WO2006095590A1 - Matière de remplissage pour résine, matériau de base de résine contenant ladite matière et matériau substrat de composant électronique - Google Patents

Matière de remplissage pour résine, matériau de base de résine contenant ladite matière et matériau substrat de composant électronique Download PDF

Info

Publication number
WO2006095590A1
WO2006095590A1 PCT/JP2006/303599 JP2006303599W WO2006095590A1 WO 2006095590 A1 WO2006095590 A1 WO 2006095590A1 JP 2006303599 W JP2006303599 W JP 2006303599W WO 2006095590 A1 WO2006095590 A1 WO 2006095590A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
filler
base material
compound
resin base
Prior art date
Application number
PCT/JP2006/303599
Other languages
English (en)
Japanese (ja)
Inventor
Toshifumi Kawamura
Toru Imori
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to JP2007507048A priority Critical patent/JP5072094B2/ja
Publication of WO2006095590A1 publication Critical patent/WO2006095590A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)

Abstract

L’invention concerne une technique que l’on peut appliquer à un matériau de base de résine utilisé couramment comme matériau substrat et permettant d’améliorer la force d’adhérence entre le matériau de base et une couche de métal plaquée, et un matériau de base de résine général de plus grande adhérence à une couche de métal plaquée. Elle concerne spécifiquement une matière de remplissage pour résines composée d’une silice traitée en surface avec à la fois une solution contenant un agent de couplage silane comme un agent obtenu par une réaction entre un composé d’azole ou un composé d’amine et un composé d’époxysilane et une solution contenant un composé de métal noble ou bien traitée en surface avec un mélange de ces solutions. Elle concerne également spécifiquement un matériau de base de résine contenant une telle matière de remplissage et un matériau substrat de composant électronique que l’on obtient par placage autocatalytique d’un tel matériau de base de résine.
PCT/JP2006/303599 2005-03-10 2006-02-27 Matière de remplissage pour résine, matériau de base de résine contenant ladite matière et matériau substrat de composant électronique WO2006095590A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007507048A JP5072094B2 (ja) 2005-03-10 2006-02-27 樹脂用フィラー、それを配合した樹脂基材、及び電子部品基材

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005-066604 2005-03-10
JP2005066604 2005-03-10
JP2005248707 2005-08-30
JP2005-248707 2005-08-30

Publications (1)

Publication Number Publication Date
WO2006095590A1 true WO2006095590A1 (fr) 2006-09-14

Family

ID=36953190

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/303599 WO2006095590A1 (fr) 2005-03-10 2006-02-27 Matière de remplissage pour résine, matériau de base de résine contenant ladite matière et matériau substrat de composant électronique

Country Status (2)

Country Link
JP (1) JP5072094B2 (fr)
WO (1) WO2006095590A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009173846A (ja) * 2007-12-27 2009-08-06 Sekisui Chem Co Ltd 有機修飾無機酸化物微粒子、その製造方法、その分散スラリ及び樹脂組成物
GB2444010B (en) * 2005-09-15 2010-12-08 Sekisui Chemical Co Ltd Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
JP2014129529A (ja) * 2012-12-28 2014-07-10 Samsung Electro-Mechanics Co Ltd アルキルスルホン化テトラゾール化合物で表面改質されたシリカ、その製造方法及びそれを含有する樹脂組成物
JP2015516509A (ja) * 2012-03-29 2015-06-11 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 誘電体基板と金属層との間の密着性を促進するための方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09169871A (ja) * 1995-12-20 1997-06-30 Japan Energy Corp 表面処理されたフィラーおよびそれを用いた樹脂組成物
WO2001049898A1 (fr) * 2000-01-07 2001-07-12 Nikko Materials Co., Ltd. Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere
WO2001081652A1 (fr) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Agent de pretraitement pour revetement metallique
WO2004024984A1 (fr) * 2002-09-10 2004-03-25 Nikko Materials Co., Ltd. Procede de galvanoplastie et agent de pre-traitement
JP2004277735A (ja) * 2003-02-27 2004-10-07 Sanyo Chem Ind Ltd 硬化性樹脂組成物およびその硬化物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3733204B2 (ja) * 1997-06-12 2006-01-11 イビデン株式会社 樹脂充填剤調製用の原料組成物および樹脂充填剤の調製方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09169871A (ja) * 1995-12-20 1997-06-30 Japan Energy Corp 表面処理されたフィラーおよびそれを用いた樹脂組成物
WO2001049898A1 (fr) * 2000-01-07 2001-07-12 Nikko Materials Co., Ltd. Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere
WO2001081652A1 (fr) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Agent de pretraitement pour revetement metallique
WO2004024984A1 (fr) * 2002-09-10 2004-03-25 Nikko Materials Co., Ltd. Procede de galvanoplastie et agent de pre-traitement
JP2004277735A (ja) * 2003-02-27 2004-10-07 Sanyo Chem Ind Ltd 硬化性樹脂組成物およびその硬化物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2444010B (en) * 2005-09-15 2010-12-08 Sekisui Chemical Co Ltd Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
JP2009173846A (ja) * 2007-12-27 2009-08-06 Sekisui Chem Co Ltd 有機修飾無機酸化物微粒子、その製造方法、その分散スラリ及び樹脂組成物
JP2015516509A (ja) * 2012-03-29 2015-06-11 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 誘電体基板と金属層との間の密着性を促進するための方法
JP2014129529A (ja) * 2012-12-28 2014-07-10 Samsung Electro-Mechanics Co Ltd アルキルスルホン化テトラゾール化合物で表面改質されたシリカ、その製造方法及びそれを含有する樹脂組成物

Also Published As

Publication number Publication date
JP5072094B2 (ja) 2012-11-14
JPWO2006095590A1 (ja) 2008-08-14

Similar Documents

Publication Publication Date Title
CN102164995B (zh) 半固化物、固化物、叠层体、半固化物的制造方法以及固化物的制造方法
KR102278716B1 (ko) 프린트 배선판용 절연층 및 프린트 배선판
CN1439038A (zh) 环氧树脂组合物和用其得到的固化制品
KR100976313B1 (ko) 무전해도금을 실시한 전자 부품기재, 및 전자 부품기재의 제조 방법
JPWO2020022084A1 (ja) 硬化性組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板
CN109983157B (zh) 印刷电路板的制备方法
WO2006095590A1 (fr) Matière de remplissage pour résine, matériau de base de résine contenant ladite matière et matériau substrat de composant électronique
JP6088966B2 (ja) アルキルスルホン化テトラゾール化合物で表面改質されたシリカ、その製造方法及びそれを含有する樹脂組成物
WO2000049070A1 (fr) Preimpregne, stratifie a revetement metallique et carte a circuit imprime obtenue a partir de ceux-ci
KR102579149B1 (ko) 방열용 수지 조성물, 방열 부재 및 전자기기
JP5750009B2 (ja) 積層体の製造方法
JP6914194B2 (ja) プリント配線板の製造方法、及び樹脂組成物
JP4899280B2 (ja) 配線板用複合材料とその製造方法
JP2013095958A (ja) 金属層を有する積層体の製造方法
JP2001233945A (ja) 無電解メッキ可能な高耐熱性エポキシ樹脂組成物、それを用いたビルドアップ用絶縁材料並びにビルドアップ基板
JP2010258462A (ja) 配線板用複合材料とその製造方法
JP4872180B2 (ja) 半導体搭載用基板および半導体パッケージ
JP7336170B1 (ja) 積層体の製造方法
JP4766295B2 (ja) エポキシ樹脂組成物及びこれを用いた積層板
JP2003008212A (ja) 配線回路付き樹脂材料及びそれらの製造方法と多層プリント配線板
JP2010251783A (ja) 半導体搭載用基板および半導体パッケージ
JP5642378B2 (ja) 絶縁性樹脂、絶縁性樹脂層形成用組成物、積層体、表面金属膜材料の作製方法、金属パターン材料の作製方法、配線基板の作製方法、電子部品、半導体素子
JPH03173493A (ja) めっきレジスト剥離防止剤
JP2013070064A (ja) 半導体搭載用基板および半導体パッケージ
JP2011174104A (ja) 樹脂硬化物のメッキ方法及びそのメッキ方法でメッキ処理された樹脂硬化物

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2007507048

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 06714736

Country of ref document: EP

Kind code of ref document: A1