WO2006129547A1 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- WO2006129547A1 WO2006129547A1 PCT/JP2006/310446 JP2006310446W WO2006129547A1 WO 2006129547 A1 WO2006129547 A1 WO 2006129547A1 JP 2006310446 W JP2006310446 W JP 2006310446W WO 2006129547 A1 WO2006129547 A1 WO 2006129547A1
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- WO
- WIPO (PCT)
- Prior art keywords
- bonding apparatus
- chip
- head
- substrate
- chip component
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 238000005086 pumping Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01082—Lead [Pb]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
Definitions
- the present invention relates to a bonding apparatus for mounting a chip component such as an electronic component on a work made of glass, a resin, a metal substrate, and the like.
- a conventional bonding apparatus for mounting a chip component with a bump electrode on a substrate which is a workpiece in a face-up state, uses a alignment mark for identifying a chip component alignment mark and a substrate mounting site. Recognize both from the top of the chip part. Specifically, a prism is used for the head portion that holds the chip component by suction, and the images of both members including the alignment marks of the chip component and the substrate are reflected by the slope of the prism, and the head is located on the side of the head. The image is projected onto a CCD camera that is independently fixed.
- the holding table for holding the substrate is moved horizontally and vertically and the center of the chip component is It is rotated around the axis (for example, see Patent Document 1).
- Patent Literature l WO2003Z041478
- the conventional bonding apparatus is also configured with a mechanism for moving the chip holding head in the vertical direction and a mechanism force for moving the substrate holding table in the horizontal direction and the rotation direction. Therefore, when the conventional configuration is followed to support a large board and chip components are mounted on the entire board with a chip holding head, the stroke is twice the board mounting area and the diagonal length of the board is the rotation area. Therefore, there is a problem that the equipment becomes larger.
- the present invention has been made in view of such circumstances, and solves a problem mainly intended to provide a bonding apparatus having a simple apparatus configuration and capable of improving mounting accuracy. Means to do
- the present invention has the following configuration in order to achieve the above object.
- the bonding apparatus of the present invention is a bonding apparatus for mounting a chip component on a work held by a work holding means, and includes a box-like frame body having at least a part of a side face and an open bottom face.
- a transparent chip holding means attached to the lower surface opening portion of the frame body and holding the chip component; and a chip holding means that advances and retreats into an opening on a side surface of the frame body of the head.
- a chip part held by the chip holding means, a recognition means for recognizing a mounting position of the chip part of the work held by the work holding means through the chip holding means, and the chip holding the chip part First driving means for rotating the head around the central longitudinal axis of the component, second driving means for moving the head and the work holding means relatively up and down, the head and the front
- Second driving means for moving the head and the work holding means relatively up and down, the head and the front Based on the recognition result of the third drive means for relatively horizontally moving the work holding means and the recognition means, a relative positional deviation between the chip part and the reference position of the work is detected, and the positional deviation is corrected.
- the first drive means and the control means for driving and controlling the third drive means are provided.
- the bonding apparatus of the present invention it is not necessary to rotate the substrate by driving the head so as to rotate about the central axis of the chip component. That is, it is not necessary to secure a space to rotate in consideration of the diagonal length longer than the vertical and horizontal length of the workpiece.
- the device configuration is simplified.
- the recognition means advances and retreats at the side opening of the head, so Since chip parts and workpieces can be recognized at a constant angle and a constant distance, image changes (distortions) due to changes in the optical projection angle do not occur. Therefore, it is possible to accurately recognize the position of the chip part and the workpiece and improve the mounting accuracy.
- the recognition means includes a CCD camera that recognizes both reference positions of the chip part and the workpiece, and a projection means that projects the reference position of the chip part and the work to the CCD camera in front of the forward and backward direction of the CCD camera. And is preferably composed of
- the projection means is configured to project the chip parts and the workpiece reference positions separately onto the two CCD cameras.
- the projection means can be configured as follows.
- the projection means includes a pair of first mirrors that reflect both the reference position of the chip part and the workpiece, and a pair of second mirrors that reflects the image of the reference position reflected on the first mirror and projects it onto the CCD camera. It can consist of.
- the alignment marks at one corner are reflected on one first mirror. Reflected by the second mirror and projected onto one CCD camera, the alignment marks at the other corners are projected onto the other first mirror, reflected to the second mirror and projected onto the other CCD camera. It is preferable to configure.
- the reference positions of both members can be accurately recognized with a wide field of view even within the narrow opening of the head. be able to. For example, when there are a plurality of reference positions (alignment marks) separated from each other in the chip part, all the alignment marks can be recognized by one process.
- the reference position of the chip component a bump formed on the chip component when mounted in a face-up state can be used.
- the head is moved up and down over the operation position for mounting the chip component on the board and the upper standby position, or the head is moved horizontally with respect to the board surface. It is preferable to combine these configurations.
- the second driving means includes a piston that slides in the cylinder, and a tip of the piston.
- the actuator is an actuator that is composed of a rod that extends also, and that allows the piston to rotate around the axis within the cylinder.
- the rod of the cylinder of the second driving means and the first driving means are connected by a link mechanism so that the driving force of the second driving means is converted into the rotational force of the first driving means.
- the first drive means is provided in the head.
- the configuration on the head side can be simplified. That is, since the configuration on the head side can be reduced, for example, when the head side is raised and lowered, the elevation adjustment is facilitated, and the risk of excessive pressurization of the chip component is eliminated.
- the rod has a guide on its outer peripheral surface, and the link mechanism slides the link portions of the two link bars in conjunction with the two link bars and the bending action of the two link bars.
- the link bar is composed of a telescopic guide that makes the lengths of both link bars constant.
- a scale fixed to the tip of the link bar connected to the rod side, a detection means for detecting the rotation angle of the scale interlocking with the rotation of the link bar, and a detection result by the detection means, And a control means for positioning the head.
- the control means uses a master substrate having a scale associated with the mounting position of the chip component, and positional information of each mounting position recognized by the recognition means.
- the correlation with the drive shafts of the first to third drive means is obtained and stored in advance, and when mounting chip components on the workpiece, the offset of the drive axis of each drive means is offset using the correlation.
- each drive means is controlled to be driven.
- the bonding apparatus it is not necessary to rotate the substrate by driving the head so as to rotate around the central axis of the chip component, so that a space for rotating a workpiece larger than the chip component is saved. There is no need to secure. As a result, the device configuration is simple It becomes.
- the recognition means moves back and forth at the side opening of the head and can always recognize the chip part and the workpiece at a constant angle and a constant distance, a change (distortion) of the image due to a change in the optical projection angle does not occur. Absent. Therefore, it is possible to accurately recognize the position of the chip component and the workpiece and improve the mounting accuracy.
- FIG. 1 is a perspective view of a bonding system according to an embodiment.
- FIG. 2 is a front view showing a schematic configuration of a mounting unit.
- FIG. 3 is a plan view showing a configuration of a link mechanism.
- FIG. 4 is a side view showing a schematic configuration of a recognition unit.
- FIG. 5 is a plan view showing a schematic configuration of a projection unit.
- FIG. 6 is a diagram showing an image projected on a CCD camera.
- chip portion A case where an electronic component with a bump is mounted as a product on a substrate will be described as an example.
- chip components for example, all forms on the side to be bonded to a substrate related to the type and size of IC chips, semiconductor chips, optical elements, surface mount components, wafers, etc. are shown.
- examples of the substrate include all forms on the side to be bonded to the chip component, such as a resin substrate, a glass substrate, a film substrate, and a metal substrate (for example, a copper substrate).
- FIG. 1 is a perspective view of the bonding system according to the present embodiment.
- the chip mounting apparatus is broadly divided into an apparatus base 1, a substrate supply unit 2 disposed on the front side (left end in FIG. 1) of the apparatus base 1, and an apparatus base. 1 is composed of a mounting unit 3 disposed on the back side of 1 and a chip component supply unit 4 disposed on the left side of the mounting unit 3.
- the substrate supply unit 2 has a box-like shape having an opening / closing door 5 that can be opened / closed up and down at the top, a mounting table 6 on which a substrate W as a workpiece is mounted, and the mounting table 6 There is further provided a transport mechanism 7 for sucking and holding the substrate W placed on the placement table 6 from the surface and transporting it to the substrate holding stage 14 provided on the movable table 15 on the mounting unit 3 side described later.
- positioning pins 8 that pass through positioning holes formed in the substrate W are erected at a predetermined interval.
- the transport mechanism 7 includes a suction plate 9 that can suck the surface of the substrate W, and the suction plate 9 can be moved in one axis (Y) direction above the mounting table 6 and above the substrate holding stage 14. At the same time, it can be moved up and down (in the Z-axis direction) at a position opposite to the mounting table 6 and the substrate holding stage 14.
- the suction plate 9 is connected in communication with the pump via a pipe (not shown).
- the mounting unit 3 includes a holding unit 10 that holds the substrate W transported by the transport mechanism 7 and a crimping unit that holds the chip component 11 by suction and mounts it on the substrate W.
- the unit 12 includes a recognition unit 13 for recognizing the alignment mark provided in advance on the substrate 12 and the substrate W and the chip component 11.
- the holding unit 10 has been transported with the surface being sucked and held by the suction plate 9 of the transport mechanism 7.
- the substrate holding stage 14 that holds the substrate W by suction in a horizontal posture and the movable table 15 that can move the substrate holding stage 14 in the horizontal uniaxial (Y) direction are provided.
- the movable table 15 moves forward and backward along the guide rail 16 by driving a motor (not shown) forward and reverse.
- the holding unit 10 may be a linear table.
- a heater (not shown) is incorporated in the lower part of the substrate holding stage 14 so that the substrate W can be heated from the back surface! RU
- the crimping unit 12 includes a head 17 that holds the chip component 11 by suction, a horizontal drive mechanism 18 that moves the head 17 in the horizontal one axis (X) direction, and a lift drive mechanism 19 that moves the head component 17 in the vertical (Z) direction. And a rotary drive mechanism 20 that rotates around the Z axis ( ⁇ ), and a CCD camera 37 that moves back and forth within the opening of the head 17.
- the horizontal drive mechanism 18 corresponds to the third drive means of the present invention
- the elevation drive mechanism 19 corresponds to the second drive means
- the rotary drive mechanism 20 corresponds to the first drive means
- the CCD camera 37 Corresponds to a recognition means.
- the head 17 is attached to the lower end of a lift drive mechanism 19 fixed to a movable base 25 that is movable along a guide rail 24 of a frame 23 erected on the apparatus base 1 by a horizontal drive mechanism 18. It has been.
- the head 17 includes a frame body 21 having an inverted concave shape, and a suction portion 22 having a transparent glass plate force attached to an opening at the bottom of the frame body.
- the suction part 22 is formed with a flow path that connects an opening formed in the center of the lower surface and an opening formed in the side part, and is connected in communication via a pump and a hose (not shown).
- the opening of the lower surface acts as a suction hole by the operation of the pump, and holds the chip component 11 by suction.
- an attachment having a force such as a transparent glass plate corresponding to the shape of the chip component 11 may be attached to the lower surface of the suction portion 22.
- the suction unit 22 corresponds to the chip holding means of the present invention.
- the horizontal drive mechanism 18 reciprocates the movable base 25 in the horizontal (X) direction along the guide rail 24 by driving the motor Ml forward and backward.
- the horizontal drive mechanism 18 may be a linear table! / ⁇ .
- the elevating drive mechanism 19 is an actuator composed of a cylinder 26, a piston 27 that moves in the cylinder, and a rod 28 that also extends the tip force of the piston 27.
- the piston 27 and the rod 28 are rotatable around the axis within the cylinder.
- Syrin In the pressure chamber between the piston 26 and the piston 27, a flow path for supplying or exhausting fluid is formed, and the internal pressure can be controlled by the control unit 29A for supplying and exhausting the pumping gas. it can.
- the control unit 29A and a control unit 29B described later correspond to the control unit of the present invention.
- a motor M2 constituting the rotary drive mechanism 20 is attached to the lift drive mechanism 19 on the left side in FIG. 2 with its rotary shaft facing downward.
- a link mechanism 32 that is connected to the rod 28 of the actuator via a rod guide G.
- the link mechanism 32 has an extendable guide 34 at the connecting portion of the two link bars 33a and 33b, and the tip of one link bar 33a is connected to the motor M2 and the other link bar 33a is connected to the other side.
- the end of the link bar 33b is connected to the rod guide G of the rod 28 of the actuator.
- both link bars 33a, 33b are swung left and right, and rotational power is transmitted to the rod 28, and the piston 27 rotates in the cylinder.
- the link bars 33a and 33b swing, the telescopic guide 34 expands and contracts so as to follow the change in the distance between the rotating shaft of the motor M2 and the rod 28.
- the link bar 33b is configured to maintain a constant height without following the advance / retreat of the rod 28 by the mouth guide G.
- a fan-shaped scale 35 is attached to the link bar 33b, and a memory provided on the side surface of the scale is read by an encoder 36 provided in close proximity. That is, the rotational angle of the head 17 around the Z axis can be read by reading the rotational angle of the piston 27 and transmitting the result to the control unit 29B.
- the encoder 36 corresponds to the detection means of the present invention, and the control unit 29B corresponds to the control means.
- the recognition unit 13 includes two CCD cameras 37, the alignment mark R2 of the chip component 11 held by the head 17 at the tip of each CCD camera 37, and the substrate. It consists of a projection unit 38 that captures the alignment mark R1 of W and projects it onto the CCD camera 37.
- the projection unit 38 projects the first mirror 39a that reflects the alignment mark of the chip component 11 positioned below, and the alignment mark that is projected on the first mirror 39a, and is located 90 degrees behind the CC. And a second mirror 39b projected onto the D camera 37.
- the projection unit 38 is provided on the lower surface of the movable base 25 by forward / reverse driving of the motor M3, and is configured to be movable back and forth along the guide rail 40. That is, the projection unit is configured to advance and retract within the opening of the head 17.
- the chip component supply unit 4 mounts the chip components 11 held on the ring-shaped frame after the die wafer is die-cinder-mounted, or the chip components 11 aligned on the chip tray.
- the chip component transport mechanism 42 is provided along a movable frame 45 that is movable back and forth on a guide rail 44 that extends in the Y direction of the device base 1, and a guide rail 46 that faces the front surface of the movable frame 45.
- a movable base 47 that can move in the horizontal (Y) direction is provided, and a suction head 48 that can suck and hold the chip component 11 is arranged on the movable base 47 so as to be movable up and down.
- the chip component 11 placed on the placement table 41 is sucked and held by the suction head 48, delivered to the relay unit 50, and further delivered to the slide table 43.
- the slide table 43 is movable in the horizontal (Y) direction of a frame erected on the apparatus base 1, and the chip part 11 transported to the relay unit 50 by the chip part transport mechanism 42 is removed. Configured to receive. That is, the slide table 43 conveys the chip part 11 to a position where the head 17 can be sucked.
- the chip surface is in a state where the bump electrode is on the surface, that is, the face-up state, with the back surface force of the ring-shaped frame being die-sinked for the semiconductor wafer held at the center via the adhesive tape.
- a case where a plurality of 11 are mounted on a sheet-like resin substrate will be described as an example.
- a thermosetting adhesive material is transferred to the back surface of the chip part 11.
- a master substrate engraved with a reference scale associated with the mounting portion of the substrate W is mounted on the mounting table and positioned by the pin 9 Align. After that, the master board is transported by the transport mechanism 7 and mounted on the mounting queue.
- the reference scale on the master substrate is sequentially projected from the projection unit 38 that is mounted on the substrate holding stage 14 of the first stage 3 and moved to the opening of the head 17 by operating the mounting unit 3 and the recognition unit 13.
- the CCD camera force captures the image data and the coordinates of each drive axis (X, ⁇ , Z) of the CCD camera 37, substrate holding stage 14, etc., and each drive axis (X, ⁇ , Z) obtained from the image data Coordinate force
- the correlation between the CCD camera 37 and each axis is obtained and stored in the apparatus body in advance as a correlation function.
- a process of mounting the chip component 11 on the substrate W to be mounted is performed.
- the ring-shaped frame holding the semiconductor wafer after die cinder is set on the mounting table 41 of the chip component supply unit 4.
- the opening / closing door 5 of the substrate supply unit 2 is opened, the substrate W is aligned and placed on the mounting table 6, and then the opening / closing door 5 is closed.
- the suction plate 9 operates, descends at a position opposite to the substrate W, adsorbs and holds the substrate W, and transports it to the substrate holding stage 14.
- the suction plate 9 When the suction plate moves above the substrate holding stage 14, the suction plate 9 is lowered, the back surface of the substrate W is brought into contact with the substrate holding stage 14, and then the suction on the suction plate side is released. The suction plate 9 that has released the suction returns to the standby position. At the same time as the suction of the suction plate is released, the suction of the substrate holding stage 14 is activated to hold the substrate W by suction.
- the chip component supply unit 4 also performs a process of delivering the chip component 11 to the head 17 of the mounting unit 3.
- the movable frame 45 and the movable base 47 on which the suction head 48 is mounted move in the horizontal (X, Y) direction, and hold a predetermined chip component 11 in a face-up state.
- the suction head 48 that sucks and holds the chip part 11 is moved to the right end in the figure by the movable base 47 and transfers the chip part 11 to the relay part 50. Therefore, the relay part 50 places the chip part 11 on the slide table 43. Pass to.
- the slide table 47 that has received the chip part 11 moves along the guide rail to the position where the chip part 11 is delivered to the head 17.
- the movable base 25 is moved along the guide rail 24 to a position where the chip component 11 is mounted.
- the head 17 sucks and holds the chip component 11 conveyed to the mounting position by the slide table 43.
- the projection unit 38 in the opening of the head 17 in advance includes the alignment mark R 1 written on the substrate W and two bumps at diagonal positions of the chip component 11.
- R2 is the alignment mark and is projected onto the pair of left and right first and second mirrors 39a and 39b.
- the alignment mark R1 on the right side of the substrate W figure is displayed on one CCD camera 37 and the alignment mark on the left side of the substrate W figure is shown. Project R1 to the other CCD camera 37.
- the alignment mark R 2 on the right side of the chip part 11 in the figure is projected onto one CCD camera 37, and the alignment mark R 2 on the left side of the chip part 11 in the figure is projected onto the CCD camera 37.
- the control unit 29B compares the alignment marks acquired by the CCD camera 37 with a pre-stored reference position. If a positional deviation occurs as a result of the comparison, a correction value is calculated using the correlation function obtained with the master substrate.
- control unit 29B rotates the movable table 15 in the horizontal (Y) direction, the movable table in the horizontal (X) direction, and the head 17 around the Z axis ( ⁇ ). Move to align.
- the actuator When the alignment is completed, the actuator is operated to lower the head 17 and press the chip component 11 against the mounting portion of the substrate W. At this time, since the pressure in the pressure chamber of the cylinder is kept constant by the control unit 29A, a predetermined pressure is applied to the chip component 11. Simultaneously with this pressing, the adhesive on the back surface of the chip component 11 is heated by the heater built in the substrate holding stage 14 to accelerate the polymerization reaction. Then, when the polymerization reaction of the adhesive is completed, the head 17 returns to the upper standby position. When the polymerization reaction is completed, the chip component 11 is fixed to the substrate W.
- the suction plate 9 is actuated to move toward the substrate holding stage 14, and the chip component 11 is mounted.
- the substrate W is sucked and held and transferred to the mounting table 6 of the substrate supply unit 2.
- this board is taken out from the board supply unit 2, a series of processes for mounting the chip component 11 on the board W is completed.
- the head 17 is rotated around the axis, so that it is not necessary to rotate the substrate W larger than the chip component 11.
- the rotation radius of the head 17 is smaller than the rotation radius of the square or rectangular substrate W, the device can be made smaller.
- the projection part is moved back and forth within the opening of the head 17 to recognize the alignment marks on the substrate W and the chip component 11, the optical imaging conditions are always constant, and a certain distance from the mirror to the CCD camera.
- the image that maintains is projected onto the CCD camera.
- the alignment mark projected on the CCD camera 37 is not deformed and can be accurately recognized because it is not affected by changes in the projected image such as a prism due to changes in the projection angle. Therefore, implementation errors can be suppressed.
- each CCD camera 37 Since the first and second mirrors 39a and 39b and the CCD camera 37 are separately provided so that the alignment mark of the substrate W and the chip component 11 is individually recognized by the projection unit, each CCD camera 37 The positioning process can be performed in parallel based on the image data. In other words, mounting speed can be improved by parallelizing the positioning process. In this case, it functions effectively when the distance between the alignment mark of the substrate W and the chip component 11 is long.
- the link mechanism 32 can perform highly accurate rotation control that is not affected by a loss error due to deterioration of the link mechanism 32, by the guide rod center, the concentric circle angle detection scale 35, and the encoder 36. Further, since only the head 17 is rotated, the rotating mechanism can be reduced in size and weight.
- the movable table 15 is moved only in the horizontal (Y) direction.
- the movable table 15 may be moved in the X direction.
- the moving radius can be made smaller than when the substrate w is rotated.
- the first and second mirrors, 39a, 38b, and the CCD camera 37 are individually provided so that the alignment marks of the substrate W and the chip part 11 are individually recognized by the projection unit.
- a single configuration may be used. In the case of a single chip, this is preferable when the chip component 11 is small and the alignment mark with the substrate W is close! /.
- the chip mounting apparatus includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.
- the force for storing the chip 2 in the chip tray in the face-up state is not limited to this.
- the wafer may be diced and supplied in the face-up state. Yes.
- the recognition means is not limited to the CCD camera 37. Use a CMOS or image pickup tube.
- the present invention is suitable for mounting a chip component such as an electronic component on a work having a strong force, such as a glass resin substrate.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims
Priority Applications (2)
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KR1020077025622A KR101245995B1 (ko) | 2005-05-31 | 2006-05-25 | 본딩장치 |
JP2007518936A JP5065892B2 (ja) | 2005-05-31 | 2006-05-25 | ボンディング装置 |
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JP2005160071 | 2005-05-31 | ||
JP2005-160071 | 2005-05-31 |
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PCT/JP2006/310446 WO2006129547A1 (ja) | 2005-05-31 | 2006-05-25 | ボンディング装置 |
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JP (1) | JP5065892B2 (ja) |
KR (1) | KR101245995B1 (ja) |
CN (1) | CN100565829C (ja) |
TW (1) | TWI368466B (ja) |
WO (1) | WO2006129547A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017157682A (ja) * | 2016-03-02 | 2017-09-07 | Tdk株式会社 | 部品実装装置及び実装方法 |
KR20190068467A (ko) | 2017-12-08 | 2019-06-18 | 아스리트 에프에이 가부시키가이샤 | 전자 부품 실장 장치 및 전자 부품 실장 방법 |
Families Citing this family (8)
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KR100933353B1 (ko) * | 2008-01-25 | 2009-12-22 | 주식회사 탑 엔지니어링 | 본딩 장비의 위치 감지장치 및 그 제작방법 |
TWI381200B (zh) * | 2008-11-11 | 2013-01-01 | Au Optronics Suzhou Corp | 對位檢測方法和對位檢測裝置 |
CN103367175B (zh) * | 2013-07-02 | 2015-08-19 | 华中科技大学 | 一种用于芯片倒装的多自由度键合头 |
KR101510815B1 (ko) * | 2013-12-26 | 2015-04-10 | 세광테크 주식회사 | 촬상 장치 및 촬상 방법 |
CN108511381B (zh) * | 2017-02-28 | 2023-05-23 | 韩美半导体株式会社 | 接合设备及其控制方法 |
KR102430480B1 (ko) * | 2017-10-19 | 2022-08-08 | 세메스 주식회사 | 다이 본딩 장치 및 방법 |
KR102272618B1 (ko) * | 2020-01-03 | 2021-07-05 | 주식회사 제이스텍 | 디스플레이 패널과 cof의 수직 정렬 및 접합장치 |
WO2024023926A1 (ja) * | 2022-07-26 | 2024-02-01 | ヤマハ発動機株式会社 | 表面実装機及び表面実装方法 |
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JPH07245500A (ja) * | 1994-03-07 | 1995-09-19 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP2003504882A (ja) * | 1999-07-12 | 2003-02-04 | エルアイロジックス インコーポレイテッド | 電子部品の取付装置 |
JP2003152031A (ja) * | 2001-11-15 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディング方法 |
JP2004031868A (ja) * | 2002-06-28 | 2004-01-29 | Toray Eng Co Ltd | 実装方法および実装装置 |
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JP3988878B2 (ja) * | 2001-03-02 | 2007-10-10 | 東レエンジニアリング株式会社 | チップ実装方法およびその装置 |
JP2004006467A (ja) * | 2002-05-31 | 2004-01-08 | Osaki Engineering Co Ltd | パネルまたは基板のパーツ実装装置 |
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2006
- 2006-05-25 WO PCT/JP2006/310446 patent/WO2006129547A1/ja active Application Filing
- 2006-05-25 CN CNB2006800162419A patent/CN100565829C/zh active Active
- 2006-05-25 JP JP2007518936A patent/JP5065892B2/ja active Active
- 2006-05-25 KR KR1020077025622A patent/KR101245995B1/ko active IP Right Grant
- 2006-05-30 TW TW095119178A patent/TWI368466B/zh active
Patent Citations (4)
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JPH07245500A (ja) * | 1994-03-07 | 1995-09-19 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP2003504882A (ja) * | 1999-07-12 | 2003-02-04 | エルアイロジックス インコーポレイテッド | 電子部品の取付装置 |
JP2003152031A (ja) * | 2001-11-15 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディング方法 |
JP2004031868A (ja) * | 2002-06-28 | 2004-01-29 | Toray Eng Co Ltd | 実装方法および実装装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2017157682A (ja) * | 2016-03-02 | 2017-09-07 | Tdk株式会社 | 部品実装装置及び実装方法 |
KR20190068467A (ko) | 2017-12-08 | 2019-06-18 | 아스리트 에프에이 가부시키가이샤 | 전자 부품 실장 장치 및 전자 부품 실장 방법 |
Also Published As
Publication number | Publication date |
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JPWO2006129547A1 (ja) | 2008-12-25 |
CN101176197A (zh) | 2008-05-07 |
JP5065892B2 (ja) | 2012-11-07 |
KR20080007349A (ko) | 2008-01-18 |
KR101245995B1 (ko) | 2013-03-20 |
TW200708213A (en) | 2007-02-16 |
TWI368466B (en) | 2012-07-11 |
CN100565829C (zh) | 2009-12-02 |
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