Classifications

• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/07773—Antenna details
  • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
  • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W44/00—Electrical arrangements for controlling or matching impedance
  • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
  • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
  • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/01—Manufacture or treatment
  • H10W72/0198—Manufacture or treatment batch processes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/072—Connecting or disconnecting of bump connectors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/073—Connecting or disconnecting of die-attach connectors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/073—Connecting or disconnecting of die-attach connectors
  • H10W72/07331—Connecting techniques
  • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
  • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
  • H10W72/241—Dispositions, e.g. layouts
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/321—Structures or relative sizes of die-attach connectors
  • H10W72/325—Die-attach connectors having a filler embedded in a matrix
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/351—Materials of die-attach connectors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/351—Materials of die-attach connectors
  • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/351—Materials of die-attach connectors
  • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
  • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
  • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
  • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
  • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
  • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
  • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
  • Y10T29/53178—Chip component

Definitions

• the present invention relates to a method for manufacturing an electronic device suitable for obtaining low-cost, excellent productivity and good communication characteristics with respect to a non-contact type individual identification device mounted with an IC chip.
• the radio frequency RFID tag using microwaves is, for example, one using a TCP (Tape Carrier Package) type inlet developed by Hitachi, Ltd. and Nenesa // Renesas Technology Corp.
• TCP type inlets are manufactured by mounting each IC chip with all external electrodes on the same surface on a tape carrier that is formed by continuously forming a polyimide substrate and a copper antenna circuit.
• TAB Tepe Automated Bonding
• an IC chip 110 in which all external electrodes are formed on the same surface on which the gold bumps 104 are formed on the circuit surface is separated into individual pieces by a die cinder. After that, it is adsorbed from the die cinder film 10 by the vacuum adsorber 20.
• it is moved to the vacuum suction station 30 so that the gold bumps 104 of the IC chip 110 on which all external electrodes are formed on the same surface become the surface.
• the vacuum suction station 30 is turned upside down so that the gold bump 104 is on the lower surface.
• the IC chip 110 having all the external electrodes formed on the same surface is replaced with a polyimide-based copper foil with a copper foil.
• the heater substrate 40 is used for thermocompression bonding and fixed.
• a connection between the gold and tin alloy can be obtained.
• the gap between the IC chip 110 on which all external electrodes are formed on the same surface and the antenna substrate 500 is sealed with a thermosetting resin 600.
• the state where the thermosetting resin has been cured is an intermediate form of an RFID tag called an inlet. By storing this inlet in a label or thin case, it can be used as an RFID tag.
• inlet structures are, for example, formed on each surface by Usami of Hitachi, Ltd., in which each IC chip is formed on each surface of a set of IC chip external electrodes facing each other.
• a glass diode package structure has been developed in which a dipole antenna is connected to each of the external electrodes (see Japanese Laid-Open Patent Publication No. 2002-269520).
• Sandwich 'antenna structure has been developed, sandwiching each external electrode formed on each side of a pair of faces (see ISS CC Digest of Technical Papers, pp. 398-399, 2003) ).
• a dipole antenna structure having an excitation slit can match the impedance of the antenna and the input impedance of the IC chip by changing the width and length of the slit, thereby improving the communication distance.
• the two external electrodes of the IC chip are connected to the antenna across the excitation slit to form a resonance circuit.
• the conventional TAB method shown in Fig. 1 uses the same surface by a vacuum suction device with a die cinder film force. Adsorption and transfer of IC chip with all external electrodes formed on it, alignment and placement of IC chip with all external electrodes formed on the same surface and antenna substrate, thermocompression bonding, grease sealing, etc. It is very difficult to reduce the tact time of each process to about 1 second or 1 second or less, because each process is performed for each IC chip on which all external electrodes are formed on the same surface. It was a big issue in mass productivity.
• the antenna has two external electrodes facing each other. One is formed on each surface of the set. An IC chip is sandwiched between each external electrode formed on each surface of the IC chip. If the structure is used, high-precision alignment between the excitation slit and each external electrode formed on each surface of the IC chip is not required, but the conventional production method using the TAB method is not necessary. In order to shorten the tact time, a plurality of chips are simultaneously sucked and transported by a plurality of vacuum suckers, which complicates the production equipment and increases the amount of capital investment. It becomes difficult to dredge.
• the IC chip is individually transported in the notch of the disc-shaped transporter having a plurality of notches into which the IC chip can be inserted on the outer periphery, and the disc-shaped transport is performed.
• a system has been devised that simultaneously conveys a plurality of the IC chips that maximize the number of notches by rotating the device (see Japanese Patent Application No. 2004-008313).
• the present invention has been made in view of the above, and an object thereof is to provide an electronic device manufacturing method that is inexpensive, excellent in productivity, and capable of obtaining good communication characteristics. [0013] That is, the present invention is as follows.
• a method for manufacturing an electronic device comprising at least a step of heat-pressing in a batch through an adhesive layer.
• any one of the manufacturing methods of the electronic device at least one of the first and second metal foils is supported on a base substrate made of an organic resin, and the organic resin is Salty mochi Bull resin (PVC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), polycarbonate resin (PC), biaxially oriented polyester (O— A method for manufacturing an electronic device, characterized in that it is selected from PET) and polyimide resin.
• PVC Salty mochi Bull resin
• ABS acrylonitrile butadiene styrene
• PET polyethylene terephthalate
• PET glycol-modified polyethylene terephthalate
• PEN polyethylene naphthalate
• PC polycarbonate resin
• O biaxially oriented polyester
• the gap between the antenna substrate and the short-circuit plate is sealed by thermocompression bonding of the first and second anisotropic conductive adhesive layers.
• the plurality of IC chips are continuous after the step of thermocompression bonding together with the antenna substrate and the short-circuit plate.
• a method for manufacturing an electronic device comprising a step of cutting an antenna circuit into individual pieces.
• the following effects can be obtained by the method for manufacturing an electronic device of the present invention.
• the IC chips formed on each surface of a set of external electrodes facing each other are placed on the outer periphery of a disk-shaped transporter, and held individually by a plurality of hands that can hold one IC chip.
• excellent productivity can be realized even when individually arranged on the antenna substrate and the short-circuit plate, Also, good communication characteristics can be obtained.
• the production tact time per inlet can be reduced to about 1 second or less and less than 1 second, and the base substrate is used to connect the IC chip to the antenna substrate and the short-circuit plate through the anisotropic conductive adhesive layer.
• Inexpensive materials can be realized because inexpensive materials can be used for the material and the antenna circuit.
• FIG. 1 is a diagram for explaining a conventional manufacturing method.
• FIG. 2 is a view showing the structure of an inlet obtained by the production method of the present invention.
• FIG. 3 is a manufacturing process diagram for explaining the first embodiment of the present invention.
• FIG. 4 is a manufacturing process diagram for explaining a second embodiment of the present invention.
• FIG. 5 is a production process diagram for explaining a fourth embodiment of the present invention.
• An electronic device electrically connects an IC chip formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna formed with a slit, and the IC chip and the antenna. And a short-circuit plate to be provided.
• the electronic device is an RFID tag inlet using the manufacturing method of the present invention.
• Fig. 2 (a) is a schematic view of the RFID tag inlet as seen from above.
• FIG. 2 (b) is a schematic sectional view taken along the line AA 'of FIG. 1 (a). The structure of the inlet will be briefly described with reference to FIG.
• a first external electrode 102 and a second external electrode 103 are formed on each of a pair of faces of the IC chip 100 facing each other.
• the IC chip 100 is contained in the anisotropic conductive adhesive layer 400 in the first connection part 2 in the antenna substrate 200 constituted by the base substrate 202 and the antenna circuit 201 by the first external electrode 102.
• the conductive particles 401 are connected to each other.
• the short-circuit plate 300 composed of the base substrate 302 and the metal foil 301 and the second external electrode 103 of the IC chip 100 are connected to the second connection portion 3, and the short-circuit plate 300 and the antenna substrate 200 are connected to each other.
• the third connection portion 4 they are connected via the conductive particles 401 contained in the anisotropic conductive adhesive layer 400.
• the second connection portion 3 of the second external electrode 103 of the IC chip and the third connection portion 4 on the antenna substrate are connected across the slit 1 formed in the antenna substrate. That is, the first external electrode 102 and the second external electrode 103 of the IC chip are the first connection part 2, the antenna circuit 201, the third connection part 4, the metal foil 301 of the short-circuit plate, and the second connection. It is electrically connected via part 3. Further, the gap between the antenna substrate 200 and the short-circuit plate 300 is sealed with a matrix resin 402 of an anisotropic conductive adhesive layer.
• a first example of the manufacturing method of the electronic device includes an IC chip formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna formed with a slit,
• a method of manufacturing an electronic device including a short-circuit plate that electrically connects the IC chip and the antenna, a step of forming a plurality of antenna circuits using a first metal foil and the base substrate on the base substrate.
• the process of forming the antenna substrate by providing the antenna circuit or the first metal foil force provided on the base substrate
• the process of forming the antenna substrate by providing multiple antenna circuits, aligning the IC chips The process of aligning the IC chips arranged on the outer periphery of the disk-shaped transporter, holding the IC chips individually in a plurality of hands that can hold one, and transporting them by the rotation of the disk-shaped transporter.
• a step of producing a short-circuit plate with an IC chip by individually disposing the first metal foil on the short-circuit plate on which the second metal foil is formed so as to be electrically connected via the first anisotropic conductive adhesive layer; Predetermined A step of aligning the short circuit plate with the IC chip so that the IC chip is electrically connected to the position, and the second anisotropic conductive material with the short circuit plate with the IC chip at a predetermined position on the antenna substrate. At least a step of thermocompression bonding through the adhesive adhesive layer.
• a second example of the method for manufacturing an electronic device includes an IC chip formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna formed with a slit, and the IC
• a manufacturing method of an electronic device including a chip and a short-circuit plate that electrically connects the antenna, a step of forming a plurality of antenna circuits using a first metal foil, and the antenna circuit on a base substrate Forming the antenna substrate by providing the first metal foil force provided on the base substrate, forming the antenna substrate by providing a plurality of antenna circuits, aligning the IC chips, aligned IC
• a third example of the method for manufacturing an electronic device according to the present invention includes an IC chip formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna formed with a slit,
• a step of manufacturing an electronic device including a short-circuit plate that electrically connects the IC chip and the antenna, a step of forming a plurality of antenna circuits using a first metal foil and a base substrate A step of forming an antenna substrate by providing the antenna circuit, or a first metal foil force provided on a base substrate, a step of forming an antenna substrate by providing a plurality of antenna circuits, a predetermined position on the antenna circuit A first anisotropic conductive adhesive layer, a step of aligning the IC chips, a plurality of IC chips arranged on the outer periphery of the disc-shaped transporter, and holding a single IC chip.
• At least one of the first and second metal foils is aluminum.
• the first and second metal foils is supported on a base substrate made of organic resin or paper.
• the organic resin includes vinyl chloride resin (P VC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PE N), polycarbonate resin (PC) Biaxially stretched polyester (O-PET) and polyimide resin.
• a method of forming the antenna substrate for example, a plurality of antenna circuits are formed using the first metal foil, and the force is also provided on the base substrate.
• a method for forming a substrate, a first metal foil provided on a base substrate There is a method for forming an antenna substrate by forming a plurality of antenna circuits by means of,
• Examples of the IC chip alignment method include a high-speed barta feeder, a high-frequency parts feeder, and a linear feeder that align chip components such as chip capacitors and chip resistors in a row.
• the IC chips are arranged in the width direction of the antenna substrate, one row at a time.
• an anisotropic conductive adhesive layer is formed on each surface of the IC chip with an external electrode, and the IC chip is attached to the anisotropic conductive adhesive.
• the inlet can be more efficiently produced by using a semiconductor element sandwiched between layers.
• the plurality of IC chips are collectively thermocompression bonded to the antenna substrate and the short-circuit plate by heating and pressing the first and second anisotropic conductive adhesive layers.
• the gap between the antenna substrate and the short-circuit plate can be sealed.
• the sum of the thicknesses of the first and second anisotropic conductive adhesive layers should be at least half or more of the thickness of the IC chip. This is preferred because it can provide sealing properties and achieve high reliability.
• an anisotropic conductive adhesive layer is formed on each surface of the IC chip with an external electrode, and the IC chip is bonded to the anisotropic conductive adhesive. It is also possible to use a short circuit plate provided in advance on one surface of the anisotropic conductive adhesive layer of the semiconductor element that is sandwiched in advance by a layer. Can be manufactured.
• the second metal foil is simply provided on the base substrate. Since there is no need to process the second metal foil such as etching, the number of steps is reduced, the tact time can be shortened, and the cost can be reduced.
• the short-circuit plate in the cutting step, when the AA direction in FIG. 2 is the width direction, the short-circuit plate is long enough to cover the IC chip across the slit. It is necessary to have a length substantially equal to the width of the antenna circuit, and the appearance of the entire inlet is preferable.
• an inlay structure that is an electronic device of the present invention can be obtained through the above steps.
• the inlet is used in the form of an RFID tag, it is preferable to provide cover sheets above and below the inlet in order to protect the circuit and prevent short circuits.
• the plurality of aligned IC chips are individually held by a plurality of hands capable of holding one of the IC chips arranged on the outer periphery of a disk-shaped transporter, and the disks
• the transported chips can be individually arranged at predetermined positions on the short-circuit plate and the antenna circuit.
• IC chips are sucked, transported, and arranged one by one with a vacuum suction device, it is possible to achieve superior productivity. Inlet by improving productivity
• the tact time per piece can be shortened.
• the external electrode on the surface in contact with the antenna circuit of the IC chip is used.
• high-precision alignment of the excitation slits on the antenna circuit is unnecessary, so that it is possible to reduce the cost of production equipment and achieve high-speed conveyance.
• the IC chip, the antenna substrate, the short-circuit plate, and the short-circuit plate And each electrical connection of the antenna substrate is made through an anisotropic conductive adhesive layer.
• the connection with the anisotropic conductive adhesive layer is achieved by contacting each external electrode formed on each surface of the IC chip, which is a connected body, with the conductive particles contained in the anisotropic conductive adhesive layer. This eliminates the need for surface plating on the antenna circuit, and does not require a high heat-resistant base material that can withstand bonding at a high temperature of 200 ° C or higher to form a metal bond. Therefore, it is possible to use an inexpensive base substrate and antenna circuit, and to realize low cost.
• an antenna substrate obtained by forming an aluminum antenna circuit on a polyethylene terephthalate base substrate is a suitable member for manufacturing an inexpensive RFID tag inlet.
• the first anisotropic conductive adhesive layer may be formed on the short-circuit plate in advance or on the second external electrode side of the IC chip. Further, the second anisotropic conductive adhesive layer may be formed on the antenna substrate in advance, or may be formed on the first external electrode 102 side of the IC chip.
• the first anisotropic conductive adhesive layer may be formed in advance on the antenna substrate, or may be formed on the first external electrode 102 side of the IC chip. . Further, the second anisotropic conductive adhesive layer may be formed in advance on the short-circuit plate, or may be formed on the IC chip and the antenna circuit.
• an IC chip formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna formed with a slit, the IC chip and the antenna described above
• the IC chip is transported to the hand of the disc-shaped transporter having a plurality of hands on the outer periphery that can hold one IC chip
• the IC chips are individually held and the disk-shaped transporter is rotated.
• a method of manufacturing an electronic device, wherein a plurality of the IC chips maximizing the number of hands can be simultaneously transported by rolling.
• each of the IC chips arranged on the outer periphery of the disc-shaped transporter is individually held by a plurality of hands capable of holding one IC chip, and the disc A plurality of IC chips that maximize the number of hands by the rotation of the state transporter are transported simultaneously, so that even if they are individually arranged to be electrically connected to the short-circuit plate and the antenna substrate, the inlet Productivity can be dramatically improved.
• FIG. 2 (a) is an embodiment of the present invention and is a schematic view of an RFID tag inlet using the manufacturing method of the present invention as seen from above.
• FIG. 2 (b) is a schematic sectional view taken along the line AA 'of FIG. 2 (a). The structure of the inlet will be briefly described with reference to FIG.
• a first external electrode 102 and a second external electrode 103 are formed on each of a pair of faces of the IC chip 100 facing each other.
• the IC chip 100 includes conductive particles contained in the anisotropic conductive adhesive layer 400 in the first connection portion 2 on the antenna substrate 200 constituted by the base substrate 202 and the antenna circuit 201 by the first external electrode 102. Connected via 401.
• the short-circuit plate 300 constituted by the base substrate 302 and the metal foil 301 and the second external electrode 103 of the IC chip 100 are provided at the second connection portion 3, and the short-circuit plate 300 and the antenna substrate 200 are also provided. Are connected to each other via the conductive particles 401 in the third connection portion 4.
• the second connection portion 3 of the second external electrode 103 of the IC chip and the third connection portion 4 on the antenna substrate are connected across the slit 1 formed in the antenna substrate.
• the first external electrode 102 and the second external electrode 103 of the IC chip include the first connection part 2, the antenna circuit 201, the third connection part 4, the metal foil 301 of the short-circuit plate, and the second connection part. It is electrically connected via the connection part 3. Further, the gap between the antenna substrate 200 and the short-circuit plate 300 is sealed with a matrix resin 402 of an anisotropic conductive adhesive layer.
• the antenna circuit 201 is continuously formed using a salty ferric aqueous solution as an etching solution.
• the width of the antenna per antenna circuit is 2.5 mm
• the slit width is 0.5 mm
• the formation pitch of the antenna circuit is 3 mm.
• an IC chip 100 having a thickness of 0.4 mm and a thickness of 0.15 mm was formed on each surface of a set of approximately 10,000 external electrodes facing each other.
• the IC chip is placed on the linear feeder 1 by continuously vibrating the high frequency parts feeder 1 and the linear feeder 701 connected to the parts feeder 1 at a frequency of 280 Hz. Aligned in a row.
• a short circuit board 300 in which an aluminum foil having a thickness of 9 m is bonded to a polyethylene terephthalate substrate having a width of 2 mm, a length of 50 m, and a thickness of 50 ⁇ m with an adhesive.
• An anisotropic conductive adhesive layer is prepared, the linear feeder 701, a disc-shaped transporter 703 having a plurality of hands 704 capable of holding one IC chip on the outer periphery, the anisotropic conductive adhesive layer was placed upward.
• the tip of the linear feeder is provided with a pin 702 for preventing the IC chip from dropping due to vibration and for separating only one IC chip held by the hand of the disk-shaped transporter.
• the pin 702 at the tip of the linear feeder 701 is lowered to separate only one IC chip B aligned at the top of the linear feeder, and then the linear feeder is separated.
• the disk-shaped transporter 703 stopped at the position where it is connected to one hand.
• the IC chip B which is separated by only one hand, is lowered and held at the tip of the terminal 704, and the disk-shaped transporter is moved up. Rotated.
• the pin at the tip of the linear feeder rises to prevent the IC chip held thereafter from falling off, and the disk-shaped transporter thereafter connects the hand holding the IC chip to the linear feeder. Stop rotation at position.
• the IC chip is held on the tip of the hand 704 of the disk-shaped transporter 703 by vacuum suction, and a hole for that purpose is made in the hand 704.
• the rotational speed of the disk-shaped transporter is 0.3 rotation Z seconds
• the moving speed of the short-circuit plate having the anisotropic conductive adhesive layer is 18mmZ seconds.
• the anisotropic conductive adhesive film 400 having the width described above is placed on the external electrode surface on the side opposite to the external electrode on the short-circuit plate side of the arranged IC chip.
• the separator film was peeled off to form an anisotropic conductive adhesive layer, and the above-mentioned short circuit plate with IC chips in which 40 IC chips were arranged in a row at a pitch of 3 mm was obtained.
• each surface of the IC chip with the external electrode is sandwiched between the anisotropic conductive adhesive layers.
• the IC chip as seen through the force on the anisotropic conductive adhesive layer of the short board with the IC chip using a CCD camera and an image processing device By aligning with a predetermined position on the antenna circuit, the IC chip of the short-circuit plate with the IC chip was temporarily fixed in a direction to be connected to the antenna substrate. Also, there is no problem with the positional accuracy of the IC chip as seen through the anisotropic conductive adhesive layer instead of using a CCD camera and an image processing device.
• the crimping head is lowered from the short-circuit plate side, and a row of antenna circuits in which the short-circuit plates with IC chips are arranged in the width direction of the antenna substrate under the conditions of pressure 3 MPa, temperature 180 ° C, and heating time 15 seconds.
• the gap between the antenna substrate and the short-circuit plate was sealed.
• the pressure-bonding head is formed with protrusions of a predetermined thickness on the IC chip so that the IC chip can be connected to the antenna substrate and the short-circuit plate and the short-circuit plate and the antenna substrate can be connected simultaneously.
• each piece was cut into pieces using a press cutter as shown in FIG. An inlet structure with a square shape was obtained.
• the time required for transporting and arranging the IC chip is 0.167 seconds per inlet, and the time required for connecting the short-circuit plate with the IC chip to the antenna substrate is It was 0.375 seconds per piece. If multiple crimping heads are used, the tact time per inlet can be further reduced.
• the mounting position accuracy of the IC chip was within ⁇ 0.3 mm from a predetermined position, and assembly failure and communication failure due to misalignment were strong.
• the antenna circuit 201 is continuously formed using a salty ferric aqueous solution as an etching solution.
• the width of the antenna per antenna circuit is 2.5 mm
• the slit width is 0.5 mm
• the formation pitch of the antenna circuit is 3 mm.
• an anisotropic conductive adhesive film 400 having a width of 2 mm (Yachi-2052? -45 (manufactured by Hitachi Chemical Co., Ltd.) )) was laminated at 80 ° C, and the separator film was peeled off to form an anisotropic conductive adhesive layer.
• an IC chip 100 having a thickness of 0.4 mm and a thickness of 0.15 mm was formed on each side of a set of approximately 10,000 external electrodes facing each other.
• the IC chip is placed on the linear feeder 1 by continuously vibrating the high frequency parts feeder 1 and the linear feeder 701 connected to the parts feeder 1 at a frequency of 280 Hz. Aligned in a row.
• the linear feeder 701 a disc-shaped transporter 703 having a plurality of hands 704 capable of holding one IC chip on the outer periphery, a predetermined on the antenna circuit
• the anisotropic conductive adhesive layer 400 formed at the position was disposed upward.
• the tip of the linear feeder is provided with a pin 702 for preventing the IC chip from dropping due to vibration and for separating only one IC chip held on the hand of the disk-shaped transporter.
• the pin 702 at the tip of the linear feeder 701 is lowered to separate only one IC chip C aligned at the top of the linear feeder, and then the linear feeder is separated.
• the disk-shaped transporter 703 stopped at the position where it is connected to one hand.
• the IC chip C which has been separated only by one, is held at the tip of the terminal 704, and the disk-shaped transporter is moved up. Rotated. At this time, the pin at the tip of the linear feeder rises to prevent the IC chip held thereafter from falling off, and the disk-shaped transporter thereafter connects the hand holding the IC chip to the linear feeder. Stop rotation at position. Further, the IC chip is held on the tip of the hand 704 of the disk-shaped transporter 703 by vacuum suction, and a hole for that purpose is formed in the hand 704.
• the disc-shaped transporter 7 03 Hand 704 descends, breaks the vacuum adsorbing the IC chip C, fixes the IC chip C to the anisotropic conductive adhesive layer, and an antenna having the anisotropic conductive adhesive layer.
• the circuit 201 was moved by 3 mm, and 40 IC chips were arranged at intervals of 3 mm on the anisotropic conductive adhesive layer formed on the antenna circuit by repeating the above operation.
• the number of notches included was 20, the rotation speed of the disk-shaped transporter was 0.3 rotation Z seconds, and the moving speed of the short-circuit plate having the anisotropic conductive adhesive layer was 18 mmZ seconds.
• a tape-shaped substrate aluminum having a width of 2 mm in which an aluminum foil having a thickness of 9 ⁇ m is bonded to a polyethylene terephthalate substrate having a thickness of 50 ⁇ m with an adhesive.
• the anisotropic conductive adhesive film 400 having the same width as the tape-like substrate was laminated at 80 ° C., and the separator film was peeled off to obtain a short-circuit plate with an anisotropic conductive adhesive layer.
• the short-circuit plate with the anisotropic conductive adhesive layer and the antenna substrate were aligned at a predetermined position on the basis of the external dimensions and temporarily fixed. Subsequently, the crimping head is lowered from the side of the shorting plate with the anisotropic conductive adhesive layer, and the shorting plate with the anisotropic conductive adhesive layer is removed under the conditions of a pressure of 3 MPa, a temperature of 180 ° C, and a heating time of 15 seconds. The IC chip and one row of the antenna circuit arranged in the width direction of the antenna substrate were collectively heat-pressed at a predetermined position, and the gap between the antenna substrate and the short-circuit plate was sealed.
• the IC chip and The protrusions corresponding to the thickness of the IC chip are formed at predetermined positions so that the connection of the antenna substrate and the short-circuit plate and the connection of the short-circuit plate and the antenna substrate can be performed simultaneously.
• the time required for transporting and arranging the IC chip is 0.167 seconds per inlet, as in the first embodiment, and the short-circuit plate is connected to the antenna substrate.
• the time required was 0.375 seconds per inlet. If multiple crimping heads are used, the tact time per inlet can be further reduced.
• the mounting accuracy of the IC chip is within ⁇ 0.3 mm from the predetermined position, and there was no assembly failure or communication failure due to misalignment. .
• the antenna substrate is processed using the same process as in the second embodiment, and the anisotropic conductive adhesive film is laminated on the antenna circuit.
• Method Forming a conductive adhesive layer, aligning and transporting IC chips formed on each surface of the set of external electrodes facing each other, and individually placing the IC chips at predetermined positions on the antenna circuit Arranged.
• the anisotropic conductive adhesive film having the same width as the laminated anisotropic conductive adhesive film is laminated on the arranged IC chip at 80 ° C, and the separator film is peeled off to remove the anisotropic conductive film. An adhesive layer was formed.
• a tape-shaped substrate having a width of 2 mm was prepared by bonding an aluminum foil having a thickness of 9 ⁇ m with an adhesive to a polyethylene terephthalate substrate having a thickness of 50 ⁇ m, and this was used as a short-circuit plate.
• the aluminum foil surface side of the short-circuit plate was directed to the IC chip, aligned with the anisotropic conductive adhesive film on the basis of the outer dimensions, and temporarily fixed. Subsequently, the crimping head is lowered from the short-circuit plate side, and the short-circuit plate is thermocompression bonded at a predetermined position to the IC chip and antenna circuit under the conditions of pressure 3 MPa, temperature 180 ° C, and heating time 15 seconds.
• the crimping head has an IC chip and The protrusions corresponding to the thickness of the IC chip are formed at predetermined positions so that the connection of the antenna substrate and the short-circuit plate and the connection of the short-circuit plate and the antenna substrate can be performed simultaneously.
• each piece was cut into pieces using a press cutter to obtain an inlet structure having the shape shown in FIG.
• the time required for transporting and placing the IC chip is 0.167 seconds per inlet, and the short-circuit plate is in contact with the antenna substrate.
• the time required to continue was 0.375 seconds per inlet. If multiple crimping heads are used, the tact time per inlet can be further reduced.
• the mounting position accuracy of the IC chip is within ⁇ 0.3 mm from a predetermined position, and assembly failure and communication failure due to misalignment are eliminated. There wasn't.
• the antenna substrate is processed using the same process as in the first embodiment !, and the IC chips are aligned in a line on the linear feeder. did.
• a short circuit board 300 in which an aluminum foil having a thickness of 9 m is bonded to a polyethylene terephthalate substrate having a width of 2 mm, a length of 50 m, and a thickness of 50 ⁇ m by an adhesive.
• An anisotropic conductive adhesive layer is prepared, and the linear feeder 701, a disc-shaped transporter 803 having a plurality of notches 804 into which one IC chip can be inserted, 803, the anisotropic conductive adhesive The layers were placed face up.
• the tip of the linear feeder is provided with a pin 702 for preventing the IC chip from dropping due to vibration and for separating only one IC chip to be inserted into the notch of the disk-shaped transporter.
• the pin 702 at the tip of the linear feeder 701 is lowered, and only one IC chip D aligned at the top of the linear feeder 701 is cut. Inserted into the notch 804 and rotated the disk-shaped transporter. At this time, the pin at the front end of the linear feeder rises to prevent the IC chip to be inserted later from falling off, and the disc-shaped Thereafter, the conveyor stops rotating at a position where the notch for inserting the IC chip is connected to the linear feeder.
• the rotational speed of the disk-shaped transporter is 0.25 rotation Z seconds
• the moving speed of the short-circuit plate having the anisotropic conductive adhesive layer was 18 mmZ seconds.
• the time required for transporting and arranging the IC chip was 0.167 seconds per inlet.
• the IC chip which is generated about once per 2000 IC chips, was attracted to the notch. Excluding the time when was stopped.
• the time required to connect the short-circuit plate with the IC chip to the antenna substrate was 0.375 seconds per inlet.
• using multiple crimping heads further reduces the tact time per inlet. be able to.
• the mounting position accuracy of the IC chip was within ⁇ 0.3 mm from the predetermined position, and there was no significant assembly failure or communication failure due to misalignment.
• an antenna circuit is continuously formed using a salty ferric aqueous solution as an etching solution.
• the antenna width per antenna circuit is 2.5 mm
• the slit width is 0.5 mm
• the antenna circuit formation pitch is 3 mm.
• an anisotropic conductive adhesive film 400 (A C-2052P-45 (manufactured by Hitachi Chemical Co., Ltd.) was laminated at 80 ° C, and the separator film was peeled off to form an anisotropic conductive adhesive layer.
• the short-circuit plate with the anisotropic conductive adhesive layer and the antenna substrate were aligned at a predetermined position based on the outer dimensions and temporarily fixed. Subsequently, the crimping head is lowered from the side of the short-circuit plate with the anisotropic conductive adhesive layer, and the short-circuit plate with the anisotropic conductive adhesive layer is placed on the IC under the conditions of pressure 3 MPa, temperature 180 ° C, and heating time 15 seconds. The chip and the antenna circuit were collectively heat-pressed at a predetermined position, and the gap between the antenna substrate and the short-circuit plate was sealed.
• the pressure-bonding head is formed with a projection corresponding to the thickness of the IC chip at a predetermined position so that the connection between the IC chip and the antenna substrate and the short-circuit plate and the connection between the short-circuit plate and the antenna substrate can be performed simultaneously.
• each piece was cut into pieces using a press cutting machine to obtain an inlet having the shape shown in FIG.
• the time required for transporting and placing the IC chip per inlet is 0.2 seconds, and the time required for connecting the shorting plate to the antenna substrate is per inlet. 0. 375 seconds.
• the mounting position accuracy of the IC chip is within ⁇ 0.3 mm from a predetermined position, and assembly failure due to misalignment. And there was no communication failure.
• Embodiment Time required (second Z Time required (number of defects (number of defects)
• the fourth embodiment 0.375 0,2000 0/2000 is caught in the notch

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• 2006
  • 2006-04-18 CN CN2006800127538A patent/CN101160596B/zh not_active Expired - Fee Related
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