WO2006134858A1 - Feuille de graphite dissipant la chaleur et dispositif électrique l’utilisant - Google Patents

Feuille de graphite dissipant la chaleur et dispositif électrique l’utilisant Download PDF

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Publication number
WO2006134858A1
WO2006134858A1 PCT/JP2006/311728 JP2006311728W WO2006134858A1 WO 2006134858 A1 WO2006134858 A1 WO 2006134858A1 JP 2006311728 W JP2006311728 W JP 2006311728W WO 2006134858 A1 WO2006134858 A1 WO 2006134858A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
sheet
graphite sheet
specific gravity
graphite
Prior art date
Application number
PCT/JP2006/311728
Other languages
English (en)
Japanese (ja)
Inventor
Kazuhiko Kubo
Norihiro Kawamura
Masashi Funaba
Hidefumi Sasaki
Minoru Oouchi
Mitsuru Tamaoki
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Priority to JP2007521269A priority Critical patent/JP5098642B2/ja
Publication of WO2006134858A1 publication Critical patent/WO2006134858A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C01B32/205—Preparation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Definitions

  • the present invention relates to a heat radiating sheet for radiating heat from a heat generating portion of various electronic devices, and more particularly to a heat radiating sheet using a graphite.
  • Graphite is used in various applications such as electrodes, heat-resistant sealing materials, and gaskets because of its excellent heat resistance, chemical resistance, thermal conductivity, and high electrical conductivity.
  • the graphite sheet for heat dissipation according to the present invention has a specific gravity of 1.57 gZcm 3 or more of the graphite sheet formed by the covalent bond of carbon, thereby dramatically increasing the thermal conductivity of the graphite sheet. Can be improved.
  • FIG. 1 is a front view of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of an essential part of the electronic apparatus in one embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of the electronic device according to the embodiment of the present invention.
  • FIG. 4A is an exploded perspective view of the semiconductor package according to one embodiment of the present invention.
  • FIG. 4B is a cross-sectional view of the semiconductor package in one embodiment of the present invention.
  • FIG. 5 is a graph showing the thermal conductivity of various materials.
  • FIG. 6 is a schematic view showing the structure of a graph eye sheet.
  • FIG. 1 is a front view when a folding mobile phone as an electronic device is opened, and FIG.
  • a base plate 4 and a battery 9 on which various electronic components are mounted are arranged on the inner back surface of the operation button 3.
  • a power amplifier 5 and an isolator 6 that are heat-generating components are mounted on the substrate 4.
  • a heat dissipation graph eye sheet 7 (hereinafter simply referred to as a graph eye sheet) is arranged on the inner surface of the case 8 so as to face the power amplifier 5 and the isolator 6.
  • the graph eye sheet 7 effectively carries heat generated from the power amplifier 5 and the isolator 6 to the case 8 and reduces heat spots.
  • the heat spot means that heat is concentrated at a specific location.
  • the graphite sheet is sheet-like graphite and is produced by thermally decomposing a polymer film.
  • the power amplifier 5 is an example of a semiconductor amplifier element
  • the isolator 6 is an example of a semiconductor arithmetic element.
  • the semiconductor amplifier element is not limited to the power amplifier 5, but the semiconductor arithmetic element is not limited to the isolator 6.
  • FIG. 2 shows a cross-sectional view of the operation unit 2 and a surface temperature distribution diagram of the case 8 showing the heat radiation effect of the graph eye sheet 7 in the operation unit.
  • the horizontal axis shows the position from the heat spot
  • the vertical axis shows the relative temperature at each position.
  • Curve 1 shows the surface temperature distribution when no graph eye sheet 7 is provided.
  • the surface temperature of the case 8 shows the highest temperature in the part of the case 8 where the power amplifier 5 and the isolator 6 face each other, and the surface temperature gradually decreases over the peripheral edge.
  • Curve 2 shows the surface temperature distribution when a conventional graphite sheet, that is, a graphite sheet having a specific gravity of less than 1.57 gZcm 3 is used. Compared to curve 1, the maximum temperature is significantly reduced in curve 2. However, it has not been possible to achieve a heat dissipation effect that is more than the heat spot is not completely eliminated.
  • Curve 3 shows the surface temperature distribution when the graph eye sheet 7 of the present invention is used.
  • the maximum temperature is even lower than curve 2 using the conventional graphite sheet.
  • the graph eye sheet 7 of the present invention effectively dissipates heat to the peripheral portion.
  • FIG. 3 is an exploded perspective view of the electronic apparatus according to the embodiment of the present invention, and particularly shows the flow of heat generated from the heat generating component. That is, heat from the heat generating component 10 mounted on the substrate 11 is conveyed to the graph eye sheet 7 disposed on the upper surface side of the substrate 11 (arrow A). This heat is transmitted from the graph eye sheet 7 to the case 12 at that position (arrow B), and is also transmitted to the case 12 after propagating through the graph eye sheet 7 (arrow C). Similarly, the heat generated from the heat generating component 10 is transported to the graph eye sheet 7 via the substrate 11 and is radiated from the graph eye sheet 7 to the surface. At the same time, it propagates through the graph eye sheet 7 and is dissipated from the entire graph eye sheet 7.
  • one of the functions of the graph eye sheet 7 has a function of carrying heat, that is, carrying heat and a function of diffusing heat. Therefore, in addition to the above example, for example, the heat from the heat generating component 10 can be transported to the heat sink (not shown) installed separately via the graphic sheet 7, and the heat sink force can also be dissipated.
  • FIG. 4A is an exploded perspective view of the semiconductor package and the heat sink in one embodiment of the present invention
  • FIG. 4B is a cross-sectional view thereof.
  • the graph sheet 7 is provided between the semiconductor package 15 and the heat sink 16, and between the outer periphery of the semiconductor package 15 and the heat generation source 17.
  • the heat generated from the heat source 17 housed in the semiconductor package 15 is conveyed to the outer periphery of the semiconductor package 15 via the graph eye sheet 7, and further via the graph eye sheet 7.
  • FIG. 5 is a graph showing the thermal conductivity in the plane direction of the graphite sheet 7 of the present invention, the conventional graphite sheet, and various metal materials.
  • Heat made of conventional silicone rubber The thermal conductivity is 1 WZ (mK) for the conductive sheet, 70 WZ (mK) for the magnesium alloy, 200 WZ (m'K) for aluminum, and 350 WZ (m'K) for pure copper.
  • the thermal conductivity of the conventional graphite sheet is about 700WZ (m'K).
  • the thermal conductivity of the graphite sheet of the present invention is 1260 WZ (m'K), which is far higher than that of the conventional graphite sheet. It has been realized so far! It achieves a high level of thermal conductivity.
  • the structure of the graphite sheet is a crystal structure in which carbon atoms are covalently bonded in the ab plane direction as shown in FIG. 6, and a flat structure formed by a carbon six-membered ring in the C axis direction.
  • the surface has a layered structure. In other words, due to the intermolecular force, the distance between the planes in the c-axis direction is 3. 354 to 3. 356 X 10 _8 cm.
  • a polyimide film having a thickness of 50 ⁇ m is heated to 1400 ° C. in an argon atmosphere, held at 1400 ° C. for 2 hours, and then cooled.
  • the polyimide film begins to decompose before and after 600 ° C, and the nitrogen atoms, oxygen atoms, and hydrogen atoms that form the polyimide are gasified and the polyimide film force is lost.
  • the pre-baked polyimide film is heated to 2900 ° C. in an argon atmosphere, held at 2900 ° C. for 1 hour, and then cooled.
  • the film out of the gas exceeds 200 ° C.
  • the remaining carbon atoms are covalently bonded using the thermal energy at this time, crystallization is promoted and the crystallized structure is layered.
  • using an iron roller The film after high-temperature firing is rolled to produce a graphite sheet.
  • the specific gravity of the graphite sheet can be adjusted according to the rolling conditions of the iron roller.
  • Graphite sheets having different specific gravities were produced by the above production method.
  • the dullite sheets of Examples 1 to 3 have a specific gravity of 1.57 or more, and the graphite sheets of Comparative Examples 1 to 3 have a specific gravity of less than 1.57.
  • the thermal diffusivity and thermal conductivity of each graphite sheet were measured.
  • the thermal diffusivity was measured by the scanning laser heating cycle method, and the thermal conductivity was calculated by calculating the thermal diffusivity, specific gravity, and specific heat value. The results are shown in Table 1.
  • the specific gravity of the graphite sheet is 1.57 gZcm 3
  • the thermal conductivity is 1005 WZ (m′K), which is an unprecedented high value.
  • m′K the specific gravity indicated a value of 1069W / (m'K)
  • the specific gravity of the graphite sheet is preferably 1.57 gZcm 3 or more. More preferably, the specific gravity is 1. 67gZcm 3 than on, even more preferably it is desirable specific gravity of 1. 8gZcm 3 or more.
  • the gesture et desired 8 cm 2 Zs on than is for effective heat dissipation, 10 cm 2 Zs or more is more preferable.
  • the heat-dissipating graph-eye sheet of the present invention is useful for electronic devices that have heat-generating components such as power amplifiers, isolators, and semiconductor elements and that require heat dissipation.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Geology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

La présente invention concerne une feuille de graphite dissipant la chaleur présentant une densité de 1,57 g/cm3 ou plus. La feuille de graphite dissipant la chaleur selon l’invention présente une conductivité thermique remarquablement améliorée et atteint une conductivité thermique élevée de 1005W/(m·K) non encore atteinte de façon conventionnelle.
PCT/JP2006/311728 2005-06-16 2006-06-12 Feuille de graphite dissipant la chaleur et dispositif électrique l’utilisant WO2006134858A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007521269A JP5098642B2 (ja) 2005-06-16 2006-06-12 放熱用グラファイトシートの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005175944 2005-06-16
JP2005-175944 2005-06-16

Publications (1)

Publication Number Publication Date
WO2006134858A1 true WO2006134858A1 (fr) 2006-12-21

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JP (1) JP5098642B2 (fr)
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009043851A (ja) * 2007-08-07 2009-02-26 Toshiba Corp 半導体パッケージ
JP2009111003A (ja) * 2007-10-26 2009-05-21 Kaneka Corp 複合断熱体とそれを含む電子機器
JP2009176689A (ja) * 2008-01-28 2009-08-06 Sanyo Electric Co Ltd 電池パック
JP2009280433A (ja) * 2008-05-21 2009-12-03 Kaneka Corp グラファイト複合フィルム
JP2009292694A (ja) * 2008-06-06 2009-12-17 Kaneka Corp グラファイトフィルムの製造方法
JP2011508446A (ja) * 2007-12-28 2011-03-10 ジーイー・インテリジェント・プラットフォームズ・インコーポレイテッド ヒートシンク、および楔係止システムを用いたヒートシンク形成方法
JP2012148904A (ja) * 2011-01-17 2012-08-09 Kaneka Corp ヒートスポット抑制フィルム、デバイス、およびヒートスポット抑制フィルムの製造方法
JP2013139390A (ja) * 2013-04-24 2013-07-18 Kaneka Corp グラファイトフィルムの製造方法
WO2014196347A1 (fr) * 2013-06-07 2014-12-11 信越化学工業株式会社 Feuille composite thermiquement conductrice et structure de dissipation de chaleur
JP2015532531A (ja) * 2012-09-25 2015-11-09 モーメンティブ・パフォーマンス・マテリアルズ・インク バルクグラフェン材料を含む熱管理アセンブリ
JP2017071528A (ja) * 2015-10-06 2017-04-13 株式会社カネカ 層間熱接合材料およびパワー半導体用冷却システム
JP2019023285A (ja) * 2017-07-21 2019-02-14 達勝科技股▲ふん▼有限公司 人造グラファイトを含む複合材料、グラファイトシート及びこれらの製造方法
US11805593B2 (en) 2020-06-01 2023-10-31 Denso Corporation Cooling device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04214072A (ja) * 1990-12-12 1992-08-05 Osaka Gas Co Ltd 炭素質組成物、燃料電池用炭素材およびその製造方法
JPH04342407A (ja) * 1989-12-07 1992-11-27 General Electric Co <Ge> 膨脹熱分解性グラファイト、膨脹熱分解性グラファイトの製造法およびそれから製造される絶縁材
JPH10156832A (ja) * 1996-11-28 1998-06-16 Matsushita Electric Ind Co Ltd 熱伝導制御装置及びこの装置を用いた樹脂成形金型装置
JP2000323633A (ja) * 1999-05-10 2000-11-24 Mitsubishi Pencil Co Ltd 炭素放熱体及びその製造方法
JP2001278608A (ja) * 2000-03-31 2001-10-10 Matsushita Electric Ind Co Ltd 熱放射体の製造方法
JP2003165715A (ja) * 2001-11-29 2003-06-10 Du Pont Toray Co Ltd 炭素フィルムの製造方法およびそれから得られる炭素フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04342407A (ja) * 1989-12-07 1992-11-27 General Electric Co <Ge> 膨脹熱分解性グラファイト、膨脹熱分解性グラファイトの製造法およびそれから製造される絶縁材
JPH04214072A (ja) * 1990-12-12 1992-08-05 Osaka Gas Co Ltd 炭素質組成物、燃料電池用炭素材およびその製造方法
JPH10156832A (ja) * 1996-11-28 1998-06-16 Matsushita Electric Ind Co Ltd 熱伝導制御装置及びこの装置を用いた樹脂成形金型装置
JP2000323633A (ja) * 1999-05-10 2000-11-24 Mitsubishi Pencil Co Ltd 炭素放熱体及びその製造方法
JP2001278608A (ja) * 2000-03-31 2001-10-10 Matsushita Electric Ind Co Ltd 熱放射体の製造方法
JP2003165715A (ja) * 2001-11-29 2003-06-10 Du Pont Toray Co Ltd 炭素フィルムの製造方法およびそれから得られる炭素フィルム

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7868450B2 (en) 2007-08-07 2011-01-11 Kabushiki Kaisha Toshiba Semiconductor package
JP2009043851A (ja) * 2007-08-07 2009-02-26 Toshiba Corp 半導体パッケージ
JP2009111003A (ja) * 2007-10-26 2009-05-21 Kaneka Corp 複合断熱体とそれを含む電子機器
JP2011508446A (ja) * 2007-12-28 2011-03-10 ジーイー・インテリジェント・プラットフォームズ・インコーポレイテッド ヒートシンク、および楔係止システムを用いたヒートシンク形成方法
JP2009176689A (ja) * 2008-01-28 2009-08-06 Sanyo Electric Co Ltd 電池パック
JP2009280433A (ja) * 2008-05-21 2009-12-03 Kaneka Corp グラファイト複合フィルム
JP2009292694A (ja) * 2008-06-06 2009-12-17 Kaneka Corp グラファイトフィルムの製造方法
JP2012148904A (ja) * 2011-01-17 2012-08-09 Kaneka Corp ヒートスポット抑制フィルム、デバイス、およびヒートスポット抑制フィルムの製造方法
JP2015532531A (ja) * 2012-09-25 2015-11-09 モーメンティブ・パフォーマンス・マテリアルズ・インク バルクグラフェン材料を含む熱管理アセンブリ
JP2013139390A (ja) * 2013-04-24 2013-07-18 Kaneka Corp グラファイトフィルムの製造方法
WO2014196347A1 (fr) * 2013-06-07 2014-12-11 信越化学工業株式会社 Feuille composite thermiquement conductrice et structure de dissipation de chaleur
JP6032359B2 (ja) * 2013-06-07 2016-11-24 信越化学工業株式会社 熱伝導性複合シート及び放熱構造体
JPWO2014196347A1 (ja) * 2013-06-07 2017-02-23 信越化学工業株式会社 熱伝導性複合シート及び放熱構造体
JP2017071528A (ja) * 2015-10-06 2017-04-13 株式会社カネカ 層間熱接合材料およびパワー半導体用冷却システム
JP2019023285A (ja) * 2017-07-21 2019-02-14 達勝科技股▲ふん▼有限公司 人造グラファイトを含む複合材料、グラファイトシート及びこれらの製造方法
US11805593B2 (en) 2020-06-01 2023-10-31 Denso Corporation Cooling device

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JPWO2006134858A1 (ja) 2009-01-08
JP5098642B2 (ja) 2012-12-12

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