WO2008001487A1 - corps microstructureL et son procédé de fabrication - Google Patents

corps microstructureL et son procédé de fabrication Download PDF

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Publication number
WO2008001487A1
WO2008001487A1 PCT/JP2007/000658 JP2007000658W WO2008001487A1 WO 2008001487 A1 WO2008001487 A1 WO 2008001487A1 JP 2007000658 W JP2007000658 W JP 2007000658W WO 2008001487 A1 WO2008001487 A1 WO 2008001487A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
microstructure
resist
protrusions
forming
Prior art date
Application number
PCT/JP2007/000658
Other languages
English (en)
Japanese (ja)
Inventor
Shinya Kunimatsu
Ryoji Kitada
Hiroshi Kitagaki
Hiroya Miyauchi
Original Assignee
Towa Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corporation filed Critical Towa Corporation
Publication of WO2008001487A1 publication Critical patent/WO2008001487A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a microstructure and a method of manufacturing the same.
  • the microstructure has a microstructure comprising one or more protrusions provided on a base member having a predetermined strength and a lower portion other than the one or more protrusions.
  • a mold having a microstructure will be described as an example of the background art.
  • a mold including at least a microstructure having a length of the order of submillimeter has been manufactured by the following method.
  • the first method is a method of machining (cutting or grinding) a steel-based material.
  • the second method is a method of electrical discharge machining a steel-based material.
  • a third method is a method using exposure-development, etching, and plating processes of a resist, which is known as a method for manufacturing a microstructure.
  • a method has been proposed in which a metallized layer having a fine structure is formed on a silicon substrate, and the metallized layer is peeled off from the silicon substrate to manufacture a mold composed of the metallized layer (for example, Patent Document 1 Paragraph [0 0 1 8], see Figure 1).
  • a silicon-containing resist is coated on a polymer (for example, polymethyl methacrylate; PMMA) coated on a silicon substrate. After that, the applied resist is exposed, developed and patterned.
  • PMMA polymethyl methacrylate
  • a fourth method is a method of using a process of exposure-development of a resist and plating, which is known as a method of manufacturing a microstructure.
  • the surface of the mold member is mirror-finished, a metallized portion having a fine structure is formed on the surface, and the tip of the metallized portion is polished or the like to a predetermined height (groove depth).
  • the desired pattern mold (nesting) is obtained with the final pattern having the same pattern finished precisely (for example, paragraph [0 0 2 5] _ [0 0 2 7] of Patent Document 2), Figure 1 See).
  • This method will be described below. First, the surface of mold parts made of high-speed tool steel (SKH) etc. is mirror-finished with high precision. Next, a resist or resist sheet is applied to or affixed to the mirror-finished surface.
  • a predetermined thickness of plating (which will be a preliminary mask pattern to be described later) is applied between the predetermined resist pattern (the portion where the resist is missing) obtained by patterning.
  • the resulting composite substrate is obtained.
  • the resist pattern in the composite substrate is stripped (removed) by, for example, a release agent, atsing or the like to obtain a mold having a preliminary mask pattern having a predetermined thickness.
  • the tip end portion of the plating portion having a predetermined thickness is machined (eg, polished) to a predetermined height (groove It is possible to obtain a desired molding die in which a final pattern having a depth) is precisely finished.
  • the mold needs to have a certain thickness, which causes a problem that it takes a long time for plating.
  • the demolding treatment when the demolding treatment is performed, there is a possibility that the fine structure of the mold consisting of the resin layer may be damaged or deformed.
  • the mold surface is used when the mold is used. There is a problem that high precision positioning is difficult. That is, it is difficult to position the mold surface with high accuracy in both the horizontal direction and the vertical direction.
  • the releasability in the portion where the resist pattern existed is poor.
  • the reason is as follows. In parts where the resist wedge pattern was present, no hard C r or N i etc. would be formed by plating, so in these parts a mold member made of high-speed tool steel etc. was exposed. Form the mold surface. Therefore, in the portion of the mold surface where the mold member is exposed, the adhesion to the cured resin or the like used in the resin molding becomes high (in other words, the releasability deteriorates).
  • Patent Document 1 Japanese Patent Application Laid-Open No. 8-23863 1 (Page 3, Fig. 1)
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2 0 2 0 2 5 0 3 7 (Page 4, Figure 1) Disclosure of the Invention
  • the problem to be solved by the present invention is that, first, a microstructure having a microstructure and having a desired strength can not be produced in a short time. Next, desired positioning when used with and having microstructures The point is that it is difficult to manufacture a microstructure with accuracy.
  • the second problem is that it is difficult to produce a fine structure having a fine structure and excellent in low adhesion and antifungal properties. Next, there is a possibility that peeling, damage, deformation, etc. may occur when manufacturing a microstructure.
  • the microstructure according to the present invention comprises one or more protrusions (10, 45, 58) and one or more protrusions (10, 45, 58)
  • a resist layer (16) is formed on the conductive layer (9), The resist layer (16) is exposed and developed to form a resist pattern (24) having a recess (22) and a protrusion (23), and the conductive layer (9) exposed in the recess (22)
  • the fine structure (1, 28, 48, 49, 62) is formed by removing the resist pattern (24, 53) by forming one or more protrusions (10, 45, 58) on top of the At the same time, at least a part of the one or more projections (10, 45, 58) in the thickness direction is formed by the electrode.
  • the microstructure according to the present invention in the above-mentioned microstructure (48, 49), at least one protrusion (45) is exposed in the recess (22). Also, it is characterized in that the conductive layer (9) is formed in the recess (40) formed by etching.
  • microstructure according to the present invention in the above-mentioned microstructure (62),
  • another resist layer (50) is formed on the one or more protrusions (10) and the resist ridge pattern (24), and another resist layer is formed.
  • (50) is exposed and developed to form another resist pattern (53) having an opening (52) on at least a portion of the desired protrusion (10) of the one or more protrusions (10).
  • a step (59) is a step (59).
  • the microstructure (1, 28, 48, 49, 62) is used in the above-mentioned microstructure (1, 28, 48, 49, 62).
  • the alignment mark (4) is formed on the non-contact part (3) which does not come in contact with other materials when the alignment mark (4) is formed by the resist layer (16) or another resist layer ( 50) It is characterized in that it is used for alignment at the time of exposure and alignment at the time of use of microstructures (1, 28, 48, 49, 62).
  • the microstructure in the above-mentioned microstructure (28), the microstructure may be formed by curing the filled fluid resin (31) or one or more protrusions (1) 0) and the lower part (11) are transferred to another material to form the mold surface of the mold (28) used in molding the molded article (37), and the microstructure
  • the surface (29) of (28) is characterized by being made of a material having low adhesion to the molded article (37).
  • a mold (28) having a microstructure is formed by resin-sealing chip-like electronic components (34) mounted on one surface of a substrate (33) having a plurality of through holes (35).
  • Product (37) which is a resin-sealed type used when molding a package, which is made of chip-like electronic components by curing of the flowable resin (31)
  • one or more of the protrusions (10, 45) are used.
  • , 58) is characterized in that it comprises a step of forming at least a part of the one or more protrusions (10, 45, 58) in the thickness direction by means of an electrode.
  • a recess is provided in the method of manufacturing a microstructure (48, 49) described above.
  • the recess (40) is formed by etching at least the conductive layer (9) exposed.
  • one or more of the plurality of protrusions may be formed after the step of forming the one or more protrusions (10).
  • the conductive layer (9) is formed on the base member (2) having a predetermined strength, and the conductive layer (9) is formed by plating a plurality of projections (10, 45, 58). Therefore, a plurality of bumps may be formed on the base member (2) having a predetermined strength.
  • a microstructure (10, 45, 58) is formed, and a microstructure having a large strength (compared to a mold made of the plated layer manufactured by peeling the plating layer from the silicon substrate) ( The result is 1, 28, 48, 49, 62).
  • the base member (2) is not exposed on the mold surface of the completed microstructure (1, 28, 48, 49, 62), the base member (2) is excellent even when it is made of a steel-based material. A fine structure (1, 28, 48, 49, 62) having a mildew resistance is obtained.
  • the resist layer (16) on the conductive layer (9) is exposed and developed to form a resist pattern (24) having a recess (22), and 22) to form one or more protrusions (10, 45, 58) on the conductive layer (9) exposed in step 22), and removing the resist pattern (24, 53) to obtain a microstructure (1, 28). , 48, 49, 62) are formed.
  • a microstructure (1, 28, 48, 49, 62) having excellent dimensional accuracy in a plane can be obtained.
  • the one or more protrusions (10, 45, 58) in the thickness direction is formed by the electrode, the one or more protrusions (10, 45) having a height and a large aspect ratio , 58) are formed in a short time (1, 28, 48, 49, 62).
  • one or more projections (45) are formed by plating at least in the depressions (40) formed by etching the conductive layer (9), and At least a part of the plurality of protrusions (45) in the thickness direction is formed by the electrode.
  • the bottom of the one or more projections (45) bites into at least the conductive layer (9). Therefore, the adhesion between the base member (2) and the plurality of protuberances (45) is improved by the so-called anchor effect (the anchoring effect).
  • Another resist pattern (53) having an opening (52) is formed by exposure 'development on at least a part of the desired protrusions (10) among the one or more protrusions (10). Then, by forming a columnar metal (55) by an electric wire at the opening (52), one or more higher projections (58) including the desired projection (10) and the columnar metal (55) are formed. A step (59) is formed at the boundary between the desired protrusion (10) and the columnar metal (55). As a result, there is formed a step (59), and a microstructure having one or more higher projections (58) with excellent dimensional accuracy in a plane can be obtained.
  • the alignment mark (4) formed on the non-contact portion (3) of the surface of the microstructure (1, 28, 48, 49, 62) is a resist wedge layer. Used for alignment when exposing (1 6) or another resist layer (50) and for aligning when fine structures (1, 28, 48, 49, 62) are used .
  • the dimensional accuracy between the alignment mark (4) and the microstructure (12, 47, 61) is improved, and the microstructure When (1, 28, 48, 49, 62) is used, the dimensional accuracy with the object becomes better.
  • the microstructure (12, 47, 61) is formed on the mold surface of the mold (28), and the surface of the microstructure (1, 28, 48, 49, 62) is formed. (2 9) is made of a material having low adhesion to the molded article (37). As a result, in the fine structure (12, 47, 61) formed on the mold surface of the mold (28), the releasability between the molded article (37) and the mold (28) is improved.
  • the plurality of projections (10) are arranged to close the plurality of through holes (35), and each of the plurality of projections (10) is a substrate Prevent flowable resin (31) from flowing out to the other side (39) opposite to one side in (33). Accordingly, there is obtained a microstructure (28) having a microstructure (12), that is, a mold (28) having a microstructure (12) such that resin leakage on the other surface (39) of the substrate (33) is prevented.
  • FIG. 1 is a partial cross-sectional view showing a microstructure according to a first embodiment.
  • FIG. 2 shows a base member which is a base material of the microstructure according to Example 2, and Fig. 2 (2)-(4) is a process of forming a conductive layer on the surface of the base member.
  • FIG. 6 is a partial cross-sectional view showing, in order, each step from the step to the step of exposing the resist layer on the conductive layer.
  • FIG. 3 Fig. 3 (1)-(4) show the steps from forming the resist pattern on the conductive layer to forming the fine structure on the conductive layer to complete the fine structure.
  • FIG. 3 (1)-(4) show the steps from forming the resist pattern on the conductive layer to forming the fine structure on the conductive layer to complete the fine structure.
  • FIG. 4 is a partial cross-sectional view showing an example in which a mold composed of a microstructure according to the present invention is used.
  • FIGS. 5 (1) to 5 (3) show the steps from the step of forming a recess in the conductive layer to the step of peeling (removing) the resist pattern when manufacturing the microstructure according to Example 4.
  • FIG. 7 is a partial cross-sectional view of each of FIG.
  • FIG. 5 (4) is a partial cross-sectional view showing a modification of the microstructure according to example 4.
  • FIGS. 6 (1) to 6 (4) are partial cross-sectional views sequentially showing each step of manufacturing a microstructure according to Example 5.
  • Chip Chip-like electronic component
  • Resin sealing body (molded article)
  • a fine structure (48, 49) is provided with a fine structure (47, 49) having a plurality of protrusions (45) and a groove (46) consisting of lower portions (46) other than the plurality of protrusions (45).
  • a base member (2) having strength, a conductive layer (9) formed on a part of a surface (6) of the base member (2), and a plurality of protrusions formed by plating on the conductive layer (9) (45) and. And the conductive layer
  • a resist pattern (24) having recesses (22) is formed, and etching is performed at least in the recesses (22) in the recesses (22).
  • recesses (40) are further formed in the base member (2), a plurality of projections (45) are formed in the recesses (40), and the resist pattern (24) is removed.
  • a microstructure (48, 49) is formed.
  • it is formed by plating which causes thin deposition of metal layer (hereinafter referred to as “function plating” as appropriate).
  • the fourth layer (44) formed on the third layer (41) in each of the plurality of protrusions (45) is formed by an electrode.
  • Example 1 of the microstructure according to the present invention will be described with reference to FIG.
  • FIG. 1 is a partial cross-sectional view showing a microstructure according to this example. Note that any figure used in the following description is schematically drawn with omission or exaggeration, as appropriate, for the sake of easy understanding.
  • a microstructure as a mold used for molding a molded article will be described.
  • the molded articles referred to here include resin materials such as cured resin, translucent materials (translucent resin, glass etc.) and the like.
  • the mold composed of the microstructure according to the present embodiment is used when molding a molded article containing another material.
  • the other material referred to here is basically a material other than the material constituting the mold, and is, for example, a material made of a resin material such as a cured resin, a translucent material or the like.
  • one example of the molded article mentioned here is one containing a cured resin (other material) formed by curing the flowable resin (other material) in the cavity provided in the molding die.
  • other examples of the molded product mentioned here are molded (hot-embossed, nano-imprinted) by transferring the microstructure of the mold to a material (other material) such as a resin material or a translucent material. It is.
  • the mold in this case is sometimes called a "stamper". Further, in this example, a mold used when molding a molded article by curing the flowable resin in the cavity will be described unless otherwise specified.
  • the mold 1 comprising the microstructure according to the present embodiment includes a base member 2 having a predetermined strength, and a noncontacting portion 3 at the end of the base member 2. And an alignment mark 4 formed of a narrow groove having a predetermined shape (for example, a “cross shape” but not limited thereto).
  • the non-contact part 3 means a fluid resin which is an object when the mold 1 is used, a translucent material, etc., that is, a portion which can not contact any of other materials.
  • a first layer 7 and a second layer 8 each made of a conductor are sequentially formed on the surface 6 of the base member 2 so as to entirely cover the contact portion 5.
  • the contact portion 5 is a fluid resin which is an object when the mold 1 is used, a translucent material Etc., that is, parts that may come into contact with any of the other materials
  • the first layer 7 and the second layer 8 are respectively N i layers formed by plating, and collectively constitute the conductive layer 9.
  • a plurality of fine projections 10 are formed on the conductive layer 9. Between the projections 10, a portion (lower portion) having a narrow width and a low surface, ie, a groove 11 other than the projections 10 is formed.
  • the plurality of projections 10 and the plurality of grooves 11 together constitute a microstructure 12.
  • the protrusion 10 is formed of a third layer 13 formed sequentially on the conductive layer 9 and each made of a conductor and a fourth layer 14 having a thickness.
  • the third layer 13 and the fourth layer 14 are Ni layers formed by plating in a state in which the groove 11 is closed by a resist layer (described later).
  • the lowermost third layer 13 is plated with a functional plating (plating for thinly depositing a metal layer (specifically, a Ni layer) while activating the plating surface).
  • the fourth layer 14 which is a portion other than the lowermost layer is formed by an electric wire, respectively. Therefore, the fourth layer 14 which is a thick layer of the protrusion 10 is formed by the electrode. As a result, the thick portion in the fine structure 12 is formed by the electric wire. Therefore, the height of the protrusion 10 of the fine structure 12 can be increased in a short time.
  • Base member 2 having a predetermined strength will be described.
  • the “predetermined strength” mentioned above refers to the mechanical strength required for the mold 1, ie, the mechanical pressure applied to the mold 1 when the mold 1 is used. Say the degree of strength that can be achieved.
  • “mechanical pressure” is, for example, the following pressure.
  • a molded article is formed by transferring the microstructure 1 2 of the mold 1 to a resin material such as a cured resin or a translucent material, that is, mechanical added to the mold 1 by hot embossing or the like. It is a pressure.
  • the first to fourth layers 7, 8, 1 3, and 14 will be described.
  • the first layer 7 is an N i layer formed by functional plating
  • the second layer 8 is an N i layer formed for the purpose of thickening by sulfamic acid plating.
  • the third layer 13 is an Ni layer formed by functional plating in a state where the groove 11 is closed by a resist layer (described later).
  • the fourth layer 14 is formed by sulfamic acid plating in a state in which the groove 11 is closed by the resin wedge layer (described later), and has a thickness larger than that of the third layer 13. It is a thick Ni layer. Therefore, the conductive layer 9 and the protrusion 10 contain the common metal element N i.
  • the fourth layer 14 formed by the sulfamic acid plating corresponds to the layer formed by the electrode.
  • Ni is a material having low adhesion to a resin material such as a cured resin, which is a material constituting at least a part of a molded product, a light-transmissive material or the like.
  • low adhesion refers to “comparison between the adhesion between steel materials, cemented carbides, etc., which are conventional mold materials, and materials such as resin materials, translucent materials, etc. In this case, it means “low adhesion”.
  • the alignment mark 4 In the alignment mark 4, the dimensions (width, length) of the alignment mark 4 itself and the distance between the alignment marks 4 are previously processed with high accuracy.
  • the alignment mark 4 functions as a reference for alignment both in the step of forming the microstructure 12 in the base member 2 and in the step of manufacturing a molded product using the completed mold 1. .
  • a fine structure 12 is formed, which is mainly formed by an electric wire through and has a protrusion 10 consisting of an N i layer.
  • the mold consisting of the plating layer manufactured by peeling the plating layer from the silicon substrate (microstructure Microstructures with greater strength are obtained compared to the body).
  • the conductive layer 9 is formed on the base member 2 by plating, and the protrusions 10 are formed sequentially by mainly using an electrode, so that a microstructure having high strength can be obtained in a short time.
  • a structure (mold 1) is obtained.
  • the first layer 7 which is a layer in contact with the base member 2 in the conductive layer 9 and the lowermost layer in the protrusion 10 are conductive.
  • the third layer 13 which is a layer in contact with the layer 9 is a Ni layer formed by functional plating.
  • this function plating has the purpose of improving the adhesion between the Ni layer formed by the plating and the metal layer in contact therewith.
  • this function plating has the purpose of improving the covering power of the Ni layer formed by the plating.
  • the adhesion between the base member 2 and the second layer 8 through the first layer 7 and the second through the third layer 13 The adhesion between the layer 8 and the fourth layer 14 is improved. Therefore, a microstructure (molding die 1) having excellent adhesion between the base member 2, the conductive layer 9, and the microstructure 12 can be obtained.
  • the step of forming the microstructure 12 in the base member 2 and in the step of using the finished microstructure ie, the step of using the mold 1 to produce a molded article
  • Act as a reference for the dimensional accuracy between the alignment mark 4 and the microstructure 12 in the microstructure (molding die 1) is improved, and the dimension between the microstructure 12 of the molding die 1 and the molded article is improved.
  • Legal accuracy will be good. Therefore, good dimensional accuracy can be obtained both in the finished fine structure, the mold 1 which is a finished microstructure, and in the resulting product manufactured using this, ie, the molded product.
  • the conductive layer 9 and the projections 10 are formed of Ni, but the invention is not limited thereto, and the possibility of contact of the microstructures is also possible.
  • the type of metal can be changed according to the characteristics of a given substance. For example, when a microstructure is used as a mold for transferring a microstructure to a glass, P t (platinum) forms at least a second layer 8 of the conductive layer 9, P t ⁇
  • the protrusion 10 may be formed by R e (platinum, rhenium). As a result, a mold for hot embossing (nano imprinting) with excellent mold releasability to glass can be obtained.
  • the conductive layer 9 and the protrusion 10 contain the common metal element N i (or P t). Not limited to this, depending on the combination of the metal constituting the conductive layer 9 and the protrusion 10, the conductive layer 9 and the protrusion 10 may not need to have a common metal element.
  • the following materials can be used as materials for forming the conductive layer 9 and the protrusions 10. First, as single metal plating, Cu (copper), Cr (chrome), Z n (zinc), Sn (tin), P b (lead), Au (gold), Ag (silver), etc. Can be used.
  • alloy plating use Cu Z Z n, C u-S n, P b-S n, S n-Z n, Z n-N i, Fe (iron) and Ni etc. Can.
  • dispersion (composite) plating materials such as nickel-alumina, silicon carbide can be used. Among these, suitable materials are selected according to the characteristics of the substance with which the microstructure (mold 1) contacts, the adhesion required between the base member 2 and the conductive layer 9 and the microstructure 12 and the like. Choose.
  • the conductive layer 9 may be formed of one layer.
  • the conductive layer 9 is formed by functional plating or ordinary plating (for example, sulfamic acid plating etc.), and the third layer 13 is formed by functional plating, and thereafter, it is electrically The fourth layer 14 will be formed.
  • the fine structure 12 may have the following structure. that is, A third layer 13 is formed on the conductive layer 9 by functional plating, another conductive layer is formed thereon by plating, and a thick conductive layer is formed on the conductive layer by an electrode. It is a laminated structure in which four layers (corresponding to fourteen layers) are formed. Furthermore
  • the conductive layer may be formed by functional plating between the conductive layer formed by other plating and the conductive layer formed by the electrode.
  • the conductive layer 9 may be formed using a known film forming method other than plating. As a well-known film-forming method, vapor deposition, sputtering, C V D, etc. may be mentioned. Here, the material constituting the conductive layer 9 may contain at least one of a metal-based material and a carbon-based material.
  • the second layer 8 and the fourth layer 14 may be formed using metals other than Ni, respectively.
  • the first layer 7 which is the base layer of the second layer 8 and the third layer 13 which is the base layer of the fourth layer 14 are each provided with a functional Ni layer. It can be formed as Furthermore, the first layer 7 and the third layer 13 may be formed of a suitable metal other than Ni, depending on the function. As a result, the adhesion between the base member 2 and the second layer 8 is improved through the first layer 7, and the second layer 8 and the fourth layer are increased through the third layer 13. Adhesiveness with 14 improves.
  • the base member 2 is made of a metal material such as a steel-based material
  • the base member 2 may be made of a nonconductive material having a predetermined strength.
  • the non-conductive material for example, ceramics, glass, engineering plastics, etc. can be used.
  • Example 2 of the microstructure (the mold 1 of FIG. 1) according to the present invention and the method of manufacturing the same will be described with reference to FIGS.
  • Figure 2 (1) shows the base member which is the base material of the minute structure which relates to this execution example
  • Figure 2 (2) _ (4) is the base member
  • FIG. 16 is a partial cross-sectional view sequentially showing each step from the step of forming a conductive layer on the surface of the step to the step of exposing a resist layer on the conductive layer.
  • Fig. 3 (1) _ (4) sequentially shows each process from forming a resist pattern on the conductive layer to forming a microstructure on the conductive layer to complete the microstructure.
  • a base member 2 made of a steel material, a cemented carbide, a metal material such as aluminum, and having a predetermined strength is prepared, and is opposed to the surface 6
  • the surface 6 is previously polished on the basis of a reference surface (not shown; located on the lower side in the figure) which is a plane substantially parallel to this. Thereby, the parallelism between the reference surface and the surface 6 can be improved.
  • a registration mark 4 having a “X” shape is formed in advance using a slicer or the like. Here, machining is performed so that the dimensions (width, length) of the alignment mark 4 itself and the distance between the alignment mark 4 become high precision. Thereafter, the surface 6 is washed.
  • a masking tape 15 is attached so as to cover the alignment marks 4 in the non-contact portion 3 and their surroundings.
  • the functional plating forms a first layer 7 of Ni layer.
  • a second layer 8 made of Ni layer is formed on the first layer 7 by sulfamic acid plating.
  • the first layer 7 and the second layer 8 each consisting of a Ni layer formed by plating together constitute a conductive layer 9.
  • the first layer 7 is formed by functional plating to remove deposits (soils) such as oil adhering to the surface 6 and to be replaced with Ni. Therefore, the adhesion between the base member 2 and the second layer 8 through the first layer 7 is improved.
  • functional plating is applied for a short time using special operating conditions or bath composition.
  • a resist wedge layer 16 composed of a positive type photoresist is formed on the conductive layer 9. .
  • a film resist which has been formed in a film form, is attached onto the conductive layer 9 so that no bubbles are generated.
  • a roll coater may be used with the masking tape 15 attached, or a spin coater may be used depending on the shape and size of the base member 2.
  • a photomask 17 is directly disposed on the resist layer 16.
  • a predetermined light shielding pattern 18, which is a black portion, and an alignment pattern 19 at a position corresponding to the alignment mark 4 of the base member 2 are formed on the lower surface of the photomask 17.
  • the photomask 17 use the alignment pattern 19 and the alignment mark 4 on the surface 6 of the base member 2 using the alignment optical system (not shown) of the exposure machine. Align horizontally and vertically (Z direction).
  • the resist layer 16 is irradiated with ultraviolet light 20 through a photomask 17 using a light exposure machine to expose the resist layer 16 (contact exposure).
  • the irradiated portion of the resist layer 16 is decomposed to change the irradiated portion to the soluble portion 21.
  • the soluble portion 21 is soluble in a predetermined developer.
  • ultraviolet rays 20 or X-rays can be used as light rays for exposure.
  • the U V — L I G A process using ultraviolet light 20 is adopted. This reduces the cost for manufacturing the mold 1. Note that, depending on the degree of fineness required for the fine structure 12, it is possible to adopt an X-ray single LIGA process.
  • the resist layer 16 exposed on the base member 2 is developed using a predetermined developer.
  • the concave portion 22 formed by melting the soluble portion 21 of FIG. 2 (4) in the developer and the remaining resist layer 16 (FIG. And a convex portion 23 formed of the conductive layer 9 are formed on the conductive layer 9.
  • the recess 22 and the protrusion 23 together constitute a resist pattern 24.
  • a masking tape 25 is applied so as to cover the alignment marks 4 in the non-contact part 3 and their surroundings.
  • a third layer 13 consisting of a Ni layer is formed by functional plating on the base member 2 on which the resist pattern 24 is formed.
  • a thick layer 26 consisting of a Ni layer is formed on the third layer 13 by sulfamic acid plating.
  • the formation of the thick layer 26 by the sulfamic acid plating corresponds to the formation by the electrode.
  • the third layer 13 consisting of Ni layer formed by plating in the recess 2 2 (refer to FIG. 3 (1)) and the thick layer 26 together constitute a columnar metal 27.
  • functional plating is applied for a short time using special operating conditions or bath composition.
  • the surface of the conductive layer 9 is activated, and residues of the resist layer 16 (see FIG. 2 (4)) on the surface, etc. The deposits (dirt) are removed and replaced with Ni.
  • the adhesion between the conductive layer 9 (see FIG. 3 (1)) and the thick layer 26 via the third layer 13 is improved.
  • the planar shape of the columnar metal 27 may be formed into a polygon other than a square, a circle, an ellipse, or the like. Can be changed regularly or irregularly.
  • the top portion of the thick layer 26 shown in FIG. 3 (2) ie, the columnar metal 27. Polish the top.
  • the tops of the columnar metals 27 are polished to form a plurality of protrusions 10 each having a constant height.
  • the term “grinding” as used herein means processing to lower the top of the columnar metal 27 in a flat state, and also includes grinding, lapping, grinding, grinding, and the like.
  • the columnar metal 2 7 is referred to a reference surface (not shown; located on the lower side in the drawing) which is a surface opposite to the surface 6 (see FIG. 2 (1)) of the base member 2.
  • the top of the It is preferable to polish the top of the. Thereby, the parallelism between the reference surface, the surface 6 and the top surface of the protrusion 10 can be improved.
  • only the tops of the columnar metals 27 may be polished to make their tops constant height, and the tops of the columnar metals 27 and the upper surfaces of the protrusions 23 of the resist pattern 24 may be polished together. They may be in the same plane (so-called flush).
  • the thick layer 26 whose top is polished corresponds to the fourth layer 14.
  • the resist pattern 2 4 (see FIG. 3 (3)) is peeled off (removed) from the base member 2 on which the conductive layer 9 and the plurality of protrusions 10 are formed. ).
  • the mold 1 made of a microstructure is cleaned. This completes the microstructure (mold 1) shown in FIG.
  • the first method is 0 2 (oxygen) atsing.
  • the second method is to apply ultrasonic vibration when cleaning the microstructure using a cleaning solution such as acetone.
  • a third method is to remove resist residue by functional plating to activate the surface of the microstructure and to actively release air bubbles.
  • a reference surface (not shown; located on the lower side in the drawing) which is a surface facing the surface 6 of the base member 2 and an alignment mark 4 formed on the non-contact portion 3 at the end of the surface 6 Produce a fine structure based on the standard .
  • a microstructure (mold 1) having good dimensional accuracy as follows:
  • the restriction on the shape of the protrusion 10 is reduced as compared with the conventional technique of forming a fine structure by cutting, grinding, electric discharge machining or the like.
  • a large number of projections 10 having a large height and a high aspect ratio can be formed in a short time.
  • a microstructure (mold 1) having the large number of projections 10 can be manufactured in a short time.
  • the first layer 7 of the conductive layer 9 and the third layer 13 of the columnar metal 27 are formed by functional plating, respectively.
  • the thick layer 26 of the columnar metal 27 is formed by the electrode on the third layer 13 and the top surface of the thick layer 26 is polished in a state where the resist pattern 24 is formed.
  • a plurality of projections 10 Therefore, a fine structure having a plurality of projections 10 having a plurality of projections 10, a good adhesion between the conductive layer 9 and the base member 2, and a high dimensional accuracy in the height direction (molding die 1) Can be manufactured.
  • the top surface of the thick layer 26 is polished.
  • a microstructure 12 is formed on the base member 2 having a predetermined strength by plating including an electrode.
  • a microstructure having excellent strength as compared with the prior art in which the plating layer is peeled off from the master pattern to create a mold consisting of the plating layer (molding die 1 Can be manufactured in a short time.
  • the occurrence of peeling, damage, deformation, etc. in the fine structure 12 is prevented. be able to.
  • the Ni layer is formed on the entire surface of the contact portion 5 (see FIG. 1) which is a portion in contact with the flowable resin or the like. By forming, it is possible to manufacture a microstructure (mold 1) having excellent low adhesion and anti-mold properties.
  • the use of the UV-LIGA process can reduce the cost associated with manufacturing equipment.
  • a microstructure (mold 1) having a microstructure 12 with good dimensional accuracy and excellent adhesion to the base member 2 is manufactured at low cost. can do.
  • a resist layer 16 made of a positive type photoresist was used.
  • the present invention is not limited to this, and a combination of a negative photoresist and a photo mask having a pattern obtained by inverting the light shielding pattern 18 of the photo mask 17 can also be used.
  • a plurality of protrusions 10 having a substantially tapered (trapezoidal) cross-sectional shape can also be formed.
  • an appropriate photo resist, and a mask having a pattern corresponding to the photo resist move the photo mask minutely in the horizontal direction of FIG. 2 (4).
  • the contact exposure is performed in which the lower surface of the mask 17 and the upper surface of the resist wedge layer 16 are brought into close contact and exposed.
  • proximity exposure may be performed in which the distance between the lower surface of the photomask 17 and the upper surface of the resist layer 16 is maintained at about several tens / m.
  • the upper surface of the resist layer 16 and the surface of the noncontact portion 3 of the surface 6 of the base member 2 be located at substantially the same vertical direction (Z direction).
  • the non-contact portion 3 of the portion other than the periphery of the alignment mark 4 and the whole of the contact portion 5 are previously cut by a depth approximately equal to the thickness of the resist layer 16 It is preferable to add it.
  • This processing can be done by machining (for example, by grinding after cutting).
  • both of the alignment pattern 19 provided on the lower surface of the photomask 17 and the alignment mark 4 on the surface of the non-contact portion 3 are of the alignment optical system (not shown). It is possible to locate within the depth of focus.
  • the alignment in the horizontal direction (XY direction) of the base member 2 and the photomask 17 can be performed with high accuracy.
  • alignment in the vertical direction (Z direction) in other words, focusing when exposure is performed It can be done with high accuracy.
  • the alignment mark 4 can be formed on another member.
  • the surfaces of the other member and the base member 2 may be machined.
  • the portion other than the periphery of the alignment mark 4 may be previously dug to a depth substantially equal to the thickness of the resist layer 16.
  • the separate member may be made of a non-conductive material. According to this configuration, it is not necessary to apply the masking tape 15, and the conductive layer 9 can be formed on the entire surface 6 of the base member 2.
  • the alignment mark 4 can be formed at the end of the base member 2. Furthermore, in this case, as described above, the portion other than the periphery of the alignment mark 4 may be previously dug to a depth substantially equal to the thickness of the resist layer 16. According to this configuration, the step of providing a separate member at the end of the base member 2 can be omitted by using the integral base member 2.
  • the columnar metal is formed in the state where the resist pattern 24 is formed.
  • polishing is not always necessary. The same is true for the other embodiments, as it is not always necessary to polish the top of the columnar metal.
  • FIG. 4 is a partial cross-sectional view showing an example in which a mold comprising the microstructure according to the present invention is used. In FIG. 4, the detailed structure as a fine structure is not shown.
  • a lower structure 28 which is a microstructure and corresponds to the mold 1 of FIG. 1 has a plurality of projections 10 and a groove 11 between the plurality of projections 10. It has a fine structure 12.
  • the mold surface of the lower mold 28, that is, the surface 2 9 shown in FIG. 4 is another material other than the material constituting the lower mold 28 (for example, a resin material such as a cured resin, a translucent material Etc.) is made of a material (eg, N.sub.i) having low adhesion.
  • An upper die 30 is disposed opposite to the upper portion of the lower die 28 and the upper die 30 is provided with a cavity 32 which is a space filled with the flowable resin 31. .
  • a substrate 33 consisting of a lead frame is mounted on the lower mold 28 and a chip-like electronic component such as a semiconductor chip, ie, a chip 34, is mounted on the upper surface of the substrate 33.
  • the substrate 33 is provided with a plurality of through holes 35.
  • the substrate 33 is placed on the lower mold 28.
  • the substrate 33 is aligned with the lower mold 28 so that the plurality of through holes 35 are closed by the plurality of projections 10 of the lower mold 28.
  • the alignment mark 4 shown in FIG. Not shown is used.
  • the plurality of projections 10 shown in FIG. 4 are formed in portions which may come in contact with the flowable resin 31, ie, the contact portions 5 (see also FIG. 1).
  • the alignment mark (not shown) is for the flowable resin 31 It is formed in the part where there is no possibility of contact, ie non-contact part 3 (see also FIG. 1). Then, as described in the second embodiment, in the step of exposing the resist layer 16, the alignment mark 4 is used when aligning the photomask 17 and the base member 2 (see FIG. 2). (See 4)). Therefore, the alignment mark 4 shown in FIG. 1 _ FIG. 3 is a process in which the resist layer 16 is exposed (see FIG. 2 (4)) and in which the fine structure (lower mold 28) is used. Both are used respectively.
  • a molded article is obtained by resin-sealing the chip 34 on the substrate 33 by resin foam molding using a mold (lower mold 28) comprising the microstructure according to the present invention.
  • a mold lower mold 28
  • the flowability of the thermosetting resin such as epoxy resin is achieved by the plunger (not shown). Press the resin 31 to fill the cavity.
  • the flowable resin 31 is cured to form a cured resin 36.
  • the resin sealing body 37 including the substrate 33, the chip 34 and the cured resin 36 is completed.
  • both the fluid resin 31 and the cured resin 36 obtained by curing the resin are contained in at least a part of the molded resin article 3 7. These correspond to materials other than the materials that make up the mold, that is, other materials.
  • the plurality of through holes 3 possessed by the substrate 3 3 with respect to the plurality of protrusions 10 possessed by the lower mold 2 8 Use the alignment mark 4 shown in Figure 1 (not shown in Figure 4) when aligning 5 each.
  • the alignment mark (not shown in FIG. 4) and the plurality of protrusions 10 are formed with high dimensional accuracy in the horizontal direction.
  • the plurality of through holes 35 can be aligned with high accuracy with respect to the plurality of projections 10 in the horizontal direction. it can.
  • the plurality of projections 10 have a uniform height.
  • the flowability resin 31 is filled in the cavity 32 with the plurality of through holes 35 completely blocked by the plurality of projections 10.
  • the plurality of protrusions 10 Only the vicinity of the outer edge of the portion (terminal) of the substrate 33 sandwiched by the through holes 35 is supported by the plurality of protrusions 10.
  • the contact pressure is increased at the supported portion of the terminal, so that the leakage of the flowable resin 31 to the lower surface 39 of the substrate 33 is prevented.
  • the surface 29 of the lower mold 28 is made of a material having low adhesion to the material forming at least a part of the resin sealing body 37.
  • the molding die 2 8 made of the microstructure according to the present example As described above, according to the molding die 2 8 made of the microstructure according to the present example, the leakage of the flowable resin 31 to the lower surface 39 of the substrate 33 is prevented. Therefore, since the leaked flowable resin 31 is cured to prevent the formation of resin burrs, the yield in manufacturing the package and the quality of the package are improved. In addition, the releasability between the resin sealing body 37 and the molding die 28 is improved.
  • the microstructure according to the present invention can be applied.
  • the microstructure according to the present invention can be applied to resin molding other than resin sealing, as long as the purpose is to close the through hole of the member to be inserted into the molded body.
  • Example 4 relating to a microstructure according to the present invention and a method of manufacturing the same will be described with reference to FIGS. 5 (1) to (3).
  • 5 (1) to 5 (3) show each process from the process of forming the recess in the conductive layer to the process of removing (removing) the resist pattern in manufacturing the microstructure according to this example. Each is a partial sectional view shown.
  • the features of the microstructure according to the present embodiment are: between the plurality of protrusions and the base member Adhesion is better than the microstructure shown in FIG. This feature is obtained by the so-called anchor effect (casting effect).
  • the method of manufacturing a microstructure according to the present invention is the same as that of Example 2 up to the state shown in FIG. 3 (1). Then, from this state, as shown in FIG. 5 (1), a groove-like recess 40 is formed in the conductive layer 9 exposed in the recess 22 of the resist pattern 24 by etching.
  • etching any one that can remove the conductive layer 9 may be used, and for example, electrolytic etching, wet etching, dry etching or the like can be used.
  • the recess 40 may be formed only in the second layer 8 as shown in FIG. 5 (1), or may be formed over both the second layer 8 and the first layer 7. In the usual case, as shown in FIG. 5 (1), the recessed portion 40 has a tapered cross-sectional shape that spreads upward by being side-etched during etching.
  • the third layer 41 made of Ni layer is formed by functional plating in the recess 40, and thereafter, the third layer 41 of the third layer 41 is formed.
  • a thick layer 42 of Ni layer is formed on top by sulfamic acid plating. This process is the same as the process shown in Fig. 3 (2).
  • the third layer 41 made of Ni layer and the thick layer 42 which are respectively formed by plating in the recess 22 (see FIG. 5 (1)), together form a columnar metal 43.
  • the formation of the thick layer 42 by the sulfamic acid plating corresponds to the formation by the electrode.
  • the top of the thick layer 42 ie, the top of the columnar metal 43 is polished .
  • a plurality of projections 45 each having a constant height, consisting of the third layer 41 and the fourth layer 44 are formed, and the resist pattern 24 is peeled off (removed) from the base member 2 and thereafter Do the cleaning.
  • a microstructure having a microstructure 47 composed of a plurality of projections 45 and grooves 46, ie, a mold 48 is completed.
  • the third layer 41 which is the lowermost layer of the plurality of protrusions 45, functions in the recess 40 formed by the etching of the conductive layer 9. It is formed by
  • a fourth layer 44 which is a portion other than the third layer 41 in the plurality of protrusions 45 is formed on the third layer 41 by an electrode.
  • the bottoms of the plurality of protrusions 45 are formed so as to bite into the conductive layer 9 in the depressions 40 formed in the conductive layer 9. Therefore, in addition to the effect of improving the adhesion by the third layer 41, which is a Ni layer formed by functional plating, the base member 2 and the plurality of protrusions 45 by the so-called anchor effect (the anchoring effect). The adhesion between the two improves when.
  • FIG. 5 (4) is a partial cross-sectional view showing a modification of the microstructure according to Example 4.
  • the illustrated ⁇ bump portion 40 is formed deeper to form a recessed portion 40 across the base member 2 as well as the conductive layer 9. ing.
  • the microstructure shown in FIG. 5 (4), ie, the mold 4 9 is completed.
  • the base member 2 and the plurality of protrusions are The adhesion between 4 and 5 is further improved.
  • the first reason is that, in the mold 49, the plurality of projections 45 not only bite into the conductive layer 9, but also bit deeply into the base member 2.
  • the portion biting into the base member 2 is formed by the third layer 41 formed by the functional plating and the fourth layer formed by the electrode plate. It means that both layers are 4 and 4.
  • the contact area between the base member 2 and the plurality of protrusions 45 is larger than that of the mold 48 shown in FIG. 5 (3). . Therefore, according to this modification, a microstructure having an improved adhesion between the base member 2 and the plurality of protrusions 45 can be obtained, That is, a mold 4 9 is obtained.
  • the microstructures according to the present embodiment and the modification thereof are also applied to the molding die shown in FIG.
  • the mold is a mold for preventing leakage of the flowable resin, and is represented by a mold for resin sealing.
  • anisotropic etching may be used when forming the recess 40.
  • the recess 40 has a cross-sectional shape of substantially the same size in the vertical direction.
  • the adhesion between the base member 2 and the plurality of projections 45 is further improved by the anchor effect (the anchoring effect).
  • the concave portion 40 having a tapered cross-sectional shape that spreads upward is formed by side etching. It is preferable to do this.
  • FIGS. 6 (1) to 6 (4) are partial cross-sectional views sequentially showing each step of manufacturing the microstructure according to this example.
  • the feature of the microstructure according to the present embodiment is that at least a part of the plurality of protrusions has a structure having one or more steps, that is, a multistage structure.
  • the method for producing a microstructure according to the present invention is the same as that of Example 2 up to the state shown in FIG. 3 (3). Then, from this state, as shown in FIG. 6 (1), in other words, a plurality of projections 10 and a resist pattern (see FIG. 3 (FIG. Another resist layer 50 is formed on the conductive layer 9 via the convex portion 23 of the resist pattern 24 of 1). The convex portion 23 and another resist layer 50 together constitute the entire resist layer 51.
  • This process is basically the same as the process shown in Fig. 2 (3).
  • FIG. 6 (2) another resist layer 50 is exposed using a photo mask (not shown) and developed, and a desired protrusion of the plurality of protrusions 10 is obtained.
  • An opening 52 is formed on 0 (which may be part of a plurality of projections 10 or all).
  • the openings 52 formed in another resist layer 50 are shown in FIG. This corresponds to the recess 22 of the resist pattern 24 shown in 1).
  • the entire resist pattern 54 consisting of the convex portion 23 of the resist pattern 24 and another resist pattern 53 is formed.
  • the area to be exposed may be the same area as the upper surface of the desired projection 10 or may be an area narrower than the upper surface.
  • sulfamic acid is plated on the fourth layer 14 in the desired projection 10 (see FIG. 6 (2)) in each opening 52.
  • a second thick layer 55 composed of an Ni layer is formed.
  • the fourth layer 14 formed of sulfamic acid and the second thick layer 55 together form a whole thick layer 56.
  • the top of the entire thick layer 56 ie, the top of the second thick layer 55, is polished.
  • a plurality of projections 5 8 (see FIG. 6 (4)), each of which has a constant height, is formed of the third layer 13, the fourth layer 14 and the fifth layer 57.
  • the fourth layer 14 and the second step in the desired protrusion 10 are formed.
  • a step 59 can be formed at the boundary with the thick layer 55.
  • the formation of the fourth layer 14 and the second thick layer 55 by the sulfamic acid plating, that is, the formation of the entire thick layer 56 corresponds to the formation of the electric layer.
  • the second thick layer 55 whose top is polished corresponds to the fifth layer 57.
  • the surface of the fourth layer 14 in each of the openings 52 is activated, and deposits (contamination) such as residue of another resist layer 50 on the surface are removed.
  • the Ni layer may be formed by functional plating on the fourth layer 14.
  • a second thick layer 55 is formed on the Ni layer by sulfamic acid plating.
  • another resist pattern 53 having an opening 52 is formed on at least a portion of the protrusions 10 by exposure ⁇ development.
  • a second step thick layer 55 is formed using an electrode at the opening 52, and if necessary, the upper surface of the second step thick layer 55 is polished, and thereafter the entire resist pattern is formed.
  • the step 59 is formed at the boundary between the plurality of protrusions 10 and the second thick layer 55.
  • a plurality of protrusions 58 have a protrusion with a step 59, a protrusion without a step 59 and a protrusion with a low height at the same time. It can be formed.
  • the light shielding pattern 1 8 (refer to FIG. 2 (4)) of the photomask 17
  • a microstructure having various fine dimensions and shapes can be obtained.
  • a mold 62 composed of such a microstructure is used for the production of a molded article.
  • the upper surface of the second thick layer 55 is polished if necessary from the state shown in FIG. 6 (3).
  • a third resist layer is formed on the entire resist pattern 54 and the polished second thick layer 55, and the third resist layer is exposed and developed to form an opening. Form.
  • the entire resist pattern 54 is removed. This makes it possible to manufacture a mold provided with a microstructure having two steps (in other words, a three-step structure). The same can be applied to a mold provided with a microstructure having a multistage structure of four or more stages.
  • the microstructure according to this example is also applied to the molding die shown in FIG.
  • the mold is a mold for preventing leakage of the flowable resin, and is typified by a mold for resin sealing.
  • the microstructures shown in Embodiments 1 to 4 are provided with a plurality of projections having a cross section close to a square, in other words, a plurality of projections having a small aspect ratio. It was Not limited to this, it is also possible to form a plurality of projections having a large aspect ratio by using a resist wedge layer having an appropriate thickness and a phonon mask having a light shielding pattern of an appropriate size.
  • a plurality of protrusions having a large aspect ratio can be formed as a whole. By these, it is possible to form a fine structure having an overall shape like a sword.
  • the present invention can also be applied to a fine structure having one protrusion and a portion other than the protrusion (a portion having a low surface, ie, a low portion).
  • a microstructure having one protrusion is used, for example, as a probe.
  • the present invention is not limited to the above-described embodiments, and any combination, modification, or selection may be made arbitrarily and appropriately as needed without departing from the spirit of the present invention. Can be adopted.

Abstract

La présente invention concerne un corps microstructurel qui comporte des microstructures, chacune ayant une résistance et une précision de positionnement souhaitées, et qui en outre présente une excellente adhérence et d'excellentes propriétés de résistance à la rouille. L'invention concerne une filière de moulage (1) (corps microstructurel) avec une microstructure (12) comportant de multiples projections (10), utilisée dans la production d'objets moulés au moyen du durcissement d'une résine fluide chargée ou au moyen du transfert d'une microstructure sur un matériau translucide. Ladite filière comprend un élément de base (2) ayant une résistance donnée ; une couche conductrice (9) formée par placage de Ni au niveau d'une partie de la surface de l'élément de base (2) ; et de multiples projections (10) formées par placage sur la couche conductrice (9) et contenant Ni qui est un élément métallique commun à la couche conductrice (9). Dans la couche conductrice (9), chacune parmi la première couche (7) en contact avec l'élément de base (2) et la troisième couche (13) formant la couche la plus basse des projections multiples (10) est formée par un placage fonctionnel. Une quatrième couche (14) étant une couche différente de la troisième couche (13) des multiples projections (10) est formée par électroformage.
PCT/JP2007/000658 2006-06-26 2007-06-20 corps microstructureL et son procédé de fabrication WO2008001487A1 (fr)

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