arm, When the aforementioned substrate is transferred to the aforementioned holding plate, The substrate lifting mechanism is in a fallen state. The access operation is performed on the lower side of the holding plate. In order to solve the above problems, According to another aspect of the present invention, Providing a substrate transfer arm, The present invention is applied to a substrate transfer arm that transfers the substrate to a substrate holding boat in which a plurality of holding plates for holding the substrate are arranged in the upper and lower directions. It is characterized by: The advance and retreat can be set on the abutment that can be hovers and rises and falls. And a fork portion of the substrate lifting mechanism that can be lifted up. In the substrate transfer device of the present invention, Set the second arm (substrate transfer arm), The second arm is provided with a lifting fork provided with a substrate lifting mechanism that can be inverted. Thereby, the first arm for transporting the substrate, And the second arm ' used to lift the substrate is inserted under any of the holding plates, The substrate can be transferred. Thereby, it is possible to hold between the holding plates of the boat on the substrate, The substrate is transferred (the mounting or removal of the substrate). and, Because the substrate lifting mechanism can be lowered, Let the second arm enter and exit the lower side of the retaining plate, Therefore, the spacing of the retaining plates can be narrower than conventionally known. And the above second arm system has: The frame plate that constitutes its outer frame, The substrate lifting mechanism provided on the inner side of the frame plate in such a manner as to advance and retract the outer frame, The system has: With the support of the substrate, the 200814226 is inverted, And a substrate lifting plate formed by connecting a support plate of the inverted plate by a hinge, And the substrate lifting plate is connected between the frame plate and the movable plate by a hinge. Thereby, in response to the horizontal movement of the movable plate, Let the aforementioned upside down board rise. With this, As long as the movable plate is actuated, the inverted plate can be lifted up. Therefore, the substrate can be simply lifted or removed. at this time, The substrate lifting mechanism described above, By adjusting the position of each of the aforementioned hinge portions and the length between the aforementioned hinge portions, In response to the horizontal movement of the movable plate, The front end of the substrate supporting portion may be moved in the vertical direction. With this, In the same conditions as the Scott-Russell organization, To adjust the position of each hinge portion and the length between the hinge portions, Thereby, the substrate supporting portion of the inverted plate can be vertically moved to lift the substrate. With this, When lifting or removing the substrate, It can prevent the substrate from shifting in the horizontal direction. In order to solve the above problems, According to another aspect of the present invention, Providing a substrate transfer method, A substrate transfer method of transferring a substrate to a substrate transfer device of a substrate holding substrate in which a plurality of holding plates for holding a substrate are arranged in a vertical direction, Its characteristics are: The aforementioned substrate transfer device, Department has: Abutment that can be hoisted and raised, And the advance and retreat settings are on the aforementioned abutments, And having a first arm for carrying the transport fork portion for transporting the substrate, And the advance and retreat settings are on the aforementioned abutments, And a second arm having a lifting fork portion that can be raised by the substrate lifting mechanism; The method has the following steps: Put the aforementioned first arm, In a state in which the substrate is placed on the transport fork portion, Inserted into the upper side of the holding plate to be transferred to the substrate and the aforementioned second arm, a step of inserting into the lower side of the holding plate in a state in which the substrate lifting mechanism is inverted; Raising the aforementioned substrate lifting mechanism -8- 200814226, And lifting the substrate on the first arm; a step of pulling out the first arm from the upper side of the holding plate; Let the aforementioned substrate lifting mechanism fall down, a step of discharging the substrate onto the aforementioned holding plate; With the aforementioned substrate lifting mechanism as a falling state, The step of pulling out the second arm from the lower side of the holding plate. With this, Even if the spacing of the holding plates is narrowed, The second arm can still be inserted or removed from the underside of the retaining plate. The substrate can be reliably placed on the desired holding plate. In order to solve the above problems, According to another aspect of the present invention, Providing a substrate transfer method, A substrate transfer method of transferring a substrate to a substrate transfer device of a substrate holding substrate in which a plurality of holding plates for holding a substrate are arranged in a vertical direction, Its characteristics are: The aforementioned substrate transfer device, Department has: Abutment that can be hoisted and raised, And the advance and retreat settings are on the aforementioned abutments, And having a first arm for carrying the transport fork portion for transporting the substrate, And the advance and retreat settings are on the aforementioned abutments, And a second arm having a lifting fork portion that can be raised by the substrate lifting mechanism; The method has the following steps: Put the aforementioned second arm, The substrate lifting mechanism is in a fallen state. a step of inserting into a lower side of a holding plate on which a substrate to be transferred is placed; Raising the aforementioned substrate lifting mechanism, And lifting the step of holding the substrate on the board; a step of inserting the aforementioned first arm between the lifted substrate and the aforementioned holding plate; Let the aforementioned substrate lifting mechanism fall down, a step of discharging the substrate on the holding plate onto the carrying fork portion of the first arm; Put the aforementioned second arm, The substrate lifting mechanism is in a fallen state. Pulled out from the lower side of the aforementioned retaining plate, And the aforementioned first arm, In a state in which the substrate is placed on the carrying fork portion, Step -9 - 200814226 ° _ lit ′ pulled out from the upper side of the aforementioned retaining plate, even if the spacing of the retaining plates is narrowed, Still on the underside of the retaining plate _ A or pull out the second arm, It is possible to reliably place the substrate on the desired holding plate. [Effect of the Invention] According to the present invention, The substrate can be transferred between any of the holding plates of the substrate holding boat and the spacing of the holding plates can be narrower than is conventional. [Embodiment] [Best Mode for Carrying Out the Invention] Hereinafter, with reference to the drawings, The best mode for carrying out the invention will be described in detail. Furthermore, In this detailed description and drawings, For components that actually have the same function, Attach the same symbol, This duplicates the description. (Configuration example of vertical heat treatment device) First, An embodiment of a vertical heat treatment apparatus to which the substrate transfer apparatus of the present invention can be applied will be described with reference to the drawings. In this embodiment, A vertical heat treatment apparatus is proposed for use in a high-speed heat treatment apparatus (FTP) capable of raising and lowering the temperature in a high-speed furnace. The figure is a cross-sectional view showing a vertical heat treatment apparatus according to this embodiment. As shown in Figure 1, Vertical heat treatment unit 100, A processing container 118 made of high-purity quartz having an open bottom is provided. In the processing vessel (heat treatment furnace) 1 18, A wafer holding boat 200 as an example of a substrate holding boat that holds a plurality of substrates such as semiconductor wafers (hereinafter referred to as "wafers") is housed. At the lower end of the processing container 18, The cover portion 122 is airtight and detachable. On the cover portion 122, A heat-insulating cylinder 124 made of quartz having a hollow cylindrical shape is rotatable. The wafer holds the boat 200, It is placed on the lid portion 122 via the temperature keeping cylinder 124. Furthermore, Cover portion 122, It is connected to a lifting mechanism not shown. With the lifting mechanism, Opening and closing the lid portion 1 22, And holding the wafer 200 into the wafer of the processing container 18, Move out. At the top of the processing vessel 118, A processing gas introduction nozzle 126 for introducing a processing gas into the processing container 118 is provided. on the other hand, Processing the lower side wall of the container 1 18, An exhaust nozzle 128 connected to an exhaust pump (not shown) is provided. Exhaust is performed in the processing vessel 1 18 via the exhaust nozzle 128. On the outside of the processing container 1 18, A heat insulating material 130 is provided so as to cover the entire processing container 1 1 8 . On the inner side of the heat insulation material 130, A heater 133 that heats the entire processing vessel 1 18 is provided. The heater 1 3 2 , For example, by molybdenum molybdenum (trade name: KANTHAL SUPER heating body). With this, The calorific value per unit area is set, for example, to a very high level of 10 to 30 watts/^^cm2. To speed up the wafer's local speed. At the lower end of the heat insulating material 130, A ring-shaped air blowing head 136 connected to the blower fan 134 is provided. From the appropriate place of the air supply head 136, A blowing nozzle 138 is disposed in a space between the processing container 1 18 and the heat insulating material 130. When the temperature of the wafer after the heat treatment is lowered, The cooling air is blown from the air blowing nozzle 138 to perform forced air cooling. This allows for high speed cooling. At the top of the insulation material 130, It is connected with exhaust gas that discharges cooling air. -11 - 200814226 Passage 140. The exhaust passage 140 is sequentially provided with: The shutter 142, Cooling mechanism 144 for cooling the exhaust air, Exhaust fan 146. The wafer holds the boat 200, As shown in Figure 2, A plurality of holding plates 2 10 for holding the wafer W are provided at a predetermined pitch in the up and down direction. The holding plate 210 is, for example, mounted on: A plurality of pillars 220 disposed in the heat insulating cylinder 124 are disposed. The pillar 220 is disposed to surround the peripheral portion of the retaining plate 210, The peripheral portion of the holding plate 210 is horizontally supported by the inner sides of the plurality of pillars 220. The wafer holds one side of the boat 200, By increasing the spacing of the pillars 220, The transfer carry-in/out port 222 is formed. With this, For each of the holding plates 210 of the wafer holding boat 200, The transfer operation of the wafer W is performed by the substrate transfer device 300 from the transfer port 222 for transfer at the side. Keep the board 2 1 0, For example, as shown in Figure 2, It is larger than the diameter of the wafer W without a continuous ring. With this, When the wafer W is formed into a film, the film thickness of the peripheral portion tends to be thicker than the center portion. However, when the wafer W placed on the holding plate 2 10 is formed into a film, Since the film formation is performed as if the peripheral portion of the wafer W is elongated, Therefore, a uniform film can be formed in the entire area including the peripheral portion of the wafer W. and, In the case where the holding plate 2 10 is formed into a ring shape, The inner diameter is the diameter of the hollow portion, It is preferable to form a size (diameter) which can stably maintain the lower edge portion of the wafer W. Furthermore, Above the holding plate 210, It is preferable to form a concave portion (not shown) for preventing horizontal movement of the wafer W. With this, It is possible to prevent the wafer W from coming off the holding plate 210 due to the slippage. Preferably, the holding plate 210 and the pillar 220 are Heat resistant, Materials that do not cause contamination of the wafer (for example: Quartz material, 碳 -12 - 200814226 (SiC) materials, etc.). The upper end and the lower end of the pillar 220, As shown in Figure 1, The upper end ring member 206 and the lower end ring member 206, which are formed of, for example, a transparent quartz material or a tantalum carbide material, are fixed. and, In the hollow portion of the upper end ring member 204, The visor 202 should be embedded. Light shield 202, For example, it is made of high-purity opaque quartz or opaque tantalum carbide without impurities. A heat line (light) from a heater or the like is formed to be blocked. With this, Near the upper end of the wafer holding boat 200, Blocking direct light from heater 132, And the wafer W located near the upper end of the wafer holding boat 200, The same heating environment state is formed as the wafer located in the middle portion of the boat. Therefore, unevenness in heat treatment due to the difference in the arrangement position of the wafer W can be prevented. In the vicinity of the above wafer holding boat 200, The wafer cassette 150 is equipped. Wafer 匣 1 50, It is constituted by a substrate storage container formed of, for example, a resin. On the inner wall surface of the substrate storage container, Forming a plurality of grooves (not shown), The peripheral portion of the plurality of wafers W is supported by the grooves. Crystal circle 匣 1 5 0, For example, it is possible to store, for example, 25 wafers W. The wafer holds the boat 200 and the wafer cassette 150, The system is roughly arranged on the same circumference. In its center, A substrate transfer device 300 that transfers wafers between the wafer holding boat 200 and the wafer cassette 150 is disposed. (Specific configuration example of the substrate transfer device) Next, With respect to the substrate transfer device of the embodiment, Refer to the figure for explanation. Fig. 3 is an enlarged view of the substrate transfer device 3 00 of the substrate transfer device shown in Fig. 2, It is equipped with a base that can be hoisted and raised and lowered. And as the first arm of the substrate transfer arm provided on the base 310 The second arm 320' -13- 200814226 3 3 0 ° abutment 3 1 0, For example, forming a slightly box shape 'extending in a single direction' below A base drive mechanism 302 for twisting and lifting the base 310 is attached. The base drive mechanism 322 is configured, for example, as follows. which is, The base drive mechanism 312 includes a spinning motor (not shown). By means of the spinning motor, The base 3 1 0 is rotated in the horizontal direction. and, The base drive mechanism 312 includes a lift motor (not shown). By means of a ball screw driven by the lifting motor, The base 3 1 0 is raised and lowered. With this, The first on the base 310 The second arm 320, 330, Can be circling in the horizontal direction by the base 310, Lifting. Furthermore, The structure of the abutment drive mechanism 3 02, It is not limited to the above. a groove 3 1 2 is provided on the upper surface of the base 3 1 0 along the longitudinal direction thereof, Constructed as the first The second arm 3 20, 3 3 0 sliding portion 321, 395 The advancement and retreat can be independently performed along the groove 312, respectively. Among the substrates for transferring substrates, The first arm 320 has a transport fork portion 32 at its front end portion. The wafer is placed on the transport fork portion 32 and transported. The carrying fork portion 3 22 is preferably, A fork shape is formed in order to avoid interference with the action of the substrate lifting mechanism 340 of the second arm 333 described later. E.g: In the transport fork portion 3 22 shown in Fig. 3, It is a forked person having a notch from the intermediate portion to the front end. on the other hand, The second arm 3 3 0, Has: Set up on the front end side, The lifting fork portion 3 3 2 of the fallen substrate lifting mechanism 300 By lifting the fork 3 3 2, Raising the wafer on the fork 3 22, Keeping the crystal on the plate 210, Wafers in the wafer 匣150, etc. The second arm 330, For example, Figure 3, As shown in Figure 4A, have: The frame plate that constitutes the outer -14- 200814226 frame 3 3 4, And a movable plate 363 disposed inside the frame plate 3 3 4 that can advance and retreat the frame plate 3 3 4 . Frame board 3 3 4, It is fixed to the sliding portion 3 3 1 . Relative to the frame board 3 3 4, The movable plate 3 3 6 is as shown in Fig. 4A. The drive is horizontally moved in the advancing and retracting direction by the cylinder mechanism 3 3 8 provided in the sliding portion 33 1 . Lifting mechanism 340, For example, a substrate lifting plate in which a plate member is hinged to be bent is used. The substrate lifting plate, It is connected between the frame plate 3 34 and the movable plate 3 36 by a hinge. With the forward and backward movement of the movable plate 3 3 6 Fall down. Specifically, as shown in Figure 4A, The lift mechanism 340 is in a down state, The movable plate 336 moves in the forward direction by the cylinder mechanism 3 3 8 . With this, As shown in Figure 4B, The lifting mechanism 340 will stand up. By the erection of such a lifting mechanism 340, Fall down, It is possible to lift the crystal circle W from below. Furthermore, Lifting mechanism 3 4 0, In order to lift the wafer W horizontally from below, At least three or more are attached to the lift fork 332. here, For a specific configuration example of the lifting mechanism 340, Refer to the diagram for explanation. Figure 5A, Fig. 5B is a perspective view showing a specific configuration example of the lift mechanism. Lifting mechanism 340, For example, as shown in Fig. 5A, it is composed of a substrate lifting plate, The substrate lifting plate system has: A flip-up plate 3 4 that supports the underlying substrate support portion 34 of the wafer W is provided. And for supporting the inverted plate 3 4 2 to be erected, Fall down, The support portion 344 of the up-and-down plate 342 is connected by a hinge. Substrate lifting plate, As mentioned above, It is connected between the frame plate 3 3 4 and the movable plate 3 36 by a hinge. Specifically, for example: The base end of the support plate 344 is connected to the frame plate 3 3 4 by a hinge. And the base end of the inverted plate 3 42 is connected to the movable plate 336 by a hinge. Furthermore, The connection state of the substrate lifting plate, Not necessarily limited to this, Although not shown, For example, it can also be: The base end -15- 200814226 of the support plate 344 is connected to the movable plate 3 3 6 by a hinge And the base end of the up-down plate 342 is connected to the frame plate 3 3 4 substrate support portion 3 46 by a hinge, For example, Figure 5A, Figure 5B, Formed integrally with the inverted plate 3 4 2 . which is, Substrate support portion 3 4 6, A portion of the end face before the falling plate 3 4 2 is disposed to extend from the front end face. In Figure 5A, In Figure 5B, The case where the substrate supporting portion 346 is provided in the vicinity of one side surface of the end surface before the falling plate 342 is exemplified, But not necessarily limited to this, E.g: It is also possible to provide the substrate supporting portion 3 46 near the other side surface of the end face before the inverted plate 3 42 is used. It may also be disposed at the center of the front end face of the up-and-down plate 342. Furthermore, The front end surface of the substrate supporting portion 346 is preferably By forming a slanted notch or chamfer, To continue borrowing a portion of the contact wafer W. Lifting mechanism 340, For example, materials with elastic resilience (for example: Polypropylene, Piano wire). For example, a plate made of polypropylene, The up-and-down plate 342 and the support plate 344 of the lift mechanism 340 are integrally formed. at this time, The hinge plate 342 and the hinge portion of the support plate 344, For example, the surface of a sheet of polypropylene is cut, It consists of the remaining thin parts. Figure 5A, Figure 5B is the top of the board for cutting polypropylene, The hinge portion is constituted by the remaining thin portions below. The same, Frame board 334, The movable plate 3 3 6 is also formed, for example, of a sheet of polypropylene. And the hinge plate of the movable plate 3 36 and the inverted plate 342, a hinge portion of the frame plate 3 34 and the support plate 344, For example, the surface of a sheet of polypropylene is also cut, It consists of the remaining thin parts. Figure 5A, Figure 5B, a hinge portion of the movable plate 3 36 and the inverted plate 3 42 a hinge portion of the frame plate 3 3 4 and the support plate 344, Cutting the underside of the polypropylene sheet separately, It consists of the thin part of the remaining -16- 200814226 above. Furthermore, Each hinge portion of the lifting mechanism 340, Not limited to the above, E.g: It may be constituted by a coil spring or the like. According to the lift mechanism 340 constructed in this way, As shown in Figure 5A, The inverted plate 342 is in a fallen state. Move the movable plate 336 toward the forward direction (arrow direction) shown in Fig. 5B, Thereby, the inverted plate 342 (and the substrate supporting portion 3 46) is erected by rotating around the hinge portion. With this, The front end of the substrate support portion 346, From the frame board 334, The upper surface of the movable plate 336 protrudes upward. In this state, The movable plate 3 3 6 moves in a direction opposite to the direction of the arrow shown in FIG. 5B. With this, The up-and-down plate 342 (and the substrate support portion 3 46) are collapsed by the elastic restoring force of each member. Return to the state shown in Figure 5A. Furthermore, Thus, by the hinge portion, the lifting mechanism 300 can be configured to stand up and down. In the state where the falling plate 342 is fallen, As long as the movable plate 336 moves in the forward direction, The up-and-down plate 342 is in a state of being able to move to the upper side of the second arm 333 from the upper side and the lower side. For this, At the lifting mechanism 340, The hinge portion between the up-and-down plate 342 and the support portion 3 44 is disposed below the hinge portion. The up-and-down plate 3 4 2 rotates around the lower hinge portion, Therefore, the inverted plate 3 42 is erected toward the upper side of the second arm 333. Can also be designed to On the fall of the falling plate 342, Will not fall to the state of the dead point. With this, Even if the hinge portion is not provided under the up-and-down plate 342 and the support portion 344, As long as the movable plate 3 36 moves in the forward direction, the inverted plate 3 42 can be erected toward the upper side of the second arm 333. Figure 4A, A specific example of the second arm 3 30 shown in FIG. 4B, Although it is exemplified by the cylinder mechanism 3 3 8, Let the movable plate 3 3 6 move in the forward and backward direction -17- 200814226 to explain But it is not necessarily limited to this', for example: By the cam mechanism 3 3 9, as shown in Fig. 6A The movable plate 3 3 6 may be moved in the advancing and retracting direction. at this time , E.g: The cam shape of the cam mechanism 3 3 9 is elliptical. By rotating the cam, As shown in Figure 6A, The inverted plate 3 42 can be inverted by the lifting mechanism 3 40, As shown in Figure 6B, The inverted plate 342 is erected. Although Figure 5A, Lifting mechanism 340 shown in Fig. 5B, Forming the substrate support portion 3 46 from the front end surface of the inverted plate 3 42 But it is not necessarily limited to this, E.g: As shown in Figure 7A, As shown in Figure 7B, The plate material constituting the substrate supporting portion 346 may be attached to the lower side of the up-and-down plate 342 to be integrally formed. With the lift mechanism 340 thus constructed, As shown in Figure 7A, Since the inverted plate 342 is in a fallen state, Move the movable plate 3 3 6 toward the arrow shown in Fig. 7B. Thereby, the inverted plate 3 42 (and the substrate supporting portion 346) is erected by rotating around the hinge portion. With this, The front end of the substrate support portion 346, From the frame board 3 3 4, The upper surface of the movable plate 3 3 6 protrudes upward. In this state, The movable plate 3 3 6 moves in a direction opposite to the direction of the arrow shown in Fig. 7B. With this, The up-and-down plate 342 (and the substrate support portion 346) are collapsed by the elastic restoring force of each member. Return to the state as shown in Fig. 7A. According to the second arm 320 of the present embodiment as described above, The substrate lifting mechanism 340 is in a fallen state. The second arm 340 can be moved in and out of the lower side of the holding plate 210. Therefore, the spacing of each maintaining a temperature of 210 can be narrower than conventional. Lifting mechanism 340, By adjusting the position of each hinge portion and the length between the hinge portions, The front end of the substrate supporting portion 346 can be linearly moved in the vertical direction. E.g: Under the same conditions as the Sco 〇 11 - R u s s e 11 mechanism that converts the motion in the horizontal direction into the linear motion in the vertical direction, -18-200814226, By adjusting the position of each hinge portion and the length between the hinge portions, the front end of the substrate supporting portion 346 can be vertically moved to lift the wafer. the following, Example 7A, Lifting mechanism 340 shown in Fig. 7B, The condition for causing the front end of the substrate supporting portion 364 to move vertically is described with reference to the drawings. Figure 8A, Figure 8B is a side view of the lifting mechanism 340 in Figure 7A, Figure at the state shown in Fig. 7B. As shown in Figure 8B, The hinge portion of the movable plate 3 3 6 and the inverted plate 3 4 2 is a, The hinge portion of the up-down plate 3 42 and the support plate 3 44 is b, The front end of the substrate supporting portion 3 46 is c, The hinge portion of the support portion 344 and the frame plate 3 34 is d. At this time, the hinge portion b overlaps the midpoint of the line connecting the hinge portion a and the front end c, And connecting the length of the straight line of the hinge portion b and the hinge portion d, It is equal to the length of a straight line connecting the hinge portion a and the hinge portion b (the midpoint of the straight line connecting the hinge portion a and the front end c). like this, Lifting mechanism 340 shown in Fig. 8B, The same conditions as the Scott Russell institution, Using the thickness of the sheet, To adjust the position of each hinge portion and the length between the hinge portions, By moving the movable plate 336 relative to the frame plate 334 in the advancing and retracting direction (the direction of the horizontal arrow shown in FIG. 8B), The front end c of the substrate supporting portion 3 46 moves along a vertical line passing through the leading end c of the hinge portion d. With this, Lifting the lower surface of the wafer W by the front end c of the substrate supporting portion 3 46 With this, Since the wafer W moves toward the vertical direction (the direction of the vertical arrow shown in Fig. 8B), Therefore, the lifting action generated by the lifting mechanism 3 40, It is possible to prevent the wafer W from shifting in the horizontal direction. Furthermore, As shown in Figure 5A, Lifting mechanism 340 shown in Fig. 5B, The position of each hinge and the length between the hinges of -19-200814226 can also be adjusted under the same conditions as the Struers. By setting the hinge plate 342 and the hinge portion b of the support plate 344 to pass through the center of the plate thicknesses, the hinge portion b can be overlapped with the front end of the connection hinge portion a and the substrate support portion 346. The midpoint of the line of c. The length 'the length of the straight line connecting the hinge portion b and the hinge portion d is equal to the length of the straight line connecting the hinge portion a and the hinge portion b (the point connecting the straight line of the front end c of the hinge portion a and the substrate support portion 3 46). The same conditions as the Scott Russell institution. With this, The wafer can be lifted by causing the front end c of the substrate supporting portion 364 to move vertically. In such a substrate transfer device 300, Cooperating with the position of the wafer W to rotate the base 3 1 0 0, Lifting to adjust the position of the base 3 1 0, And make the first 2 arm 3 20, 3 3 0 action, The wafer W is taken in and out with respect to the wafer cassette 150 and the wafer holding boat 200. (Operation of Substrate Transfer Device) A specific example of the operation of the substrate transfer device 300 will be described. First of all, For the case of transferring the wafer W to any of the holding plates 2 10 of the wafer holding boat 200, Refer to FIG. 9A to FIG. 9F for explanation. For example, as shown in Figure 9A, In a state where the wafer W taken out from the wafer cassette 150 is placed on the transport fork portion 322 of the first arm 320, The first arm 320 is advanced from the base 310, The carrying fork portion 3 22 is inserted into the upper side of the holding plate 210 on which the wafer W is to be transferred. and, The substrate lifting mechanism 3 40 of the second arm 333 is in a fallen state. The second arm 3 3 0 is advanced from the base 310, The lift fork portion 3 3 2 is inserted into the lower side of the above-described holding plate 210. With this, It becomes the state shown in Fig. 9B. Secondly, As shown in Figure 9C, Raising the substrate lifting mechanism 340, Lift -20- 200814226 to lift the wafer W on the first arm 3 20 . at this time, The wafer W is separated from the first arm 320, In this state, As shown in Figure 9D, The first arm 320 is pulled out from the upper side of the holding plate 210. then, As shown in Figure 9 E, The substrate lifting mechanism 340 of the second arm 333 is lowered, The wafer W is discharged onto the holding plate 210. and, As shown in Figure 9F, The substrate lifting mechanism 3 40 maintains the fallen state, The second arm 333 is pulled out from the lower side of the holding plate 210. Thus, the wafer W can be mounted on the holding plate 2 1 0 . With this, Even if the pitch of each of the holding plates 2 10 is narrowed, The second arm 3 3 0 can also be inserted or removed toward the lower side of the holding plate 210, Therefore, the wafer W can be surely mounted on the desired holding plate 2 10 . Secondly, For the case where the transfer wafer holds the wafer W on any of the holding plates 210 of the boat 200, Refer to Figure 10A to Figure 10F for illustration. As shown in Figure 10A, Will the second arm 3 3 0, The substrate lifting mechanism 3 40 is in a fallen state. The lift fork portion 3 3 2 is inserted into the lower side of the holding plate 2 1 0 on which the wafer W to be transferred is placed. in this way, It becomes the state shown in the first figure B. Secondly, As shown in Figure 10C, The substrate lift mechanism 340 is erected to lift the wafer W on the holding plate 210. at this time, The wafer W is separated from the holding plate 2 10 . In this state, As shown in Figure l〇D, The conveying fork portion 32 2 of the first arm 3 20 is inserted between the lifted wafer W and the holding plate 2 10 . then, As shown in Figure 10E, The substrate lift mechanism 3 40 is lowered. The wafer W on the holding plate 210 is discharged to the transport fork portion 32 2 of the first arm 325. and, As shown in Figure 1 F, The second arm 3 3 0 ' is maintained in a fallen state by the substrate lifting mechanism 3 40. Pull out the lifting fork from the lower side of the retaining plate 2 1 0 200814226 3 3 2, And will be the first arm 3 20, The state in which the wafer W is placed on the fork portion, Pull out from the upper side of the holding plate 2 10 . Thus, the wafer W can be taken out from the holding plate 2 . Thereby, even if the pitch of each of the holding plates 2 10 is narrowed, The second arm 3 3 0 can also be inserted or pulled out to the lower side of the holding plate 2 1 0, Therefore, the wafer W can be surely taken out from the desired holding plate 210. As described above, the substrate transfer device 300 according to the present embodiment, System settings: a first arm 320 for carrying a transport fork portion 322 for transporting the wafer W, And have the settings to be erected, The second arm 330 of the lifting fork portion 332 of the fallen substrate lifting mechanism 340, Taking this first The second arm 320, 330 is inserted into the upper and lower of any holding plate 2 1 0, To transfer the wafer. With this, Can be held between any of the holding plates 210 of the wafer holding boat 200, The transfer of the wafer W (installation or removal of the wafer W) is performed. In addition, The substrate lifting mechanism 340 is in a fallen state. The second arm 333 can be moved in and out toward the lower side of the holding plate 2 1 0, Therefore, the spacing of each of the protections of 210 can be narrower than conventional. With this, The number of holding plates 2 10 disposed on the wafer holding boat can be increased, It is also possible to increase the number of wafers W that can be transferred to the wafer holding boat. therefore, The number of wafers W that can be heat treated at one time can be increased, so that the throughput can be increased. and, The height of the wafer holding boat 200 can be lowered, and the length of the furnace can also be shortened. Furthermore, In the above embodiment, Although the case where the annular holding plate 2 1 0 is formed in the wafer holding boat 200 is exemplified, it is not limited thereto. For example: As shown in Figure 11, In the case where the wafer holding boat 200 is set to form a circular plate holding plate 25 0 ° -22- 200814226, in this case, A hole 252 into which the base plate lifting mechanism 340 of the second arm 333 is insertable is provided in the holding plate 250. With this, For the disc-shaped retaining plate 250, The wafer can also be transferred by the substrate transfer device 300 of the present embodiment. the above, The preferred embodiment of the present invention will be described with reference to the accompanying drawings. However, the invention is of course not limited to the relevant examples. Familiar with this artist, Various modifications and modifications are conceivable within the scope of the claims. Of course, these also fall within the technical scope of the present invention. For example, in the above embodiment, Although it is exemplified as a case where a high-speed heat treatment device (FTP) is used as a substrate processing device, But it is not necessarily limited to this, As long as it is a substrate processing apparatus that transfers a substrate to a substrate holding boat in which a plurality of substrates are arranged in the vertical direction, Regardless of the type of heat treatment, Further, it is also applicable to a substrate processing apparatus other than the heat treatment apparatus. [Industrial Applicability] The present invention is applicable to a substrate transfer apparatus, Substrate processing device, Substrate transfer arm, Substrate transfer method. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a schematic configuration of a vertical heat treatment apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view showing the wafer holding boat shown in Fig. 1. Fig. 3 is a perspective view showing a configuration example of a substrate transfer device of the same embodiment. -23- 200814226 Fig. 4A is a perspective view showing a configuration example of the second arm, Indicates that the substrate lifting mechanism is in a fallen state. 4B is a perspective view showing a configuration example of the second arm. Indicates that the substrate lifting mechanism is in a state of being erected. Fig. 5A is a perspective view showing a configuration example of a substrate lifting mechanism, It indicates that the substrate lifting mechanism is in a fallen state. Fig. 5B is a perspective view showing a configuration example of the substrate lifting mechanism, It indicates that the substrate lifting mechanism is in a state of being erected. 6A is a perspective view showing another configuration example of the second arm, The table is not in the state of falling. 6B is a perspective view showing another configuration example of the second arm. Indicates that the baselift is in a erected state. Fig. 7A is a perspective view showing another configuration example of the substrate lifting mechanism, Indicates that the substrate lifting mechanism is in a fallen state. Fig. 7B is a perspective view showing another configuration example of the substrate lifting mechanism, Indicates that the substrate lifting mechanism is in a state of being erected. Fig. 8A is a view showing the substrate lifting mechanism shown in Fig. 7A viewed from the side. Fig. 8B is a view showing the substrate lifting mechanism shown in Fig. 7B viewed from the side. Fig. 9A is a view for explaining the operation of the substrate transfer device in the case where the wafer is mounted on the holding plate of the wafer holding boat. Fig. 9B is a view for explaining the operation of the ninth embodiment. Fig. 9C is a view for explaining the operation of the ninth drawing. -24- 200814226 Figure 9D is an illustration of the action following the 9Cth diagram. Fig. 9E is a view for explaining the operation of the ninth figure. Fig. 9F is a view for explaining the operation of the ninth embodiment. Fig. 10A is a view for explaining the operation of the substrate transfer device in the case where the wafer package is taken out from the holding plate of the wafer holding boat. Fig. 10B is a view for explaining the operation of the continuation of Fig. 10A. Fig. 10C is a view for explaining the operation of the continuation of Fig. 10B. Fig. 10D is a view for explaining the operation of the continuation of Fig. 10C. Fig. 10E is a view for explaining the operation of the continuation of the 10th figure. Fig. 10F is a view for explaining the operation of the continuation of Fig. 10E. Fig. 1 is a perspective view showing another configuration example of the wafer holding boat. [Main component symbol description] 1〇〇 : Vertical heat treatment unit 1 1 8 : Processing container 122 : Cover 124: Insulation tube 126 : Process gas introduction nozzle 1 2 8 : Exhaust nozzle 1 3 0 : Insulation material 132 : Heater 134 : Send fan 1 3 6 : Air supply head 1 3 8 : Air supply nozzle -25- 200814226 140 : Exhaust passage 142 : Shutter 144: Cooling mechanism 1 4 6 : Exhaust fan 1 5 0 : Wafer 匣 200: Wafer holding boat 202 : Sun visor 204 : Upper end ring member 206: Lower end ring member 2 1 0 : Hold plate 2 2 0 : Pillar 222: Transfer port
2 5 0 :保持板 252 ：孑L 3 00 :基板移載裝置 3 0 2 :基台驅動機構 3 1 0 :基台 3 1 2 :溝槽 3 20 :第1臂 3 2 1 :滑動部 3 2 2 :搬運叉部 330 :第2臂 3 3 1 :滑動部 3 3 2 :舉升叉部 -26 200814226 3 3 4 :框板 3 3 6 :可動板 3 3 8 :汽缸機構 3 3 9 :凸輪機構 3 40 :基板舉升機構 3 42 :起倒板 3 4 4 :支承板 346 :基板支承部 W :晶圓 -27-2 5 0 : holding plate 252 : 孑 L 3 00 : substrate transfer device 3 0 2 : abutment drive mechanism 3 1 0 : base 3 1 2 : groove 3 20 : first arm 3 2 1 : sliding portion 3 2 2 : carrying fork 330 : second arm 3 3 1 : sliding portion 3 3 2 : lifting fork portion -26 200814226 3 3 4 : frame plate 3 3 6 : movable plate 3 3 8 : cylinder mechanism 3 3 9 : Cam mechanism 3 40 : substrate lifting mechanism 3 42 : up-plate 3 4 4 : support plate 346 : substrate support portion W : wafer 27 -