DE102005035102A1 - Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen - Google Patents

Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen Download PDF

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Publication number
DE102005035102A1
DE102005035102A1 DE200510035102 DE102005035102A DE102005035102A1 DE 102005035102 A1 DE102005035102 A1 DE 102005035102A1 DE 200510035102 DE200510035102 DE 200510035102 DE 102005035102 A DE102005035102 A DE 102005035102A DE 102005035102 A1 DE102005035102 A1 DE 102005035102A1
Authority
DE
Germany
Prior art keywords
connection
electrically conductive
conductive connection
layer
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200510035102
Other languages
German (de)
English (en)
Inventor
Gerhard Wetzel
Helmut Deringer
Peter Sprafke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE200510035102 priority Critical patent/DE102005035102A1/de
Priority to PCT/EP2006/062863 priority patent/WO2007012514A1/fr
Publication of DE102005035102A1 publication Critical patent/DE102005035102A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
DE200510035102 2005-07-27 2005-07-27 Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen Withdrawn DE102005035102A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200510035102 DE102005035102A1 (de) 2005-07-27 2005-07-27 Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen
PCT/EP2006/062863 WO2007012514A1 (fr) 2005-07-27 2006-06-02 Connexion electroconductrice et procede de production de cette connexion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200510035102 DE102005035102A1 (de) 2005-07-27 2005-07-27 Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen

Publications (1)

Publication Number Publication Date
DE102005035102A1 true DE102005035102A1 (de) 2007-02-01

Family

ID=37012108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200510035102 Withdrawn DE102005035102A1 (de) 2005-07-27 2005-07-27 Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen

Country Status (2)

Country Link
DE (1) DE102005035102A1 (fr)
WO (1) WO2007012514A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2922373A1 (fr) * 2014-03-18 2015-09-23 Robert Bosch Gmbh Procédé de raccordement de deux composants conducteurs d'électricité au moyen d'un rayon laser et composite de composant
WO2017194618A1 (fr) * 2016-05-11 2017-11-16 Flex Automotive Gmbh Ensemble circuit électrique et son procédé de fabrication
US9844146B2 (en) 2016-05-11 2017-12-12 Flextronics Automotive Gmbh & Co. Kg Electrical circuitry assembly and method for manufacturing the same
JP2019121774A (ja) * 2017-12-28 2019-07-22 株式会社フジクラ 金属片付き配線基板および金属片付き配線基板の製造方法
DE102022213610A1 (de) 2022-12-14 2024-06-20 Robert Bosch Gesellschaft mit beschränkter Haftung Kontaktierung einer flexiblen Leiterfolie mit einer starren Leiterplatte sowie Verfahren zur Herstellung einer derartigen Kontaktierung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110557904A (zh) * 2019-09-03 2019-12-10 东莞市震泰电子科技有限公司 双面电路板及其导通方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2053500A1 (de) * 1969-11-13 1971-05-19 Philips Nv Verfahren zum Verbinden metallener Kontaktstellen elektrischer Einzelteile mit metallenen Leitern eines schlaffen Substrates
DE3535008A1 (de) * 1985-10-01 1987-04-02 Telefunken Electronic Gmbh Folienschaltung
DE4301692A1 (en) * 1992-01-24 1993-07-29 Matsushita Electric Ind Co Ltd Electrically connecting together 2-printed type circuit boards - by e.g. applying circuit of conducting thermoplastics to two insulating sheets, ultrasonically bonding them together under pressure and cooling
JPH07335359A (ja) * 1994-06-13 1995-12-22 Sumitomo Electric Ind Ltd テープ電線の接続方法
DE69325536T2 (de) * 1992-03-27 1999-11-18 Raytheon Co Zwischenverbindung mit Erhebungen für Flachkabel und Leiterplatten
JP2001237526A (ja) * 2000-02-23 2001-08-31 Fujikura Ltd プリント配線基板と金属端子の接続方法
US20020081894A1 (en) * 2000-12-21 2002-06-27 Fuerst Robert M. Flat flexible circuit interconnections
DE10036900C2 (de) * 2000-07-28 2002-07-11 Siemens Ag Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner
US6523734B1 (en) * 1999-06-22 2003-02-25 Omron Corporation Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules
DE10224713A1 (de) * 2002-06-04 2003-12-18 Daimler Chrysler Ag Flachkabel, Verfahren zur Reparatur des Flachkabels und Vorrichtung zur Durchführung des Verfahrens

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD122760A1 (fr) * 1975-12-10 1976-10-20
DE19549635B4 (de) * 1995-02-15 2004-12-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
JPH11312568A (ja) * 1998-04-27 1999-11-09 Yazaki Corp ステアリング用電気的接続装置における電線とフラットケーブルの接続コネクタ
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2053500A1 (de) * 1969-11-13 1971-05-19 Philips Nv Verfahren zum Verbinden metallener Kontaktstellen elektrischer Einzelteile mit metallenen Leitern eines schlaffen Substrates
DE3535008A1 (de) * 1985-10-01 1987-04-02 Telefunken Electronic Gmbh Folienschaltung
DE4301692A1 (en) * 1992-01-24 1993-07-29 Matsushita Electric Ind Co Ltd Electrically connecting together 2-printed type circuit boards - by e.g. applying circuit of conducting thermoplastics to two insulating sheets, ultrasonically bonding them together under pressure and cooling
DE69325536T2 (de) * 1992-03-27 1999-11-18 Raytheon Co Zwischenverbindung mit Erhebungen für Flachkabel und Leiterplatten
JPH07335359A (ja) * 1994-06-13 1995-12-22 Sumitomo Electric Ind Ltd テープ電線の接続方法
US6523734B1 (en) * 1999-06-22 2003-02-25 Omron Corporation Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules
JP2001237526A (ja) * 2000-02-23 2001-08-31 Fujikura Ltd プリント配線基板と金属端子の接続方法
DE10036900C2 (de) * 2000-07-28 2002-07-11 Siemens Ag Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner
US20020081894A1 (en) * 2000-12-21 2002-06-27 Fuerst Robert M. Flat flexible circuit interconnections
DE10224713A1 (de) * 2002-06-04 2003-12-18 Daimler Chrysler Ag Flachkabel, Verfahren zur Reparatur des Flachkabels und Vorrichtung zur Durchführung des Verfahrens

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2922373A1 (fr) * 2014-03-18 2015-09-23 Robert Bosch Gmbh Procédé de raccordement de deux composants conducteurs d'électricité au moyen d'un rayon laser et composite de composant
WO2017194618A1 (fr) * 2016-05-11 2017-11-16 Flex Automotive Gmbh Ensemble circuit électrique et son procédé de fabrication
US9844146B2 (en) 2016-05-11 2017-12-12 Flextronics Automotive Gmbh & Co. Kg Electrical circuitry assembly and method for manufacturing the same
CN109315068A (zh) * 2016-05-11 2019-02-05 伟创立汽车工业有限公司 电路组件及其制造方法
JP2019121774A (ja) * 2017-12-28 2019-07-22 株式会社フジクラ 金属片付き配線基板および金属片付き配線基板の製造方法
WO2019167602A1 (fr) * 2017-12-28 2019-09-06 株式会社フジクラ Carte de câblage comprenant une pièce métallique et procédé de fabrication de carte de câblage comprenant une pièce métallique
CN111742623A (zh) * 2017-12-28 2020-10-02 株式会社藤仓 带金属片配线基板以及带金属片配线基板的制造方法
DE102022213610A1 (de) 2022-12-14 2024-06-20 Robert Bosch Gesellschaft mit beschränkter Haftung Kontaktierung einer flexiblen Leiterfolie mit einer starren Leiterplatte sowie Verfahren zur Herstellung einer derartigen Kontaktierung

Also Published As

Publication number Publication date
WO2007012514A1 (fr) 2007-02-01

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
R012 Request for examination validly filed

Effective date: 20120514

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee