WO2014114398A1 - Ensemble d'éclairage pourvu d'un composant optoélectronique - Google Patents

Ensemble d'éclairage pourvu d'un composant optoélectronique Download PDF

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Publication number
WO2014114398A1
WO2014114398A1 PCT/EP2013/075702 EP2013075702W WO2014114398A1 WO 2014114398 A1 WO2014114398 A1 WO 2014114398A1 EP 2013075702 W EP2013075702 W EP 2013075702W WO 2014114398 A1 WO2014114398 A1 WO 2014114398A1
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WO
WIPO (PCT)
Prior art keywords
conductor layer
carrier plate
component
lighting arrangement
contacting
Prior art date
Application number
PCT/EP2013/075702
Other languages
German (de)
English (en)
Inventor
Farhang Ghasemi Afshar
Jörg SORG
Ralph Wirth
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2014114398A1 publication Critical patent/WO2014114398A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • the present invention relates to a lighting arrangement with an optoelectronic component arranged on a carrier plate and to a method for the production thereof.
  • LED semiconducting material optoelectronic component
  • the present invention is based on the technical problem to provide a particularly advantageous lighting arrangement.
  • a lighting arrangement comprising a carrier plate, an optoelectronic component and a contacting body which comprises a first insulating body (hereinafter also referred to as “insulating body”) and an electrically conductive first conductor layer (hereinafter also referred to as “conductor layer”);
  • the component and the contacting body are arranged side by side on the support plate and the component is electrically conductively connected to the conductor layer, via a component with ⁇ element and conductor layer each directly connected Connecting element, so that the component can be contacted by contacting the conductor layer of the contacting body.
  • the invention relates to a method for producing such a lighting arrangement, comprising the steps:
  • the picking up and placing of the contacting body or a plurality of contacting bodies can also be less complicated than the working out of a corresponding printed conductor structure from a flat material; The production cost can therefore be reduced approximately in comparison to an etching of the conductor track structure of a printed circuit board.
  • the component and the Kunststoff muscless stresses are also arranged at the same height, so are beispielswei ⁇ se parallel from one facing to the component and Kunststofftechniks redesign surface of the carrier plate surface ge ⁇ cut, in particular of a parallel to the surface plane.
  • “height” refers generally to a direction perpendicular to said surface (pointing in the direction of the surface normal), which is accordingly also referred to as “height direction”;”Lenght” and “width direction” are perpendicular to each other and to each other, so are parallel to said surface.
  • ⁇ provided, as well as a plate having a metallic surface may be provided for example as a carrier plate (with a metal coating or a continuous metallic plate); due to the insulating body, the conductor layer is electrically isolated from the carrier plate.
  • the carrier plate with a metallic surface can be used, for example, for a back-side contact of the component, for example via a solder joint; regardless of an electrical contact, such may also be of interest for thermal reasons.
  • a support plate with a metallic surface, for example, a plurality insulating body and because the conductor layers are not electrically short-circuited due to the insulation body ⁇ serve a wiring, such as terminals for anode and cathode.
  • the "insulator” is semiconductive neither metal- yet, but precisely electrically insulating It may Example ⁇ , be provided of glass, a ceramic material or an insulating body;. Is possible also an insulating body made of a plastic material, preferably a non-ther ⁇ tic plastic, for example, from a resin such as FR4 ⁇ example.
  • the first Insulating body is preferably not a layered body, which can simplify manufacturing and reduce costs.
  • the conductor layer is provided on the upper side of the insulating body;
  • layer means that the extent in the longitudinal / width direction is at least partially greater than in the height direction (which, however, is generally not intended to exclude a partially thickened conductor layer.)
  • the conductor layer may have an area of, for example, at least 0.1 mm 2 , 0.2 mm 2 , 0.5 mm 2 , 1 mm 2 , 2.5 mm 2 or 5 mm 2 (independent of the specific material); Upper limits are approximately 25 mm 2 , 20 mm 2 , 15 mm 2 and 10 mm 2 .
  • possible minimum thicknesses can be 30 .mu.m, 40 .mu.m or 50 .mu.m and (independently of this) in the case of the conductor layer at 2.5 .mu.m, 5 .mu.m, 7.5 .mu.m, 10 .mu.m or 12.5 yards; Moegli ⁇ surface (independent of the lower limits) limits the Isola- tion body thickness may be about 2 mm, 1.5 mm, 1 mm, 0.75 mm, 0.5 mm, 0.25 mm, 0.1 mm, 0, 09 mm and 0.08 mm, Moegli ⁇ che upper limits of the conductor layer thickness at, for example 100 .mu.m, 80 .mu.m, 60 .mu.m, 40 .mu.m, 30 .mu.m and 20 .mu.m.
  • minimum thickness in the case of the device at 50 ym, 60 ym, 70 ym, 80 ym, 90 ym, 100 ym, 110 ym, 120 ym, 130 ym or 140 ym lie ⁇ gen and (independently thereof) in the case of the support plate at 0.1 mm, 0.2 mm, 0.3 mm and 0.35 mm, respectively; possible (independent of the lower limits) upper limits of the component thickness may be about 500 ym, 400 ym, 300 ym, 200 ym, 180 y and 160 ym, possible upper limits of the carrier plate thickness at beispielswei ⁇ se 5 mm, 4 mm, 3 mm, 2 mm, 1 mm, 0.8 mm and 0.6 mm, respectively.
  • the component and / or the Kunststoff Obers stresses sets are listed directly on the carrier plate, if any of the structural integrity of a component or of justifyleiters redesign and Stroma-promoting tie layer apart;
  • the component and / or the contacting body are connected via a joint connection with the carrier plate, for example by gluing or soldering.
  • the Kunststoffels stresses is thus provided that the conductor layer, the upper surface of the insulation body ⁇ substantially covers, namely in this order with increasing preference at least 70%, 80%, 90%, 95%; Insulation body and conductor layer extend substantially congruent, by vertical projection of conductor layer and insulation body on the support plate erge ⁇ bende projection surfaces have an intersection of increasingly preferred in this order at least 70%, 80%, 90% and 95% of vertical Projection of the insulating body in the overall resulting projection surface.
  • the one-piece, molding material are covered, preferably a material including Silikonma-.
  • the potting material is provided so sol ⁇ chehog that the component is completely encapsulated due to the Umman- tion, so all surfaces are covered by it, for example, together from Vergussmateri- al and backing plate; It can thus for example, the potting ⁇ material, the top and side surfaces of the device be ⁇ cover and lie around the component peripherally on the support plate, preferably as a result of curing adhere (the Vergussma- terials) on the carrier plate, which covers the underside of the component.
  • the molding material also to be ⁇ least partial conversion of the emitted light from the device serving phosphor may for example be embedded; the light emitted by the lighting arrangement can then be the light emitted by the phosphor (full conversion) or a mixture of phosphor and component light (partial conversion).
  • the conductor layer of the contact-could body also completely covered with potting material and carried contacting "outwardly", that is to towards the application environment, for example via a potting material souset ⁇ collapsing displacement contact.
  • a contact area of the conductor layer is left free of potting material, for example, an area fraction of at least 10%, 20% or 30% and (independently thereof) of, for example, at most 90%, 80% and 70%, respectively.
  • the portion of the conductor layer not covered with potting material can be kept free, for example by a delimiting element such as a dam or a molding tool.
  • the corresponding range can also be initially covered with potting material and then subsequently exposed ⁇ hd, after at least partial hardening of the casting material, for example by exposure with a laser or by an etching process.
  • the present invention can con- takt ists stresses because of the insulation body on ei ⁇ ner carrier plate with a metallic conductive surface to be ordered;
  • a support plate with a metallic coating but a continuous consisting of metallic material, preferably before ⁇ integrally support plate is provided.
  • the component and conductor layer electrically conductive verbin ⁇ Dende connecting element is preferably a bonding wire, examples game as gold, copper or aluminum or its alloys.
  • the contact between the bonding wire and Bauele ⁇ element or conductor layer can be formed for example by thermal compression bonding, thermosonic ball-wedge bonding or ULT raschall-wedge bonding;
  • electrically conductively connected in particular with regard to use, is to be understood such that, via the conductor layer and connecting element, current is supplied to or removed from the component for its operation.
  • the upper side of the conductor layer rises away from the carrier plate, that is, different regions of the conductor layer upper side have a different distance from the carrier plate (are at different heights); the surface of the conductor layer can al ⁇ so for example have a step-shaped course.
  • the connecting portion is formed in which the contact between the conductor layer and connecting element is in the ⁇ ser embodiment arranged at a lower height than a for contacting the conductor layer "outwardly" provided contact region; in the case of step-shaped configuration are connections and contact area then in each case as is provided substantially parallel to the support plate extending plateau.
  • the contact area can for example in this order with increasing preference at least 25%, 50% or 75% hö ⁇ forth are available as the connection area (based on its distance to the top side of the carrier plate); Possible upper limits can be, for example, 400%, 300% or 200%.
  • insulation ⁇ body for example, have a substantially constant height and its vorgese ⁇ hen a conductor layer in accordance with changing thickness; preferably, however, a top surface of the insulation body describes the course and it is a conductor layer with ⁇ provided substantially constant thickness (the thickness is taken in the vertical direction).
  • An advantage of this embodiment can be found, for example, insofar as the conductor layer (the contact region) can rise from a potting material and thus does not have to be kept separate during potting. Further, moving the contact area to another "level" (height) may also be of interest in terms of a compact design (in terms of lateral dimensions).
  • a bridge-shaped contacting body is provided; so it closes in the longitudinal or width direction, in which the encryption binding and the contact area are sequentially angeord ⁇ net, another area which is with the fastening area approximately at the same height.
  • the region and the connection region can be in direct contact with the carrier plate, for example (apart from a connecting layer if appropriate, see above).
  • Such a bridge-shaped contacting body can offer advantages in the production of the illumination arrangement
  • potting with potting material can take place in two steps, wherein first a dam (seen from above, for example, approximately linear) is applied, which then for the actual molding material will provide a lateral Be ⁇ limitation (the dam defines an upwardly open cavity to the side).
  • the bridge-shaped contacting body can be arranged after the application of the dam, but still before filling the actual potting material on the support plate, and indeed such ⁇ Shen that it bridges the dam.
  • a compact design with respect to the lateral extent can be made possible (compared with a dam guided externally around the contacting body);
  • the application of the dam is not affected by the contacting body, which could be the case, for example, in a dam adjacent to the contacting body (in other words, a dam interrupted by the contacting body may be more complicated to apply).
  • a second (with the first multi-piece) insulating body is provided for the Kunststoff ists redesign in addition to the first insulating body, namely above the first conductor layer; more preferably, the second insulating body is arranged directly on the first conductor layer, optionally apart from a connecting layer, such as an adhesive layer, which mediates the structural cohesion between the first conductor layer and the second insulating body.
  • First conductor layer and first insulating body may in this case extend, for example, in the above sense is substantially de ⁇ congruent, and there may be provided in this case in the second insulating body connections and contact area releasing recesses; Looking from above onto the contacting body, connection and contact area are "separated" from one another by the second insulation body. (The first conductor layer runs under the second Isolati ⁇ ons stresses nonetheless continuously).
  • a corresponding second insulating body provided on the first conductor layer may be advantageous, for example, when casting with potting material; the connecting portion of the first conductor layer (in which, for example, a construction of the ⁇ element and the first conductor layer connecting the bonding wire is disposed) is namely limited by the second insulating body in the lateral direction. It can then be filled in an upwardly open, partially limited by the second insulating body cavity potting material; as soon as the potting material thereby exceeds the height of the first conductor layer, the releasing from the connecting portion can ⁇ recess in the second insulating body is a covering of the conjunction portion to, but keeps the second insulating body at the same time the contact area of potting material free.
  • the top of the second Isolationskör ⁇ pers, in particular a component facing the upper edge thereof represent a Aufhellgrenze, to which the upwardly open cavity is filled with potting material or is.
  • the second insulating body may for this purpose have a thickness of, for example, at least 100 ym, 200 ym, 300 ym and 400 ym respectively; possible upper limit values independent of the lower limit are for example 2 mm, 1.5 mm and 1 mm, respectively.
  • the question raised by the second insulating body provided Load Limit may be advantageous in so far as, as the height of a lower manufacturing Kunststofftechniks stresses ⁇ fluctuation may be subject as for example a lateral boundary serving dam.
  • a body made available by the contact-load limit can therefore help reduce the play as part-to-part distribution of Vergussmaterial Escape at ⁇ ; This may be advantageous insofar as embedded in the casting material about in case Phosphor particles may affect the height of the potting material and the color of the light.
  • a resultant by the vertical projection of the second insulation ⁇ body to the support plate surface can body resulting surface, for example, an area percentage of at least 20%, 30% and 40%, and (limit at a through vertical projection of the entire contact-making of this sub ⁇ independently) of, for example, at most 80%, 70% and 60%, respectively.
  • releasing recesses introduced and its area ratio is reduced accordingly.
  • a further electrically conductive, with the first conductor layer is not provided ein Seriali- ge second conductor layer for which all disclosed prior ⁇ above for the first conductor layer information should be disclosed moving ⁇ chelose (thickness, material, capping ⁇ is degree of including lying insulation body, ).
  • the component is electrically conductively connected to the second conductor layer, either a (second) connecting ⁇ element, are intended to be for which also the above disclosed for the (first) connecting member information disclosed or via a further component; so it can ⁇ example, a plurality components to be connected in series and the first conductor layer can provide a cathode contact the series scarf ⁇ tung available an anode contact and the second conductor layer.
  • the second conductor layer can be provided, for example, on the same insulating body as the first conductor layer, so it can also be a Needlesticiansêt a plurality
  • the second conductor layer is arranged on the same contacting body but on another (third) insulating body; the third insulating body is provided in addition to the first insulating body, preferably together with a / the second insulating body (the insulating body are Recstü- ckig).
  • the second conductor layer is thereby provided, however, at the top of drit ⁇ th insulating body, below the second isolati ⁇ ons stressess; from the carrier plate in the height direction, the order is thus: first insulating body, first conductor layer, third insulating body, second conductor layer and second insulating body.
  • the "second insulator” is thus arranged at the top also in the case of a plurality (> 3) insulation body and should preferably also the functions described vorste ⁇ starting meet ( "lateral limitation” / "Load Limit").
  • Such Kunststoffels stressess stresses can (at least) advantageously provide an anode and a cathode contact for the Ver ⁇ addition and at the same time, due to the second, provided above the insulating body, an open holding the card contacts rich of potting material in a comparatively easy way of enabling (see above).
  • the corresponding layered contacting body can, for example, be composed of a plurality of insulating bodies, each provided with a conductor layer on the upper side; it is thus with ⁇ game as the third insulating body (provided on the upper side of the second conductor layer) to the first provided on the upper side of the first insulating body ⁇ wire Layer set and about a joint connection, in particular an adhesive bond associated with it.
  • the second insulating body can be placed on the second conductor layer and likewise connected to it via a joining connection.
  • the geometry of the individual layers can be kept relatively simple; due to the layer structure can be realized ⁇ wiring certain complexity however.
  • the surfaces resulting from the vertical projection of the first conductor layer and the first insulation body onto the carrier plate can predetermine the projection surface of the contacting body as a whole in such a multilayer contacting body;
  • At least four recesses may then be introduced from the side into the second insulation body arranged on the second conductor layer, of which at least two are congruent with the at least two recesses in the third insulation body / second conductor layer, so that the connection and contact region of the first conductor layer also from the third Isolation body are kept free.
  • Insulating bodies keep connection and contact area of the second conductor layer free.
  • the two conductor layers are connected to one another via a protective diode;
  • a protective diode In the case of an ESD pulse, for example, this can protect the component against overvoltage and thus damage.
  • the protective diode can also be used in the above Paragraphs described to be provided at different heights conductor layers;
  • the protective diode is preferably provided between two conductor layers lying at the same height, particularly preferably as an SMD component (surface mounted device).
  • the invention also relates to the use of a lighting arrangement for the electrically conductive contacting of the component, namely by a contacting of the conductor layer "outwards" to an application environment, the contacting can take place, for example, via a soldering or clamping connection.
  • FIG. 1 shows a lighting arrangement with carrier plate, LED and contacting body in a sectional view.
  • FIG. 2 the illumination arrangement of FIG. 1 in one
  • Fig. 3 shows a lighting arrangement with an alternative
  • FIG. 4 the illumination arrangement of FIG. 3 in one
  • Fig. 5 is a Why istsharm with one of the
  • PCB away elevating conductor layer shows a bridge-shaped contacting body
  • FIG. 7 shows a lighting arrangement with a contacting body according to FIG. 5 in a sectional illustration
  • FIG. 8 shows the illumination arrangement according to FIG. 7 in an oblique view
  • FIG. 9 shows a lighting arrangement with a contacting body according to FIG. 6 in a sectional illustration
  • FIG. 10 the illumination arrangement of FIG. 9 in a
  • FIG. 11 shows a lighting arrangement with a contacting body, which comprises a first and a second insulating body
  • FIG. 12 shows a lighting arrangement whose contacting body comprises a first conductor layer and a second conductor layer as well as a first insulation body and a second insulation body;
  • FIG. 13 shows a contacting body with a first and a second conductor layer, which are arranged at different heights
  • FIG. 1 shows a lighting arrangement 1 according to the invention with a carrier plate 2 on which an LED 3 and a contacting body 4 are arranged; the Kunststoff ists ⁇ body 4 is made of an insulating body 5 and provided thereon a conductor layer 6 constructed, see FIG. the enlarged view in Fig. La.
  • Fig. 1 (and also Figs. 7, 9 and 13a) is the section ⁇ plane perpendicular to the surface of the support plate 2;
  • Cutting plane includes the height direction.
  • a metallization 7 of the LED 3 is electrically conductively connected to the conductor layer 6 via a bonding wire 8, shown schematically here, via a so-called ball-wedge connection (the wedge contact is seated on the conductor).
  • Layer 6 The carrier plate 2 is made of copper (alternative materials are for example aluminum or plastic), and the LED 3 is glued to the support plate 2 (the between the LED 3 and the support plate 2 formed adhesive material layer is the sake of clarity not Darge ⁇ asserted).
  • the support plate 2 has a thickness of 0.5 mm, the LED 3 has a thickness of 150 ym, the first insulating body 5 has a thickness of 60 ym and the conductor layer 6 has a thickness of 18 ym.
  • the LED 3 is encased in this embodiment of a Sili ⁇ konmaterial 9; In the production of the LED 3 and the Needlesssenssens stresses 4 are first arranged on the support plate 2 and then a bond with the bond ⁇ wire 8 is prepared before being potted with silicone material 9. Which then solidified to some degree Silikonma ⁇ TERIAL 9 encases the LED 3, the bonding wire 8 and a portion of the conductor layer 6; LED 3 and bonding wire 8 are completely encapsulated.
  • FIG. 2a shows an oblique view of the illumination arrangement 1 with the LED 3 encased in the silicone material 9 and the contact body 4 only partly covered with the conductor layer 6 (not resolved as a separate layer for the sake of clarity) in the region of the non-silicone material Conductor layer 6, the lighting arrangement 1 can be contacted "from the outside", for example, by a wire soldered or a terminal contact is ⁇ introduced .
  • the illumination arrangement 1 is with respect to a right to in Fig. 2 posterior rear side (the right-in Fig. 1 page area corresponds) in translation or constructed aptsymmet ⁇ driven, so there are a plurality of LEDs 3 are connected in series, and is at the last LED 3 of the series an elec- rischer contact led to a secondmaschinetechniks redesign, both via a bonding wire.
  • an anode / cathode contact By contacting the two conductor layers, an anode / cathode contact can be made and the series-connected LEDs can be supplied with power.
  • Fig. 3 shows such a lighting arrangement 1 with a plurality of LEDs connected in series, wherein for the sake of clarity again only one LED 3 and one of the two contacting body 4 is shown.
  • FIG. 4 shows the contact area 41, exposed accordingly by exposure, of the conductor layer 6, which is otherwise covered with silicone material 9, in a plan view, that is to say from above onto the carrier plate 2.
  • the contacting body 4 can, as explained with reference to FIG. 1, be constructed of insulation body 5 and conductor layer 6 provided thereon; it is then so the first Isolati ⁇ ons redesign 5 directly connected to the support plate 2, for example via an adhesive connection.
  • the contacting body 4 can also comprise an additional underside metallization layer, namely a (indicated in broken lines in FIG. 1 a) opposite the conductor layer 6. set side of the insulation body 5 provided Metalli ⁇ s réelles slaughter 42nd
  • the conductor layer 6 is made of a copper material provided with a thin (not shown for clarity) surface coating of NiPdAu, which facilitates the formation of a bond connection.
  • the first insulating body 5 is constructed of a glass fiber / resin mixture (material identifier FR4). Except as provided, the further lower side metallized layer 42 a copper ⁇ layer.
  • Figures 5 and 6 show Kunststoff matterss stresses 4 having a gradually-shaped (not shown) of the circuit board 2 away elevating guide layer 6.
  • a joint portion 51 is formed in which the contact between the conductor layer 6 and connection ⁇ element 8, is lower and therefore the carrier - Plate 2 closer than the contact area 41, in which the contact of the illumination arrangement 1 "out", the application environment takes place, see, for example, the sectional view in Fig. 7.
  • FIGS. 7 and 8 show the contacting body according to FIG. 5 after installation in a lighting arrangement 1, specifically FIG. 7 in a section perpendicular to the printed circuit board 2 and FIG. 8 in an oblique view.
  • connection region 51 like the LED 3 and the bonding wire 8, is covered by the potting material 9;
  • the contact region 41 protrudes from the potting material 9 because he based
  • An advantage of the lighting arrangement 1 according to FIGS. 7 and 8 can be that the contact area 41 does not have to be kept free during the filling of the potting material 9 or subsequently exposed, but rather due to the fact that the contact area 41 has been replaced comparatively higher position remains free.
  • the LEDs 3 and the contacting bodies 4 are first arranged on the carrier plate 2 and connected to the carrier plate 2 in each case via an adhesive connection.
  • the illumination arrangement 1 according to FIGS. 7 and 8 is in turn constructed to be translational or mirror-symmetrical; there are a lot of LEDs
  • a dam 71 is applied from a silicone-based material, by dispensing.
  • the dam 71 surrounds the LEDs 3 and the contacting bodies 4 and thus provides for the subsequent filling of the potting material 9, so the silicone material, a lateral boundary
  • the silicone material 9 can harden in the upwardly open cavity delimited by the dam 71 and then protects the LEDs 3 in an application environment.
  • FIGS. 9 and 10 show a contacting body according to FIG. 6 integrated in a lighting arrangement 1, again in a section perpendicular to the support plate 2 and in an oblique view.
  • the dam 71 is filled with potting material 9 (a silicone material); the protruding from the potting material 9 contact area 41 remains free for contacting the application environment.
  • An advantage of the lighting arrangement 1 according to FIGS. 9 and 10 is that the lateral extent of the area filled with potting material 9 is kept compact, which may also be advantageous with regard to the material costs (the potting material 9 may be offset with phosphor particles serving for light conversion; However, when applying the dam 71 no special geometric boundary conditions are to be considered, which would be the case if the dam 71 in the embodiment according to FIG. 8 were not guided around the contacting body 4 but only up to the side wall.
  • FIG. 11 shows a lighting arrangement 1 with a contacting body 4, which is constructed from a first insulating body 5, a conductor layer 6 provided thereon and a second insulating body 111 provided on the first conductor layer 6.
  • the second insulating body 111 has in principle a ERS ⁇ th insulating body 5 and the conductor layer 6 corresponding outer shape (viewed from above); However, recesses are introduced from the side into the second insulating body 111, namely at two corners and a side opposite thereto.
  • the recesses provided at the corners keep two contact areas 41 (located at the same potential, alternatively or jointly usable) free; the laterally inserted recess keeps free a connection portion 51 in which is arranged the electrical connection to the LED 3 producing Bondkon ⁇ clock.
  • the LEDs 3 and the two end-side contacting bodies 4 are first mounted on the carrier plate 2 (translation or mirror-symmetrical structure, cf. FIG. 14), in each case by means of one adhesive bond.
  • an upwardly open cavity with potting material 9 is filled to cover the LEDs 3.
  • the cavity with respect to the width direction (which is parallel to the support plate 2 and perpendicular to the support plate ⁇ 2 parallel, the series-connected LEDs 3 passing longitudinal direction) of a not shown in Fig. 11 forming tool is limited.
  • the contacting body 4 limits the propagation of the potting material 9 in the longitudinal direction, where ⁇ in the case of the insulator body 111 disposed on the insulating body 111 allows a Vergussmaterial total height at which the potting material 9, the conductor layer 6 projects beyond a height corresponding to that of the second insulating body 111.
  • the region of the cavity delimited by the lateral recess in the second insulation body 111 is also filled with potting material 9, so that the bonding wire 8 projecting a little way beyond the conductor layer 6 is also encapsulated with potting material.
  • a lateral upper, the LEDs 3 facing edge 112 of the second insulating body 111 is when filling the Kavi ⁇ ity with potting material 9 is a refill limit; in that the filling is not controlled according to the Vergussmaterialmenge done, but the cavity is filled until the level reaches the Auf Schollsky 112 of the potting material 9, a good reproducibility of the total potting material height can be achieved.
  • FIG. 12 shows a lighting arrangement 1, the contacting body 4 of which corresponds to that of FIG. 11 insofar as a first insulation body 5 and a second insulation body 111 provided with a recess are provided.
  • a first insulation body 5 and a second insulation body 111 provided with a recess are provided.
  • the LEDs 3 are also connected in series in the case of the illumination arrangement according to FIG. 12, although a separate contact-making body 4 is not provided for anode / cathode contact, but the first conductor layer 6 provides the cathode contact to the anode and the second conductor layer 121 available. Accordingly, no second contacting body is necessary at the end of the lighting arrangement 1 opposite the contacting body 4; There, the two rows of LEDs arranged side by side with respect to the width direction are electrically conductively connected via a bonding wire, so to speak a loop is closed. Between the first and second conductor layer 6, 121, a protective diode 122 is provided; this SMD component protects the
  • FIG. 13 shows a contacting body 4, which also has a first conductor layer 6 and a second conductor layer 121; however, the second conductor layer 121 is not provided on the first insulation body 5 but on another, third insulation body 131.
  • the second insulating body 111 is arranged, are introduced in the four recesses, of which two connection and contact area 5, 41 of the second conductor layer 121 release.
  • the two further recesses in the second insulation body 111 correspond to two recesses in the third insulation body 131 (and in the second conductor layer 121), so that in ⁇ total connection and contact area 51, 41 of the first Lei ⁇ ter Mrs 6 are kept free.
  • the contacting body 4 provides an anode and a cathode contact with the first and the second conductor layer 6, 121, wherein the two conductor layers 6, 121 (apart from the recesses in the second conductor layer 121) have a simple geometry, which in manufacturing ⁇ aspect is advantageous.
  • the modular construction of the Kunststofftechnischs stressess can provide 4 advantages because the second insulating body can also be glued UNMIT ⁇ telbar on the first conductor layer 6111 "simple" for producing a justifyleiters stressess according to Figure 11; with an identical second insulating body 111 can be But just realize a Kunststofftechnischs redesign 4 of FIG. 13 with a plurality of conductor layers 6, 121, which can help reduce the number of different components to be kept.
  • Fig. 13a shows the contacting body 4 in a section.
  • the third insulating body 131, on which the second Lei ⁇ ter Mrs 121 is provided, is set ⁇ adhered to the provided on the first insulating body 5 first conductor layer 6; the adhesive layer is ⁇ with crossed lines Darge.
  • the second insulation body 111 is glued (the adhesive connection is again shown with crossed lines).
  • Fig. 14 shows a total of a lighting device 1 having a plurality of serially connected LEDs 3 and two, respectively end of the row of LEDs 3 provided for contact-making bodies 4.
  • This strip-shaped LED module may, ⁇ example, in an elongated glass envelope is set to be part of an intended as a replacement for a T8 fluorescent lamp Leuchtmit- means of.
  • the invention also relates to the use of a lighting arrangement with a contact body according to the invention for electrically contacting the LED, namely by contacting the first conductor layer "outwards" to an application.
  • the first conductor layer can be contacted, for example, via a soldering or clamping connection.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Ensemble d'éclairage (1) qui comporte un composant optoélectronique (3) disposé sur une plaque de support (2). Pour la mise en contact du composant (3) avec un niveau d'application, un corps de mise en contact (4) constitué d'un corps isolant (5) et d'une couche conductrice (6) reliée au composant (3) par l'intermédiaire d'un élément de liaison (8) est situé sur la plaque de support (2).
PCT/EP2013/075702 2013-01-22 2013-12-05 Ensemble d'éclairage pourvu d'un composant optoélectronique WO2014114398A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013200990.9 2013-01-22
DE102013200990.9A DE102013200990A1 (de) 2013-01-22 2013-01-22 Beleuchtungsanordnung mit optoelektronischem Bauelement

Publications (1)

Publication Number Publication Date
WO2014114398A1 true WO2014114398A1 (fr) 2014-07-31

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PCT/EP2013/075702 WO2014114398A1 (fr) 2013-01-22 2013-12-05 Ensemble d'éclairage pourvu d'un composant optoélectronique

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DE (1) DE102013200990A1 (fr)
WO (1) WO2014114398A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014113991B4 (de) * 2014-09-26 2020-06-04 Osram Oled Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
JP6459949B2 (ja) * 2015-12-21 2019-01-30 日亜化学工業株式会社 発光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1928026A1 (fr) * 2006-11-30 2008-06-04 Toshiba Lighting & Technology Corporation Dispositif d'éclairage doté d'éléments luminescents semi-conducteurs
US20090103005A1 (en) * 2007-10-23 2009-04-23 Norio Nakazato Light Source Module
US20100187547A1 (en) * 2009-01-26 2010-07-29 Oki Data Corporation Image display apparatus
US20110198628A1 (en) * 2008-10-21 2011-08-18 K.M.W. Inc. Multi-chip led package
EP2421060A1 (fr) * 2009-04-13 2012-02-22 Panasonic Electric Works Co., Ltd. Diode électroluminescente

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1928026A1 (fr) * 2006-11-30 2008-06-04 Toshiba Lighting & Technology Corporation Dispositif d'éclairage doté d'éléments luminescents semi-conducteurs
US20090103005A1 (en) * 2007-10-23 2009-04-23 Norio Nakazato Light Source Module
US20110198628A1 (en) * 2008-10-21 2011-08-18 K.M.W. Inc. Multi-chip led package
US20100187547A1 (en) * 2009-01-26 2010-07-29 Oki Data Corporation Image display apparatus
EP2421060A1 (fr) * 2009-04-13 2012-02-22 Panasonic Electric Works Co., Ltd. Diode électroluminescente

Also Published As

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