WO2007029355A1 - Structure de protection - Google Patents

Structure de protection Download PDF

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Publication number
WO2007029355A1
WO2007029355A1 PCT/JP2006/300144 JP2006300144W WO2007029355A1 WO 2007029355 A1 WO2007029355 A1 WO 2007029355A1 JP 2006300144 W JP2006300144 W JP 2006300144W WO 2007029355 A1 WO2007029355 A1 WO 2007029355A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed wiring
wiring board
shield
circuit chip
frame
Prior art date
Application number
PCT/JP2006/300144
Other languages
English (en)
Japanese (ja)
Inventor
Shingo Komura
Tetsuro Tabata
Masato Koyama
Original Assignee
Mitsubishi Denki Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Denki Kabushiki Kaisha filed Critical Mitsubishi Denki Kabushiki Kaisha
Publication of WO2007029355A1 publication Critical patent/WO2007029355A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Definitions

  • the present invention relates to a shield structure for shielding a circuit chip on a printed wiring board.
  • circuit chips are separately soldered for each functional block on both sides or one side of one printed wiring board, and characteristic deterioration due to electrical influence between circuit chips of each functional block has occurred. For things that happen, shield them to prevent deterioration of their characteristics.
  • a printed wiring board there are a plurality of circuit chips, a shield frame that surrounds these circuit chips, and a shield case that includes a shield cover that closes the shield frame.
  • a circuit board having a shield case, which is reflow soldered, and a manufacturing method thereof are provided (for example, refer to Patent Document 1).
  • the shield case includes a shield frame that surrounds the plurality of circuit chips, and a shield cover force that closes the central opening of the shield frame.
  • the body and the shield cover that closes the central opening of the shield frame are subjected to batch reflow processing.
  • the thickness from the first printed wiring board to the second printed wiring board is the sum of the following four, resulting in an increase in the thickness of the electronic device.
  • shield case top plate top surface force gap to the bottom of the second printed wiring board is necessary is that the second printed wiring board and the shield case top plate are in contact with each other This is to prevent the electrical characteristics from being affected.
  • Patent Document 1 Japanese Patent Laid-Open No. 10-335869, page 5, FIG. 1
  • the printed wiring board is divided into a plurality of printed wiring boards for each function.
  • the thickness of electronic equipment increases.
  • the present invention has been made to solve the above-described problems.
  • the casing is required for the shield structure of the conventional electronic device.
  • An object of the present invention is to provide a shield structure for an electronic device in which the thickness of the entire electronic device is reduced by reducing the space inside the body.
  • the shield structure according to the present invention includes a first printed wiring board, a circuit chip having a bottom surface attached to the first printed wiring board, and the first printed wiring board.
  • a shield frame that covers the side surface of the chip and surrounds the circuit chip and has an opening provided at a position corresponding to the top surface of the circuit chip, and a shield pattern is formed on the surface facing the top surface of the circuit chip
  • a second printed wiring board laminated on the first printed wiring board.
  • the circuit chip can be sufficiently shielded and the thickness of the entire electronic device can be reduced.
  • FIG. 1 is an assembly diagram showing an internal configuration of a mobile phone device to which a shield structure for an electronic device according to Embodiment 1 of the present invention is applied.
  • FIG. 2 is a cross-sectional view of the printed wiring board 11 in FIG.
  • FIG. 3 is a cross-sectional view taken along the line 12a-12b of the printed wiring board 12 in FIG.
  • FIG. 4 is a diagram showing a state in which the printed wiring board 11 of FIG. 2 and the printed wiring board 12 of FIG. 3 are connected and further assembled into the chassis frame 51 of FIG.
  • FIG. 5 is an assembly diagram showing the next stage of FIG. 1.
  • FIG. 6 is a perspective view showing an internal configuration of a mobile phone device to which a shield structure for an electronic device according to Embodiment 2 of the present invention is applied.
  • FIG. 7 is a sectional view taken along line l la-l ib of FIG.
  • FIG. 8 is a cross-sectional view showing an internal configuration of a mobile phone device to which a shield structure for an electronic device according to Embodiment 3 of the present invention is applied.
  • FIG. 1 is an assembly diagram showing an internal configuration of a mobile phone to which the shield structure according to Embodiment 1 of the present invention is applied.
  • FIG. 2 is a cross-sectional view taken along line l la-l ib of the printed wiring board 11 in FIG.
  • FIG. 3 is a sectional view of the printed wiring board 12 in FIG. 1 taken along the line 12a-12b.
  • 4 is a diagram showing a state in which the printed wiring board 11 of FIG. 2 and the printed wiring board 12 of FIG. 3 are connected and further assembled into the chassis frame 51 of FIG.
  • FIG. 5 is an assembly diagram illustrating the next stage of FIG.
  • description will be given with reference to FIGS.
  • printed wiring board 11 (second printed wiring board) is an operation unit board, and a dome shape on key switch sheet 4 is formed so as to cover key switch pad 42 on one side. Key switch 41 is arranged.
  • the key switch 41 When a key press switch (not shown) on the operation unit casing is pressed, the key switch 41 is pressed down.
  • the key switch pad 42 has a double ring of copper foil. By lowering, the switch is turned on / off by short-circuiting between the rings.
  • FIG. 5 on the reverse side of the printed wiring board 11 of FIG. 2, that is, on the opposite side of the key switch sheet 4, the copper foil pattern 33 for shielding, the connector 61 connected to the connector 62 of the printed wiring board 12, and the digital memory Medium 23, audio jack connector 68, RF audio circuit and control circuit (not shown) around audio jack connector 68, connector 66 connected to connector 65 of printed wiring board 13, external connection connector to connect external equipment 6 7 is arranged.
  • printed wiring board 12 (first printed wiring board) is a control unit board.
  • BGA type CPU circuit chip 22, BGA type memory circuit chip 21, and others Circuit chip 2 and a shield frame 31 having a shield structure without a top plate surrounding the circuit chip 2 (attached to the first printed wiring board, covering the side surface of the circuit chip, surrounding the circuit chip, A shield frame) having an opening at a position corresponding to the top surface is disposed.
  • a connector 62 connected to the connector 61 of the printed wiring board 11 is arranged outside the shield frame 31 !.
  • a circuit chip 2 is also arranged on the back surface of the printed wiring board 12 and soldered by batch reflow.
  • the shield frame here is a plate formed by bending a metal plate into a mass and then cutting out the lower surface.
  • CPU chip and memory chip, etc. have relatively low frequency! Since the digital circuit is mounted on the inside, the gap due to the stagnation of the printed wiring board on the lid side and the unevenness of the shield frame on the lid side Do not affect the shielding effect!
  • the flexible printed wiring board 14 is manufactured in an integrated structure with the printed wiring board 12, and the connector 63 on the flexible printed wiring board 14 is connected to the connector 64 of the printed wiring board 13. As a result, the printed wiring board 12 is also connected to the printed wiring board 13.
  • a printed wiring board 13 is a radio unit board, and transmits / receives a mobile phone by an antenna control RF circuit.
  • the circuit chip 2 and the connector 65 to be connected to the connector 66 of the printed wiring board 11 are arranged and soldered by batch reflow.
  • connector 64 connected to connector 63 of flexible printed wiring board 14 Is arranged.
  • the chassis frame 5 is assembled in the direction of the arrow in FIG. 1 in the order of the printed wiring boards 12 and 11 from the front side and then the printed wiring board 13 from the back side. It becomes a structure that can be dredged.
  • the CPU chip 22, the memory chip 21, and the circuit chip 2 of the printed wiring board 12 are surrounded, and there is no top plate at a position corresponding to the CPU chip 22 and the memory chip 21.
  • the shield structure 31 and the shield structure surrounded by the printed wiring board 11 will be described.
  • the shield frame 31 is soldered to the cream solder application pattern 8 by the solder layer 9, and the cream solder application pattern 8 and the shield cushion pad 53 are applied to the printed wiring board 12 through the through-hole (see FIG.
  • the shield cushion pad 53 and the shield cushion 52 provided on the magnesium chassis frame 51 come into contact with each other to form a shield case shape without a top plate as a whole (Fig. Four).
  • the shielding copper foil pattern 33 on the opposing printed wiring board 11 is brought into contact with the shield frame 31 of the shield case so as to close the upper surface opening of the shield frame 31 to form a shield structure.
  • the contact is performed by pressing the shield frame 31 on the printed wiring board 12 against the shield copper foil pattern 33 on the printed wiring board 11 using the shield cushion 52 on the chassis frame 51.
  • the shielding frame 31 is formed in a shape in which the top plate facing the shielding copper foil pattern 33 faces the shielding copper foil pattern 33 rather than the horizontal direction. Therefore, the top plate can easily come into contact with the shielding copper foil pattern, and the shielding frame 31 and the shielding copper foil pattern 33 can be reliably conducted with a further restoring force.
  • the shield copper foil pattern 33 on the printed wiring board 11 facing the top plate of the CPU chip 22 and the memory chip 21 is used, and instead of the shield case bottom plate.
  • the chassis frame 51 facing the lower part of the printed wiring board 12 and further inserting the printed wiring board 13 facing the opposite side of the chassis frame 51 the printed wiring boards 11 to 13 and the shield are connected to each other. Alternately stacked Yes. As a result, the total thickness of the combination of each board is reduced, and the GND potential is joined directly with the shielding copper foil pattern 33, the shield frame 31, the chassis frame 52 on the chassis frame 51, etc. Remove the electrical effects of GND.
  • the amount of stagnation of the printed wiring board 11 due to the key press of the key switch 41 is kept small by the rigidity of the shield frame 31, and the stagnation of large parts such as the digital storage medium 23 is regulated. Reduces fatigue of keystrokes in the solder part.
  • the printed wiring board 11 is also installed in the same manner, and assembled into a cellular phone casing (chassis frame 5) after manufacturing.
  • the following assembly is performed using a board (hereinafter referred to as a base board) having a cutting margin for assembling the printed wiring board 12.
  • the first cream solder pattern that couples the plurality of circuit chips 2 and the second cream solder pattern that joins the shield frame 31 are formed by screen printing or the like.
  • the plurality of circuit chips 2 are mounted on the first cream solder pattern
  • the shield frame 31 is mounted on the second cream solder pattern.
  • the base substrate on which the multiple circuit chips 2 and the shield frame 31 are mounted is heated in a reflow furnace to perform batch reflow processing.
  • an automatic inspection machine is used to check whether there are any wetted parts in the soldered parts.
  • the base substrate is turned over and the same process is repeated from the first step to the fourth step. At that time, since the shield frame 31 exists only on one side, the process related to the frame is not performed.
  • the cut margin of the finished printed wiring board 12 is cut off and an electrical test is performed using the test pad 7.
  • underfill is applied to the lower part of BGA and other parts in order to make the structure resistant to drop and key press tests.
  • the shield structure according to the first embodiment includes the first printed wiring board (pre- Printed circuit board 12), a circuit chip (CPU chip 22, memory chip 21) with a bottom surface attached to the first printed wiring board, and a side surface of the circuit chip attached to the first printed wiring board.
  • a shielding frame shield frame 31 having an opening at a position corresponding to the top surface of the circuit chip, and a shield on the surface facing the top surface of the circuit chip.
  • a second printed wiring board laminated on the first printed wiring board. Therefore, even when a plurality of printed wiring boards (printed wiring boards 11 and 12) are stacked and used in the housing, the circuit chip can be sufficiently shielded and the overall thickness of the shield structure can be reduced. .
  • the shield structure according to the first embodiment has a switch element (key switch) that is switched on and off by pressing on the back surface of the surface on which the second printed wiring board force shielding pattern is formed.
  • a pad 42 is provided. Note that when a switch element that can be switched on and off by pressing is provided, a stress is repeatedly applied to the board, and thus a printed wiring board on which such a switch element is generally attached. It is difficult to arrange surface mount components on (printed wiring board 11).
  • the shield pattern according to the first embodiment makes effective use of such a difficult place as a place where the shield pattern is provided, and eliminates the need to take various measures to attach the surface mount component. .
  • the shield structure according to the first embodiment is supported by the second printed wiring board force shield frame. Therefore, when the switch element is pressed, the stress applied to the second printed wiring board by the shield frame can be reduced.
  • the wall surface of the shield frame body is arranged at a position corresponding to the shield frame body force switch element. Therefore, the stress applied to the second printed wiring board can be further effectively reduced.
  • the shield frame provided on the first printed wiring board is in contact with the shield pattern provided on the second printed wiring board.
  • the first printed wiring board and the second printed wiring board are conducted only by the connector. It is done.
  • the GND part where the connector force of the first printed wiring board is also away from the GND part where the connector force of the second printed wiring board is also away is the opposite position. Even so, the potential between the parts may differ to the extent that the electrical performance is affected.
  • the shield frame provided on the first printed wiring board and the pattern wiring board provided on the second printed wiring board are electrically connected. Therefore, the electrical characteristics can be effectively improved because there is little difference in GND potential between the first printed wiring board and the second printed wiring board.
  • the first printed wiring board has the first connector
  • the second printed wiring board has the second connector
  • the second printed wiring board has the second connector.
  • the positioning accuracy required between the second printed wiring board and the frame is added to the positioning accuracy required between the first printed wiring board and the frame. Therefore, the positioning system between the first printed wiring board and the second printed wiring board is not sufficient. As a result, the contact between the shield frame provided on the first printed wiring board and the shield pattern provided on the second printed wiring board is not sufficient, and the electrical performance is sufficiently improved. It is thought that it is not done.
  • the connector provided on the first printed wiring board and the connector provided on the second printed wiring board are fitted to each other, and the relative positional relationship is established. Therefore, the first printed wiring board and the second printed wiring board can be positioned with high accuracy. As a result, the electrical performance is good with high accuracy.
  • the circuit chip is a CPU chip or a memory chip.
  • the part to be shielded may be a high-frequency part used for transmission and reception. Even in this case, the shield frame provided on the first printed wiring board and the shield pattern provided on the second printed wiring board can be sufficiently shielded. Is possible.
  • the shield structure according to the first embodiment is a relatively low-frequency chip in which the components to be shielded are a memory chip and a CPU chip! /.
  • a circuit chip that shields even if there is a stagnation of the second printed wiring board provided with the shield pattern or a gap due to unevenness of the shield frame provided on the first printed wiring board of 100 m or more.
  • it is a memory chip or a CPU chip, it has a relatively low frequency, so that it can function sufficiently.
  • the circuit chip is a BGA type, the effect of reducing the thickness of the entire shield structure is particularly remarkable.
  • the thickness from the first printed wiring board to the second printed wiring board is the sum of the following four, which raises the problem that the overall thickness of the shield structure increases.
  • the circuit chip strength is 3 ⁇ 4GA type and the shield frame with the top surface of the circuit chip exposed is used, the top surface of the circuit chip is covered with the shield case when the circuit chip is BGA type.
  • the effect of reducing the overall thickness of the shield structure is significant compared to the previous configuration.
  • the shield structure according to the first embodiment is biased toward the shield pattern provided on the second printed wiring board because of the top plate force of the shield frame. And the shield pattern of the second printed wiring board do not come into contact with or separate from each other. Therefore, the thickness of the entire shield structure can be reduced as compared with a case where the shield frame and the second printed wiring board are sufficiently separated so as not to contact each other.
  • the second printed wiring board swings relative to the first printed wiring board due to the restoring force of the connector. It becomes easy to do. In such a case, if the shield frame provided on the first printed wiring board and the second printed wiring board are not brought into contact with or separated from each other, the thickness of the shield structure is further increased.
  • the opening of the shield frame has a shape in which the solder attaching the circuit chip to the first printed wiring board is exposed.
  • this shield structure does not have a shield cover top plate after batch reflow. Therefore, the following becomes possible.
  • an automatic solder wetness inspection machine can be used to confirm solder bridges and solder non-wetting by comparing images with good products from above the board.
  • test point 7 can be automatically contacted by the robot tester to perform electrical inspection.
  • good products that pass all tests can be reinforced by underfilling the lower part of parts that are vulnerable to dropping / shocking such as BGA.
  • the shield structure according to the first embodiment is held by a shield frame that covers the back surface of the surface on which the first printed wiring board force circuit chip is mounted.
  • the shield structure can be reduced.
  • the shield frame and the first printed wiring board are directly connected via the shield cushion, there is a difference in the GND potential between the shield frame and the first printed wiring board. The electrical characteristics can be improved.
  • FIG. 6 is a perspective view showing the internal structure of a mobile phone to which the shield structure of the electronic device according to Embodiment 2 of the present invention is applied.
  • FIG. 7 is a cross-sectional view taken along line 11a-lib in FIG. 6 and 7 have substantially the same configuration as the internal configuration of the mobile phone shown in FIG. 4, and the embodiment in which the circuit chip 24 is interfered with the printed circuit board 11 where the component height is higher than the printed wiring board 11 is shown. This is an example of applying 2.
  • FIG. 7 (a) shows the assembled method after the printed wiring boards 11 and 12 are assembled
  • FIG. 7 (b) shows the assembled method.
  • the circuit chip 24 on at least one side of the printed wiring board 12 contacts or overlaps the shielding copper foil pattern 33 of the printed wiring board 11 in FIG. If this happens, ensure space between the printed circuit board 12 and the circuit chip 24.
  • an opening is provided in the printed wiring board 11 (second printed wiring board), and a shield case 32 having a convex recess upward is attached.
  • a copper foil pattern 111 for shielding is formed on the back surface (circuit chip 24 side) of the printed wiring board 12 so as to surround the opening, and the end portion of the shielding case 32 is brought into contact therewith.
  • the printed wiring board 11 is assembled to the printed wiring board 12 in the direction of the arrow in FIG. Then, as shown in FIG. 7 (a), the connectors 61 and 62 are fitted, the shield frame 31 is pressed against the copper foil pattern for shielding, and the shield case 32 closes the circuit chip 24. Become.
  • the shield structure in FIG. 7 includes a shield copper foil pattern 121, a cream solder coating pattern 8, a shield frame 31 (above, printed wiring board 11), a shield copper foil pattern 111, a shield case 32 ( As described above, the printed wiring board 12) is formed by contacting each. Note that the printed wiring boards 11 and 12 are separately assembled in a batch reflow as in the first embodiment, and then the cellular phone It is assembled as described above at the assembly stage.
  • the shield structure according to Embodiment 2 includes the first printed wiring board, the circuit chip having the bottom surface attached to the first printed wiring board, and the circuit chip.
  • a first connector (connector 62) mounted on the same plane as the surface of the first printed wiring board mounted, and attached to the first printed wiring board, covering the side surface of the circuit chip.
  • a second printed wiring board having a shield pattern portion (shield copper foil pattern 111) provided in the periphery of the first connector and a second connector (connector 61) that fits the first connector, and the shield putter Attached to the portion, and a shield member (shield cover 32) for covering the circuit switch-up.
  • the height force of the circuit chip mounted on the first printed wiring board is not less than the height between the first printed wiring board and the second printed wiring board.
  • a shield structure having a sufficient shielding effect can be applied.
  • FIG. 8 is a side view showing the internal configuration of the mobile phone to which the shield structure of the electronic device according to Embodiment 3 of the present invention is applied.
  • FIG. 8A shows an example in which the printed wiring boards 102, 112, 122, and 132 (first to fourth printed wiring boards) are stacked in order of four.
  • Fig. 8 (b) shows the assembly method (arrow direction) of Fig. 8 (a).
  • shield frames 311 and 312 have a structure without the top plate portion of shield frame 32 of FIG. Instead, the printed wiring board 122 (shielding copper foil pattern 83) and 132 (shielding copper foil pattern 344) serve as a shield case top plate.
  • a printed wiring board having a sufficiently high shield case such as the printed wiring board 11 in FIG. 7 is used instead of the printed wiring board 122. Also good.
  • the printed wiring board 122 can be omitted and a stacked structure of up to three stages can be adopted.
  • the shield structure in FIG. 8 includes a shield copper foil pattern 341, a cream solder coating pattern 8, a shield frame 31 (above, printed wiring board 102), a shield copper foil pattern 81, and a shield frame 311.
  • the printed frame from the printed wiring board 102 to the shield frame 311 of the printed wiring board 112, the shield frame 312 of the printed wiring board 122, and the printed circuit board serving as the shield case top plate.
  • Up to the wiring board 132 has a reverse staircase shape (Fig. 8 (a)).
  • the shield structure according to Embodiment 3 includes the first printed wiring board (printed wiring board 102) and the first printed wiring board having the bottom surface attached to the first printed wiring board.
  • Circuit Circuit chip 25
  • Second high-speed circuit chip circuit chip 26
  • a shield frame shield frame 311) having an opening at a position corresponding to the top surface of the circuit chip, and laminated on the first printed wiring board.
  • a first shield pattern portion (shield copper foil pattern 82) formed on the surface facing the top surface, an opening for accommodating the second circuit chip, and a second shield provided around the opening Second pattern part (shield copper foil pattern 82) Comprising printed wiring boards (the printed wiring board 122), attached to said second shielding pattern portion, and a shield member covering the second circuit chip (shielding copper foil pattern 344). Therefore, the distance between the first printed wiring board and the second printed wiring board can be adjusted to the height of the short circuit chip.
  • the shield member covers the side surface of the second circuit chip and surrounds the second circuit chip, and the top of the second circuit chip.
  • a shielding pattern is formed on a surface opposite to the surface, and a third printed wiring board is stacked on the first printed wiring board. Therefore, a circuit chip having an arbitrary height can be used within the total thickness range of the printed wiring boards.
  • each printed wiring board is such that the printed wiring board on which the circuit chip to be shielded is mounted to the printed wiring board that is the shield case top plate has a reverse staircase shape.
  • circuit chips etc. can be mounted on each layer pattern other than one side of the printed wiring board used for the shield case top board, or on the printed wiring board not used for the shield case top board. Can be used effectively.
  • Embodiment 1 the same effect as in Embodiment 1 can be obtained except for the effect of reducing fatigue of each part due to key pressing.
  • the thickness of the electronic device, particularly the entire portable device can be reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne une structure de protection d'un dispositif électronique comprenant une carte de circuit imprimé (12) ayant une puce de circuit (22) et un cadre de protection (31) entourant la puce de circuit (22) sur le même plan, ainsi qu'une carte à circuit imprimé (11) sur laquelle est formé un motif de feuille de cuivre (33) pour la protection. Cette structure de protection est constituée de sorte que la partie d'ouverture du cadre de protection (31) de la carte à circuit imprimé (12) entre en contact avec le motif de feuille de cuivre (33) de la carte à circuit imprimé (11) lorsque les cartes à circuit imprimé (11) et (12) sont assemblées.
PCT/JP2006/300144 2005-09-01 2006-01-10 Structure de protection WO2007029355A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005253647A JP4527035B2 (ja) 2005-09-01 2005-09-01 シールド構造
JP2005-253647 2005-09-01

Publications (1)

Publication Number Publication Date
WO2007029355A1 true WO2007029355A1 (fr) 2007-03-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/300144 WO2007029355A1 (fr) 2005-09-01 2006-01-10 Structure de protection

Country Status (2)

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JP (1) JP4527035B2 (fr)
WO (1) WO2007029355A1 (fr)

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WO2021115896A1 (fr) * 2019-12-11 2021-06-17 Valeo Siemens Eautomotive Germany Gmbh Onduleur, dispositif d'entraînement destiné à un véhicule à entraînement électrique et véhicule
FR3142864A1 (fr) * 2022-12-05 2024-06-07 Valeo Eautomotive France Sas Équipement électrique

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JP5657234B2 (ja) * 2009-11-06 2015-01-21 レノボ・イノベーションズ・リミテッド（香港） シールド部材及び該シールド部材を備える電子機器
JP5609294B2 (ja) * 2010-06-16 2014-10-22 株式会社デンソーウェーブ 携帯端末
JP5294353B2 (ja) * 2011-04-15 2013-09-18 Ｎｅｃアクセステクニカ株式会社 電磁波シールド構造
WO2016192069A1 (fr) 2015-06-04 2016-12-08 华为技术有限公司 Terminal mobile et structure de protection à dissipation de chaleur
DE102016213049A1 (de) 2016-07-18 2018-01-18 Zf Friedrichshafen Ag Anordnung und Verringerung des Schwingungsverhaltens von elektronischen Bauteilen
CN109874228A (zh) * 2019-03-28 2019-06-11 联想(北京)有限公司 电子设备
CN113692117B (zh) * 2021-08-10 2022-08-02 维沃移动通信有限公司 线路板组件及其电子设备

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JPH06164088A (ja) * 1991-10-31 1994-06-10 Sanyo Electric Co Ltd 混成集積回路装置
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