Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
  • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67138—Apparatus for wiring semiconductor or solid state device
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
  • H01L2224/838—Bonding techniques
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01004—Beryllium [Be]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01005—Boron [B]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01006—Carbon [C]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01015—Phosphorus [P]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01033—Arsenic [As]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01082—Lead [Pb]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/06—Polymers
  • H01L2924/078—Adhesive characteristics other than chemical
  • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/14—Integrated circuits
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/156—Material
  • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
  • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Definitions

• the present invention relates to a bonding apparatus for mounting a chip component such as an electronic component or a film-like circuit board on a powerful workpiece such as a glass resin substrate, and a bonding system using the same.
• a conventional bonding apparatus supplies a conductive bonding material such as an anisotropic conductive film to a predetermined portion of a circuit board made of glass resin held on a substrate holding table, and adsorbs and holds electrons by a bonding head.
• the anisotropic conductive film is heated and mounted while pressing the chip component, which is a component, against the location (see, for example, Patent Document 1).
• FPC Flexible Printed Circuit
• a circuit board using an individual bonding apparatus (see, for example, Patent Document 2).
• Patent Document 1 Japanese Unexamined Patent Publication No. 2003-59975
• Patent Document 2 Japanese Patent Laid-Open No. 2003-66479
• liquid crystal glass substrates are mounted with surface mount type electronic components, LSI (Large Scale Integrated circuit), and FPC that is easy to use and light in space in a small housing.
• LSI Large Scale Integrated circuit
• FPC has a complicated shape because it is bent and stored in a limited space in the housing. It is difficult to automatically mount such a complicated FPC on a small liquid crystal glass substrate.
• a small liquid crystal glass substrate tends to have a narrower electrode pitch, and it is required to improve not only chip parts such as LSI but also FPC mounting accuracy. Shiina Since FPC is easy to grind and difficult to handle, it is mounted with a manual device, but it is difficult to mount it manually with high accuracy.
• the present invention has been made in view of such circumstances, and provides a bonding apparatus and a bonding system including the same that can accurately mount different mounting components on a workpiece such as a substrate.
• the main purpose is to do.
• the present invention has the following configuration.
• the bonding apparatus of the present invention is a bonding apparatus for mounting a mounting member on a work via a conductive bonding material, the first holding table for mounting and holding the work, and the chip as the mounting member
• First holding means for holding a component
• second holding means for holding a film-like or sheet-like substrate as the mounting member
• a head to which the first holding means and the second holding means are attached and the first holding
• a timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means when mounting each mounting member on a work placed and held on a table
• the head or the holding tape First driving means for moving the bull up and down, and operating the first driving means to move the head up and down relatively with respect to the holding table, so that the first or second holding Characterized by comprising a heating means mounted member held in stages you heat the conductive bonding material in a state of being pressed against the workpiece.
• either the first holding means or the second holding means attached to the head can be operated in accordance with the mounting member to be mounted on the workpiece.
• mounting components of different shapes such as chip components or film-like substrates can be mounted on the workpiece with a single head.
• the chip component of the present invention is, for example, an LSI or an electronic component. Therefore, the inventive device can mount LSIs that require high mounting accuracy without mounting deviation, and can therefore improve the mounting accuracy of a film-like substrate.
• the first holding means is configured to suck and hold evenly in the center or Z and width directions of the chip component
• the second holding means is configured to suck and hold the vicinity of the plurality of corners of the substrate. And are preferred.
• the first holding means can accurately hold and hold a hard component such as a chip component. Further, the second holding means can hold the film-like substrate which is easy to stagnate on a flat surface. In other words, chip parts and film-like substrates can be accurately mounted on the workpiece.
• the bonding apparatus of the present invention includes a second driving unit that moves up and down at least one of the first holding unit and the second holding unit, and both mountings held by the first holding unit and the second holding unit. It is preferable to include a drive control means for controlling the operation of the second drive means according to the difference in thickness of the members.
• the drive control means controls the operation of the second drive means while both the first holding means and the second holding means hold the mounting member, and both holding means simultaneously mount the mounting member on the workpiece. You may comprise. According to this configuration, work efficiency can be improved.
• a bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table according to a mounting member.
• the mounting member to be transported
• the heating means and the anisotropic conductive film supplied to the work by the bonding apparatus are heated, the polymerization reaction is advanced halfway, and the mounting member is mounted on the work in an uncured state.
• the anisotropic conductive film is further heated to terminate the polymerization reaction and fix the mounting member to the work, and the bonding device.
• a second workpiece conveying means for conveying the mounted workpiece to the thermocompression bonding means.
• the bonding system of the present invention preferably includes a cleaning means for cleaning both the chip component and the film or sheet mounting member.
• a cleaning means for example, a configuration in which a gas or a gas to which ultrasonic waves are applied is blown onto the mounting member can be used.
• the bonding apparatus apparatus of the present invention is a bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material, the first holding table for mounting and holding the workpiece, and the mounting A holding means having a plurality of suction holes for sucking and holding the mounting parts of both the film-like or sheet-like substrate and chip component mounting members, a head to which the holding means is attached, and the holding means Control means for switching and controlling the suction operation of a plurality of suction holes formed in the holding means in accordance with the shape of the mounting member to be held, and first drive means for moving the holding table and the head up and down relatively The first driving means is operated to move the holding table and the head relatively up and down, and the mounting member held by the holding means is pressed against the workpiece.
• Heating means for heating the Kishirubeden bonding material characterized by comprising a.
• the bonding apparatus of the present invention preferably further includes support means for sucking and holding a portion where the holding means force protrudes when the substrate is sucked and held by the holding means.
• the holding means force is held by the supporting means by suction. Therefore, it is possible to avoid a positional shift to the mounting site due to the stagnation of the substrate.
• the supporting means is configured to suck and hold the vicinity of a plurality of corners of the substrate.
• the film substrate can be handled while maintaining a flat state without damaging the film substrate.
• the bonding apparatus of the present invention is based on the difference in thickness between the second driving means for raising and lowering at least either the holding means or the support means, and the mounting members held by the holding means and the support means. Accordingly, it is preferable to include drive control means for controlling the operation of the second drive means.
• the drive control means is configured to control the operation of the second drive means in a state where both the holding means and the first support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece. More preferred to do.
• the bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table according to a mounting member.
• the mounting member to be transported The heating means and the anisotropic conductive film supplied to the work by the bonding apparatus are heated, the polymerization reaction is advanced halfway, and the mounting member is mounted on the work in an uncured state.
• the anisotropic conductive film is further heated to terminate the polymerization reaction and fix the mounting member to the work, and the bonding device.
• the second workpiece carrying means for carrying the implemented workpiece mounting member to the heat and pressure means that you with the features.
• the holding of either the first holding means or the second holding means attached to the head is activated according to the mounting member to be mounted on the workpiece, and the chip component or film It is possible to mount mounting parts with different shapes, such as a shaped board, on the workpiece.
• a series of processes from supplying an anisotropic conductive film to a workpiece to mounting a mounting member on the supply location is performed without human intervention. Can be done. That is, since it is possible to avoid the dust from adhering to the workpiece during the conveyance process, a high-quality workpiece can be obtained.
• FIG. 1 is a perspective view of a bonding system according to an embodiment.
• FIG. 2 is a perspective view showing a schematic configuration of a mounting member supply unit.
• FIG. 3 is a view of the lower surface force of the suction member of the first and second mounting member transfer mechanisms.
• FIG. 4 is a diagram showing a state where a mounting member is mounted on a substrate.
• FIG. 5 is a view of the lower surface force of the first and second holding members provided in the temporary crimping head.
• FIG. 6 is a perspective view showing a schematic configuration of a provisional pressure bonding head.
• FIG. 7 is a view of the lower surface force of the first and second holding members provided in the temporary crimping head according to Example 2.
• FIG. 8 is a diagram for explaining the operation of a bonding apparatus according to a modification.
• an LSI is mounted as a chip component
• an FPC Flexible Printed Circuit
• the chip component for example, all forms on the side to be bonded to the substrate related to the type and size of electronic component, IC chip, semiconductor chip, optical element, surface mount component, wafer and the like are shown.
• the LSI is simply referred to as a chip.
• the substrate for example, all forms on the side to which a chip component such as a resin substrate or a glass substrate is bonded are shown.
• a glass substrate for a liquid crystal display panel is used.
• FIG. 1 is a perspective view of the bonding system according to the present embodiment.
• the chip mounting apparatus is broadly divided into an apparatus base 10, a substrate supply unit 20 disposed on one end side (left end in FIG. 1) of the apparatus base 10, and an apparatus base 10.
• the mounting member supply unit 30 disposed on the back side of the substrate and the lead disposed next to the substrate supply unit 20
• the board storage unit 70 is arranged on the front side of the apparatus base 10 and four board transfer mechanisms 80A to 80D are provided on the front side of the apparatus base 10.
• the mounting member supply unit 30 corresponds to the mounting member conveying means of the present invention
• the conductive material supply unit 40 corresponds to the conductive material supply means
• the main pressure bonding units 60A and 60B correspond to the thermocompression bonding means.
• the substrate supply unit 20 includes a substrate storage magazine 21 that stores a plurality of glass substrates 1 (hereinafter simply referred to as "substrates") before mounting LSI and FPC as mounting members in a multistage manner at regular intervals.
• a raising / lowering table 22 capable of moving up and down and horizontally moving the substrates 1 in order from the substrate storage magazine 21 is provided.
• the structure of the substrate supply unit 20 is not particularly limited as long as the substrates 1 can be sequentially supplied.
• the substrate supply unit 20 may be a tray structure in which a plurality of substrates 1 are arranged in a horizontal plane.
• the mounting member supply unit 30 is arranged in order one by one from the chip tray 3 in which a plurality of chips 2 to be mounted on the substrate 1 are arranged vertically and horizontally in a face-up state.
• the first mounting member transfer mechanism 31A that takes out and transfers in face-up state, and the FPC tray 5 force and FPC4 that are arranged in a vertical and horizontal orientation in the face-up state, and multiple FPC4s to be mounted on the board 1 are taken out one by one.
• the second mounting member transport mechanism 31B that transports the FPC4 in a face-up state, and the first and second mounting member transport mechanisms 31A and 31B receive each mounting member alternately, hold the mounting member, and move up and down.
• the reversing table 32 that changes the posture of the chip 2 and the FPC 4 in the face-down state, and each mounting member is received from the reversing table 32 and each mounting member is in the face-down state And a holding table 33 held by Each mounting member is further received from the holding table 33 by the first and second mounting member transfer mechanisms 31A and 31B, and held and transferred, so that each mounting member is placed in a predetermined position (specifically, the standby member). (Fixed position on slider 34 at position) is supplied face-down.
• a fixed rail 35A is provided in a direction along one side (Y direction) of the chip tray 3, and a movable rail 35B extending in the X direction travels on the fixed rail 35A. It has become.
• the first mounting described above is mounted on the movable base 36 traveling on the movable rail 35B.
• the member transfer mechanism 31A and the second mounting member transfer mechanism 31B are attached with a space therebetween.
• a suction head 6 A capable of sucking and holding the chip 2 is attached to the lower end portion of the first mounting member transfer mechanism 31 A.
• a suction head 6B capable of sucking and holding the FPC 4 is attached to the lower end of the second mounting member transfer mechanism 31B.
• the suction head 6A has a horizontally long rectangular shape covering the entire surface of the chip 2, and a suction hole 8A for sucking and holding the chip 2 is formed at the center thereof.
• the suction head 6B has a horizontally long rectangular shape that covers the entire surface of the FPC 4, and the suction holes 8B that suck and hold the vicinity of a plurality of corners so that the FPC 4 does not crawl. Is formed.
• the reversing table 32 is configured to be rotatable around an axis P in the Y direction within a range of 180 degrees.
• a camera 91 as a recognition means is arranged below the middle of the mounting member transfer from the first and second mounting member transfer mechanisms 31A, 31B to the slider 34, and the lower ends of both mounting member transfer mechanisms 31A, 31B.
• the suction holding posture of each mounting member held by suction is recognized. Based on the recognized image information, the suction heads of the mounting member transfer mechanisms 31A and 31B are rotated in the 0 direction, and the positions of the X and Y directions are adjusted by the movable rails 35A and 35B.
• Each mounting member is placed on the slider 34.
• a mounting member cleaning block 38 is arranged alongside the holding table 33 described above.
• the chip cleaning block 38 is provided with a gas ejection hole 38A for ejecting a gas such as nitrogen gas or clean air at the center of the upper surface thereof.
• This gas ejection hole is connected to a gas supply source (not shown).
• a pair of exhaust holes 38B for sucking and exhausting the gas ejected from the gas ejection holes is provided on both sides of the gas ejection holes.
• This exhaust hole 38B is connected to a decompression pump (not shown).
• the holding table 33 and the mounting member cleaning block 38 are arranged side by side on the slide table 39.
• the slide table 39 is configured to be able to reciprocate along the rotation axis P of the reversing table 32. This movement of the slide table 39 allows the holding table 33 and the mounting member cleaning block 38 to selectively enter the lower position of the reversing table 32 that holds each mounting member in a face-down state. Yes.
• the slider 34 is configured to be capable of reciprocating along a fixed rail 35C disposed in the Y direction. When the slider 34 is in the standby position (the state shown in FIG. 2), for example, the chip 2 is placed face down in order from the first or second mounting member transfer mechanism 31A, 31B. Supply to the crimping unit 50. After that, FPC4 is processed in the same way.
• the conductive material supply unit 40 includes a movable table 41 that holds the substrate 1 conveyed from the substrate supply unit 20 in a horizontal position, and a substrate 1-chip shown in FIGS. 2 and 4. Transfer the conductive material from the anisotropic conductive film (ACF) to each part to the bonding part la, which is the part where 2 is mounted, and the bonding part lb, which is the part where FPC4 is mounted. It has two heads 42A and 42B.
• the movable table 41 includes a substrate holding stage 43 that holds the substrate 1 by suction, and the substrate holding stage 43 is configured to be movable in two horizontal axes (X, Y), up and down (Z), and ⁇ . Yes. Each bonding part la, lb on one end side of the substrate 1 extends forward from the substrate holding stage 43.
• This anisotropic conductive film is a connecting material having the three functions of adhesion, conduction and insulation at the same time. By thermocompression bonding, the film is conductive in the thickness direction and insulative in the surface direction. This is a polymer film with electrical anisotropy. Conductive particles are mixed in an adhesive binder.
• the temporary crimping unit 50 includes a movable table 51 that holds the substrate 1 conveyed from the conductive material supply unit 40 in a horizontal posture, and bonding portions la and lb of the substrate 1 to which the conductive material is transferred.
• a two-field recognition means for example, a two-field camera
• the movable table 51 corresponds to the first holding table of the present invention
• the temporary crimping head 52 corresponds to the first drive means of the present invention.
• the movable table 51 includes a substrate holding stage 54 that holds the substrate 1 by suction, and the substrate holding stage 54 extends in two horizontal (X, Y) directions, up and down (Z) directions, and around the Z axis ( ⁇ ) direction. Each It is configured to move freely.
• the substrate holding stage 54 corresponds to the first driving means of the present invention.
• the temporary press-bonding head 52 is movable up and down, and is provided with a first holding member 56A and a second holding member 56B at its lower end for sucking and holding the chip 2 and the FPC4.
• the first holding member 56A is in contact with the entire surface opposite to the electrode side of the chip 2 and is formed with a horizontally long suction hole 57A for sucking the center.
• the second holding member 56B abuts to cover the entire surface opposite to the electrode side of the FPC 4, and has a large area.
• Adsorption holes 57B are formed in the central part of the region and in the vicinity of the plurality of corners. Is formed.
• the suction holes 57A and 57B of the first holding member 56A and the second holding member 56B are connected to a decompression pump 59 via an intake pipe 58 as shown in FIG.
• the temporary crimping head 52 has a built-in heater as a heating means.
• the first holding member 56A corresponds to the first holding means of the present invention
• the second holding member 56B corresponds to the second holding means.
• electromagnetic valves El and E2 are provided in the middle of the intake pipes 58 branching toward the tips of the holding members 56A and 56B, so that the electromagnetic valves El and E2 can be opened and closed. Accordingly, the suction holding of the first holding member 56A or the second holding member 56B can be switched.
• This switching operation is performed by the control unit 90 based on a predetermined processing program. For example, if the first holding member 56A and the second holding member 56B are operated alternately, or if any suction error occurs, the mounting member on the error occurrence side is sucked and held so as to correct the error. Or make it work.
• the control unit 90 corresponds to the timing control means of the present invention.
• the face-down chip 2 or FPC 4 transferred by the slider 34 of the mounting member supply unit 30 is sucked and held by the first or second holding members 56A and 56B, and each mounting member is Is heated at a predetermined temperature and pressed against one of the bonding sites la and lb of the substrate 1 with a predetermined pressure while causing a polymerization reaction of the conductive material.
• heating and pressing are completed in an uncured state from the start of the polymerization reaction to the end of the force reaction.
• the adhesive becomes semi-cured and the chip 2 and the FPC 4 are temporarily bonded to the substrate 1.
• the holding structure of the temporary press-bonding head 52 is not limited to the adsorption type, and any holding structure such as electrostatic adsorption using static electricity or magnetic adsorption using magnets can be used.
• the two-field recognition means 53 is movable in two horizontal (X, Y) directions and up and down (Z) directions, and the tip 2
• the FPC 4 recognition mark and the recognition mark of the substrate 1 transferred onto the movable table 51 are recognized respectively, and the positional deviation between both recognition marks is detected.
• the movable table 51 is driven and controlled in the X, Y, and ⁇ directions during temporary crimping so as to eliminate this displacement.
• the main crimping unit 60 has two blocks of 60 mm and 60 mm, and each of the blocks 60 mm and 60 mm has a movable table 61 mm, 6 IB holding the substrate 1 conveyed from the temporary pressure bonding unit 50 in a horizontal position, Each of chip 2 and FPC4 temporarily bonded to bonding sites la and lb of substrate 1 is pressurized and heated to complete the polymerization reaction of the conductive material and harden, and then bonded to each bonding site la and lb.
• Each mounting member is provided with two main pressing heads 62A and 62B that are used for main pressing. Backups 63A and 63B are fixedly installed below the respective main crimping heads 62A and 62B.
• the movable tables 61A and 61B include substrate holding stages 64A and 64B similar to the movable table 41 of the conductive material supply unit 40.
• each main crimping unit 60A, 60B has a main crimping head 62A that presses the chip 2 and the head 62B presses the FPC4.
• a mechanism for supplying a protective tape T made of fluorine resin is provided.
• the protective tape T is fed out by the supply rollers 65A and 65B attached to the main body frame of the main pressing unit 60, and taken up by the take-up rollers 66A and 66B.
• chip 2 is finally crimped in block 60A, and then substrate 1 is transported to block 60B and FPC4 is finally crimped.
• the substrate storage unit 70 includes a substrate storage magazine 71 that stores a plurality of substrates 1 on which each mounting member is mounted in multiple stages at regular intervals, and an elevating and lowering unit that sequentially stores the substrates 1 in the substrate storage magazine 71. And a vertically movable lifting table 72.
• a storage structure of a tray structure may be provided as described in the substrate supply unit 20.
• the substrate supply unit 20 and the substrate storage unit 70 do not necessarily need to be separate from each other, so that the substrate 1 on which the chip 2 is mounted is returned to the original substrate supply unit.
• the substrate transport mechanisms 80A to 80D include a rail 81 disposed in the longitudinal direction of the apparatus base 10, a support 82 that runs along the rail 81, and a support 82 that can be moved up and down on the support 82. And a substrate holder 83 that holds 1 by suction.
• Substrate transport mechanism 80A takes substrate 1 to be processed from substrate supply unit 20 and transports substrate 1 to conductive material supply unit 40.
• the substrate 1 is transferred onto the substrate holding stage 43 of the movable table 41 and held by suction.
• the substrate holding stage 43 moves forward (Y direction), and the bonding portion of the substrate 1 is placed on the backup 44.
• the head 42A descends and a conductive material corresponding to the electrode width of the chip 2 is transferred onto the bonding part la. .
• the board 1 is moved to the left horizontal direction in the figure to align with the bonding part lb where the FP C4 is mounted, and the head 42B is lowered and the conductive material corresponding to the electrode width of the FPC4 is bonded to the bonding part lb. Transcript to.
• the substrate holding stage 43 moves horizontally to the delivery position of the substrate 1.
• the substrate 1 returned to the delivery position is transported to the temporary pressure bonding unit 50 by the substrate transport mechanism 80B.
• the substrate 1 transported to the temporary pressure bonding unit 50 is transferred onto the substrate holding stage 54 of the movable table 51 and held by suction.
• the substrate holding stage 54 moves forward (Y direction), and first, the bonding portion la of the substrate 1 is positioned on the backup 55.
• the first mounting member transfer mechanism 31A moves onto a predetermined chip 2 of the chip tray 3 by moving the movable base 36 in the X and Y directions, respectively. Subsequently, the first mounting member transfer mechanism 31A descends, and the chip 2 in the chip tray 3 is sucked and held by the first holding member 6A. After the first mounting member transfer mechanism 31A rises and the chip 2 is taken out from the chip tray 3, the first mounting member transfer mechanism 31A moves onto the reversing table 32 by moving the movable base 36 in the X and Y directions, respectively. Move to. At this time, the reversing table 32 is in a standby posture (state shown in FIG. 2) with the chip mounting surface facing upward. Next, the first mounting member transfer mechanism 31A descends, and the chip 2 held by the first holding member 6A 2 On the reverse table 32.
• the chip 2 When the chip 2 is placed on the reversing table 32 and is sucked and held, the chip 2 is reversed around the axis P, and the face 2 in the face-up state is changed to the face-down state. Inverted reversal
• the mounting member cleaning block 38 enters under the table 32.
• the slide table 39 moves to move the mounting member cleaning block 38 out of the lower position of the reversing table 32, and the holding table 33 is positioned below the reversing table 32. enter in. Subsequently, chip 2 is transferred from reversal table 32 to holding table 33. The reversing table 32 sucks and holds the chip 2 delivered in the face-down state. After handing over chip 2, reversing table 32 reverses in the opposite direction and returns to the standby position.
• the first mounting member transfer mechanism 31A that has reached each position descends and holds the chip 2 on the holding table 33 by suction with the suction member 6A.
• the first mounting device transfer mechanism 31A that holds the chip 2 on the holding table 33 in a face-down state transfers the chip 2 and transfers it onto the camera 91.
• the camera 91 recognizes the position using the outline of chip 2 or the alignment mark.
• the suction head is rotated in the ⁇ direction, and the movable base 36 is adjusted in the X and Y directions to be transferred to the slider 34.
• the slider 34 that has received the chip 2 in the face-down state moves toward the temporary crimping unit 50, and transfers the chip 2 to a position below the temporary crimping head 52.
• the second mounting member transfer mechanism 31B takes out the FPC 4 from the FPC tray 5 in the same procedure as the chip 2 and performs processing.
• the electromagnetic valve E1 is opened while the electromagnetic valve E2 is closed by the control unit 90, and the tip 2 transferred by the slider 34 is sucked and held by the first suction member 56A at the lower end of the temporary press-bonding head 52.
• a two-field recognition means 53 has advanced between the temporary crimping head 52 and the bonding part la of the substrate 1, and the chip 2 and the substrate sucked and held by the first suction member 56A of the temporary crimping head 52
• the movable table 51 moves in the X, Y, and ⁇ directions to eliminate this misalignment.
• the alignment between the chip 2 and the substrate 1 is performed.
• the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered, and the chip 2 is temporarily pressure bonded to the bonding portion la of the substrate 1 to which the conductive material is transferred.
• the control unit 90 opens the solenoid valve E2 and closes the solenoid valve E1, and the FPC 4 transferred by the slider 34 is moved to the second suction member 56B at the lower end of the temporary crimping head 52. Adsorb and hold. Subsequently, a two-field recognition means 53 advances between the temporary crimping head 52 and the bonding part lb of the substrate 1, and the FPC4 and the substrate 1 that are attracted and held by the second suction member 56B of the temporary crimping head 52 In order to detect misalignment, the alignment mark printed on each is detected.
• the movable table 51 is controlled in the X, Y, and ⁇ directions so as to eliminate this misalignment, and the FPC 4 and the substrate 1 are aligned.
• the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered, and the FPC 4 is temporarily pressure bonded to the bonding portion lb of the substrate 1 to which the conductive material is transferred.
• the substrate holding stage 54 moves horizontally to the delivery position of the substrate 1.
• the substrate 1 moved to the delivery position is first transferred to the main pressure bonding unit 60A by the substrate transfer mechanism 80C.
• the substrate 1 conveyed to the main pressure bonding unit 60A is transferred onto the substrate holding stage 64A of the movable table 61A and is sucked and held.
• the substrate holding stage 64A moves forward (Y direction), and the bonding portion la of the substrate 1 is positioned on the backup 63A.
• the main crimping head 62A descends, and the temporarily crimped chip 2 is heated and pressurized via the protective tape T.
• the bumps of the chip 2 are electrically connected to the electrodes of the substrate 1 through the conductive material.
• the substrate holding stage 64A moves horizontally to the delivery position of the substrate 1.
• the substrate 1 moved to the delivery position is transferred by the substrate transfer mechanism 80C and transferred to the main pressure unit 60B.
• the substrate 1 transported to the main pressure bonding unit 60B is transferred and held on the substrate holding stage 64B of the movable table 61B.
• Substrate holding stage 64B moves forward (Y direction)
• the bonding part lb of the substrate 1 is positioned on the backup 63B.
• the main crimping head 62B descends, and the temporarily crimped FPC4 is heated and pressurized via the protective tape T.
• the electrode of FPC4 is electrically connected to the electrode of substrate 1 through the conductive material.
• the substrate holding stage 64B moves horizontally to the delivery position of the substrate 1.
• the substrate 1 moved to the transfer position is transferred by the substrate transfer mechanism 80D and transferred to the lift table 72 of the substrate storage unit 70, and is stored in the substrate storage tray 71 by the lift table 72.
• the chip mounting of one substrate 1 is completed.
• the adhesive is transferred to the next substrate 1 in the conductive material supply unit 40.
• the transfer of the adhesive to the substrate 1, the temporary crimping of the chip 2 or the FPC4, and the final crimping of the chip 2 or the FPC4 are performed in parallel.
• the substrate 1 transported from the temporary crimping unit 50 can be processed smoothly without delaying the processing of the substrate 1 by adjusting the tact time of each pair of final crimping units 60A and 60B.
• the bonding system including the bonding apparatus according to the above-described embodiment includes a chip 2 such as an LSI and an FPC 4 that is sometimes handled and flexed with a predetermined bonding of a substrate 1 that is a workpiece with a single bonding apparatus. Can be mounted on the mounting site.
• the bonding apparatus of this embodiment can mount an LSI with a narrow electrode pitch with high accuracy, it can also realize high-precision mounting even for an FPC4 with a narrow pitch.
• the bonding system of this embodiment can be taken out from each tray of chip 2 and FPC4 using a single mechanism and transported to temporary crimping unit 50, dust adheres to substrate 1 during the transporting process. Can be suppressed. That is, the processing efficiency can be further improved.
• the provisional pressure bonding head 52 includes a first holding member 56C and a second holding member 56D at the lower end thereof.
• the first holding member 56C is located at the center of the shaft core that moves the temporary crimping head 5 up and down.
• the first holding member 56C is a horizontally-long rectangular shape that is larger than the chip 2 and has a size that covers at least the entire surface of the bonding part 1b for mounting the FPC 4 on the substrate 1. I am doing.
• a plurality of suction holes 57C and 57D for sucking the mounting member are formed on the lower surface of the first holding member 56C.
• the suction hole 57C is formed at a position that sucks the center of the chip 2 in the longitudinal direction. Further, the suction holes 57D are formed at positions where both ends of the longitudinal direction of the FPC4 or Z and the center are sucked.
• the second holding member 56D sucks and holds the portion where the force of the first holding member 56C that cannot be held by the first holding member 56C protrudes. It is arranged close to the same temporary crimping head 52. The shape covers the entire surface of the portion protruding from the first holding member 56C.
• a plurality of suction holes 57E are formed on the lower surface of the second holding member 56D. These suction holes 57E are in positions for sucking the vicinity of the corners of the FPC4.
• the first and second holding members 56C, 56D are connected in communication with a decompression pump 59 via an intake pipe 58 as shown in FIG.
• the intake pipe 58 is branched in three directions (not shown) upstream of the decompression pump 59 side, and each intake pipe is provided with a solenoid valve.
• two intake pipes are connected in communication with the first holding member 56C, and one intake pipe is connected in communication with the second holding member 56D.
• one of the intake pipes communicates with the suction hole 57C, and the other intake pipe communicates with the suction hole 57D.
• the control unit 90 controls the opening / closing operation of the three-port valve so as to operate the suction of the suction holes 56C to 56E according to the mounting member. For example, when chip 2 is mounted, one solenoid valve is opened so that suction hole 57C is activated. When mounting FPC4, open the two solenoid valves to operate the suction holes 56D and 56E.
• the bonding parts of both the chip 2 and the FPC 4 can be suction-held by the first holding member 56C. it can.
• the center of the first holding member 56C is the temporary pressure. Since the landing head 52 coincides with the lifting axis, the applied pressure during mounting can be efficiently measured.
• the portion protruding from the first holding member 56C can be sucked and held by the second holding member 56D, so that the FPC4 is not handled with the FPC4 in a state of being put on. That is, the bonding apparatus of this embodiment can mount the chip 2 and the FPC 4 which are different mounting members with high accuracy.
• Example 1 when any force of the first holding member 56A, 56B of the temporary crimping unit 50 sucks and holds the mounting member, the holding member on the holding side descends or holds. You may comprise so that the holding member of the side which has not been raised.
• the second holding member 56B is attached to the ball shaft B connected to the pulse motor M arranged in parallel with the lifting axis of the temporary crimping head 52 via the movable base 100.
• the second holding member 58B can be moved up and down by forward and reverse rotation of the pulse motor M. Therefore, according to this configuration, when the chip 2 is mounted, the member in the vicinity of the chip 2 and the second holding member 56B do not come into contact with each other so that other members are not damaged. Can be.
• the first holding member 56 C when the chip 2 is held, the first holding member 56 C may be lowered or the second holding member 56D may be raised! ⁇ .
• the distance at which the temporary pressing head 52 descends is constant.
• the relative distance in the height direction of the first holding member 56C and the second holding member 56D may be adjusted so that the height at which the chip 2 and the FPC 4 are mounted on the substrate 1 is reached at the same time.
• the center of the first holding member 56C does not have to coincide with the axis.
• the shape of the first holding member 56C changes depending on the workpiece shape, and as a result, the center of the shaft center and the lower surface shape of the first holding member 56C may not be aligned.
• the first and second chip transfer mechanisms 31A and 31B are configured to move together, but each chip transfer mechanism is configured to move individually. Moyo Yes.
• the crimping unit is divided into two units of the temporary crimping unit 50 and the main crimping unit 60. You can do it with a crimping unit!
• each unit and the substrate transport mechanism are not limited to those in the above-described embodiments, and various modifications can be made.
• a substrate transport mechanism having a plurality of substrate holders is configured to be rotatable around the Z axis, and around this substrate transport mechanism, a substrate supply unit, a mounting member supply unit, an adhesive adhesion unit, a temporary pressure bonding unit
• the main crimping unit and the substrate storage unit are arranged in this order.
• a rotary type may be used.
• the chip mounting apparatus includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.
• the force for storing the chip 2 in the chip tray in the face-up state is not limited to this, and the wafer may be diced and supplied in the face-up state.
• the first holding member provided in the temporary press-bonding head with the respective adsorbing members of the first mounting member transfer mechanism 31A and the second mounting member transfer mechanism 31B of the mounting member supply unit 30 It is possible to individually use the shape according to the mounting member, such as 56A and second holding member 56B.
• the mounting member supply unit may not be provided with the cleaning block 38.
• FPC4 is finally crimped by the main crimping head 62A provided in one block 60A of the main crimping unit 60, and the chip 2 is finally crimped by the main crimping head 62B provided in the other block 60B. You may make it do.
• chip 2 and FP C4 may be finally crimped at the same time for each block 60A and 60B, or chip 2 and FPC4 for each block 60A and 60B. You can make a final crimp.
• Example 2 when FPC4 is mounted, two solenoid valves are opened so that the suction holes 56D and 56E are actuated. You can make it happen.
• the suction head 6A provided in the first mounting member transfer mechanism 31A and the suction head 6B provided in the second mounting member transfer mechanism 31B are respectively arranged over the entire surface of the chip 2 and the FP C4.
• the force that was the covering shape may be the following shape.
• the suction head 6A may have a shape capable of sucking and holding the central portion of the chip 2
• the suction head 6B may have a shape surrounding the corner including the corner of the FPC4 or covering the corner and the central portion. Good.
• the present invention is suitable for mounting a chip component such as an electronic component, a film-like circuit board, or the like on a work having a strong force such as a glass resin substrate.

Landscapes

• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Wire Bonding (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Die Bonding (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=37307818

Family Applications (1)

Country Status (4)

Cited By (5)

Families Citing this family (4)

Citations (4)

• 2006
  • 2006-04-17 WO PCT/JP2006/308056 patent/WO2006118016A1/ja active Application Filing
  • 2006-04-17 JP JP2007514585A patent/JP4908404B2/ja not_active Expired - Fee Related
  • 2006-04-17 KR KR1020077021112A patent/KR101245901B1/ko not_active IP Right Cessation
  • 2006-04-27 TW TW095115000A patent/TWI343610B/zh not_active IP Right Cessation

Patent Citations (4)

Also Published As

Similar Documents

Legal Events