WO2007012514A1 - Connexion electroconductrice et procede de production de cette connexion - Google Patents

Connexion electroconductrice et procede de production de cette connexion Download PDF

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Publication number
WO2007012514A1
WO2007012514A1 PCT/EP2006/062863 EP2006062863W WO2007012514A1 WO 2007012514 A1 WO2007012514 A1 WO 2007012514A1 EP 2006062863 W EP2006062863 W EP 2006062863W WO 2007012514 A1 WO2007012514 A1 WO 2007012514A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection
electrically conductive
conductor
conductive connection
layers
Prior art date
Application number
PCT/EP2006/062863
Other languages
German (de)
English (en)
Inventor
Gerhard Wetzel
Helmut Deringer
Peter Sprafke
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2007012514A1 publication Critical patent/WO2007012514A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Definitions

  • the present invention relates to an electrically conductive connection and a method for producing a corresponding electrical connection thereto.
  • EM - In electronic modules for control devices, in particular for transmission controls, also referred to as EM - are hybrid control devices, sensors and at least one connector, a so-called gear plug, for electrically connecting the electronic module to the vehicle wiring harness or a higher-level control unit available.
  • the electrical connection between the hybrid control unit, the sensors and the gearbox plug is made via known punched grids or flexible printed circuit boards (flex foils or FPCs).
  • Flexible printed circuit boards have the advantage that they are completely protected by their insulation against conductive deposits in the gearbox (for example, abrasion chips) in comparison with plastic fully encapsulated stamped gratings. Although they are designed with complete insulation, they are highly flexible. This makes it possible to compensate for positional tolerances between two parts to be contacted.
  • ATF Automatic Transmission Fluid
  • contacts between a flexible printed circuit board and functional assemblies for example, sensors, connectors
  • a contact partner for example a punched grid of a sensor
  • the opposite side of the film is irradiated with laser light, resulting in a
  • DE 19715128 and DE 10157113 describe pressure or press-fit contacts for connecting a (flexible) conductor carrier to a contact partner or between two flexible conductor carriers.
  • DE 10224266 shows a contacting technique between a flexible and a rigid printed circuit board, which is carried out by means of a soldering.
  • connection partners each have only one access opening in the region of the connection which lie opposite one another, wherein the outer insulation of the connection point remains and no additional insulation measures are necessary.
  • Another advantage is that the connecting parts have a high stability due to the remaining outer insulation.
  • connection partners need only be prepared to a small extent and result in a cost-effective connection with a high degree of robustness and a flat contact point.
  • low-cost flexible printed circuit boards can be connected to one another as connection partners, together with a metallic conductor, for example stamped gratings, or else with flexible flat cables, whereby flat cables can also be connected to one another in this way.
  • the flexible printed circuit boards require for connection only a one-sided access through their cover film, the base film remains isolated over the entire surface.
  • connection partners each with at least one conductor layer, which is provided on one side with a base layer and on the opposite side with a cover layer, in the cover layers of the connection partners in the region of the compound are superimposed
  • planar connection offers a further advantage over the punctiform connections of the prior art, since their planar design has a higher current carrying capacity.
  • the region of the base layers which is in each case opposite the access openings is essentially homogeneous and has only minor penetrations or indentations. This offers the particular advantage that the junction has a high stability.
  • FIG. 1 two exemplary flexible circuit boards in a schematic representation in the production of a contact according to the inventive method
  • the flexible printed circuit boards 1, 1 * with their cover layers 5, 5 * are arranged one above the other, wherein in the region in which a connection between the line layers 3, 3 * is to be produced, the cover layers 5, 5 * each have a so-called access opening 2, 2 *.
  • FIG. 2 shows the welded connection point with the contact surface 8.
  • notches 10 the thorn-like projections 7, 7 * of the components 6, 6 * remain in the base layers 4, 4 *. Due to the strength of the base layers 4, 4 * and the geometry of the thorn-like projections 7, 7 *, the indentations 10 can be influenced.
  • the notches 10 are so small in their extent or size that chips, originating from Gereteabrieb or the like, no shorts or contact bridges between different conductor layers 1, 1 * can produce at different locations.
  • the joint thus advantageously makes no additional insulation necessary.
  • the mechanical strength of this joint is determined by the reinforced existing base layer sections in the region of the junction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

L'invention concerne une connexion électroconductrice entre au moins deux éléments de connexion conjugués (1, 1*) comprenant chacun au moins une couche de conduction (3, 3*) présentant sur une face une couche de base (4, 4*) et sur la face opposée une couche de recouvrement (5, 5*). Des ouvertures d'accès (2, 2*) sont ménagées l'une au-dessus de l'autre dans les couches de recouvrement (5, 5*) des éléments de connexion conjugués (1, 1*) au niveau de la connexion, les couches de conduction (3, 3*) étant reliées de façon électriquement conductrice à l'intérieur de ces ouvertures d'accès (2, 2*). Les zones des couches de base (4, 4*) situées en vis-à-vis de ces ouvertures d'accès (2, 2*) sont conservées. L'invention concerne également un procédé de production d'une telle connexion.
PCT/EP2006/062863 2005-07-27 2006-06-02 Connexion electroconductrice et procede de production de cette connexion WO2007012514A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005035102.6 2005-07-27
DE200510035102 DE102005035102A1 (de) 2005-07-27 2005-07-27 Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen

Publications (1)

Publication Number Publication Date
WO2007012514A1 true WO2007012514A1 (fr) 2007-02-01

Family

ID=37012108

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/062863 WO2007012514A1 (fr) 2005-07-27 2006-06-02 Connexion electroconductrice et procede de production de cette connexion

Country Status (2)

Country Link
DE (1) DE102005035102A1 (fr)
WO (1) WO2007012514A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110557904A (zh) * 2019-09-03 2019-12-10 东莞市震泰电子科技有限公司 双面电路板及其导通方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014205015B4 (de) * 2014-03-18 2023-03-16 Robert Bosch Gmbh Verfahren zum Verbinden zweier elektrisch leitender Bauteile mittels eines Laserstrahls und Bauteileverbund
US9844146B2 (en) 2016-05-11 2017-12-12 Flextronics Automotive Gmbh & Co. Kg Electrical circuitry assembly and method for manufacturing the same
MX2018013731A (es) * 2016-05-11 2019-08-01 Flex Automotive Gmbh Montaje de circuitos electricos y metodo para la fabricacion del mismo.
JP2019121774A (ja) * 2017-12-28 2019-07-22 株式会社フジクラ 金属片付き配線基板および金属片付き配線基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD122760A1 (fr) * 1975-12-10 1976-10-20
US5354392A (en) * 1992-01-24 1994-10-11 Matsushita Electric Industrial Co., Ltd. Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves
DE19504967A1 (de) * 1995-02-15 1996-08-22 Fraunhofer Ges Forschung Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
US6247977B1 (en) * 1998-04-27 2001-06-19 Yazaki Corporation Connector for flat cable
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe

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BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
DE3535008C2 (de) * 1985-10-01 1994-09-29 Telefunken Microelectron Folienschaltung mit zwei sich überdeckenden Leitungsträgern
US5213511A (en) * 1992-03-27 1993-05-25 Hughes Aircraft Company Dimple interconnect for flat cables and printed wiring boards
JP3430634B2 (ja) * 1994-06-13 2003-07-28 住友電気工業株式会社 テープ電線の接続方法
JP3928682B2 (ja) * 1999-06-22 2007-06-13 オムロン株式会社 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
JP2001237526A (ja) * 2000-02-23 2001-08-31 Fujikura Ltd プリント配線基板と金属端子の接続方法
DE10036900C2 (de) * 2000-07-28 2002-07-11 Siemens Ag Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner
US20020081894A1 (en) * 2000-12-21 2002-06-27 Fuerst Robert M. Flat flexible circuit interconnections
DE10224713A1 (de) * 2002-06-04 2003-12-18 Daimler Chrysler Ag Flachkabel, Verfahren zur Reparatur des Flachkabels und Vorrichtung zur Durchführung des Verfahrens

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD122760A1 (fr) * 1975-12-10 1976-10-20
US5354392A (en) * 1992-01-24 1994-10-11 Matsushita Electric Industrial Co., Ltd. Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves
DE19504967A1 (de) * 1995-02-15 1996-08-22 Fraunhofer Ges Forschung Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
US6247977B1 (en) * 1998-04-27 2001-06-19 Yazaki Corporation Connector for flat cable
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110557904A (zh) * 2019-09-03 2019-12-10 东莞市震泰电子科技有限公司 双面电路板及其导通方法

Also Published As

Publication number Publication date
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