WO2008001935A1 - Structure antireflet et procédé de production de cette dernière - Google Patents

Structure antireflet et procédé de production de cette dernière Download PDF

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Publication number
WO2008001935A1
WO2008001935A1 PCT/JP2007/063242 JP2007063242W WO2008001935A1 WO 2008001935 A1 WO2008001935 A1 WO 2008001935A1 JP 2007063242 W JP2007063242 W JP 2007063242W WO 2008001935 A1 WO2008001935 A1 WO 2008001935A1
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WO
WIPO (PCT)
Prior art keywords
antireflection structure
mold
antireflection
manufacturing
shape
Prior art date
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PCT/JP2007/063242
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English (en)
Japanese (ja)
Inventor
Takamasa Tamura
Makoto Umetani
Kazuhiko Ishimaru
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2008522674A priority Critical patent/JP4820871B2/ja
Publication of WO2008001935A1 publication Critical patent/WO2008001935A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures

Definitions

  • the present invention relates to an antireflection structure and a method for manufacturing the same.
  • an antireflection treatment for example, a film having a relatively low refractive index (low refractive index film), or a film having a low refractive index and a film having a relatively high refractive index (high refractive index film) are alternately laminated. And a process of forming an antireflection film having the same strength on the surface (for example, Patent Document 1). In general, such an antireflection film having a low refractive index film or a multilayer film is formed by vapor deposition, sputtering, or the like.
  • the process of forming an antireflection film using a vapor deposition method, a sputtering method, or the like is complicated. For this reason, the light reflection preventing film has a problem that productivity is low and production cost is high.
  • such an antireflection film has a problem that the wavelength dependency is large. Specifically, it has a high antireflection function for light of a predetermined wavelength (design wavelength), but does not have a sufficient antireflection function for light of other wavelengths. There's a problem. For this reason, it is difficult to achieve an anti-reflection effect over the entire visible wavelength range required for an imaging optical system or the like with a low-refractive index film or a multilayer anti-reflection film.
  • the light reflection preventing film having a low refractive index film or a multilayer film has a relatively high light reflection preventing effect with respect to the normal incident light, but when the incident angle is increased, the light reflection preventing effect is obtained. Has an incidence angle dependency that becomes smaller. That is, there is a problem that a sufficient light reflection preventing effect cannot be obtained for light having a large incident angle.
  • an antireflection structure composed of a plurality of conical protrusions arranged at a submicron pitch (hereinafter, sometimes referred to as an “antireflection uneven structure”) has been proposed. It is.
  • the abruptness at the optical element interface is sharp.
  • a drastic change in refractive index is suppressed. That is, the refractive index gradually changes in the antireflection uneven structure. For this reason, light reflection on the surface of the optical element is reduced, and a high light incidence rate into the optical element can be realized.
  • reflection of light having a wavelength equal to or greater than the pitch between the cone-shaped protrusions can be suppressed.
  • the anti-reflection concavo-convex structure has a relatively high anti-reflection effect even for light having a large incident angle. That is, this anti-reflection uneven structure has a small wavelength dependency and incident angle dependency. Therefore, by using this antireflection concavo-convex structure, it is possible to realize an optical element, an optical system, and the like that have a high light reflection preventing effect in a wide wavelength range.
  • a method for manufacturing such an antireflection structure a combination of EB drawing and RIE etching has been proposed as disclosed in Patent Document 2.
  • Patent Document 1 Japanese Patent No. 2566634
  • Patent Document 2 JP 2001-272505 A
  • a primary replica mold is manufactured using the created antireflection structure as a mold, and a secondary replica mold is manufactured using the primary replica mold as a mold. Then, a method of manufacturing an antireflection structure using the secondary replica mold as a mold can be considered. According to this method, once the antireflection structure is produced, the secondary replica mold can be mass-produced at low cost, and the manufacturing cost of the antireflection structure can be further reduced.
  • the antireflection structure generally has a structure in which a plurality of fine conical projections are arranged as shown in FIG.
  • the antireflection structure and the secondary replica type have substantially the same shape. Therefore, the secondary replica mold is used to press-mold the anti-reflective structure.
  • an antireflection structure as shown in Fig. 2 is produced which has an uneven shape opposite to the original antireflection structure. That is, an antireflection structure having an antireflection structure in which a plurality of concave portions corresponding to the shape of the convex portions formed in the original antireflection structure is formed.
  • an antireflection structure having an antireflection structure in which a plurality of fine cone-shaped projections are arranged cannot be manufactured at low cost using a secondary replica mold. There is a problem.
  • the present invention has been made in view of such a point, and an object of the present invention is to provide an antireflection structure that can be inexpensively and easily mass-produced.
  • the antireflection structure according to the present invention has a structure in which a plurality of fine convex portions are arranged and an antireflection structure for suppressing reflection of incident light is formed on the surface.
  • the anti-reflection structure is characterized in that the shape obtained by inverting the unevenness of the anti-reflection structure is substantially the same as the shape of the anti-reflection structure.
  • the shape of the plurality of fine protrusions and the shape obtained by inverting the plurality of recesses formed by the plurality of protrusions are substantially the same. It is characterized by being.
  • the unevenness of the antireflection structure Therefore, the microstructure formed in the first replica mold and the micro structure formed in the second replica mold are both included in the present invention.
  • Such an antireflection structure has substantially the same shape as the antireflection structure.
  • the antireflection structure according to the present invention can be mass-produced by the electric press molding method using the first or second replication mold. In other words, after one antireflection structure according to the present invention is produced, a large number of first or second replica molds can be produced using the produced antireflection structure as a mold.
  • the antireflection structure according to the present invention can be mass-produced easily and inexpensively.
  • the first manufacturing method of the antireflection structure according to the present invention includes a plurality of fine convex portions arranged, and an antireflection structure that suppresses reflection of incident light is formed on the surface.
  • the antireflection structure is a two-beam interference exposure method or an X-ray lithography method. It is formed by.
  • the second manufacturing method of the antireflection structure according to the present invention a plurality of fine convex portions are arranged, and an antireflection structure that suppresses reflection of incident light is formed on the surface.
  • This is a method for manufacturing an antireflection structure in which the irregularities of the structure are inverted and the antireflection structure is approximately the same shape.
  • the antireflection structure is formed using a replication mold.
  • the third manufacturing method of the antireflection structure a plurality of fine convex portions are arranged, and an antireflection structure that suppresses reflection of incident light is formed on the surface.
  • a method for manufacturing an antireflection structure in which the shape of the structure is inverted and the antireflection structure is substantially the same shape, and the object to be molded is press-molded using the antireflection structure as a mold
  • a replica mold is manufactured, and an antireflection structure is formed using the replica mold.
  • FIG. 1 is a diagram of a general conical antireflection structure.
  • FIG. 2 is a diagram in which the concavities and convexities of the conical antireflection structure are reversed.
  • FIG. 3 is a schematic diagram for explaining the manufacturing method of the antireflection structure according to the first embodiment.
  • FIG. 4 is a schematic diagram showing the intensity distribution of X-rays formed on the substrate after exposure
  • FIG. FIG. 3 is an enlarged perspective view showing the intensity distribution of X-rays irradiated onto the substrate after exposure in a three-dimensional manner.
  • FIG. 5 is a schematic diagram for explaining a manufacturing method of the antireflection structure according to the second embodiment.
  • Fig. 6 is a schematic diagram for explaining an electric wire manufacturing method according to the third embodiment.
  • FIG. 7 is a schematic diagram for explaining a glass replication mold manufacturing method according to the fourth embodiment.
  • FIG. 8 is a schematic diagram for explaining a manufacturing method of the antireflection structure according to the fifth embodiment.
  • FIG. 9 is a perspective view of an antireflection structure according to Embodiment 7.
  • FIG. 10 is a cross-sectional view of the antireflection structure according to Embodiment 7.
  • FIG. 11 is a cross-sectional view of another antireflection structure according to Embodiment 7.
  • FIG. 12 is a cross-sectional view of a mold used in the method for manufacturing an antireflection structure according to Embodiment 7.
  • an antireflection structure was produced by irradiating the PMMA substrate 31 with X-rays as follows. Details will be described with reference to FIG.
  • the X-ray mask A was opposed to the PMMA substrate 31 so as to form a gap of 100 ⁇ m. After that, X-ray exposure was performed at 10 A ⁇ min from the X-ray mask A side (first exposure process: Fig. 3 (A)). Subsequently, X-ray mask A was rotated 90 degrees around the optical axis of the X-ray, and X-ray exposure was similarly performed from the X-ray mask A side with lOA'min (second exposure process: Fig. 3 ( B)). After X-ray exposure, the film was developed by dipping in a developer containing 2- (2-n-butoxyethoxy) ethanol as the main component. The MMA substrate 31 was processed into a microstructure 32 with a pitch of 300 nm and a height of 400 nm (development process: FIG. 3 (C)).
  • the pattern exposed on the PMMA substrate 31 is a square lattice with an X-ray exposure amount of 3 levels, as shown in (4-1 A) of FIG. That is, on the substrate after exposure, an area where X-rays are not exposed before and after the rotation (indicated as “0” in (4-1-1A) in FIG. 4), and a displacement force before and after the rotation once.
  • the area where only X-rays were exposed (denoted as “1” in (4-1-1A) in Fig. 4) and the area where X-rays were exposed both before and after rotation ((4-1) in Fig. 4). — In A), “2”) is formed.
  • both the area where X-rays are exposed before and after the rotation and the area where X-rays are exposed only once both before and after the rotation are both marked with a recess by the image. Become. At this time, the formation depth of the concave portion becomes deeper when the X-ray dose to be irradiated is larger. Therefore, the concave portion becomes deeper than the area where the X-rays are exposed only once before and after the rotation of the area where the X-rays are exposed before and after the rotation. As described above, the X-ray intensity distribution corresponding to the shape in which the three-level unit structure shown in (4 1 A) of FIG. 4 is periodically formed can be obtained.
  • the three-dimensional shown in (4 1 B) of Fig. 4 is caused by the influence of interference and side etching during development.
  • the shape of a rectangular cross section cannot be obtained as in the case of a simple structure, and the edge portion is rounded, and the convex portion is shaped like a bell.
  • the three-level unit structure is arranged in an array with a pitch less than the wavelength of the light whose reflectance should be reduced, and has the effect of preventing reflection incident on the surface.
  • Embodiment 1 the example in which the X-ray mask A is rotated 90 degrees around the X-ray optical axis and the pattern is superimposed is shown, but the present invention is not limited to this.
  • an example in which the X-ray mask A is rotated by 270 degrees around the optical axis of the X-ray and the pattern is superimposed may be shown, or may be rotated a plurality of times. In short, it is only necessary to rotate the X-ray mask so that the LZS patterns are finally orthogonal to each other.
  • the substrate instead of rotating the X-ray mask A, the substrate may be rotated. [0030] Regarding the rotation angle, exposure may be performed three times at 60 degrees or 120 degrees as shown in FIG.
  • the pattern exposed on the substrate has an X-ray exposure level of 4 as shown in (4-2-A) in Fig. 4, and the shape shown in (4 2-B) in Fig. 4 by development.
  • a structure with a rounded corner is formed.
  • This structure is also concave-convex inverted like the structure of (4-1-1 B) in Fig. 4, that is, "3" and "0” and (2) and "1" of (4 2-A) in Fig. 4 It can be seen that even if "
  • the force with which the width of the X-ray absorption region 3 and the X-ray transmission region 4 is 1: 1 may be an arbitrary ratio.
  • the LZS pattern is formed so that the width varies between the vicinity of the center of rotation and the vicinity of the periphery, it is possible to make the reflectance wavelength dependent.
  • the absorber may be any of Ta, Ni, Au, Cu, Ag, Cr, Fe and the like.
  • the antireflection structure is manufactured by X-ray lithography, but a similar shape can be manufactured by a two-beam interference (hologram) exposure method or the like.
  • quartz that is not PMMA is used for the substrate.
  • a method for forming an antireflection structure on the surface of a quartz glass substrate by X-ray lithography will be described with reference to FIG.
  • An X-ray resist 51 having a thickness of 0.3 ⁇ m was formed on the surface of the quartz glass substrate Q1 by spin coating.
  • An X-ray mask A was opposed to a quartz glass substrate Q1 coated with an X-ray resist 51 through a gap of 100 m. Thereafter, X-ray exposure was performed from the X-ray mask A side with lOA'min (first exposure step: FIG. 5 (A)).
  • the X-ray mask A was rotated 90 degrees around the optical axis of the X-ray, and X-ray exposure was similarly performed from the mask A side with lOA'min (second exposure process: Fig. 5 (B)) ).
  • the X-ray resist 51 is shown in (4-1-1B) in Fig. 4 as a result of being immersed in a developer containing 2- (2-n-butoxyethoxy) ethanol as the main component. Based on the three-dimensional intensity distribution, a pitch of 300 nm was obtained (development process: Fig. 5 (C)).
  • the quartz glass substrate Ql on which the fine structure 32 made of the X-ray resist is formed is placed in an RF dry etching apparatus, and the surface of the quartz glass substrate is etched using CHF +0 gas.
  • the anti-reflection structure 33 having a pitch of 300 nm and a height of 400 nm was formed on the surface of the quartz glass substrate Q1 by the etching process (structure formation process: FIG. 5 (D)). Similarly to the antireflection structure produced in the first embodiment, the antireflection structure 53 has the same shape even if it is inverted.
  • the etching mask is preferably Cr, Ni, or Fe.
  • FIG. 6 is a schematic diagram for explaining a method of manufacturing an electric type used in a method for manufacturing a member having an antireflection structure according to the third embodiment.
  • the method for producing a member having an antireflection structure according to the third embodiment is characterized in that the mold is electrically duplicated.
  • a process for electrically replicating the PMMA substrate 61 on which the antireflection structure formed by the manufacturing method of Embodiment 1 is formed will be described as an example.
  • the PMMA substrate 61 (master type, FIG. 6 (A)) is not electrically conductive by the manufacturing method described in the first embodiment, it is immersed in the NiZB solution 63 for electroless plating so as to prevent reflection.
  • An electroless plating layer 64 was formed on the surface of the body 62 (FIG. 6 (B)).
  • the electroless plating layer 64 formed on the antireflection structure 62 of the PMMA substrate 61 had a thickness of 30 nm.
  • the master type in which the electroless plating layer 64 was formed was immersed in a nickel sulfamate electrolyte 65 and electroplated to form a Ni plating layer 66A on the surface of the master type (FIG. 6 (C)).
  • the master mold with Ni plating was immersed in the base solution 67, and the PMMA substrate 61 was pulled away (FIG. 6 (D)) to obtain a Ni replication mold 68 (FIG. 6 (E)).
  • the thickness of the Ni replica type 68 was 1. Omm.
  • a release film 69 was formed on the surface of the primary Ni replication mold 68 by sputtering (FIG. 6 (b)).
  • the primary Ni replication mold 68 on which the release film 69 was formed was added to the nickel sulfamate electrolyte 6 Immersion into 5 and electroplating was performed to form a Ni plating layer 66B on the surface (Fig. 6 (c)).
  • the Ni-plated primary Ni replica mold 68 was also mechanically peeled off the Ni-plating layer force (Fig. 6 (d)) to obtain the secondary Ni replica mold 60 (Fig. 6 (e )).
  • the secondary Ni replication mold 60 obtained in this way is the same shape as the master mold and the primary Ni replication mold 68 because it has the same shape even when the concaves and convexes are inverted.
  • a mold having the same shape can be obtained.
  • both the primary replica mold and the secondary replica mold have the same shape, the molded products using these molds also have the same shape.
  • the mold duplicated as described above can be duplicated many times, it can be duplicated at a very low cost.
  • these replica molds can be used as a mold for directly molding heat-softened rosin glass or the like, an antireflection structure can be produced at a low cost.
  • a thin film 71 for surface protection having Ir—Rh force is formed by 0.01 ⁇ m by sputtering.
  • the upper mold 72 for molding was formed.
  • the lower mold 73 was formed by forming a thin film 71 with a thickness of 0.03 / zm on the surface of a cemented carbide containing WC as a main component by sputtering using Ir—Rh force.
  • a crown-based borosilicate glass (transition point Tg: 501 ° C, yield point At: 549 ° C) is used, and boron nitride (BN) is used as a release agent on the surface.
  • a thin film 75 was formed.
  • the upper mold 72 and the lower mold 73 were placed facing each other in a molding machine, and a molding glass material 74 was placed between them (FIG. 7 (A)).
  • the upper mold 72, the lower mold 73, and the molding glass material 74 are all housed in a chamber 76 that is replaced with nitrogen gas. Press-molded for 3 minutes at a temperature of 590 ° C and a pressure of 1000N (Fig. 7 (B)), and the upper mold 72 was released without cooling, and the reversal shape of the anti-reflection structure on the surface of the molding material 74 To form a member 77 (FIG. 7C).
  • the member formed from the lower mold 73 was taken out, and the manufacturing process of the member 77 having the antireflection structure was completed. Without a surface-protecting thin film, the glass material will be in direct contact with the mold, causing fusion and making it impossible to release the mold force. If you try to release the mold forcibly, the glass material or mold will break.
  • the mold replicated as described above can be used as a mold for directly molding heat-softened rosin glass or the like. According to the fourth embodiment, it is possible to manufacture the mold used for forming the antireflection structure without using a high-cost and low-productivity method such as electron beam drawing.
  • FIG. 8 is a schematic diagram for explaining a method for manufacturing a member having an antireflection structure according to the fifth embodiment.
  • the fifth embodiment is characterized in that a member made of an optical resin is molded using a mold that is electrically replicated from the master mold described above.
  • the sixth embodiment is characterized in that a member made of optical resin is molded using a mold that is electronically replicated from the master mold car described above.
  • An optical resin material was press-molded by using a molding machine similar to that of Embodiment 4 using an electric replica type in which a surface protective film was formed with a silane coupling agent.
  • the electric replica type with a surface protective film was used as the upper die, and the cemented carbide containing WC as the main component was used as the lower die.
  • the upper mold, the lower mold, and the PMMA resin substrate were set and press-molded at 180 ° C. and 20 MPa to form an antireflection structure on the surface of the resin substrate.
  • the embodiments are acrylic, Teflon (registered trademark), polyethylene, polyolefin, and polycarbonate. Bonates and the like can be used as the resin substrate.
  • the antireflection structure according to Embodiment 7 has a periodic structure in which convex structural units and concave structural units are alternately arranged in an array as shown in FIGS.
  • the concave-shaped structural unit is generally conical or bell-shaped, while the convex structural unit is a general cone-shaped or bell-like shape obtained by inverting the concave shape and has a tip portion thereof. It has a cut shape.
  • the antireflection structure actually obtained has a structure in which the shape of a rectangular cross-section is not obtained as shown in FIG. 9 due to the influence of interference and side etching at the time of image formation, and the edge portion is distorted. It becomes.
  • the antireflection structure according to Embodiment 7 has a periodic structure in which convex structural units and concave structural units are alternately arranged in an array as shown in FIG.
  • the concave-shaped structural unit is generally conical or substantially bell-shaped, while the convex-shaped structural unit is generally conical or substantially bell-shaped obtained by inverting the concave shape and The radius of curvature of the tip is larger than the radius of curvature of the concave bottom end.
  • the antireflection structure having the antireflection structure according to Embodiment 7 can tolerate the occurrence of air pockets in which the transferability of the tip of the convex shape is lowered when it is molded by injection molding or press molding. It has a shape like this. As a result, the formation of the antireflection structure by injection molding or press molding enables mass production easily and inexpensively.
  • the method for manufacturing an antireflection structure described in Patent Document 2 and the like has a problem that it requires a very long time and a large manufacturing cost to manufacture the antireflection structure. Therefore, as a method of manufacturing the antireflection structure at low cost, for example, a method of forming the antireflection structure by injection molding or press molding using a master or replica of the antireflection structure as a molding die is conceivable.
  • the seventh embodiment it is possible to realize an antireflection structure that can permit air accumulation due to injection molding of the antireflection structure and can be easily mass-produced at low cost.
  • Such an antireflection structure is formed by using the antireflection structure produced by the X-ray exposure according to the first embodiment as a master, and using the antireflection structure according to the third embodiment.
  • a body replica mold can be produced and manufactured by injection molding according to Embodiment 5 using the replica mold.
  • the antireflection structure as a master can be manufactured by the manufacturing method according to the second embodiment.
  • the master of the antireflection structure made of the quartz glass substrate manufactured in Embodiment 2 has high heat resistance and high strength, and can be used as it is as a mold for injection molding.
  • the replica molds are manufactured from the anti-reflection structure master disk using a quartz glass substrate by Ni electroplating. May be.
  • a replica type of the antireflection structure can also be manufactured by the method of the fourth embodiment.
  • the manufacturing of the antireflection structure using the replica mold may be the method according to the sixth embodiment.
  • the antireflection structure produced by the manufacturing method according to the first or second embodiment can be used as a master, and can be manufactured by the manufacturing method according to the fifth or sixth embodiment using the master.
  • the concave structural unit is substantially conical or bell-shaped, while the convex structural unit is the concave shape.
  • an antireflection structure having an antireflection structure that is substantially conical or bell-shaped in which is inverted is formed.
  • the concave structural unit is substantially conical or bell-shaped, whereas the convex structure
  • the unit is a general cone-shaped or bell-shaped with inverted concave shape and the shape of the tip is cut, or a general cone-shaped or inverted bell-shaped inverted concave shape, with the tip of the tip
  • the curvature radius may be larger than the curvature radius of the concave bottom end.
  • the method of manufacturing an antireflection structure capable of allowing the occurrence of air accumulation is, in other words, the manufacture of an antireflection structure having an antireflection structure that suppresses reflection of incident light on the surface.
  • the antireflection structure is a periodic structure in which convex structural units and concave structural units are alternately arranged in an array, and has a region obtained by inverting the periodic structure.
  • the concave structural unit is substantially conical or substantially bell-shaped, while the convex structural unit is substantially conical or substantially bell-shaped obtained by inverting the concave shape. It shall be.
  • the cross section of the mold in the method for producing an antireflection structure according to the present invention has a structure as shown in FIG. That is, the molding die in this manufacturing method is characterized in that the convex shape and the shape obtained by inverting the convex and concave portions and the shape before being inverted are substantially the same.
  • the molding die in the method for manufacturing an antireflection structure according to the present invention can produce a large number of second or third replica molds by using the antireflection structure itself produced thereby as a molding die.
  • An antireflection structure having an antireflection structure in which a plurality of fine convex portions are arranged using the produced replica mold can be more easily and inexpensively mass-produced.
  • the step of preparing the molding die is to produce the molding die so as to form the above-described cavity using an antireflection structure produced by a two-beam interference exposure method or an X-ray lithography method. May be.
  • a replica mold is manufactured from the antireflection structure manufactured by the two-beam interference exposure method or the X-ray lithography method, and the above-mentioned cavity is formed using the replica mold. You can also make a mold to form.
  • the step of preparing the mold includes a two-beam interference exposure method or an X-ray lithography.
  • a replica mold is manufactured by press molding a molded object using an antireflection structure manufactured by a method, and the mold is manufactured using the replica mold to form the above-described cavity. Also good.
  • the pitch between the concave shapes is equal to or less than the wavelength of light whose reflection is suppressed by the antireflection structure.
  • the antireflection structure is preferably an optical member.
  • the present invention is suitable for an optical element having an optical function surface that requires antireflection processing for light rays in an optical path, such as a lens element and a prism element used in a digital camera, a printer device, and the like.
  • the present invention is applied to a structural member used for holding these optical elements, for example, a casing member that protects the entire device including the optical element, thereby providing an antireflection surface that prevents unnecessary light. it can.
  • the present invention is applicable to various devices such as light emitting elements such as semiconductor laser elements and light emitting diodes, light receiving elements such as photodiodes, imaging elements such as CCDs and CMOSs, and optical switches and branching devices used for optical communication.
  • each device can be improved by forming it in a portion requiring antireflection treatment.
  • the present invention may be applied to the display portion of a display panel such as a liquid crystal display panel, an organic electrification luminescence panel, or a plasma light emission panel! / ⁇ .
  • the present invention is widely applicable to all members that require antireflection treatment used in optical equipment.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

L'invention concerne une structure antireflet et un procédé de production de cette dernière. Plus spécifiquement, l'invention concerne une structure antireflet qui peut être facilement produite en série à faible coût. La structure antireflet présente une surface qui est pourvue d'un système antireflet destiné à supprimer la réflexion de lumire incidente, une pluralité de parties saillantes fines étant formée sur ladite surface. Ladite structure antireflet est caractérisée en ce que la forme inversée selon laquelle les creux et les parties saillantes du système antireflet sont inversés est généralement identique à la forme du système antireflet.
PCT/JP2007/063242 2006-06-30 2007-07-02 Structure antireflet et procédé de production de cette dernière WO2008001935A1 (fr)

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JP2010021202A (ja) * 2008-07-08 2010-01-28 Ushio Inc 発光装置
JP2010021268A (ja) * 2008-07-09 2010-01-28 Ushio Inc 発光装置
WO2012173258A1 (fr) * 2011-06-17 2012-12-20 三菱レイヨン株式会社 Moule présentant une structure de surface irrégulière, article optique, procédé de fabrication de celui-ci, matière de base transparente pour corps à émission par la surface et corps à émission par la surface

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JP2005335379A (ja) * 2004-04-27 2005-12-08 Matsushita Electric Ind Co Ltd 接触検出センサ及び接触検出方法
JP2006130841A (ja) * 2004-11-08 2006-05-25 Matsushita Electric Ind Co Ltd 反射防止構造体を備えた部材の製造方法

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JP2010021202A (ja) * 2008-07-08 2010-01-28 Ushio Inc 発光装置
JP2010021268A (ja) * 2008-07-09 2010-01-28 Ushio Inc 発光装置
WO2012173258A1 (fr) * 2011-06-17 2012-12-20 三菱レイヨン株式会社 Moule présentant une structure de surface irrégulière, article optique, procédé de fabrication de celui-ci, matière de base transparente pour corps à émission par la surface et corps à émission par la surface
JPWO2012173258A1 (ja) * 2011-06-17 2015-02-23 三菱レイヨン株式会社 凹凸構造を表面に有するモールド、光学物品、その製造方法、面発光体用透明基材および面発光体
US9696464B2 (en) 2011-06-17 2017-07-04 Mitsubishi Rayon Co., Ltd. Mold having an uneven surface structure, optical article, manufacturing method therefor, transparent substrate for surface light emitter and surface light emitter

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