WO2007105820A1 - ガス溶解洗浄水の製造方法、製造装置及び洗浄装置 - Google Patents
ガス溶解洗浄水の製造方法、製造装置及び洗浄装置 Download PDFInfo
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- WO2007105820A1 WO2007105820A1 PCT/JP2007/055336 JP2007055336W WO2007105820A1 WO 2007105820 A1 WO2007105820 A1 WO 2007105820A1 JP 2007055336 W JP2007055336 W JP 2007055336W WO 2007105820 A1 WO2007105820 A1 WO 2007105820A1
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- gas
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- dissolved
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/70—Treatment of water, waste water, or sewage by reduction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F21/00—Dissolving
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0036—Flash degasification
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
- B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
- B01F23/231—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids by bubbling
- B01F23/23105—Arrangement or manipulation of the gas bubbling devices
- B01F23/2312—Diffusers
- B01F23/23124—Diffusers consisting of flexible porous or perforated material, e.g. fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
- B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
- B01F23/231—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids by bubbling
- B01F23/23105—Arrangement or manipulation of the gas bubbling devices
- B01F23/2312—Diffusers
- B01F23/23124—Diffusers consisting of flexible porous or perforated material, e.g. fabric
- B01F23/231244—Dissolving, hollow fiber membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
- B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B3/00—Hydrogen; Gaseous mixtures containing hydrogen; Separation of hydrogen from mixtures containing it; Purification of hydrogen
- C01B3/50—Separation of hydrogen or hydrogen containing gases from gaseous mixtures, e.g. purification
- C01B3/501—Separation of hydrogen or hydrogen containing gases from gaseous mixtures, e.g. purification by diffusion
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0052—Gas evolving or heat producing compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
- B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
- B01F23/237—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
- B01F23/2376—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media characterised by the gas being introduced
- B01F23/23764—Hydrogen
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2203/00—Integrated processes for the production of hydrogen or synthesis gas
- C01B2203/04—Integrated processes for the production of hydrogen or synthesis gas containing a purification step for the hydrogen or the synthesis gas
- C01B2203/0405—Purification by membrane separation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2203/00—Integrated processes for the production of hydrogen or synthesis gas
- C01B2203/04—Integrated processes for the production of hydrogen or synthesis gas containing a purification step for the hydrogen or the synthesis gas
- C01B2203/0465—Composition of the impurity
- C01B2203/0495—Composition of the impurity the impurity being water
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
- C02F1/444—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by ultrafiltration or microfiltration
Definitions
- This effort relates to the production and difficulty of gas melt water.
- this Tokuaki can produce water with a desired gas concentration and water without using a ⁇ shelf such as a vacuum pump.
- Water can be used for water and specific gas, and can be placed in a semiconductor such as silicon wafers for semiconductors, glass for flat panel displays, etc. that require high cleanliness. It can be related to gas dissolution and water production, gas production, gas dissolution, and installation using water. Background
- RC A ⁇ is used for heating and water supply (SPM) heated to 120 to 150 ° C, or for ammonia and peroxygen M water?
- SPM heating and water supply
- APM ammonia and peroxygen M water
- Warm liquid is heated to 60 to 80 ° C, or soot and peracid are heated to 60 to 80 ° C. Use »Yes.
- the cost of this high-concentration chrysanthemum night that explored the past is great, the amount of rinsing it, the cost of supersurgery, chemical vapors, and fresh air
- Various simple efforts have been made to reduce the cost of the preparation, such as the cost of the water, and the load on the water, such as a large amount of water, ffl, a large amount of chemicals, and emission of exhaust gas.
- the representative column is an ultrasonic cleaning simulation with water that dissolves a specific gas such as hydrogen.
- Dissolving a specific gas at a high concentration is the key point of this new level. Furthermore, in order to maintain a high level and a high level of stability, it is necessary to control the gas concentration below the high concentration or the saturation concentration in the field for f ⁇ . In addition, at the age when hydrogen is dissolved to a level higher than the hydrogen concentration, there is a risk that hydrogen will bubble into the system under the large armature. That force S is desirable. In response to such sickle needs, after removing the gas (mainly nitrogen) in the raw or 3 ⁇ 4 * by degassing treatment, supply the dissolved gas and gas in an amount less than the saturation concentration. A dissolving Sfi has been developed by the present inventors.
- the water-based super yarn fck for use and the amount of water that can be generated when ⁇ J is generated, can be used.
- ⁇ As a storage device for SifeK, it is possible to use Sui K as a storage device for electronic materials using water woven paper.
- Fok sealed water tank with mixed water, pump to send water to the tank, deaeration part to remove dredged gas, and hydrogen supplied from hydrogen supply part It has a solubilizing part that dissolves in the water after the aeration, a filter, and a circulation pipe that returns to the water tank through the use point, and circulates i ⁇ ⁇ to the use point to provide the required amount of water Thread ⁇ 1 ⁇ Water 3 ⁇ 4 ⁇ Super thread Yek placement of ifek has been proposed (Patent Document 2).
- the present invention makes it possible to produce gas water with a desired gas concentration without using an E «, such as a vacuum pump. It can be used for women's scrambles such as silicon wafers for the body, glass panels for flat panel boards, glass plates for flat panel displays, etc. that require a high degree of cleanliness. Is it possible to make the gas?
- the present inventors dissolved a specific gas in the raw material under a pressure exceeding the atmospheric pressure, and contained in the raw material other than the specific gas.
- the concentration of the specific gas is high, and the power i is not inclusive V, gas Melting angle? »Preparing water without using a vacuum pump or the like.
- the gas part ⁇ 3 ⁇ 4 device is a device that increases the gas dissolved water up to Etfi ⁇ (8) The gas melting angle described in (8)?
- Fig. 1 is the present invention
- W One of the implementations of the present invention 13 ⁇ 4 ⁇ 3 ⁇ 4
- One of the apparatus of the present invention :! 3 ⁇ 43 ⁇ 4 diagram
- Fig. 2 is another implementation of the method of the present invention and the apparatus of the present invention.
- the other H ⁇ : [ ⁇ chart, Fig. 3 is another chart of the implementation of the present invention method, chart of another embodiment of the apparatus of the present invention, F. ig. It is a process flow diagram of the trial placement used.
- reference numeral 1 is a gas dissolving device
- 2 is a gas partial removal device
- 3 is a gas square reed device
- 4 is a gas partial removal device
- 5 is a gas ⁇ device
- 6 is a gas partial removal device
- 7 is wisteria.
- Gas melting angle of the present invention I »The removal of water is the production of gas melting angle water in which a specific gas is dissolved in water. Gas dissolved water with a concentration equal to or higher than the solubility of the gas, and then remove the gas part by removing the gas dissolved water; In this effort, it is preferable to depressurize the dissolved water to around E and remove a part of the gas.
- Gas production capacity of the present invention »Water production is a gas dissolution device that dissolves a specific gas in water under pressure exceeding a large amount in a gas dissolution device that dissolves a specific gas in water» And a gas partial removal device that removes part of the soot gas by setting the gas dissolved water from the gas dissolving device to a pressure lower than the pressure at the time of gas dissolution.
- the gas partial removal apparatus is an apparatus that pours gas-dissolved water up to;) barley.
- the gas dissolved water in the caloric pressure state is large ⁇ 1 £ or a large difficulty, for example, the range of ⁇ 20% of large ffi Power S is preferable.
- the pressure is lower than the eaves when the eyes are connected to the piping of the factory and the like.
- the gas dissolving apparatus for dissolving a specific gas in water under a caloric pressure exceeding a large pressure
- water such as a gas »1 module, an ejector, a pump having a high gas melting angle function
- examples include gas generators.
- a gas dissolving device such as an ejector or a pump that can straighten water and gas.
- the gas partial device that evaporates the gas dissolved water from the gas dissolving device to a pressure lower than the pressure at the time of gas dissolution and removes a part of the soot gas. Moduyuno, gas-liquid concealment and the like.
- Fig. 1 is a process flow diagram showing the first aspect of the method of the present invention and the dislike of the apparatus of the present invention.
- the apparatus of the present invention comprises a gas dissolving device 1 for dissolving a specific gas in water under a pressure exceeding a large amount of E, and reducing the gas dissolved water from the gas dissolving device to a pressure lower than the pressure at the time of dissolving the gas.
- a gas partial removing device 2 for removing a part of the gas.
- a gas module is used as a gas partial unit, gas rapid water is introduced into the water phase of the gas knitted membrane module, and the compensation ⁇ of the gas transmembrane module is opened to the atmosphere.
- the raw material is sent to the water phase of the gas dissolving device, and the compensation gas is injected at a pressure exceeding the large E.
- the specific gas dissolves in water via the gas 3 ⁇ 4ii membrane.
- Gas repellent water flowing out from the gas dissolving device is sent to the water phase part of the gas partial removal device, and the pressure in the gas phase part is set to a pressure lower than the pressure at the time of gas dissolution. ⁇ A part of the gas is removed from the gas via the gas transduction.
- each crane 7. 6 mg / L , 04 0.4m gZL or ⁇ 1.
- ⁇ element nitrogen, soot, .i .rn, and noble gases.
- One of these specific gases can be used with insects, or two or more can be used in combination.
- a vacuum pump is required for the production of the gas melted angle separation water, and there is no risk of a fire due to the static electricity of the rotary part such as rotation and reciprocation. It can be applied to the production of water and waterfoil, »water production, and can be applied to the production of hydrogen dissolution especially *.
- the valve attached to the secondary side of the gas dissolving device is used to appropriately reduce the pressure of the gas partial removing device while maintaining the pressure of the gas dissolving device, to remove some of the soot gas,
- the gas melting angle is not included. 3 ⁇ 4f Water can be guided to the machine.
- gas-dissolved water does not contain bubbles even under a caloric pressure, even if it dissolves gases with a degree of saturation greater than 1. Also in this case, if the pressure is lowered after the pulp provided on the secondary side of the gas dissolving device, the gas force s bubbles corresponding to the knitting are separated and the gas-liquid component ⁇ can be applied.
- gas part ⁇ * device can be used as the gas part ⁇ * device.
- the gas module of this eye preferably has the power to open the joint of the parts to the atmosphere. If the gas melting angle is somewhat saturated, or water is required, the valve pressure can be adjusted to keep the gas pressure at a predetermined value when the valve is open. On the other hand, for example, by connecting the gas part of the eye to the joint part of the lit module of the eye, or the aspirator, etc. In this way, it is possible to promote the removal of the gas whose saturation degree exceeds 1.
- the device of the present invention can be a device in which a gas dissolving device and a gas partial device are alternately arranged in a difficult manner.
- Fig. 2 is a schematic diagram of another male of the present invention and another male of the present invention device.
- gas dissolving device 3 gas section A fraction removing device 4
- a gas dissolving device 5 and a gas partial removing device 6 are connected in this order, and the respective water phase portions are connected in series.
- the raw gas S is fed into the water phase part of the first gas dissolving device 3, and a specific gas is heated to 1 ⁇ at a pressure exceeding a large amount in the gas phase part and dissolved in water.
- Gas dissolved water flowing out from the first gas dissolving device is sent to the water phase part of the first gas partial removing device 4, where it is partly removed by the soot gas in the gas dissolving water.
- the Dissolved water flowing out from the first gas partial removal device is sent to the water phase of the second gas dissolution device 5, and is injected into the eye at a pressure exceeding a specific gas force S, and dissolves. .
- the gas-dissolved water flowing out from the second gas dissolving device is sent to the water phase portion of the second gas partial removing device 6, and ⁇ 3 ⁇ 4 of the gas in the gas dissolving water moves to the eye and is removed.
- the gas is dissolved in water under pressure to obtain a gas-dissolved water having a concentration higher than the solubility under the large ffi, and the gas-dissolved water is added at the next stage to remove the gas " ⁇ ".
- concentration of the specified gas melting angle I »water specific gas for example, 17.6 mg / L of nitrogen is dissolved at 25 ° C.
- the water that dissolves the specific gas under pressure can be used as the used gas-dissolving water.
- the used gas dissolution water is used to dissolve the specific gas under pressure, it is preferable to remove the contaminant I contained in the gas dissolution angle water.
- a self-contained self-pipe for returning the confirmed gas-melting angle water to the gas dissolving apparatus can be provided.
- Fig. 3 is another process flow diagram of the present invention; the other H3 ⁇ 4 of the last and the other apparatus of the present invention.
- the spent hydrogen melt water used in dredging machine 7 is returned to tank 9 via return pipe 8.
- the aquarium is provided with a pipe for supplying 7_ ⁇ , a pipe for supplying nitrogen to the space above the aquarium, and a pressure gauge for maintaining the space above the aquarium at a positive pressure.
- the water held in the aquarium is pumped out by the pump pump 11 and is collected by the female 12, and then the fine particles and the like obtained in S3 ⁇ 4f are removed in the filter unit 13. By providing a trapping filter in this position, dust from the pump can be removed.
- ⁇ Corresponding to the removed concentrated water can be leaked into the self-tube between the gas storage device and the gas dissolving device.
- ⁇ may be the front stage of the water tank or gas dissolution apparatus, etc. It can be placed anywhere in the system.
- the sickle has been shown as a illusion device, but a suitable decontamination device is used according to the contamination mist. be able to.
- a microfiltration (MF) device can be used instead of the recoil membrane device.
- the main purpose of the removal of fine particles is the iil ⁇ gX ⁇ f * dense filter, which has excellent accuracy and cleanliness for removing fine particles, and can be suitably used because it is extremely suitable. Also shelves dissolved gas, »water, dirt , As containing ions: ⁇ contains force, ⁇ 3 ⁇ 4% contains anion and silica: ⁇ contains cation-oil tower, and TOC contains TO C ⁇ Irradiated acid can be provided as a soil removal device.
- the water from which the fine particles have been removed is sent to the gas dissolving device 14 where it is dissolved in the hydrogen power S under a high caloric pressure.
- the hydrogen-dissolved water whose saturation exceeds 1 due to the dissolution of hydrogen is sent to the gas partial removal device 15, where the gas with a degree of saturation exceeding 1 is removed to dissolve in hydrogen and become water.
- Hydrogen melting angle? 3 ⁇ 4f Make water; gas partial evacuation equipment exhausts gas power containing a large amount of 7k s, so it is attached to the exhaust pipe with an oxidation square so that hydrogen can be turned into air. It is preferable to use water and avoid the dangers associated with hydrogen discharge.
- the removed exhaust gas passes through the exhaust gas treatment unit 16 and is treated with hydrogen power contained in the exhaust gas, and then released into the atmosphere or a duct provided in the factory.
- Hydrogen-dissolved conflict water is sent to machine 7 via gas tank and water pipe 17.
- the gas melt water piping is equipped with a pH meter of 18 8 S, and a signal is sent from the pH meter to the pump 19, and ammonia water is added to the water from the ammonia water tank 20. It is added, and the pH is increased.
- hydrogen melting angle I »Hydrogen concentration in water is comforted.
- a specific gas is dissolved in used gas I water, and the obtained specific gas dissolution »7 is supplied again to the dredger and converted to“ »”. If such a circulation shelf of water is repeated, the amount of brine rises. Therefore, in the present invention, it is preferable to arrange heat at an arbitrary position in the circulation system to suppress the rise of water. Usually, it is handed over to the room temperature key, but it can be stably put in the range of 40 to 50 ° cms.
- tek element and salt include elemental acid, sulfuric acid and other acids, chelating agents, and surfactants.
- the amount of the drug can be controlled according to the measured value by measuring the concentration of IJ or its equivalent, or it can be converted to the amount of nek ⁇ k.
- the chemical can be reduced to ⁇ feR by proportional control.
- the 7 element melting angle I » ⁇ water is circulated and used if only the amount of super ⁇ * equivalent to ⁇ removed from the jumping and lapping device is drowned. Therefore, the amount of supersurgery used for dredging can be greatly reduced. »The price returned from the machine to the tank Since the hydrogen remaining in the spent hydrogen melt is not removed by degassing, it is used as a part of the newly prepared hydrogen melt conflict water, so a relatively high concentration, for example, 3 ⁇ 4f Hydraulic power S ⁇ returned to ⁇ is saved while reducing the amount of hydrogen used for dredging and reducing the amount of hydrogen discharged. To reduce the danger.
- the apparatus of the present invention converts a specific gas under pressure exceeding the general view, to a gas dissolver in which a specific gas is dissolved, a scrambler using water, and a used gas melt angle conflict water discharged from m force.
- a gas dissolver in which a specific gas is dissolved
- a scrambler using water and a used gas melt angle conflict water discharged from m force.
- Gas partial removal device that removes " ⁇ " of gas and gas part ⁇ * Gas dissolution that dissolves a specific gas flowing out from the device.
- the used gas discharged from the dredger is dissolved.
- the water is circulated through the heat exchange and removal device.
- the heat and dirt removal device there is no particular restriction on the location where the heat and dirt removal device is installed.
- it can be placed between the dredger and the used gas dissolution, »water tank.
- you can ⁇ ei "between the used water melting angle ⁇ » ⁇ between the water tank and the gas dissolving device.
- heat exchange »and the fouling removal device isgiiiim.
- Fig. 4 is a process flow diagram of the equipment used.
- the water phase part of three gas 3 ⁇ 41 membrane modules [Celguard Co., Ltd., Liquicel, 4 inches] was connected to iS.
- the gas phase part of the first gas transmembrane module 2 2 can be opened to the atmosphere via the valve 2 3 and the mass flow controller. 1 [Yamatake Co., Ltd.] 2 4 via the hydrogen cylinder 2 Connected to 5 to supply a certain amount of hydrogen.
- the 7K element supply pipe was equipped with a pressure gauge 26, and a predetermined amount of hydrogen was supplied to the second gas module 28 by the mass flow controller [Yamatake Corporation] 27. Relief of the third gas 3 ⁇ 41 membrane module 29 was released to the atmosphere through the pipe 30 to remove more than the solubility below the large Mffi.
- the water phase of the first gas transmembrane module is connected to the feK via the water flow meter 3.1. Was fed at a flow rate of 10 LZ.
- the hydrogen concentration at the inlet of the second gas membrane module was measured with a hydrogen densitometer Record Ultra Analytics Japan Inc.] 32, and the hydrogen concentration at the outlet of the third gas membrane module was measured using a hydrogen concentration meter [hack Ultra Analytics Japan Ink] 33.
- the pressure in the aqueous phase of the third gas membrane 1 membrane module was measured with a pressure gauge 34.
- the second gas transmembrane module was dissolved with 1.6 mg / L of silicon, that is, hydrogen with a saturation degree of 1 was dissolved in water, and the degree of water was changed to 2.
- the water pressure at the outlet of the third gas 3 ⁇ 411 module was maintained at 0.2 MPa. Open the eyes of the first gas membrane module to the atmosphere, and the ultra-fine ifeK's gas is turned into the atmosphere, and the hydrogen concentration at the inlet of the second gas # 3 ⁇ 413 At / L, the hydrogen concentration at the outlet of the third gas 3 ⁇ 41 membrane module was 0.793 mg.
- the first gas 3 ⁇ 41 Hydrogen is fed into the eyes of the membrane module in the manner of pressurized irf ventilation, and the hydrogen concentration at the inlet of the second gas transmembrane module is 0.46mg / L.
- the concentration of ⁇ 7 at the outlet of the third gas module was 1.017mg / L.
- the hydrogen gas at the inlet of the second gas 3 ⁇ 4 ⁇ Muomoyuore? Is O. ZemgZL
- the dissolved hydrogen concentration at the outlet of the third gas 3 ⁇ 4i membrane module is 1.163 mg / L. .
- the third gas when the hydrogen concentration at the inlet of the third gas transmembrane module is Dim g / L and the gas above the solubility under the large ME is adjusted to a saturation level of 1 is obtained. If the dissolved hydrogen concentration at the outlet is D 2 mgZL, the following equation holds.
- the concentration of hydrogen at the inlet of the second gas module is Omg / L
- the concentration of ⁇ 7_ silicon at the inlet of the third gas 3 ⁇ 4 ⁇ membrane module is 1.6mgZL
- the calculated hydrogen concentration D 2 is l. SmgZL.
- the inlet of the 'Yu 7 iodine concentration of the second gas 3 ⁇ 4i membrane module 0.46MgZL is (0.46 +1.6) mg / L
- the calculated value of D 2 is (0.46 + 1.03mgZL.
- the hydrogen concentration at the inlet of the second gas 3 ⁇ 41 membrane module is 0.76 mg / L
- D 2 is (0.76 + 1.18mg / L.
- the same operation was repeated except that in the second gas membrane module, hydrogen having a saturation level of 2 was dissolved in zeta silicon 3.2 mgZL, that is, water, and the water saturation level was changed to 3.
- the hydrogen concentration at the inlet of the second gas expansion module was OmgZL
- the dissolved hydrogen concentration at the outlet of the third gas membrane module was 1.015 mg L.
- the hydrogen concentration at the inlet of the second gas permeable membrane module was 0.46 mg / L
- the dissolved hydrogen concentration at the outlet of the third gas flat membrane module was 1.167 mg / L.
- the hydrogen concentration at the inlet of the second gas permeable membrane module is 0'.76 mgZL
- the hydrogen concentration was 1 ⁇ 260 mg / L.
- the concentration of ⁇ 7 at the inlet of the second gas 3 ⁇ 411 moth module is 0.76 mg / L
- D 2 is (0.7 6 + It becomes.
- the hydrogen concentration at the inlet of the second gas module is set to 1.0 mg / L, and 0.8 mg / L of hydrogen, that is, hydrogen with a saturation level of 0.5 is dissolved in water.
- the present invention is particularly useful when the concentration of hydrogen at the inlet of the module for the gas to be dissolved under the pressure of calolysis is relatively high as in the first example.
- conventional ⁇ : When conventional ⁇ : is applied here, it will be discharged once through a 1. O mg / L hydrogen vacuum pump, and then 1.2 mg ZL of hydrogen will be supplied.
- 0.8 mgZL of hydrogen is supplied, and 0.6 mg / L of hydrogen is discharged without using a vacuum pump. In addition to securing it, the effect of reducing hydrogen consumption can also be obtained.
- the water pressure at the outlet of the third gas transmembrane module is maintained at 0.05 MPa, the cell portion of the first gas permeable membrane module is opened to the atmosphere, and the second gas permeability module is opened.
- Dissolved hydrogen 1.6 mg / L (saturation level 1 equivalent) or hydrogen J element 3.2 mg / L (saturation level 2 equivalent) at the outlet of the third gas membrane module. was measured.
- the soot hydrogen concentrations were 0.798 mg / L and 1.006 mgZL, respectively.
- the water pressure at the outlet was kept at 0.2 MPa: combined with ⁇ and the results are shown in Table 2.
- Example 2 Hydrogen melt water produced according to the present invention was used for the glass sickle machine.
- the machine was immersed for 5 minutes using a 40 kHz ultrasonic wave and covering a glass substrate having a size of about 1 m square. »The average number of fine particles above 1 in the previous glass was about 4,000.
- 'Fujimizu as 3 ⁇ 43 ⁇ 4K, prepared hydrogen hydrogen 1. ⁇ 2 mg , L hydrogen melting angle! 3 ⁇ 43 ⁇ 4 #] or 3 ⁇ 4K elementary melting angle?
- the average value of fine particles over m is about 80,000 when using M fek, hydrogen melting angle? 3 ⁇ 4f when using water, hydrogen inlet hydrogen melting angle I »water is used. When it was about 30.
- the water melting method and the separation and production apparatus it is possible to stabilize the gas melting angle by dissolving a high concentration of specific gas without using a degassing pump.
- the present invention and the device of the present invention can be suitably used to circulate and reuse a large amount of water, which is highly practical. ,.
Abstract
Description
Claims
Priority Applications (3)
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KR1020087024925A KR101364903B1 (ko) | 2006-03-13 | 2007-03-12 | 가스용해 세정수의 제조방법, 제조장치 및 세정장치 |
US12/225,038 US8123833B2 (en) | 2006-03-13 | 2007-03-12 | Process for producing gas-containing cleaning water, apparatus for producing the cleaning water and cleaning apparatus |
CN2007800084202A CN101401193B (zh) | 2006-03-13 | 2007-03-12 | 气体溶解洗涤水的制造方法、制造装置和洗涤装置 |
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JP2006067406A JP5072062B2 (ja) | 2006-03-13 | 2006-03-13 | 水素ガス溶解洗浄水の製造方法、製造装置及び洗浄装置 |
JP2006-067406 | 2006-03-13 |
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US (1) | US8123833B2 (ja) |
JP (1) | JP5072062B2 (ja) |
KR (1) | KR101364903B1 (ja) |
CN (1) | CN101401193B (ja) |
TW (1) | TWI421132B (ja) |
WO (1) | WO2007105820A1 (ja) |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0760005A (ja) * | 1993-08-31 | 1995-03-07 | Miura Co Ltd | 液状製品の脱気方法 |
JP2004351399A (ja) * | 2003-05-26 | 2004-12-16 | Wataru Murota | 還元水及びその製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0647105B2 (ja) * | 1989-12-19 | 1994-06-22 | 株式会社荏原総合研究所 | 純水又は超純水の精製方法及び装置 |
JP2652301B2 (ja) * | 1992-05-28 | 1997-09-10 | 株式会社荏原製作所 | 洗浄水製造装置 |
CN1150397A (zh) * | 1994-04-14 | 1997-05-21 | 株式会社东芝 | 清洗方法以及清洗装置 |
JP3521393B2 (ja) | 1995-06-28 | 2004-04-19 | 忠弘 大見 | ウエット処理方法および処理装置 |
US6082373A (en) * | 1996-07-05 | 2000-07-04 | Kabushiki Kaisha Toshiba | Cleaning method |
CN1163946C (zh) * | 1996-08-20 | 2004-08-25 | 奥加诺株式会社 | 清洗电子元件或其制造设备的元件的方法和装置 |
JP3662111B2 (ja) * | 1997-06-24 | 2005-06-22 | アルプス電気株式会社 | 洗浄液の製造方法およびそのための装置 |
JP4151088B2 (ja) | 1997-09-01 | 2008-09-17 | 栗田工業株式会社 | 水素含有超純水の供給装置 |
TW350798B (en) * | 1998-01-21 | 1999-01-21 | Shuzurifuresher Kaihatsukyodokumiai | Cleaning method and apparatus of high-density liquidized gas |
JP2000288490A (ja) * | 1999-04-01 | 2000-10-17 | Furontekku:Kk | ウェット処理装置 |
JP3333149B2 (ja) * | 1999-07-05 | 2002-10-07 | アルプス電気株式会社 | ガス溶解水製造装置およびガス溶解水製造方法ならびに洗浄装置 |
JP4469078B2 (ja) * | 2000-11-13 | 2010-05-26 | コフロック株式会社 | 高濃度オゾン水製造装置及びこの装置を用いた高濃度オゾン水の製造方法 |
JP2003334433A (ja) * | 2002-05-16 | 2003-11-25 | Kurita Water Ind Ltd | 連続溶解装置、連続溶解方法及び気体溶解水供給装置 |
JP2004230370A (ja) * | 2002-12-05 | 2004-08-19 | Wataru Murota | 還元水及びその製造方法 |
JP2005262031A (ja) * | 2004-03-17 | 2005-09-29 | Kurita Water Ind Ltd | 循環式ガス溶解水供給装置及び該装置の運転方法 |
JP2006071340A (ja) * | 2004-08-31 | 2006-03-16 | Kurita Water Ind Ltd | 液体中の溶存気体濃度の測定方法、測定装置及び窒素ガス溶解水の製造装置 |
JP4442383B2 (ja) * | 2004-10-12 | 2010-03-31 | 国立大学法人 東京大学 | 超音波洗浄装置 |
-
2006
- 2006-03-13 JP JP2006067406A patent/JP5072062B2/ja active Active
-
2007
- 2007-03-12 WO PCT/JP2007/055336 patent/WO2007105820A1/ja active Application Filing
- 2007-03-12 KR KR1020087024925A patent/KR101364903B1/ko not_active IP Right Cessation
- 2007-03-12 US US12/225,038 patent/US8123833B2/en not_active Expired - Fee Related
- 2007-03-12 TW TW096108398A patent/TWI421132B/zh not_active IP Right Cessation
- 2007-03-12 CN CN2007800084202A patent/CN101401193B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0760005A (ja) * | 1993-08-31 | 1995-03-07 | Miura Co Ltd | 液状製品の脱気方法 |
JP2004351399A (ja) * | 2003-05-26 | 2004-12-16 | Wataru Murota | 還元水及びその製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018146823A1 (ja) * | 2017-02-09 | 2018-08-16 | 栗田工業株式会社 | 導電性水溶液の製造装置及び導電性水溶液の製造方法 |
WO2018146824A1 (ja) * | 2017-02-09 | 2018-08-16 | 栗田工業株式会社 | アンモニア水溶液の製造装置及びアンモニア水溶液の製造方法 |
JP2018126700A (ja) * | 2017-02-09 | 2018-08-16 | 栗田工業株式会社 | 導電性水溶液の製造装置及び導電性水溶液の製造方法 |
JP2018127383A (ja) * | 2017-02-09 | 2018-08-16 | 栗田工業株式会社 | アンモニア水溶液の製造装置及びアンモニア水溶液の製造方法 |
US11104594B2 (en) | 2017-02-09 | 2021-08-31 | Kurita Water Industries Ltd. | Ammonia solution production device and ammonia solution production method |
US11834638B2 (en) | 2017-02-09 | 2023-12-05 | Kurita Water Industries Ltd. | Conductive aqueous solution production device and conductive aqueous solution production method |
TWI712454B (zh) * | 2017-10-25 | 2020-12-11 | 日商海上股份有限公司 | 超音波洗淨裝置及超音波洗淨系統 |
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JP2007243113A (ja) | 2007-09-20 |
KR101364903B1 (ko) | 2014-02-19 |
US8123833B2 (en) | 2012-02-28 |
JP5072062B2 (ja) | 2012-11-14 |
US20090165829A1 (en) | 2009-07-02 |
KR20090007701A (ko) | 2009-01-20 |
TW200744763A (en) | 2007-12-16 |
CN101401193B (zh) | 2010-10-27 |
TWI421132B (zh) | 2014-01-01 |
CN101401193A (zh) | 2009-04-01 |
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