EP2225807A1 - Procédé de mise en contact d'une carte rigide de circuit et d'un partenaire de contact et système constitué d'une carte rigide de circuit et d'un partenaire de contact - Google Patents

Procédé de mise en contact d'une carte rigide de circuit et d'un partenaire de contact et système constitué d'une carte rigide de circuit et d'un partenaire de contact

Info

Publication number
EP2225807A1
EP2225807A1 EP08864519A EP08864519A EP2225807A1 EP 2225807 A1 EP2225807 A1 EP 2225807A1 EP 08864519 A EP08864519 A EP 08864519A EP 08864519 A EP08864519 A EP 08864519A EP 2225807 A1 EP2225807 A1 EP 2225807A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
contact partner
rigid
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08864519A
Other languages
German (de)
English (en)
Inventor
Josef Loibl
Hermann-Josef Robin
Karl Smirra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP2225807A1 publication Critical patent/EP2225807A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the invention relates to a method for producing an electrical connection between a rigid printed circuit board (PCB) and a metallic contact partner, an arrangement of said elements with an electrical connection point realized between them and an assembly for complete installation in an engine or transmission of a motor vehicle (motor vehicle ), which uses such an electrical connection point.
  • PCB printed circuit board
  • control devices In automotive engineering, components such as transmission, engine or brake systems are increasingly being primarily electronically controlled. There is a trend towards integrated mechatronic controls, ie the integration of control electronics and the associated electronic components such as sensors or valves in the transmission, the engine or the brake system. Control devices thus generally have a plurality of electronic components, which are in connection with other components outside the control unit. In such "on-the-spot" electronics, these controls are no longer housed in a separate protected electronics room and therefore must withstand environmental and mechanical, thermal and chemical stresses.
  • housings fulfill an important shielding function.
  • an electrical connection from the inside of the housing to the outside of the housing is necessary.
  • the distribution of electrical signals and currents are in current series applications Lead frames (leadframes) or realized by using flexible printed circuit boards (FPCB).
  • the usual design of flexible circuit boards for mechatronic applications consists of a base layer as a composite of polyimide film, acrylic adhesive film and copper foil.
  • the copper layer is usually given a conductive web structure by an etching process.
  • These interconnect structures must have bondable, weldable and / or solderable surfaces in the contacting region.
  • a cover layer of polyimide film is laminated onto the structured copper layer with acrylic adhesive film. This entire composite of base layer, copper layer and cover layer is then laminated to a base plate.
  • 1 305 988 Bl describes a method for contacting a flexible printed circuit board with a contact partner, in which the laser light irradiation for producing the welded structure can take place directly through the second insulating layer. This eliminates the need to provide a recess in the second insulation layer or subsequently to create a double-sided access to the finished flexible printed circuit board by local removal of the second insulation layer at this point.
  • PCB Print Circuit Boards
  • press fit interconnector which has at least one pressfit pin or pressfit pin area on two sides.
  • the disadvantage is that such a plug must be individually designed and made.
  • the installation and connection step of the plug to the printed circuit boards is an additional process that must meet the relevant quality requirements and is expensive. Due to the increasing demand, further efforts are being made to reduce the costs of producing electrical connections from printed circuit boards to various possible contact partners.
  • the invention has for its object to provide a method for producing an electrical connection between a rigid printed circuit board (PCB) and a metallic contact partner, which is simple and inexpensive to perform while realizing a mechanically stable and electrically secure connection.
  • the connection point created by means of the method should also be suitable for contacting electrical components under harsh environmental conditions, such as those prevailing in a gearbox or an engine of a motor vehicle.
  • the rigid printed circuit board at least comprising a copper layer and at least one prepreg layer approximating the metallic contact partner and the
  • a rigid printed circuit board is understood to mean a printed circuit board (PCB) having at least one single-layer structure made of a copper layer and a prepreg layer connected thereto.
  • This prepreg layer is also called a prepreg core.
  • Prepreg Preimpragnated fiber
  • FR4 material identifier
  • heat-resistant material combinations for example a so-called FR5 material, can also be used as the prepreg core.
  • a further layer for electrical insulation for example a solder resist, can be applied to the copper layers.
  • the contact pad on the copper layer remains as a contact point of a possible insulating layer, such as a solder stop plaque, freed or freed before placing the contact partner of the insulating layer.
  • a possible insulating layer such as a solder stop plaque
  • contact partners in particular wires, pins and pins, stranded wire, stamped grid or other flexible or rigid circuit boards can be used.
  • the contact pad is the contact point on the conductor layer on which a contact partner is brought to the plant and subsequently mechanically and electrically connected thereto by the laser welding.
  • the invention thus provides a method that is simple to perform and in particular represents a less expensive alternative to the hitherto known applications with flexible printed circuit boards.
  • the use of laser welding with high process reliability can reproducibly produce high-quality electrical connections that also meet high mechanical requirements.
  • all the advantages of laser technology can be exploited. For example, additional parts such as rivets or additives such as solder are not required for a consistent laser weld joint.
  • the type of connection allows high degrees of freedom with regard to the mechanical design and guarantees minimal contact resistance.
  • the rigid circuit board comprises at least two copper layers and at least one intermediate prepreg layer.
  • at least two conductor track layers namely the copper layers, are available.
  • this can be compared to a structure with only one copper layer in particular a better unbundling in the layout, a higher number of interconnects and / or a wider interconnects to increase the current carrying capacity can be provided.
  • the depth of penetration of the laser beam into the contact partner plays an important role for the quality of the connection formed during the welding process.
  • the laser beam can not penetrate into the contact partner, d. H. if only the conductor track (copper layer) is melted, no satisfactory welding result is achieved. On the other hand, if the laser beam penetrates the contact partner, it enters
  • the laser is preferably operated such that the melting point of the contact partner surface is between 0.5 and 1 mm.
  • the expression of the deep-welding effect is influenced by a large number of parameters, in particular welding energy, pulse power, welding time and spot diameter.
  • a plurality of welding points can also be set in order to secure and strengthen the welded joint.
  • the current carrying capacity can be improved.
  • a further advantageous method measure is characterized in that a plurality of positionally offset laser light pulses are used to build up the welded connection. Due to the positional offset, an effective enlargement of the welding reached, which leads to an increase in the strength of the compound.
  • a contacting tab can additionally be formed in the rigid printed circuit board for this purpose.
  • the rigid circuit board in the welding areas is formed so that a tab is introduced as a preloaded spring in the circuit board.
  • this tab can be produced by, for example, cutting or milling around a rectangular area on three sides in the printed circuit board around the contact pad.
  • wires or lead frames used as contact partners they can be embossed in an advantageous development of the method in the welding area.
  • embossing creates a so-called contact eye on the contact partner, with the safe investment can be created on the contact pad on the circuit board.
  • strands When using strands, they can be compacted at the ends to improve weldability.
  • the rigid printed circuit board can be made thin. This is indicates that the copper layers of the rigid printed circuit board have a thickness in the range of 35 ⁇ m to 70 ⁇ m and the prepreg layer have a thickness in the range of 150 ⁇ m to 350 ⁇ m. Due to the thin design, a plastic deformability of the rigid printed circuit board can be achieved. The plastic deformability is particularly good if the interconnects in the copper layer are produced by thin dividing lines, ie in other words the largest possible copper surface remains on the circuit board. By bending the circuit board advantageously three-dimensional areas and structures can be formed and the design variability can be increased.
  • the prepreg layer can be removed mechanically to produce the recess in the rigid printed circuit board, for example by drilling, milling or punching.
  • An equally preferred embodiment of the method provides that the removal of the prepreg layer is effected by a laser light irradiation.
  • formation of the recess with the removal of the prepreg layer and the subsequent welding by laser light irradiation can also take place in one method step.
  • the quality of the weld can also be determined by the influencing variables of the angle of incidence of the laser beam, focus position,
  • the mentioned parameters and influencing variables can influence each other at least partially, i. H. that they must be optimized in terms of minimizing the deep welding effect depending on each other.
  • welds are created with a full-surface, substantially circular disk-shaped connection zone.
  • a further improvement in the strength of the resulting welded structure can be achieved in a further embodiment of the invention by the use of laser light double pulses, which are directed to different locations within the contour of the contact pad.
  • the invention further relates to an arrangement of a rigid printed circuit board, a metallic contact partner and an electrical connection point between the rigid printed circuit board and the metallic contact partner, wherein the rigid printed circuit board is composed of at least one copper layer and a prepreg layer. At least one contact pad is formed on the copper layer, on which the metallic contact partner is brought into contact. According to the invention, there is also a welding region brought about by the laser light irradiation between the named elements.
  • a metallic contact partner and an electrical connection between the rigid printed circuit board and the metallic contact partner comprises at least a first and a second copper layer and at least one prepreg layer extending therebetween.
  • an important technical application of the method and the inventive arrangement with electrical connection point consists in the contacting of electrical wiring elements or in the direct contacting of electrical components, such as plugs, sensors, valves and / or actuators, which together with a control unit in a motor or Gearbox of a car are housed.
  • the inventive method and the arrangement according to the invention a suitable, especially compared to the use of flexible printed circuit boards, cost-effective way of electrical contact between said elements, wherein the weld created is particularly resistant, so that they prevail in a transmission or engine ambient conditions (temperature range of about -40 0 C. to 150 0 C, vibration up to about 40 g) is able to withstand.
  • the type of connection according to the invention allows high degrees of freedom with regard to the mechanical design and guarantees minimal contact resistance.
  • the present invention relates to an assembly for complete installation in an engine or a transmission of a motor vehicle, in which the above-described advantageous arrangement according to the invention is integrated.
  • This assembly can have the following elements:
  • control unit which has an oil-tight housing in which an electronic circuit is housed, a rigid circuit board which is in electrical connection with the electronic circuit and is guided through a sealing gap of the housing to the outside, and
  • control unit Provided outside the control unit electrical connections, which are connected in accordance with the inventive arrangement as a contact partner with the rigid circuit board.
  • Fig.l is a schematic sectional view of a rigid circuit board and a metallic contact partner at a time in the construction of the welded joint according to the invention
  • Figure 2 is a schematic sectional view of a rigid printed circuit board at the time of construction of the welded joint according to the invention to a second rigid printed circuit board.
  • Fig. 3 is a perspective plan view of a rigid circuit board connected to metallic contact partners and formed with Maisierlasche.
  • FIG. 1 shows a schematic sectional view of a rigid circuit board 1 and a pin 2a as a metallic contact partner 2 at a time in the construction of the welded joint according to the invention.
  • the rigid circuit board 1 comprises a first copper layer 3 and a second copper layer 4, between which a prepreg layer 5 is embedded.
  • the first copper layer 3 is also referred to below as the upper copper layer 3.
  • a solder stopper layer 6 is applied for electrical insulation.
  • the upper copper layer 3 is freed from the Lötstopplack für 6.
  • the pin 2a is brought to the contact pad 7 with an end face to the plant.
  • the rigid circuit board 1 and the contact partner 2 are thus approximated in such a way that one surface of the contact partner 2 rests over the entire surface of the copper layer 3.
  • a recess 8 in the circuit board 1 is formed below the contact pad 2 a.
  • the welded joint is produced from below, ie from the side of the copper layer 3 opposite the pin 2 a, by means of a laser beam 9.
  • a vertical to the copper layer conductor track level 3 light incidence is selected.
  • the laser beam can impinge on the adjacent end face of the pin 2a in the area of the central longitudinal axis x.
  • the printed circuit board 1 can also be connected in an analogous manner to the ends of electrical wiring elements running in the gearbox or in the motor, for example leadframes or other ren contact partners, be connected.
  • Fig. 2 shows a sectional view of a rigid circuit board 1 at the time of construction of the laser welding connection according to the invention to a second rigid circuit board 10.
  • the circuit boards 1, 10 may be the same or different. Mechanically, the connection to the second circuit board 10 can be made, for example, by lamination or gluing.
  • the first and the second printed circuit board 1, 10 are superimposed with their contact pads 7 and welded by means of a laser beam 9.
  • a copper rinlay 11 may be inserted in the contacting region 7 in a recess 8 of the printed circuit board 10. This can be used advantageously if, for a secure welding connection, the layer thickness of the copper layers 3, 4 im
  • connection according to the invention of two or more circuit boards 1, 10 advantageously allows the construction of complex structures.
  • FIG. 3 shows a perspective plan view of the connection between a rigid printed circuit board 1 for potential and signal distribution with a pin 2a and a punched grid 2b as a contact partner 2.
  • contact pads 7 are provided, which may be configured circular.
  • To the pin 2 a and the associated contact pad 7 may be formed in the circuit board 1 a rectangular configured Greierlasche 12.
  • This Greierlasche 12 can act as a preloaded spring and thereby advantageously take a hold-down function. In this way, the printed circuit board 1 with the contact pad 7 is firmly pressed against the contact partner 2, in the present case, therefore, against the adjacent end face of the pin 2 a.
  • the embodiment of the contact pads 7 and the Kunststoffierlasche 12 can be carried out according to the invention in other geometric configurations.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé pour former une liaison électrique entre une carte rigide de circuit (1) et un partenaire métallique de contact (2), ledit procédé présentant les étapes suivantes : préparer la carte rigide de circuit (1) qui comprend au moins une couche de cuivre (3) et au moins une couche (5) de préimprégné, rapprocher le partenaire métallique de contact (2) de la carte de circuit (1) de telle sorte que le partenaire métallique de contact (2) soit amené à se poser sur un tampon de contact (7) prévu sur la couche de cuivre (3) de la carte de circuit (1), former une découpe dans la carte de circuit (1) en enlevant la couche (5) de préimprégné dans au moins une partie du tampon de contact (7) et irradier par de la lumière laser (9) pour former une liaison soudée entre le partenaire de contact (2) et le tampon de contact (7). L'invention concerne en outre un système constitué d'une carte rigide de circuit (1), d'un partenaire métallique de contact (2) et d'un emplacement de liaison électrique, ainsi qu'un module qui contient un tel système.
EP08864519A 2007-12-21 2008-12-11 Procédé de mise en contact d'une carte rigide de circuit et d'un partenaire de contact et système constitué d'une carte rigide de circuit et d'un partenaire de contact Withdrawn EP2225807A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007062202.5A DE102007062202B4 (de) 2007-12-21 2007-12-21 Beschreibung Verfahren zur Kontaktierung einer starren Leiterplatte mit einem Kontaktpartner und Anordnung aus starrer Leiterplatte und Kontaktpartner
PCT/EP2008/067292 WO2009080540A1 (fr) 2007-12-21 2008-12-11 Procédé de mise en contact d'une carte rigide de circuit et d'un partenaire de contact et système constitué d'une carte rigide de circuit et d'un partenaire de contact

Publications (1)

Publication Number Publication Date
EP2225807A1 true EP2225807A1 (fr) 2010-09-08

Family

ID=40364467

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08864519A Withdrawn EP2225807A1 (fr) 2007-12-21 2008-12-11 Procédé de mise en contact d'une carte rigide de circuit et d'un partenaire de contact et système constitué d'une carte rigide de circuit et d'un partenaire de contact

Country Status (5)

Country Link
US (1) US8502089B2 (fr)
EP (1) EP2225807A1 (fr)
JP (1) JP5080653B2 (fr)
DE (1) DE102007062202B4 (fr)
WO (1) WO2009080540A1 (fr)

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DE102007062202A1 (de) 2009-07-02
DE102007062202B4 (de) 2021-06-10
WO2009080540A1 (fr) 2009-07-02
JP2011509499A (ja) 2011-03-24
JP5080653B2 (ja) 2012-11-21
US20110036627A1 (en) 2011-02-17
US8502089B2 (en) 2013-08-06

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