WO2007013132A1 - 半導体装置およびその制御方法 - Google Patents
半導体装置およびその制御方法 Download PDFInfo
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- WO2007013132A1 WO2007013132A1 PCT/JP2005/013607 JP2005013607W WO2007013132A1 WO 2007013132 A1 WO2007013132 A1 WO 2007013132A1 JP 2005013607 W JP2005013607 W JP 2005013607W WO 2007013132 A1 WO2007013132 A1 WO 2007013132A1
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- voltage
- output node
- pump circuit
- reference voltage
- semiconductor device
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/145—Applications of charge pumps; Boosted voltage circuits; Clamp circuits therefor
Definitions
- the present invention relates to a semiconductor device and a control method thereof, and more particularly to a semiconductor device having a pump circuit that boosts a line connected to a memory cell and a control method thereof.
- a transistor constituting a memory cell of a flash memory has a floating gate or an insulating film called a charge storage layer. Data is stored by accumulating charges in the charge accumulation layer. Charge accumulation (writing) in the charge storage layer is performed by injecting hot electrons and hot holes that have become highly engineered between the source and drain into the charge storage layer. Therefore, a positive voltage is applied to the word line connected to the gate, and a high positive voltage is applied to the bit line connected to the drain. For example, 4V is applied to the bit line for a power supply voltage of 3V.
- a conventional pump circuit (conventional example 1) will be described with reference to FIG. Figure 1 is a circuit diagram of the booster circuit.
- Oscillator 2 outputs a clock to pump circuit 8.
- the pump circuit 8 stores electric charges when the clock is high level, and boosts the voltage until the voltage DPUMP at the output node of the pump circuit 8 becomes about 6V with respect to 3V which is the power supply voltage Vcc.
- DPUMP exceeds 6V, the charge boosted by the pump circuit 8 flows from the regulation circuit 6 to the ground and maintains a substantially constant level.
- the output DPUMP of the pump circuit 8 is adjusted to 4V required for the bit line by the level adjustment circuit 4.
- Patent Document 1 discloses a circuit (conventional example 2) in which a capacitor is connected to an output node of a pump circuit.
- Patent Document 1 Japanese Translation of Special Publication 2000-514946
- Patent Document 2 JP-A-6-20485
- An object of the present invention is to provide a semiconductor device capable of suppressing power consumption of a booster circuit and a control method thereof.
- the present invention comprises a pump circuit that boosts an output node connected to a memory cell array, an oscillator that outputs a clock to the pump circuit, and a detection circuit that outputs an operation signal to the oscillator,
- the operation signal is a signal for operating the oscillator when the voltage at the output node of the pump circuit is lower than the first reference voltage, and stopping the oscillator when the voltage at the output node is higher than the second reference voltage. It is a certain semiconductor device. According to the present invention, when the voltage at the output node of the pump circuit is equal to or higher than the target voltage, the oscillator is stopped. Therefore, the pump circuit is also stopped. Therefore, unnecessary charges do not flow to the ground. Therefore, power consumption of the booster circuit can be reduced.
- the present invention can be a semiconductor device including a capacitor coupled to the output node. According to the present invention, the voltage drop at the output node of the pump circuit can be reduced. it can.
- the present invention can be a semiconductor device in which the capacitance value of the capacitor is larger than the sum of the wiring capacitances of the lines connected to the output node and selectable at the same time. According to the present invention, it is possible to store the charge necessary for boosting a line that is required to boost simultaneously in the capacitor. Therefore, the voltage drop at the output node of the pump circuit can be reduced.
- the present invention may be a semiconductor device in which the frequency of the clock is equal to or lower than a frequency at which the efficiency of the pump circuit does not substantially depend on the frequency. According to the present invention, the efficiency of the pump circuit can be increased and the power consumption can be reduced.
- the present invention provides the operation signal in which the first reference voltage is lower than the second reference voltage, the output node voltage being lower than the first reference voltage when the output node voltage is lower than the first reference voltage.
- the pump circuit is operated until it becomes higher than the reference voltage of 2, and when the voltage of the output node becomes higher than the second reference voltage, the pump circuit until the voltage of the output node becomes lower than the first reference voltage.
- the semiconductor device can be a signal for stopping the operation. According to the present invention, the on / off cycle of the pump circuit becomes longer. Therefore, the efficiency of the pump circuit is improved and the power consumption can be reduced.
- the pump circuit may include a plurality of sub-pump circuits, and the oscillator may be a semiconductor device that outputs a clock whose phase is shifted to each sub-pump circuit.
- the output node of the circuit pump can be boosted substantially in a short period. Therefore, even when the voltage at the output node of the circuit pump suddenly drops, the timing for boosting can be accelerated.
- the present invention may be a semiconductor device in which the oscillator shifts the same phase as the phase shift of the clock and stops each clock. According to the present invention, the timing at which the sub-pump stops shifts, so that it is possible to suppress the voltage at the output node of the circuit pump from temporarily increasing without the sub-pumps operating simultaneously.
- the present invention may be a semiconductor device including a level adjuster that adjusts an output voltage to keep constant at the output node.
- the line voltage can be kept more constant by the level adjuster.
- the memory cell array can be a semiconductor device that is a flash memory cell array.
- the pump circuit may be a semiconductor device that boosts the output node when the flash memory cell array is programmed.
- the output node can be a semiconductor device connected to the bit line of the memory cell array. According to the present invention, power consumption can be suppressed even when there is a high possibility that the power consumption of these booster circuits will increase.
- the present invention provides a method for controlling a semiconductor device, comprising: a pump circuit that boosts an output node connected to a memory cell array; and an oscillator that outputs a clock to the pump circuit.
- a semiconductor device comprising: operating the oscillator when a node voltage is lower than a first reference voltage; and stopping the oscillator when a voltage at the output node is higher than a second reference voltage.
- the oscillator is stopped when the voltage at the output node of the pump circuit is equal to or higher than the target voltage. Therefore, the pump circuit is also stopped. Therefore, unnecessary charges do not flow to the ground. Therefore, power consumption of the booster circuit can be reduced.
- the step when the voltage of the output node becomes lower than the first reference voltage, the step operates the pump circuit until the voltage of the output node becomes higher than the second reference voltage.
- the control of the semiconductor device is a step of stopping the pump circuit until the voltage of the output node becomes lower than the first reference voltage. It can be a method. According to the present invention, the on / off cycle of the pump circuit is lengthened. Therefore, the efficiency of the pump circuit is improved.
- FIG. 1 is a diagram showing a configuration of a booster circuit of a flash memory according to Conventional Example 1.
- FIG. 2 is a diagram illustrating a configuration of a booster circuit of the flash memory according to the first embodiment.
- FIG. 3 is a view showing the periphery of the memory cell of the flash memory according to the first embodiment.
- Figure 4 shows the time variation of each voltage during programming in Conventional Example 1 and Example 1. It is a figure.
- Fig. 4 (a) shows the time variation of DPUMP and bit line voltage (BL) in Conventional Example 1
- Fig. 4 (b) shows the time variation of DPUMP and BL in Example 1
- Fig. 4 (c) shows the example.
- FIG. 6 is a diagram showing a voltage of a clock-enable signal of 1.
- FIG. 5 is a diagram showing changes with time of each voltage during programming when a capacitor is provided at the output node of the pump circuit in the first embodiment.
- Fig. 5 (a) shows the case without a capacitor
- Fig. 5 (b) shows the case with a capacitor.
- Fig. 6 is a diagram showing the result of calculating the efficiency with respect to the frequency of the pump circuit.
- FIG. 7 (a) or FIG. 7 (c) is a circuit diagram (part 1) of a part of the detection circuit of the flash memory according to the first embodiment.
- FIG. 8A and FIG. 8B are circuit diagrams (part 2) of a part of the detection circuit of the flash memory according to the first embodiment.
- FIG. 9 is a circuit diagram (part 3) of a part of the detection circuit of the flash memory according to the first embodiment.
- FIG. 10 (a) and FIG. 10 (b) are diagrams for explaining the operation of the detection circuit of the flash memory according to the first embodiment.
- FIG. 11 is a circuit diagram of a sub-pump of the flash memory according to the first embodiment.
- FIG. 12 (a) and FIG. 12 (b) are diagrams showing a configuration of a part of the pump circuit and the oscillator of the flash memory according to the first embodiment.
- FIG. 13 (a) and FIG. 13 (b) are diagrams for explaining the operation of the pump circuit of the flash memory according to the first embodiment.
- FIG. 14 is a diagram showing a configuration of a level adjustment circuit of the flash memory according to the first embodiment.
- the flash memory according to the first embodiment is a SONOS type flash memory described in Patent Document 1, and adopts a virtual ground type array system. It is also used as a flash memory that operates on the same interface as the NAND type.
- NAND flash memo Generally, the memory uses a memory cell that accumulates charges in a floating gate. Writing to the memory cell is performed by the FN tunneling phenomenon, generating a high potential between the control gate on the floating gate and the substrate. For this reason, it is possible to write data in batches in page units (for example, 2 kByte).
- page units for example, 2 kByte
- the interface with the outside is operated as a NAND flash memory. Therefore, the number of data to be programmed continuously stabilizes the voltage of the bit line when it is required to program as much data as possible to improve the programming speed, and when a large amount of current is required when writing data. It is decided in consideration of the demand for In the first embodiment, for example, programming is continuously performed in units of 128 bits. In other words, 128 core cells connected to the same word line are programmed continuously.
- FIG. 2 is a configuration diagram of the booster circuit 40 of the flash memory according to the first embodiment.
- the oscillator 12 outputs a clock to the pump circuit 10.
- the pump circuit 10 is connected to the memory cell 22 (core cell), and boosts the output node 17 of the pump circuit 10 to a voltage higher than the power supply voltage Vcc (for example, 3 V) by a clock.
- the voltage at output node 17 (DPUMP) is detected by detection circuit 16.
- the detection circuit 16 sets the operation signal Clock-enable to a low level if DPUMP is higher than a reference voltage (for example, 6V), and sets the operation signal Clock-enable to a high level if DPUMP is lower than the reference voltage.
- the oscillator 12 outputs a clock to the pump circuit 10 when the operation signal Clock—enable is high. When the clock—enable is low, the oscillator 12 does not output a clock.
- a capacitor 18 is coupled to the output node 17 and accumulates the charge carried by the pump circuit 10.
- the output node 17 is connected to the level adjustment circuit 14.
- Level adjustment circuit 14 adjusts the voltage (4V) output to the bit line to be constant and outputs it to the bit line.
- FIG. 3 is a configuration diagram around the memory cell array of the flash memory according to the first embodiment.
- core cells 22 are arranged in a matrix.
- Core cell 22 game The source is connected to the word line 26, and the source and drain are connected to different bit lines 24.
- a plurality of word lines 26 are arranged in the vertical direction of FIG. 3, and a plurality of bit lines 24 are arranged in the horizontal direction.
- the line amplifiers 30 are connected through FETs 28a, 28b and 28c.
- FETs 28a, 28b, and 28c are connected to the Y decoder, and the bit line 24 for programming is connected to the write amplifier 30.
- a booster circuit 40 is connected to the write amplifier 30.
- the word line 26 for writing is selected and a positive voltage is applied.
- a voltage (4 V) boosted from the booster circuit 40 to a power supply voltage (3 V) or higher is supplied to the write amplifier 30.
- the write amplifier 30 sets the bit line 24a selected by the FET 28a from the decoder to 4V.
- the drain force S4V of the transistor of the core cell 22a is obtained.
- the source of the core cell 22a is illustrated as! /, NA! /, Selected by the FET and connected to the ground.
- data is written to the core cell 22a.
- the core cell 22b it is performed in the same manner as the core cell 22a.
- the core cells 22 connected to the same word line 26 are continuously programmed in units of 128, for example, among the 128 core cells 22 to be programmed, the core cell 22 to which data is written is selected by the write amplifier 30. Then, data is written in the selected core cell 22 as described above.
- the booster circuit 40 boosts 128 bitlines 24 at the same time, so a booster circuit 40 that can charge a large charge is required. This is because a large write current flows to the memory cell in the initial stage of writing.
- Conventional Example 1 in this case, if the DPUMP voltage increases, unnecessary charges will flow from the regulation circuit 6 to the ground. This increases power consumption.
- the booster circuit 40 of the flash memory When the voltage DPUMP of the output node 17 of the pump circuit 10 is lower than the target voltage (first reference voltage), the booster circuit 40 of the flash memory according to the first embodiment operates the oscillator 12 and outputs Node 17 voltage has a detection circuit 16 that outputs an operation signal to the oscillator 10 to stop the oscillator 10 when the DPUMP is higher than the target voltage (second reference voltage). .
- the oscillator 12 is stopped. Therefore, the pump circuit 10 also stops. Therefore, unlike the conventional example 1, the regulation circuit 6 does not cause unnecessary charges to flow to the ground. Therefore, power consumption can be reduced.
- the first reference voltage and the second reference voltage may be the same or different.
- the booster circuit 40 has a capacitor 18 coupled to the output node 17.
- a large amount of charge is required. Therefore, by storing the charge boosted by the pump circuit 10 in the capacitor 18, the voltage drop at the time of writing can be reduced.
- the capacitance value of the capacitor 18 can be made larger than the sum of the wiring capacitances of bit lines (lines) that are connected to the output node and can be selected simultaneously. As a result, charges necessary for boosting the bit lines 24 that are required to boost simultaneously can be stored in the capacitor 18.
- the wiring capacity of the bit line 24 is about 5 pF.
- the booster circuit 40 can include a level adjuster 14 that adjusts the voltage of the bit line 24 at the output node 17 so as to keep the voltage constant.
- the level adjuster 14 can keep the voltage of the bit line 24 more constant.
- FIG. 4 shows the results of simulating the current consumption when 128-bit programming was continuously performed four times in the flash memories according to Example 1 and Conventional Example 1.
- Fig. 4 (a) shows the time change of DPUMP and bit line voltage (BL) in Conventional Example 1
- Fig. 4 (b) shows the time change of DPUMP and BL in Example 1.
- FIG. 4 (c) shows the voltage of the Clock-enable signal in the first embodiment.
- the range of the double-headed arrow indicates the case where the programming is repeated 4 times.
- the current consumption per step of the booster circuit 40 when programming was repeated four times in this way was 150 mA in the conventional example and 85 mA in the first example.
- the power consumption can be reduced by providing the detection circuit 16.
- FIG. 5 shows the result of simulating the DPUM P and BL voltages with and without the capacitor 18 in the flash memory according to the first embodiment.
- FIG. 5 (a) shows the result when the capacitor 18 is not provided
- FIG. 5 (b) shows the result when the capacitor 18 is provided (Example 1).
- the programming method and illustrations are the same as in Figure 4.
- the DPU MP voltage at the initial programming stage is low and recovery is slow.
- the second half of the first and third programming when the pump circuit 10 stops and DPUMP drops, the second and fourth programming starts, so the BL rise is slow.
- FIG. 5 (b) in Example 1, the delay of the decrease in DPUMP and the increase in BL is small. In this way, by providing the capacitor 18, the voltage drop of DPUMP can be reduced and the voltage increase of BL can be accelerated.
- Figure 6 shows the calculated efficiency of the pump circuit 10 with respect to the clock frequency.
- the output voltage of the pump circuit 10 is Vp
- the power supply voltage applied to the pump circuit 10 is Vcc
- the current when the output of the pump circuit 10 is grounded and forced to flow is Ip
- the power supply is consumed.
- the current is Ivcc.
- FIG. 7 (a) shows a circuit 60 that divides the output DPUMP of the pump circuit 10 by resistance and reduces it to a constant voltage.
- Resistors Rl, R2, R3, R4, R5, R6 and R7 are connected in series between the output node 17 of the pump circuit 10 and the ground.
- Resistors between R1 and R2, between R2 and R3, between R3 and R4, between R4 and R5, between R5 and R6, and between R6 and R7, terminals LA, UA, LB, UB, LC And UC are connected.
- Each mode has a reference for turning off the pump circuit 10 and a reference for turning it on.
- UC is a standard that turns off in C mode
- LC is a standard that turns on in C mode. The same applies to UA, LA, UB, and LB.
- FIGS. 7B and 7C show circuits 62a and 62b that select the reference for turning off and the reference for turning on in each mode.
- UA, UB and UC are input to the sources of the selection FETs 64a, 66a and 68a, respectively.
- One is selected by the FET selection signals SelA, SelB, and SelC input to the gates of the FETs 64a, 66a, and 68a, and is output from the drain as REFU.
- UC which is the upper limit in write (C) mode
- the lower limit selection circuit 62b in Fig. 7 (c) has the same configuration function, and LC is selected and output as REFL.
- FIG. 8 (a) shows a comparison circuit 70a that sets the OU signal to a high level if DPUMP is higher than the second reference voltage, and sets the OU signal to a low level if it is low.
- a current mirror type differential amplifier 72a is connected between the power source Vcc and the ground.
- the differential amplifier 72a has P-FETs 76a, 78a, N-F ET80a, 82a, 84a.
- the FET 84a is a current source that adjusts the voltage generated in the differential amplifier 72a by DEF 1C.
- REFU and reference voltage are applied to the input of differential amplifier 72a. Pressure VREF is input. The difference between VREF and REFU is amplified and output to the output of differential amplifier 72a.
- a comparator 74a is connected between the power source Vcc and the ground, and has a P-FET 86a and an N-FET 88a.
- the output of differential amplifier 72a is input to the gate of FET86a, and DEF—C is input to FET88a.
- the output node 94a of the comparator 74a is low when REFU is higher than VREF and high when REFU is low.
- P-FETs 71a and 90a are switches for turning on / off the comparison circuit 72a by the pump drive signal PUMP-ENB or PUMP-EN.
- the output OU of the comparison circuit 70a is inverted from the output node 94a via the inverter 92 and output.
- REFU is higher than VREF, the OU is high, and if REFU is low, it is low.
- REFU (UC) is the voltage divided by DPUMP, the comparison between REFU and VREF is equivalent to the comparison with the voltage obtained by dividing DPUMP and VREF by this voltage division ratio. Therefore, the voltage obtained by dividing VREF by the voltage division ratio becomes the second reference voltage.
- FIG. 8B shows a comparison circuit 70b that sets the OL signal to a high level if DPUMP is lower than the first reference voltage, and sets the OL signal to a low level if DPUMP is higher.
- the configuration function is the same as that of the comparison circuit 70a except that there is no corresponding inverter of the inverter 92. Therefore, OL is high when REFL is lower than VREF, and low when REFL is high.
- the voltage obtained by dividing VREF by the division ratio of REFL (LC) to DPUMP is the first reference voltage.
- Figure 9 shows that when DPUMP is lower than the first reference voltage, Clock-enable is set to high level until DPUMP is higher than the second reference voltage, and when DPUMP is higher than the second reference voltage, DPUMP This is a circuit 100 in which Clock-enable is kept low until is lower than the first reference voltage.
- P-FETs 104, 106, 108 and N-FETs 110, 112, 114 are connected in series between the power supply Vcc and ground.
- OL is input to the gates of FET104 and 114.
- the OU inverted by the inverter 102 is input to the gates of the FETs 106 and 112.
- Pump drive signals PUMP—ENB and PUMP—EN are input to the gates of FETs 108 and 110.
- a node 115 between the FETs 108 and 110 is connected to an input of a flip-flop 120 including inverters 116 and 118.
- the output of the flip-flop 120 is connected to the inverters 112 and 124 and output as Clock-enable.
- Node 115 is further grounded via FET 126.
- PUMP-EN is connected to the FET 126 via an inverter 128, and is turned on / off by a pump drive signal PUMP EN.
- the node 115 is at a high level.
- Clock-enable becomes low level.
- node 115 is at low level and Clock-enable is at high level.
- node 115 is not connected to either power supply Vcc or ground. In this case, Clock-enable is the previous level set for flip-flop 120.
- FIG. 10 is a diagram for explaining the operation of the detection circuit 16.
- FIG. 10A is a diagram schematically illustrating the voltage DPUMP of the output node 17 with respect to the time of the booster circuit 40 of the first embodiment.
- DPUMP When DPUMP is lower than the first reference voltage, OU is low and OL is high, and circuit 100 outputs high as Clock-enable. Therefore, the pump circuit 10 operates.
- DPUMP becomes lower than the second reference voltage, which is higher than the first reference voltage.
- both OU and OL are at low level.
- Circuit 100 outputs a high level which is the previous Clock—enable level. Therefore, the pump circuit 10 remains operating.
- DPUMP becomes higher than the second reference voltage.
- OU is high level and OL is low level, and circuit 100 outputs low level as Clock-enable. Therefore, the pump circuit 10 stops.
- DPUMP becomes higher than the first reference voltage, which is lower than the second reference voltage. At this time, both OU and OL are at low level. Circuit 100 outputs a low level which is the previous Clock—enable level. Therefore, the pump circuit 10 remains stopped.
- DPUMP becomes lower than the first reference voltage, Clock-enable becomes high level, and the pump circuit 10 operates.
- Clock-enable indicates that when DPUMP (the voltage at the output node of the pump circuit) becomes lower than the first reference voltage, the pump circuit continues until DPUMP becomes higher than the second reference voltage.
- DPUMP the voltage at the output node of the pump circuit
- (b) is a schematic diagram of DPUMP with respect to time when the pump circuit 10 is controlled by DPUMP and only one reference voltage.
- Clock enable is the reference voltage for DPUMP.
- a low level indicates a high level, and a high level indicates a low level. Therefore, the pump circuit 10 operates when DPUMP is lower than the reference voltage and stops when it is higher. Thus, the on / off period of the pump circuit 10 is shortened. In this case, when the pump circuit 10 is switched, a current flows through the CMOS. As a result, the efficiency of the pump circuit 10 decreases as in the case where the frequency of the oscillator 12 described in FIG. 6 is high.
- FIGS. 11 to 13 are diagrams for explaining the pump circuit 10.
- the pump circuit 10 has a plurality of sub-pumps 130.
- the upper diagram of FIG. 11 is a circuit diagram of the subpump 130.
- the sub pump 130 has a FET 134 and a plurality of boosting stages 132 to 132.
- the lower figure of FIG. 11 is a configuration diagram of a part 136 of the oscillator 12. When Clock enable is high, part 136 of oscillator 12 outputs OSC0 and OSC0B, which are complementary clocks.
- the FET 134 is provided between the power supply Vcc and the boost stage 1 32, and the pump operation signal PUMP—EN is input to the gate.
- a diode D12 is connected to 10 in the forward direction.
- the next boosting stage 132 is the capacitor C1
- the node N10 of the boosting stage 132 is precharged to Vcc-Vth (the diode forward high voltage) by the diode D1.
- Vcc-Vth the diode forward high voltage
- OSC0 goes high
- capacitor C11 is boosted.
- OSCB0 connected to C11 in the next stage is low level
- the charged charge is transferred to the capacitor C11 of the next boosting stage 132 via the diode D12.
- the charge stored in C11 is charged into capacitor C11 in the next boost stage 132.
- the diode D12 does not flow to the previous boosting stage 132. In this way, the voltage of the node N10 is boosted every time it passes through the boosting stage, and the voltage boosted through the n boosting stages becomes DPUMP.
- FIG. 12 (a) is a diagram showing a configuration of the pump circuit 10.
- the pump circuit 10 has a plurality of sub-pumps 130 described in FIG.
- the plurality of sub-pumps 151 to 158 are connected in parallel.
- OSC0, OSC0B, OSCl, OSClB, OSC2, OSC2B, OSC3, and OSC3B are input to each of the sub pumps 151 to 158 as Clock.
- each sub-pump also receives a complementary clock of each clock, but for the sake of simplicity, the complementary clock input is not described.
- FIG. 12 (b) is a configuration diagram showing a part of the oscillator 10.
- the oscillation clock signal OSC and Clock-enable are input to the AND circuit 141.
- the oscillation clock signal OSC outputs the AND circuit 141 when Clock enable is high.
- This output is OSC0.
- OSC0 passes through phase shifter 142 and shifts in phase to become OSC1.
- OSC1 passes through phase shifter 143 and becomes OSC2.
- OSC2 passes through phase shifter 144 and becomes OS C3.
- Each of the phase shifters 142 to 144 is a phase shifter that shifts the phase by 45 °.
- OSC0, OSCl, OSC2 and OSC3 pass through inverters 146, 147, 148 and 149, respectively, and output complementary OSC0B, OSClB, OSC2B and OSC3B.
- OSC0, OSCl, OSC2, OSC3, OSC0B, OSClB, OSC2B and OSC3B output in this way are clocks whose phases are shifted by 45 °.
- the pump circuit 10 includes the plurality of sub-pumps 151 to 158, and the oscillator 10 outputs a clock whose phase is shifted to each of the sub-pumps 151 to 158.
- DPUMP can be boosted in a short period. Therefore, even when DPUMP drops rapidly, the timing for boosting can be advanced.
- the force is not limited to eight as explained in the case of eight subpumps 151-158. Increasing the number of subpumps can shorten the boosting cycle, but the circuit size increases. . Taking these into account, the number of sub-pumps is determined.
- FIG. 13 (a) and FIG. 13 (b) are diagrams for explaining the effect of this configuration.
- FIG. 13 (a) is a time chart when OSC0 to OSC4 become low level when the Clock-enable signal becomes low level.
- OSC0 to OSC4 are in the middle of the high level, but the remaining high level (broken line in the figure) is not output, and OSC0 to OSC4 simultaneously become the low level. For this reason, the sub pumps 151 to 158 operate simultaneously. Therefore, DPUMP becomes temporarily high.
- FIG. 13 (b) is a time chart when OSC0 to OSC3 are stopped in the pump circuit 10 of FIG. 12 (a).
- OSC 0 goes to the same level without outputting the high level (dashed line in the figure) of the remaining power that is in the middle of the high level.
- OCS1 is later than OSC0 by tl minutes of phase shift from OSC0 of Clock.
- OSC1 goes low after a tl delay from the Clock-enable signal.
- OSC2 and OSC3 become low level with a delay of time t2 and t3 corresponding to the phase shift from OSC0, respectively.
- the stop time of the sub pumps 151 to 158 is shifted and stopped.
- FIG. 14 is a diagram showing the configuration of the level adjustment circuit 14.
- Capacitors 1 66 and 168 are connected in series between the voltage (VPROG) output to the bit line and ground, and VPROG is divided to VCOM.
- Capacitor 168 has a capacitor 168a, 168b and 168c, respectively, for each mode A, B and C (corresponding to read, erase, write, etc.) that charge bit line 24 to a different voltage, respectively. , 169b and 169c. This divides VCOMP to the voltage corresponding to each mode. In this example, the capacity is the write mode. Sita 168c is selected.
- VCOMP is input to the positive input of the differential amplifier 162, and the reference voltage VREF is input to the negative input of the differential amplifier 162.
- the power supply of the differential amplifier 162 is connected to DPUMP.
- the output of differential amplifier 162 is input to the gate of P-FET164, and the source and drain of P-FET164 are connected to VPROG and DPUMP, respectively.
- VCOMP is a voltage obtained by dividing VPROG.
- comparing VCOMP and VREF is equivalent to comparing VPROG and VREF divided by the voltage division ratio.
- the level adjuster 14 for adjusting the voltage to be kept constant at the output node 17 of the pump circuit 10, the voltage of the bit line can be kept constant.
- the booster pump 40 that boosts the bit line when programming the flash memory has been described as an example.
- the application of the present invention is not limited to flash memory.
- the flash memory requires a high voltage when storing charges in the charge storage layer. Therefore, by applying the present invention to a semiconductor device in which the memory cell array 20 is a flash memory cell array, the power consumption of the booster circuit 40 can be further suppressed.
- the application of the present invention is not limited to programming, but can be provided for reading and erasing.
- programming requires a larger voltage than reading.
- the flash memory having the SONOS type virtual ground type array system shown in the first embodiment is used as a NAND type interface, it is required to boost the bit lines corresponding to the bits to be simultaneously produced. For this reason, the booster circuit is required to have a large charge. For this reason, the booster circuit 40 can further suppress the power consumption of the booster circuit 40 by boosting the output node 17 when the flash memory cell array 20 is programmed.
- the application of the present invention is not limited to the bit line, but can be applied to, for example, a word line.
- the flash memory having the SONOS type virtual ground type array system shown in the first embodiment is used as a NAND type interface, It is required to boost the bit lines 24 for the bits to be programmed at the same time. Therefore, when the output node 17 is connected to the bit line 24 of the memory cell array 20, the power consumption of the booster circuit 40 can be further suppressed.
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- Dc-Dc Converters (AREA)
- Read Only Memory (AREA)
- Dram (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007526760A JP4950049B2 (ja) | 2005-07-25 | 2005-07-25 | 半導体装置およびその制御方法 |
| PCT/JP2005/013607 WO2007013132A1 (ja) | 2005-07-25 | 2005-07-25 | 半導体装置およびその制御方法 |
| US11/493,467 US7724071B2 (en) | 2005-07-25 | 2006-07-25 | Voltage boosting device and method for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2005/013607 WO2007013132A1 (ja) | 2005-07-25 | 2005-07-25 | 半導体装置およびその制御方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/493,467 Continuation-In-Part US7724071B2 (en) | 2005-07-25 | 2006-07-25 | Voltage boosting device and method for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007013132A1 true WO2007013132A1 (ja) | 2007-02-01 |
Family
ID=37683042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/013607 Ceased WO2007013132A1 (ja) | 2005-07-25 | 2005-07-25 | 半導体装置およびその制御方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7724071B2 (ja) |
| JP (1) | JP4950049B2 (ja) |
| WO (1) | WO2007013132A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003991A (ja) * | 2007-06-19 | 2009-01-08 | Toshiba Corp | 半導体装置及び半導体メモリテスト装置 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100816168B1 (ko) * | 2006-09-29 | 2008-03-21 | 주식회사 하이닉스반도체 | 반도체 소자의 고전압 발생 장치 |
| KR100894490B1 (ko) * | 2008-03-03 | 2009-04-22 | 주식회사 하이닉스반도체 | 반도체 메모리장치의 내부전압 생성회로 |
| US8412095B2 (en) | 2010-07-15 | 2013-04-02 | John Mezzalingua Associates, Inc. | Apparatus for minimizing amplifier oscillation in an antenna system |
| US20150116012A1 (en) * | 2013-10-30 | 2015-04-30 | Hasnain Lakdawala | Digital Voltage Ramp Generator |
| US9627016B2 (en) | 2015-09-10 | 2017-04-18 | Cypress Semiconductor Corporation | Systems, methods, and devices for parallel read and write operations |
| KR20170034578A (ko) | 2015-09-21 | 2017-03-29 | 에스케이하이닉스 주식회사 | 레귤레이터, 이를 포함하는 메모리 시스템 및 이의 동작 방법 |
| US11183244B2 (en) * | 2019-09-03 | 2021-11-23 | Winbond Electronics Corp. | Memory device and control method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0620485A (ja) * | 1992-06-30 | 1994-01-28 | Nec Corp | 不揮発性半導体記憶装置 |
| JPH06259981A (ja) * | 1992-10-22 | 1994-09-16 | Advanced Micro Devicds Inc | ドレイン電源 |
| JP2000075940A (ja) * | 1998-08-31 | 2000-03-14 | Hitachi Ltd | 半導体装置 |
| JP2000514946A (ja) * | 1996-07-23 | 2000-11-07 | サイフン・セミコンダクターズ・リミテッド | 非対称電荷トラッピングを利用する不揮発性半導体メモリセル |
| JP2002101644A (ja) * | 2000-09-22 | 2002-04-05 | Toshiba Corp | 半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6320797B1 (en) * | 1999-02-24 | 2001-11-20 | Micron Technology, Inc. | Method and circuit for regulating the output voltage from a charge pump circuit, and memory device using same |
| JP2001126478A (ja) * | 1999-10-29 | 2001-05-11 | Mitsubishi Electric Corp | 半導体装置 |
| TW494631B (en) * | 2000-01-26 | 2002-07-11 | Sanyo Electric Co | Charge pump circuit |
| KR100394757B1 (ko) * | 2000-09-21 | 2003-08-14 | 가부시끼가이샤 도시바 | 반도체 장치 |
| JP3726753B2 (ja) * | 2002-01-23 | 2005-12-14 | セイコーエプソン株式会社 | 不揮発性半導体記憶装置の昇圧回路 |
| JP2004103153A (ja) * | 2002-09-11 | 2004-04-02 | Seiko Epson Corp | 不揮発性半導体記憶装置の電圧発生回路 |
| ITRM20030512A1 (it) * | 2003-11-05 | 2005-05-06 | St Microelectronics Srl | Circuito a pompa di carica a basso tempo di assestamento |
-
2005
- 2005-07-25 JP JP2007526760A patent/JP4950049B2/ja not_active Expired - Fee Related
- 2005-07-25 WO PCT/JP2005/013607 patent/WO2007013132A1/ja not_active Ceased
-
2006
- 2006-07-25 US US11/493,467 patent/US7724071B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0620485A (ja) * | 1992-06-30 | 1994-01-28 | Nec Corp | 不揮発性半導体記憶装置 |
| JPH06259981A (ja) * | 1992-10-22 | 1994-09-16 | Advanced Micro Devicds Inc | ドレイン電源 |
| JP2000514946A (ja) * | 1996-07-23 | 2000-11-07 | サイフン・セミコンダクターズ・リミテッド | 非対称電荷トラッピングを利用する不揮発性半導体メモリセル |
| JP2000075940A (ja) * | 1998-08-31 | 2000-03-14 | Hitachi Ltd | 半導体装置 |
| JP2002101644A (ja) * | 2000-09-22 | 2002-04-05 | Toshiba Corp | 半導体装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003991A (ja) * | 2007-06-19 | 2009-01-08 | Toshiba Corp | 半導体装置及び半導体メモリテスト装置 |
| US8179730B2 (en) | 2007-06-19 | 2012-05-15 | Kabushiki Kaisha Toshiba | Semiconductor device and semiconductor memory tester |
Also Published As
| Publication number | Publication date |
|---|---|
| US7724071B2 (en) | 2010-05-25 |
| JPWO2007013132A1 (ja) | 2009-02-05 |
| US20070085597A1 (en) | 2007-04-19 |
| JP4950049B2 (ja) | 2012-06-13 |
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