WO2007042071A1 - Bloc de composants comprenant au moins deux elements cooperant de maniere electroconductrice et procede permettant de produire ledit bloc de composants - Google Patents

Bloc de composants comprenant au moins deux elements cooperant de maniere electroconductrice et procede permettant de produire ledit bloc de composants Download PDF

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Publication number
WO2007042071A1
WO2007042071A1 PCT/EP2005/055133 EP2005055133W WO2007042071A1 WO 2007042071 A1 WO2007042071 A1 WO 2007042071A1 EP 2005055133 W EP2005055133 W EP 2005055133W WO 2007042071 A1 WO2007042071 A1 WO 2007042071A1
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WIPO (PCT)
Prior art keywords
components
semiconductor chip
assembly
component
assembly according
Prior art date
Application number
PCT/EP2005/055133
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German (de)
English (en)
Inventor
Thomas Loehken
Claus Lichtenberg
Peter Schibli
Andreas Frei
Original Assignee
Alphasem Ag
P.U. Schibli Engineering
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Filing date
Publication date
Application filed by Alphasem Ag, P.U. Schibli Engineering filed Critical Alphasem Ag
Priority to PCT/EP2005/055133 priority Critical patent/WO2007042071A1/fr
Priority to TW095136704A priority patent/TW200735736A/zh
Publication of WO2007042071A1 publication Critical patent/WO2007042071A1/fr

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    • H—ELECTRICITY
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the invention relates to an assembly and a method for producing an assembly according to the preamble of claim 1 or claim 13.
  • Such assemblies are used in numerous applications, for example in microelectronics.
  • connection string is versatile. Different and varying heights of the components can be advantageously compensated.
  • the assembly is characterized by a robust construction, whereby it can withstand high acceleration forces, for example.
  • the connecting strand may be curable by using heat and / or by light, in particular by UV light.
  • a cured connecting strand is characterized by advantageous mechanical, thermal and electrical properties.
  • a further aspect of the invention in terms of the device relates to an assembly having at least two components in electrically conductive connection, whose sides, in particular their tops and / or end faces for the operative connection, are connected to one another by at least one contact means extending along a line.
  • the contact means is an electrically conductive connecting strand, which is obtainable by applying a mass in pasty or liquid form and curing of the mass. Applying is understood to mean a process for the continuous application of a pasty or liquid mass.
  • the mass may contain electrically conductive particles, for example particles of silver, gold or another (metallic or non-metallic) material.
  • electrically conductive particles for example particles of silver, gold or another (metallic or non-metallic) material.
  • electrically conductive compounds are described for example in DE-A1-1028844.
  • the composition may be based on a resin, for example an epoxy resin. Silicones can also be used. Commercially available adhesives are also suitable as the basis for the composition. These can be selected according to the desired dispensability and curing behavior. Depending on the application area can transparent or non-transparent adhesives or other materials can be used as the basis for the connecting strand.
  • one of the components is a semiconductor chip, particularly preferably an unhoused semiconductor chip (die).
  • At least one of the components that are in electrical connection therewith may be a component, in particular a substrate or a further semiconductor chip.
  • the substrate used may preferably be a rigid or flexible circuit carrier or a metallic leadframe.
  • a “die” is, for example, an LED die or a laser diode chip, In such applications, an optically transparent electrically conductive connecting strand could be particularly suitable.
  • connection strand can - similar to wire bonding - be protected in a further subsequent process step with a potting compound together with the semiconductor chip from the effects of the environment.
  • the assembly may therefore comprise a protective sheath of a potting compound, which surrounds at least the semiconductor chip and the connecting strand in whole or in part.
  • Such an encapsulation gives the assembly in particular a higher mechanical stability and thermal capacity.
  • other methods for protecting the components of microelectronic assemblies are also known.
  • the connecting strand can run at least in sections on free upper sides of the components.
  • This arrangement has the advantage that the risk of mechanical damage can be massively reduced.
  • the connection string can be from an end point arranged on an upper side of one of the components, in particular on a chip top of a semiconductor chip, to the edge of the component or of the semiconductor chip on the upper side or chip top side and / or from an end point arranged on a connection surface of the component to the edge of the component on the connection surface.
  • an electrical operative connection between said components can be produced by low material costs.
  • the chip top side and the connection surface can run plane-parallel to one another. Likewise, these contact surfaces can also lie on different levels. Of course, it is also conceivable that the chip top and the pad lie on planes that define an angle to each other.
  • connection string may be cantilevered between the edges of the component and the semiconductor chip. However, it may also be advantageous if it is supported by an electrically insulating material. For this purpose, to bridge a distance between the components, in particular between the semiconductor chip and the component, an electrically insulating filling material may be arranged, which supports the connecting strand.
  • the semiconductor chip may be inserted in a receptacle of a substrate.
  • the preferably planar insertion of the component into the receptacle has various advantages.
  • the recessed arrangement of the component leads to a leveling between the support top and top of the component. Particular advantages may arise in particular if this assembly is used for optical applications, such as LEDs.
  • electronic Components are, in particular, semiconductor chips (so-called "dice”), in particular also LED dice or laser diode chips, in question
  • a substrate is, for example, a metallic leadframe or a printed circuit board, both of which can be designed to be rigid or flexible.
  • Another aspect of the invention relates to a method for producing an assembly, in particular an assembly of the aforementioned type and in particular for producing an electrical contact between two components.
  • the method should work reliably even with components with varying heights.
  • a mass of pasty or liquid mass in the form of a connecting strand By applying a mass of pasty or liquid mass in the form of a connecting strand, the electrically conductive operative connection between the components can be produced in an efficient and simple manner.
  • the mass can be cured after the application process. This can be done by using heat and / or by light, in particular by UV light. Of course - depending on the nature and composition of the mass - the curing could be done in other ways.
  • the paste is pressed for application through a channel of an applicator.
  • the connecting strands can be designed differently depending on the application.
  • FIG. 1 shows a perspective view of an assembly according to the invention with a semiconductor chip and a component
  • FIG. 2 shows a longitudinal section through the assembly according to FIG. 1 and an application device
  • Figure 2a the assembly according to Figure 2 with a one
  • FIG. 2b shows the assembly according to FIG. 2a with a protective jacket
  • FIG. 2c shows a longitudinal section through a further assembly as well as an application device
  • FIG. 3 shows an assembly with a semiconductor chip and two further components
  • FIG. 4 shows a further embodiment of an assembly
  • FIG. 5 shows an assembly with a plurality of semiconductor chips and a component
  • FIG. 6 shows a perspective illustration of a further embodiment of an assembly in which a semiconductor chip is inserted into a receptacle of a substrate
  • FIG. 7 shows a longitudinal section through the assembly according to FIG. 6 and an application device, Figure 8: the assembly according to Figure 7 with a one
  • FIG. 9 shows the assembly according to FIG. 8 with a protective jacket
  • FIG. 10 a perspective view of an assembly with a bridge element
  • FIG. 11 shows a longitudinal section through the assembly according to FIG. 10,
  • FIG. 12 shows a perspective view of an assembly in which semiconductor chips are connected to one another by connecting strands
  • FIG. 13 a longitudinal section through the assembly according to FIG. 12,
  • FIG. 14 shows a perspective view of the assembly according to FIG. 12 with filling materials supporting the connecting strands
  • FIG. 15 shows a longitudinal section through the assembly according to FIG. 14,
  • FIG. 16 shows a perspective view of an alternative embodiment of the assembly according to FIG. 12 or 14, FIG.
  • FIG. 17 shows a longitudinal section through the assembly according to FIG. 16,
  • FIG. 17 a a longitudinal section through a further assembly
  • FIG. 18 shows a cross section through a connecting strand (section AA according to FIG. 1)
  • FIG. 19 shows a cross section through a flat connecting strand
  • FIG. 20 shows a perspective view of an assembly with the planar connecting strand according to FIG. 19, and FIG.
  • FIG. 21 shows another assembly with the planar connecting strand according to FIG. 19.
  • an assembly designated by 1 contains a semiconductor chip 2 and a component 3 arranged at a distance from it as a further component.
  • an exposed connecting strand 4 which connects the upper sides 7 and 8 of the two components 2 and 3, is provided.
  • semiconductor chips are understood to be unimpeded semiconductor chips, so-called "dice.”
  • Components 3 include, for example, substrates such as metallic leadframes or a printed circuit board, which may be designed to be rigid or flexible 1 and (as well as in the remaining figures) are formed by a rectangular connection section directed against the semiconductor chip 2.
  • the electrically conductive connecting strand consists of a mass which can be applied in pasty or even liquid form. As a mass commercially available silver conductive paste can be used. Electrically conductive materials are further described in DE-Al-102 28 484.
  • the connecting strand 4 extends from an end point 5 on the chip top side 7 to the edge of the semiconductor chip 2 along the chip top side 7. In the area of the connection surface 8, the connecting strand 4 runs from the end point 6 to the edge of the component 3 on the connection surface 8.
  • the compound strand 4 is applied with the aid of an application device 12. To this end, pasty or possibly liquid material is pressed through a channel 13, while the application device 12 is moved in a predetermined direction. As applicator 12 dispensing needles or metering nozzles are conceivable, for example.
  • the connecting strand is cured by the application of heat and / or by light, in particular by UV light, depending on the composition of the composition.
  • an approximately wedge-shaped, electrically insulating filling material 15, which supports the connecting strand 4 is arranged between the semiconductor chip 2 and the component 3. In this way, the distance between the components 2, 3 can be bridged.
  • the filler material can be introduced in liquid or pasty form in the distance. Of course, but also prefabricated (rigid) parts could be used for this purpose.
  • the assembly 1 can be enveloped by a protective jacket 16 made of a potting material.
  • a protective jacket 16 made of a potting material.
  • the connection string - similar to the wire bonding - in a process step subsequent to the application process for the connecting strand with a potting compound together with the semiconductor chip are protected from environmental influences.
  • Such an encapsulation gives the assembly in particular a higher mechanical stability and thermal capacity.
  • optically transparent or non-transparent potting material can be used.
  • FIG. 2c Such an arrangement is shown in FIG. 2c.
  • one of the end points 5 of the connecting strand 4 is arranged on an end face 19 of the semiconductor chip 2. It is even conceivable to provide the other end point at the end face designated by 21 of the component 3.
  • FIGS. 3 and 4 show assemblies 1 with a plurality of connecting strands 4. As these two exemplary embodiments show, various embodiments of electrically conductive active connections are possible.
  • FIG. 5 illustrates an assembly 1 with a plurality of semiconductor chips 2.
  • the semiconductor chips 2 are arranged in a row on a substrate 10, for example a leadframe or a printed circuit board.
  • a semiconductor chip 2 is assigned a conductive support surface 14 in each case.
  • the connecting strands 4 establish an electrically conductive connection to the respective connecting surfaces 8.
  • FIGS. 6 to 9 and FIGS. 10 and 11 show assemblies 1 which, in contrast to FIGS. 1 and 2, have no step or level difference between chip top side 7 and contact surface 8. This is achieved by the semiconductor chip 2 being recessed into a receptacle 11 of the substrate 10.
  • Such receptacles could be easily manufactured by a forming process.
  • a corresponding forming device (not shown) can be used.
  • Such assemblies are particularly preferably applicable to the use of LED or laser diode chips.
  • FIG. 10 shows an assembly in which a semiconductor chip 2 is inserted into a receptacle 11 of a substrate designated by 3.
  • an electrically conductive connection surface 8 is provided for the connecting strand 4.
  • the recess for the receptacle 11 is advantageously to be selected such that the chip top side 7 extends approximately flush with the connection surface 8.
  • This flush arrangement can also be seen from FIG.
  • the arrangement has the advantage that during the application process, the application device 12 (cf., but FIG. 2) would only have to be moved along the respective top sides (chip top side 7, connection surface 8) which lie on the same plane. In particular, it would thus be possible to avoid a movement vertically to the tops of the components during the application process.
  • the connecting strand 4 has a cantilevered section which bridges the gap between the semiconductor chip 2 and the terminal surface 8 of the substrate 3. It may be advantageous if this section is also supported.
  • FIG. 1 To bridge a distance between the semiconductor chip 2 and the substrate is an electrically insulating filler material 15th arranged, which supports the connection strand 4.
  • the cross-sectional shape of the filling material is predetermined by the design of the receptacle. In Figure 8, therefore, the filler 15 is formed in cross-section approximately wedge-shaped. The filler could be poured in liquid or pasty form in the appropriate area.
  • the assembly 1 is encapsulated.
  • the outline of a protective cover 16 of the encapsulation is indicated by a dashed line (FIG. 9).
  • bridge element 9 bridges the distance between the component 3 and the semiconductor chip 2.
  • the bridge element 9 has a bridge section which is arranged between the edges of the substrate 10 and the component 3 that are spaced apart from one another.
  • the connecting strand 4 is thus supported over its entire length between the end points 5 and 6.
  • the inventive connecting string arrangement is not only suitable for producing an electrically conductive operative connection between a semiconductor chip and a substrate, but also for joining together semiconductor chips. Examples of such assemblies are shown in the (schematized) Figures 12-17.
  • the semiconductor chip 7 is connected to adjacent semiconductor chips 3 and 3 'by connecting strands 4.
  • the semiconductor chips 2, 3 and 3 ' are evidently arranged in a row.
  • the connecting strands 4 are designed to be self-supporting over a relatively large distance.
  • the connecting strands 4 advantageously run approximately straight on the plane defined by the chip top sides 7 and 8, respectively. In order to prevent excessive sagging, however, the distance between the semiconductor chips should not be too large.
  • FIGS. 16 and 17 show a further embodiment variant.
  • the semiconductor chips 2, 3 and 3 ' are deposited on an electrically insulating base surface 18 arranged on a substrate 10. This base surface 18 is intended to prevent a short circuit caused by the pulled down connecting strands 4.
  • a contiguous base surface FIGS. 16, 17
  • the end faces 19 of the semiconductor chips 7, 8 can also be connected to one another by connecting strands 4.
  • a connecting strand could also connect an end face of a semiconductor chip to an upper side of an adjacent semiconductor chip.
  • Figures 18 and 20 show variants of cross-sectional shapes of the connecting strand in the region of the chip top side 7 or Terminal surface 8.
  • Figure 18 shows an approximately circular configuration (circle segment).
  • FIG. 19 shows a band-like, electrically conductive connecting strand 4 made from a material which can be applied in pasty or liquid form.
  • the connecting strand 4 according to FIG. 19 can enable a surface connection between the components 2 and 3 (FIGS. 20, 21). However, in procedural terms, a corresponding applicator would also move along a line here to apply the connecting strand.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un bloc de composants dans lequel une puce à semi-conducteur (2) et un autre élément (3), par exemple un support de circuit fixe ou flexible ou une grille de connexion, sont interconnectés par un conducteur de connexion (4). Ledit conducteur de connexion (4) se compose d'une masse électroconductrice pouvant être appliquée sous forme pâteuse ou liquide.
PCT/EP2005/055133 2005-10-10 2005-10-10 Bloc de composants comprenant au moins deux elements cooperant de maniere electroconductrice et procede permettant de produire ledit bloc de composants WO2007042071A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2005/055133 WO2007042071A1 (fr) 2005-10-10 2005-10-10 Bloc de composants comprenant au moins deux elements cooperant de maniere electroconductrice et procede permettant de produire ledit bloc de composants
TW095136704A TW200735736A (en) 2005-10-10 2006-10-03 Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/055133 WO2007042071A1 (fr) 2005-10-10 2005-10-10 Bloc de composants comprenant au moins deux elements cooperant de maniere electroconductrice et procede permettant de produire ledit bloc de composants

Publications (1)

Publication Number Publication Date
WO2007042071A1 true WO2007042071A1 (fr) 2007-04-19

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PCT/EP2005/055133 WO2007042071A1 (fr) 2005-10-10 2005-10-10 Bloc de composants comprenant au moins deux elements cooperant de maniere electroconductrice et procede permettant de produire ledit bloc de composants

Country Status (2)

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TW (1) TW200735736A (fr)
WO (1) WO2007042071A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015034664A3 (fr) * 2013-09-04 2015-07-23 Osram Sylvania Inc. Système pour fixer des dispositifs sur des substrats souples
WO2018109651A1 (fr) * 2016-12-14 2018-06-21 Osram Gmbh Procédé de connexion de formations électroconductrices, structure de support correspondante et dispositif d'éclairage
EP3429322A1 (fr) * 2017-07-11 2019-01-16 OSRAM GmbH Procédé de production de structures de support pour dispositifs d'éclairage et dispositif correspondant

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509837B (zh) * 2011-01-17 2015-11-21 Advanced Optoelectronic Tech 發光二極體晶粒及其製造方法、發光二極體封裝結構
TWI806793B (zh) * 2018-08-28 2023-06-21 晶元光電股份有限公司 半導體裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002050903A1 (fr) * 2000-12-21 2002-06-27 Gemplus Organe d'isolation decoupe et connexion par cordon de dispense
US6435414B1 (en) * 1997-03-27 2002-08-20 Gemplus Electronic module for chip card
FR2823011A1 (fr) * 2001-03-30 2002-10-04 Gemplus Card Int Connexion par depot de cordon conductrice sur zone de raccordement delimitee par masque isolant
DE10228484A1 (de) * 2001-06-28 2003-01-16 Sumitomo Bakelite Co Elektrisch leitfähige Paste und Halbleitervorrichtung, die unter Verwendung der Paste hergestellt wird

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435414B1 (en) * 1997-03-27 2002-08-20 Gemplus Electronic module for chip card
WO2002050903A1 (fr) * 2000-12-21 2002-06-27 Gemplus Organe d'isolation decoupe et connexion par cordon de dispense
FR2823011A1 (fr) * 2001-03-30 2002-10-04 Gemplus Card Int Connexion par depot de cordon conductrice sur zone de raccordement delimitee par masque isolant
DE10228484A1 (de) * 2001-06-28 2003-01-16 Sumitomo Bakelite Co Elektrisch leitfähige Paste und Halbleitervorrichtung, die unter Verwendung der Paste hergestellt wird

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015034664A3 (fr) * 2013-09-04 2015-07-23 Osram Sylvania Inc. Système pour fixer des dispositifs sur des substrats souples
WO2018109651A1 (fr) * 2016-12-14 2018-06-21 Osram Gmbh Procédé de connexion de formations électroconductrices, structure de support correspondante et dispositif d'éclairage
EP3429322A1 (fr) * 2017-07-11 2019-01-16 OSRAM GmbH Procédé de production de structures de support pour dispositifs d'éclairage et dispositif correspondant

Also Published As

Publication number Publication date
TW200735736A (en) 2007-09-16

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