WO2007049382A1 - Module haute frequence - Google Patents

Module haute frequence Download PDF

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Publication number
WO2007049382A1
WO2007049382A1 PCT/JP2006/312896 JP2006312896W WO2007049382A1 WO 2007049382 A1 WO2007049382 A1 WO 2007049382A1 JP 2006312896 W JP2006312896 W JP 2006312896W WO 2007049382 A1 WO2007049382 A1 WO 2007049382A1
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WO
WIPO (PCT)
Prior art keywords
line
transmission line
substrate
frequency
impedance
Prior art date
Application number
PCT/JP2006/312896
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English (en)
Japanese (ja)
Inventor
Yuya Dokai
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Publication of WO2007049382A1 publication Critical patent/WO2007049382A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters

Definitions

  • the present invention relates to a high-frequency module used in a high-frequency circuit such as a mobile phone, and more particularly to a high-frequency module that includes a high-frequency element and an RF circuit unit and is integrated.
  • a high-frequency module including a high-frequency element and a high-frequency circuit portion connected to the high-frequency element.
  • various circuits in which a bandpass filter is connected to a high-frequency element have been proposed.
  • Patent Document 1 discloses an LC filter using a line connected to an antenna.
  • FIG. 25 is a perspective view schematically showing the filter described in Patent Document 1. As shown in FIG.
  • a plurality of dielectric substrates 102 to 106 are laminated via metal base plates 107 to L10.
  • via metal patches 111 to 113 are arranged in the slots 107a to 109a so as not to contact the metal ground planes 107 to 109.
  • the via hole electrode 114 is provided so as to penetrate the portion where the above-mentioned slots 107a to l10a are provided so as to penetrate the laminated body formed by laminating the dielectric substrates 102 to 106! ing.
  • the via hole electrode 114 is electrically connected to the via metal patches 111 to 113.
  • the upper end of the via-hole electrode 114 is electrically connected to the microstrip line 115.
  • the microstrip line 115 is formed on the upper surface of the dielectric substrate 106 and is electrically connected to the antenna element.
  • the lower end of the via-hole electrode 114 is electrically connected to the microstrip line 116 on the lower surface of the dielectric substrate 102.
  • the microstrip line 116 is electrically connected to the high frequency circuit part.
  • the via hole electrode 114 that is, the inductivity of the line, and the via metal patch 111.
  • the filter 101 is configured by using a line portion that connects an antenna and a high-frequency circuit to which the antenna is connected. Therefore, the high-frequency module including the filter can be downsized. It is possible to plan.
  • Patent Document 1 JP 2000-101377 A
  • An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and to reduce the amount of attenuation that can be achieved simply by configuring an LC filter using a line portion formed by connecting a high-frequency element and a high-frequency circuit. It is an object of the present invention to provide a high-frequency module that can be reduced in size, can suppress spuriouses effectively, and can be easily manufactured.
  • an RF circuit unit, a high frequency element, and a line connecting the RF circuit unit and the high frequency element are provided, and the stray capacitance of the line force is connected to a ground potential.
  • the high-frequency element and the transmission line one end connected to the high-frequency element, one end connected to the transmission line, and the other end to the R A wiring line connected to an F circuit, wherein the transmission line is provided on the second substrate, the impedance of the transmission line being lower than the impedance of the wiring line, and the transmission line
  • An input impedance viewed from the wiring line side is set higher than an input impedance viewed from the high-frequency element side force of the transmission line.
  • a ratio of an input impedance viewed from the high frequency element side of the transmission line to an input impedance viewed from the wiring line side of the transmission line is 0.63 or less.
  • an input impedance of the wiring line viewed from the RF circuit side is set lower than an input impedance of the wiring line viewed from the transmission line side.
  • the transmission line is a coplanar line.
  • the transmission line is configured by a strip line, and a ground electrode is disposed above and below the portion where the strip line is provided.
  • the high-frequency element includes:
  • the high-frequency element is
  • the transmission line is mounted at a position shifted from the center of the first substrate, and one end of the transmission line is connected to a portion where the high-frequency element is mounted.
  • the high-frequency element is an antenna element.
  • a high-frequency element is provided on the second substrate, an RF circuit unit is provided on the first substrate, and a line connecting the high-frequency element and the RF circuit
  • the path includes a transmission line having one end connected to the high-frequency element, and a wiring line having one end connected to the transmission line and the other end connected to the RF circuit.
  • the impedance of the transmission line is made lower than the impedance of the wiring line, and the input line seen from the wiring line side of the transmission line. Since the impedance is higher than the input impedance seen from the high-frequency element side of the transmission line, the LC filter is configured using L by the wiring line and the capacitance of the transmission line. Therefore, a bandpass filter composed of an LC filter can be configured using the high-frequency module line itself, and the miniaturization of the high-frequency module can be promoted.
  • the transmission force has a capacitive characteristic of the transmission line due to the inductivity of the wiring line and the input impedance viewed from the wiring line side of the transmission line higher than the input impedance viewed from the high-frequency element side force.
  • the manufacturing force can be easily manufactured.
  • the attenuation is further increased. be able to.
  • the transmission line is a coplanar line
  • a planar coplanar line can be easily formed on the second substrate, and around the coplanar line on the main surface of the second substrate.
  • a large ground pattern can be formed, whereby the characteristics of the high-frequency device can be further improved.
  • the transmission line is provided with a strip line provided in the second substrate and the ground electrodes are arranged above and below the strip line, the strip line can be electromagnetically shielded by the ground. As a result, the filter characteristics can be further stabilized.
  • the second substrate is included. Therefore, the mechanical strength of the entire high-frequency module can be increased, and the module characteristics can be stabilized even in an environment such as an impact.
  • the transmission line connected to the high frequency element can be lengthened, whereby the transmission line and The L part of the line including the wiring line can be increased. Therefore, the amount of attenuation can be further increased, and spurious can be more effectively suppressed.
  • the antenna element When the high-frequency element is an antenna element, the antenna element emits a strong radio wave.
  • the antenna element can be easily shielded from other components. Therefore, it is possible to obtain a high-frequency module with less interference between the antenna element and other components. Furthermore, it is preferable to arrange an antenna element at the center of the ground electrode because the antenna characteristics can be further improved.
  • FIG. 1 is a partially cutaway perspective view showing a main part of a high-frequency module according to an embodiment of the present invention.
  • FIG. 2 is a front cross-sectional view of a high-frequency module according to an embodiment of the present invention.
  • FIG. 3 is a plan view of a second substrate in the high-frequency module according to one embodiment of the present invention.
  • FIG. 4 is a plan view for explaining a frame-like member provided on the first substrate in the high-frequency module of one embodiment of the present invention.
  • FIG. 5 is a diagram showing a transmission circuit of a filter configured in an embodiment of the present invention.
  • FIG. 6 is a schematic exploded perspective view for explaining a modification of the transmission line.
  • FIG. 7 is a schematic plan view of a second substrate for explaining another modification of the transmission line.
  • FIGS. 8 (a) and 8 (b) are diagrams showing the pass characteristics of a single wiring line in an experimental example of the high-frequency module of the embodiment and an enlarged view of the main part of the pass characteristics.
  • FIGS. 9 (a) and 9 (b) show the reflection characteristics S 11 and the reflection characteristics viewed from the transmission line side of the single RF circuit side wiring line of the high-frequency module in one embodiment of the present invention. Show 22 It is a figure.
  • FIGS. 10 (a) and 10 (b) show the reflection characteristic S11 as seen from the RF circuit side of the wiring line alone of the high-frequency module in one embodiment of the present invention and the reflection characteristic as seen from the transmission line side. It is a Smith chart which shows.
  • FIG. 11 is a schematic perspective view for explaining the specifications of a coplanar line.
  • FIGS. 12 (a) and 12 (b) are enlarged views showing the pass characteristic of the low-pass filter of the first experimental example and the main part of the pass characteristic.
  • FIGS. 13 (a) and 13 (b) are diagrams showing a reflection characteristic S11 viewed from the RF circuit side and a reflection characteristic S22 viewed from the antenna element side of the low-pass filter of the first experimental example.
  • FIGS. 14 (a) and 14 (b) are a Smith chart showing the reflection characteristics of the high-frequency module of the first experimental example, which also shows the RF circuit side force, and a Smith chart showing the reflection characteristics S22 seen from the antenna element side. It is a chart.
  • FIGS. 15 (a) and 15 (b) are enlarged views showing the pass characteristics of the coplanar line alone and the pass characteristics in the first experimental example.
  • FIGS. 16 (a) and 16 (b) show the reflection characteristics seen from the coplanar line alone wiring line side in the high frequency module of the first experimental example, and the reflection characteristics seen from the antenna element side side. It is a figure which shows S22.
  • FIG. 17 (a) is an impedance Smith chart of the reflection characteristic S11 seen from the wiring line side of the coplanar line alone in the high-frequency module of the first experimental example, and (B) is seen from the antenna element side. It is an impedance Smith chart of the reflection characteristic S22.
  • FIGS. 18 (a) and 18 (b) are enlarged views showing the pass characteristics of the high-frequency module of the second experimental example and the main parts of the pass characteristics.
  • FIGS. 19 (a) and 19 (b) are diagrams showing the reflection characteristic S11 in which the RF circuit side force of the high-frequency module of the second experimental example is also seen and the reflection characteristic S22 in view from the antenna element side.
  • FIG. 20 (a) is a diagram showing an impedance Smith chart of the reflection characteristic S11 in which the RF circuit side force of the high-frequency module of the second experimental example is also seen, and (b) is an antenna element of the high-frequency module.
  • FIG. 10 is a diagram showing an impedance Smith chart of reflection characteristics S22 as seen from the side.
  • FIGS. 21 (a) and 21 (b) are enlarged views showing a pass characteristic of a coplanar line alone and a main part of the pass characteristic in the high frequency module of the second experimental example.
  • FIGS. 22 (a) and 22 (b) show the reflection characteristics seen from the coplanar line alone wiring line side in the high-frequency module of the second experimental example and the reflection characteristics seen from the antenna element side side. It is a figure which shows S22.
  • FIG. 23 (a) is a diagram showing an impedance Smith chart showing the reflection characteristic S11 as seen from the wiring line side of the coplanar line alone in the high-frequency module of the second experimental example, and FIG. It is a figure which shows the impedance Smith chart of the reflective characteristic seen from the antenna element side of this coplanar line.
  • FIG. 24 shows the input impedance as seen from the antenna element side of the transmission line relative to the input impedance ratio Z of the transmission line in the high-frequency module of the present invention.
  • FIG. 6 is a diagram showing the relationship between the ratio z / z of the impedance z and the attenuation.
  • FIG. 25 is a schematic perspective view showing an example of a conventional filter.
  • FIG. 2 is a front sectional view of the high-frequency module according to one embodiment of the present invention.
  • the high frequency module 1 has a structure in which a first substrate 2 and a second substrate 3 are laminated.
  • the first substrate 2 is composed of a low-temperature fired ceramic multilayer substrate.
  • Bare chip ICs 4 and 5 as high-frequency elements are mounted on the upper surface of the first substrate 2.
  • other electronic component elements 6, 7 and the like are surface-mounted on the lower surface of the first substrate 2.
  • the bare chip ICs 4 and 5 and the electronic component elements 6 and 7 are electrically connected by wiring provided on the first substrate 2, thereby forming an RF circuit.
  • the second substrate 3 is made of synthetic resin in the present embodiment.
  • synthetic resin an appropriate synthetic resin such as polyimide, epoxy, and glass epoxy can be used.
  • the second substrate 3 may be made of a material other than synthetic resin, for example, ceramics.
  • FIG. 3 is a plan view of the second substrate 3.
  • an antenna element is mounted as a high-frequency element in a region surrounded by an alternate long and short dash line A at the center.
  • the ground electrode 8 is formed on almost the entire surface.
  • the ground electrode 8 has an L-shaped opening 8a. In this opening 8a, a copier as a transmission line is formed. Narrain 9 is provided.
  • One end 9a of the coplanar line 9 as a transmission line is electrically connected to the antenna element, and the other end 9b is a through-hole electrode penetrating through the second substrate 3 as shown in FIG. 10 is electrically connected to one end.
  • the lower end of the through-hole electrode 10 reaches the lower surface of the second substrate 3.
  • the ground electrode 8A is also formed on the lower surface of the second substrate 3 in the most part.
  • the antenna element 11 uses a suitable antenna element such as a dielectric antenna for the antenna element 11 mounted on the upper surface of the second substrate 3. be able to.
  • the coplanar line 9 constituting and transmitting the transmission line is a wiring line including the through hole electrode 10 and the conductive connection member 12 connected to the lower end of the through hole electrode 10. , Connected to the RF circuit described above.
  • FIG. 4 is a plan view for explaining a portion where the conductive connection member 12 is provided.
  • a rectangular frame-shaped frame member 13 is fixed on the first substrate 2.
  • the rectangular frame-shaped frame member 13 is made of an appropriate synthetic resin such as polyimide.
  • the conductive connection member 12 is embedded so as to penetrate the lower surface from the upper surface of the frame-shaped member 13.
  • At least one conductive connecting member 12 connects the antenna element 11 and the RF circuit described above, and the force frame member 13 constituting a part of the wiring line through which a signal flows is provided with a duller.
  • a plurality of conductive connection members 14 connected to the ground potential are also provided. The upper end of the conductive connection member 14 is connected to a through-hole electrode 15 provided on the second substrate 3, and the through-hole electrode 15 is electrically connected to the ground electrode 8 provided on the second substrate 3. Connected.
  • the lower end of the conductive connection member 14 is electrically connected to the ground potential of the RF circuit.
  • the second substrate 3 side and the RF circuit on the first substrate 2 side are electrically connected by the conductive connection members 12 and 14 provided on the frame member 13. ing.
  • a resin coating layer 16 is provided so as to cover the bare chips IC4, 5 (see FIG. 2).
  • the bare chip ICs 4 and 5 are sealed with the resin so that the environmental resistance is improved.
  • the plurality of conductive connecting members 14 surround the high-frequency circuit portion including the bare chips IC4 and 5, it is possible to suppress deterioration of characteristics due to the electromagnetic field of the antenna element 11 side force. Has been.
  • the high-frequency module 1 of the present embodiment is characterized in that the wiring line is provided on the second substrate 3 and includes the coplanar line 9 as the transmission line, the through-hole electrode 10, and the conductive connecting member 12 Thus, a low-pass filter is configured. This will be described more specifically with reference to FIG. 1 and FIG.
  • FIG. 1 is a partially cutaway perspective view showing an enlarged main part of the high-frequency module of the present embodiment.
  • the antenna element 11 is omitted and a conductive connecting member 12 is provided. Enlarge the end of the side and show it partially! /
  • One end 9a of the coplanar line 9 is actually arranged at substantially the center of the substrate 3, and the antenna element 11 is mounted in the center.
  • the above-described through-hole electrode 10 is connected to the other end 9b of the coplanar line 9, and the conductive connecting member 12 is electrically connected to the lower end of the through-hole electrode 10,
  • the through-hole electrode 10 and the conductive connecting member 12 constitute a wiring line 17.
  • the wiring line 17 is connected to the RF circuit of the first substrate 2.
  • the LC filter is composed of the inductivity of the wiring line 17, ie, the L component, and the capacitance of the coplanar line 9, ie, the C component.
  • the impedance of the coplanar line 9, which is the transmission line is lower than the impedance of the wiring line, and the input impedance viewed from the wiring line 17 side of the coplanar line is greater than the input impedance viewed from the antenna element 11 side force of the coplanar line 9.
  • a low-pass filter having good band characteristics and sufficient out-of-band attenuation is configured. That is, as shown in FIG. 5, a low-pass filter composed of an LC filter is configured by the L portion by the wiring line and the C portion by the portion where the coplanar line 9 is provided.
  • a transmission line is configured by the coplanar line 9!
  • the transmission line in the present invention can be variously modified.
  • a ground electrode 21 is provided in the second substrate 3A at an intermediate height position, and an L-shaped opening 21a is formed in the ground electrode 21. Yes.
  • a strip line 22 is arranged inside.
  • the stripline 22 constitutes the transmission line.
  • ground electrodes 23 and 24 are arranged above and below the portions constituting the ground electrode 21 and the strip line 22, respectively.
  • One end of the strip line 22 passes through an opening (not shown) provided in the ground electrode 23 and is electrically connected to a through-hole electrode electrically connected to the antenna element. . Further, the other end of the strip line 22 is electrically connected to the RF circuit by a through-hole electrode passing through an opening provided in the ground electrode 24.
  • the stripline 22 is sufficiently electromagnetically shielded, so that the filter characteristics are more stable. And can suppress spurious more effectively
  • the antenna element is mounted at a position where the central force on the upper surface of the second substrate 3 is also shifted, more specifically, near the end of the second substrate 3. It is structured as follows.
  • the area where the antenna element is mounted is indicated by a one-dot chain line A. Therefore, the length of the coplanar line 31 as a transmission line connected to the antenna element can be increased by forming a meandering shape as shown in the figure. Therefore, the length of the transmission line is lengthened, and as a result, the L portion of the entire transmission line is increased, so that the attenuation can be further increased.
  • the wiring line connecting the transmission line and the RF circuit also has various through-hole electrodes other than the structure using the conductive connecting member 12 embedded in the frame-shaped member 13 described above. Conductor lines can be used.
  • the impedance of the coplanar line 9 constituting the transmission line is set lower than the impedance of the wiring line 17, and the transmission line is constituted. Since the input impedance viewed from the wiring line side of the coplanar line 9 is higher than the input impedance viewed from the antenna element side force, sufficient attenuation and good spurious suppression characteristics can be realized. This is shown in Figs. 8 to 23. This will be described more specifically with reference to FIG.
  • a low-pass filter having a center frequency of 5.8 GHz is configured.
  • FIGS. 8 (a) and 8 (b) are diagrams showing the transmission characteristics of the wiring line 17 alone and the transmission characteristics showing an enlarged main part in the above embodiment.
  • (a) and (b) show the reflection characteristic S 11 on the RF circuit side of the wiring line 17 and the reflection characteristic S22 on the coplanar line 9 side
  • FIGS. 10 (a) and (b) show the reflection characteristic S 11 and It is a Smith chart drawn based on S22.
  • the impedance on the RF circuit side of the wiring line 17 obtained from FIGS. 9 (a), 9 (b) and 10 (a), 10 (b) is about 145 ⁇ as shown in Table 1 below. Yes, the input impedance in terms of the coplanar line side force is about 158 ⁇ .
  • FIGS. 8 (a) to 10 (b) are the results when the wiring line 17 is manufactured with the following specifications.
  • Conductive connection member 12 Thickness ⁇ ⁇ . 15mm, length 1. Omm
  • Fig. 12 (a) to Fig. 14 (b) show the characteristics of an embodiment in which a coplanar line having the following specifications is connected to the wiring line 17 having the above characteristics.
  • the coplanar line 9 has the following specifications.
  • T, G, V, L, and H in the following specifications are as follows: L: Length of the coplanar line, W: Width dimension of the coplanar line, G: Ground facing the coplanar line Horizontal direction between electrodes T: Thickness of electrode (fixed at 20 / zm), H: Vertical distance between ground electrodes (fixed at 0.4 mm), C3: Through-hole electrode 10 And stray capacitance at the connection between the coplanar line 9 and C4: stray capacitance at the connection between the coplanar line and the antenna feed terminal.
  • FIG. 12 (a) shows the pass characteristics of the above embodiment having the coplanar line and the wiring line designed as described above, and FIG.
  • FIGS. 13A and 13B show the reflection characteristic SI 1 viewed from the RF circuit side and the reflection characteristic S 22 viewed from the antenna element side of the above embodiment.
  • FIGS. 14A and 14B show impedance Smith charts obtained based on the reflection characteristics S11 and S22.
  • FIGS. 15 (a) and 15 (b) show the pass characteristics of the coplanar line 9 alone in the above embodiment and the pass characteristics shown by enlarging the main part thereof. Also, the reflection characteristic S11 seen from the wiring line side of the coplanar line 9 and the reflection characteristic S22 seen from the antenna element side are shown in FIGS. 16 (a) and 16 (b).
  • FIGS. 17 (a) and 17 (b) are Smith charts drawn based on the reflection characteristics Sl l and S22.
  • the impedance on the wiring line side of the coplanar line 9 is about 132 ⁇ , and the input impedance on the antenna element side is about 95 ⁇ .
  • the impedance of the coplanar line 9 is made lower than the impedance of the wiring line 17 side shown in Table 1 described above, thereby further reducing the impedance of the coplanar line 9 to the antenna element side.
  • the input impedance on the wiring line side higher than the input impedance of the line, it is confirmed that a large attenuation is secured as described above. Karu. This is due to the effect that a low-pass filter is formed by the inductivity of the wiring line 17 and the capacitance of the coplanar line 9.
  • the attenuation is about 35dB, which is larger than the above experimental example.
  • FIG. 19A shows the reflection characteristic S11 in which the RF circuit side force is also seen
  • FIG. 19B shows the reflection characteristic S22 in which the antenna element side force is also seen
  • Figures 20 (a) and 20 (b) show impedance Smith charts for the reflection characteristics Sl l and S22 drawn based on Figs. 19 (a) and 19 (b), respectively.
  • FIG. 21 (a) shows the single passage characteristic of the coplanar line 9 in this second experimental example
  • FIG. 22 (a) and 22 (b) show the reflection characteristic S11 as seen from the wiring line side of the coplanar line 9 and the reflection characteristic S22 as seen from the antenna element side.
  • FIGS. 23 (a) and 23 (b) are impedance Smith charts drawn based on the reflection characteristics S11 and S22 of the coplanar line alone.
  • the input impedance on the wiring line side of the coplanar line portion is about 124.4 ⁇
  • the input impedance on the antenna element side is about 58.6 ⁇
  • the impedance of the wiring line is the same as that of the first experiment described above. Similar to the example, the input impedance on the RF circuit side is 145 ⁇ , and the input impedance on the coplanar line side is 158 ⁇ . Therefore, in the second experimental example, the impedance of the coplanar line is less than the impedance of the wiring line 17. Is also low.
  • the impedance of the coplanar line is made lower than the impedance of the wiring line, and the input impedance ⁇ viewed from the wiring line side of the coplanar line is Input impedance seen from the antenna element side ⁇
  • the impedance ratio ⁇ / ⁇ is 0.63 or less, the out-of-band attenuation is more effectively suppressed.
  • Z / Z can be controlled by configuring the transmission line and controlling the above dimensions and area of the coplanar line 9 or the thickness of the conductor constituting the coplanar line 9.
  • the impedance ratio can be increased by increasing the stray capacitance by increasing the line length, and the impedance ratio can be decreased by increasing the stray capacitance by decreasing the line length.
  • Z / Z can be used for various transmission line structures.
  • the high-frequency element is not limited to an antenna element, and an antenna matting element, switch element, power amplifier, low noise amplifier, transmitting RF or IC, receiving RF or IC, or the like may be used. Oh ,.

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Abstract

La présente invention concerne un module haute fréquence doté d'un filtre, qui peut être miniaturisé, il présente une quantité adéquate d'atténuation hors de bande et peut efficacement supprimer les parasites hors bande. Dans un module haute fréquence (1), une partie de circuit HF est fournie sur un premier substrat (2), un élément haute fréquence est monté sur un second substrat (3), une ligne raccordant l'élément haute fréquence et le circuit HF est munie d'une ligne de transmission (9) et une ligne de câblage (17), l'impédance de la ligne de transmission (9) est rendue inférieure à l'impédance de la ligne de câblage (17), et l'impédance d'entrée (ZS11) lorsqu'elle est vue du côté de la ligne de câblage (17) de la ligne de transmission (9) est rendue supérieure à l'impédance d'entrée (ZS22) lorsqu'elle est vue du côté de l'élément haute fréquence de la ligne de transmission (9).
PCT/JP2006/312896 2005-10-27 2006-06-28 Module haute frequence WO2007049382A1 (fr)

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JP2005-312887 2005-10-27

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
US7990318B2 (en) 2007-03-22 2011-08-02 Brother Kogyo Kabushiki Kaisha Radio-frequency telephone set
CN102332640A (zh) * 2010-07-09 2012-01-25 日立电线精密技术株式会社 电磁耦合器及装载了该电磁耦合器的信息通信设备
JP2015023473A (ja) * 2013-07-19 2015-02-02 株式会社東芝 アンテナ装置
JP2016092817A (ja) * 2014-11-04 2016-05-23 パナソニックＩｐマネジメント株式会社 アンテナ装置、および電子機器

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JPH0567919A (ja) * 1991-07-25 1993-03-19 Nec Corp マイクロ波ミリ波送受信モジユール
JPH0856113A (ja) * 1994-08-11 1996-02-27 Matsushita Electric Ind Co Ltd ミリ波用検波器
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JP3708382B2 (ja) * 1999-10-12 2005-10-19 日本碍子株式会社 アンテナ装置
JP2004096180A (ja) * 2002-08-29 2004-03-25 Alps Electric Co Ltd アンテナユニット
WO2004075336A1 (fr) * 2003-02-21 2004-09-02 Matsushita Electric Industrial Co., Ltd. Circuit haute frequence

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* Cited by examiner, † Cited by third party
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US7990318B2 (en) 2007-03-22 2011-08-02 Brother Kogyo Kabushiki Kaisha Radio-frequency telephone set
CN102332640A (zh) * 2010-07-09 2012-01-25 日立电线精密技术株式会社 电磁耦合器及装载了该电磁耦合器的信息通信设备
JP2012019433A (ja) * 2010-07-09 2012-01-26 Hitachi Cable Fine Tech Ltd 電磁結合器及びそれを搭載した情報通信機器
US8803629B2 (en) 2010-07-09 2014-08-12 Hitachi Metals, Ltd. Electromagnetic coupler and information communication device including same
JP2015023473A (ja) * 2013-07-19 2015-02-02 株式会社東芝 アンテナ装置
US9698482B2 (en) 2013-07-19 2017-07-04 Kabushiki Kaisha Toshiba Antenna device
JP2016092817A (ja) * 2014-11-04 2016-05-23 パナソニックＩｐマネジメント株式会社 アンテナ装置、および電子機器

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