CN102332640A - 电磁耦合器及装载了该电磁耦合器的信息通信设备 - Google Patents
电磁耦合器及装载了该电磁耦合器的信息通信设备 Download PDFInfo
- Publication number
- CN102332640A CN102332640A CN2011101956470A CN201110195647A CN102332640A CN 102332640 A CN102332640 A CN 102332640A CN 2011101956470 A CN2011101956470 A CN 2011101956470A CN 201110195647 A CN201110195647 A CN 201110195647A CN 102332640 A CN102332640 A CN 102332640A
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- conductive pattern
- electromagnetic coupler
- pattern
- conductor
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Links
- 238000004891 communication Methods 0.000 title claims description 33
- 239000004020 conductor Substances 0.000 claims abstract description 125
- 230000005686 electrostatic field Effects 0.000 claims description 8
- 230000006698 induction Effects 0.000 claims description 8
- 239000000203 mixture Substances 0.000 description 27
- 230000005540 biological transmission Effects 0.000 description 26
- 230000005684 electric field Effects 0.000 description 18
- 230000008878 coupling Effects 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 230000005855 radiation Effects 0.000 description 14
- 238000002474 experimental method Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000006386 neutralization reaction Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000252203 Clupea harengus Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 244000188472 Ilex paraguariensis Species 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 235000019514 herring Nutrition 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/04—Coupling devices of the waveguide type with variable factor of coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/22—Electrostatic or magnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Near-Field Transmission Systems (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010156507A JP5505794B2 (ja) | 2010-07-09 | 2010-07-09 | 電磁結合器及びそれを搭載した情報通信機器 |
JP2010-156507 | 2010-07-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102332640A true CN102332640A (zh) | 2012-01-25 |
CN102332640B CN102332640B (zh) | 2015-03-04 |
Family
ID=45438189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110195647.0A Expired - Fee Related CN102332640B (zh) | 2010-07-09 | 2011-07-06 | 电磁耦合器及装载了该电磁耦合器的信息通信设备 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8803629B2 (zh) |
JP (1) | JP5505794B2 (zh) |
CN (1) | CN102332640B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020000250A1 (zh) * | 2018-06-27 | 2020-01-02 | 华为技术有限公司 | 一种天线封装结构 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150249290A1 (en) * | 2012-07-31 | 2015-09-03 | Molex Incorporated | Slot fed dipole antenna |
US10989681B2 (en) | 2015-12-17 | 2021-04-27 | Purdue Research Foundation | Grid coatings for capture of proteins and other compounds |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5596804A (en) * | 1993-02-12 | 1997-01-28 | Alcatel Network Systems, Inc. | Method of constructing an electromagnetically shielded microstrip circuit |
CN1392755A (zh) * | 2001-04-27 | 2003-01-22 | 日本电气株式会社 | 高频电路基板及其制造方法 |
WO2007049382A1 (ja) * | 2005-10-27 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 高周波モジュール |
JP2007267041A (ja) * | 2006-03-28 | 2007-10-11 | Toto Ltd | マイクロストリップアンテナ及び高周波センサ |
US20080150657A1 (en) * | 2006-12-26 | 2008-06-26 | Motorola, Inc. | Tunable high impedance surface device |
CN101395758A (zh) * | 2006-02-28 | 2009-03-25 | Tdk株式会社 | 芯片天线 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2831159B2 (ja) | 1991-05-23 | 1998-12-02 | 三菱重工業株式会社 | 印刷物の色調制御装置 |
JP3196451B2 (ja) * | 1993-10-28 | 2001-08-06 | 株式会社村田製作所 | マイクロストリップアンテナ |
JP2006121315A (ja) | 2004-10-20 | 2006-05-11 | Hitachi Cable Ltd | 小型薄型アンテナ、多層基板および高周波モジュール、それらを搭載した無線端末 |
JP4345851B2 (ja) | 2006-09-11 | 2009-10-14 | ソニー株式会社 | 通信システム並びに通信装置 |
JP4983418B2 (ja) * | 2007-06-13 | 2012-07-25 | ソニー株式会社 | 通信装置 |
-
2010
- 2010-07-09 JP JP2010156507A patent/JP5505794B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-05 US US13/080,128 patent/US8803629B2/en not_active Expired - Fee Related
- 2011-07-06 CN CN201110195647.0A patent/CN102332640B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5596804A (en) * | 1993-02-12 | 1997-01-28 | Alcatel Network Systems, Inc. | Method of constructing an electromagnetically shielded microstrip circuit |
CN1392755A (zh) * | 2001-04-27 | 2003-01-22 | 日本电气株式会社 | 高频电路基板及其制造方法 |
WO2007049382A1 (ja) * | 2005-10-27 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 高周波モジュール |
CN101395758A (zh) * | 2006-02-28 | 2009-03-25 | Tdk株式会社 | 芯片天线 |
JP2007267041A (ja) * | 2006-03-28 | 2007-10-11 | Toto Ltd | マイクロストリップアンテナ及び高周波センサ |
US20080150657A1 (en) * | 2006-12-26 | 2008-06-26 | Motorola, Inc. | Tunable high impedance surface device |
US7518465B2 (en) * | 2006-12-26 | 2009-04-14 | Motorola, Inc. | Tunable high impedance surface device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020000250A1 (zh) * | 2018-06-27 | 2020-01-02 | 华为技术有限公司 | 一种天线封装结构 |
CN111971852A (zh) * | 2018-06-27 | 2020-11-20 | 华为技术有限公司 | 一种天线封装结构 |
CN111971852B (zh) * | 2018-06-27 | 2022-01-14 | 华为技术有限公司 | 一种天线封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN102332640B (zh) | 2015-03-04 |
JP5505794B2 (ja) | 2014-05-28 |
US20120007700A1 (en) | 2012-01-12 |
US8803629B2 (en) | 2014-08-12 |
JP2012019433A (ja) | 2012-01-26 |
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Owner name: HITACHI CABLE CO., LTD. Free format text: FORMER OWNER: HITACHI CABLE FINE TECH LTD. Effective date: 20140509 Owner name: HITACHI METALS, LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20140509 |
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Effective date of registration: 20140509 Address after: Tokyo, Japan Applicant after: HITACHI METALS, Ltd. Address before: Tokyo, Japan Applicant before: Hitachi Cable Co.,Ltd. Effective date of registration: 20140509 Address after: Tokyo, Japan Applicant after: Hitachi Cable Co.,Ltd. Address before: Ibaraki Applicant before: Hitachi Metals, Ltd. |
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