WO2006088146A1 - Element d'inductance - Google Patents

Element d'inductance Download PDF

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Publication number
WO2006088146A1
WO2006088146A1 PCT/JP2006/302859 JP2006302859W WO2006088146A1 WO 2006088146 A1 WO2006088146 A1 WO 2006088146A1 JP 2006302859 W JP2006302859 W JP 2006302859W WO 2006088146 A1 WO2006088146 A1 WO 2006088146A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor
substrate
inductance element
conductors
pattern
Prior art date
Application number
PCT/JP2006/302859
Other languages
English (en)
Japanese (ja)
Inventor
Masami Yakabe
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2006088146A1 publication Critical patent/WO2006088146A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core

Definitions

  • the present invention relates to an inductance element, for example, to an inductance element used for an LC filter connected to a power supply input of an electronic circuit board.
  • An LC filter connected to a power supply input end of an electronic circuit board removes external noise to prevent circuits mounted on the electronic circuit board from malfunctioning.
  • the LC filter is composed of an inductance element and a capacitor.
  • the inductance element is composed of a conductor wound part, and it is common to mount this part on a substrate.
  • an inductance element there is a multilayer inductance element as described in Japanese Patent Laid-Open No. 2004-6922.
  • this laminated inductance element a plurality of ceramic layers are laminated, a coil pattern is disposed on the surface of each layer, and the coil patterns are connected by a through conductor to form an inductance element. Even when such an inductance element is used, it must be prepared as a separate part, and this is no different from the case where an inductance element in which a conductor is wound is used.
  • an inductance element in which a coil pattern 31 is formed flatly in a spiral on the surface of a substrate 30 to form a force coil pattern 31.
  • Some large area is needed on 30.
  • the present invention is to provide an inductance element that can be integrally formed on a substrate with a narrow area.
  • a substrate, a strip-shaped first conductor formed on one surface of the substrate, and the other surface of the substrate are formed, and one end thereof is overlapped with one end of the first conductor via the substrate.
  • a through conductor which electrically connects the overlapping ends of the first and second conductors through the substrate to form a continuous conductor.
  • a continuous conductor can be formed, so that the inductance element can be integrally formed on the narrow area of the substrate.
  • the first conductor includes a plurality of strip conductors, one end of one of the strip conductors overlaps with one end of the second conductor, and one end of the other strip conductor is on the other end of the second conductor.
  • the through conductors are formed so as to overlap, and connect the respective overlapping ends.
  • the first conductor and the second conductor are arranged mutually at a predetermined angle !.
  • the angle By changing the angle, the length and width of the entire inductance element can be adjusted.
  • the continuous conductor comprises a helical coil! /.
  • an electronic component constituting an electronic circuit is mounted on a substrate, and is connected to one end of a continuous conductor, and an input conductor for inputting a power supply voltage and a continuous conductor It includes a circuit conductor connected to the other end to supply the input power supply voltage to the electronic circuit.
  • the substrate includes a vacant area where no electronic component is mounted, and the first and second conductors and the through conductor are provided in the vacant area.
  • the substrate has at least two sides of a corner, the first conductor is formed along one side of the substrate, and the second conductor is formed along the other side of the substrate. It is formed.
  • a strip-shaped first conductor is formed on one surface of a substrate, and a strip-shaped second conductor is formed on the other surface of the substrate such that one end thereof overlaps with one end of the first conductor via the substrate. Since the conductor is formed and the overlapping ends of the first and second conductors are electrically connected by the through conductor to form a continuous conductor, the inductance element is integrally formed on the substrate in a narrow area. Can become.
  • FIG. 1 is a conceptual view of an inductance element in an embodiment of the present invention.
  • FIG. 2 is an illustrative view for realizing the inductance element shown in FIG.
  • FIG. 3 is a view showing an inductance element in another embodiment of the present invention.
  • FIG. 4 is a view showing an arrangement example of conductor patterns of an inductance element according to still another embodiment of the present invention.
  • FIG. 5 is a view showing an arrangement example of conductor patterns of an inductance element according to still another embodiment of the present invention.
  • FIG. 6 is a view showing a specific arrangement example of the inductance element in the embodiment of the present invention.
  • FIG. 7 is a view showing an inductance element in another embodiment of the present invention.
  • FIG. 8 is a view showing a conventional inductance element formed planarly on a substrate.
  • FIG. 1 is a view showing an outline of an inductance element according to an embodiment of the present invention.
  • an inductance element 40 is composed of a plurality of first and second conductors 41 and 42 and a through conductor 43.
  • the first conductor 41 is in the form of a strip, and is formed in parallel with one side of a substrate (not shown), and the second conductor 42 is in the form of a strip, one end of which is the substrate of the first conductor 41.
  • a plurality of parallel formations are made to overlap one end.
  • the through conductor 43 penetrates the substrate to electrically connect overlapping ends of the first and second conductors 41 and 42. As a result, the first and second conductors 41 and 42 and the through conductor 43 form a continuous conductor.
  • FIG. 2 is an illustrative view for realizing the inductance element shown in FIG.
  • the substrate 2 an interposer substrate used for, for example, a laminated substrate is used.
  • a plurality of conductor patterns 3 and 4 as first conductors for forming a coil for the inductance element 1 are formed in parallel at predetermined intervals on one surface of the substrate 2, respectively.
  • a plurality of conductor patterns 5, 5, 6 and 7 as second conductors for forming a coil are formed in parallel on the other side of the substrate, respectively, with predetermined intervals.
  • Conductor patterns 3 and 4 and conductor patterns 5, 6 and 7 are arranged at predetermined angles to each other.
  • the first and second conductors may be provided with the same number of forces or one more.
  • continuous conductors are formed by the conductor notions 5, 3, 6, 4, 7 and the through conductors 10, 13, 11, 14, 12.
  • a power supply input pattern 8 as a strip-like power supply conductor is formed on one surface of the substrate 1, and one end of the power supply input pattern 8 overlaps the other end of the conductor pattern 5 via the substrate 2.
  • the end portions of the power input pattern 8 and the conductor pattern 5 overlapping with each other are electrically connected to each other through the substrate 2 by the through conductor 15.
  • circuit pattern 9 as a circuit conductor is formed on one surface of the substrate 1, and one end of the circuit pattern 9 overlaps with one end of the conductor pattern 7 via the substrate 2. The overlapping end portions of 7 are electrically connected to each other through the board 2 by the through conductor 12.
  • the circuit pattern 9 is connected to a pattern of circuit parts constituting an electronic circuit (not shown).
  • the first conductor patterns 3, 4 and the second conductor patterns 5, 6, 7 are electrically connected by the through conductors 10, 11, 13, 14 to be continuous.
  • the conductor is configured, and the force is also spirally wound in the counterclockwise direction when viewed from the power input pattern 8 side in FIG. It forms a coil and works as an inductance element 1 having an inductance value of nH.
  • the inductance element 1 acts as a simple conductor in terms of direct current, the direct current voltage input to the power supply input pattern 8 is supplied to the electronic circuit through the circuit pattern 9 without causing a voltage drop. .
  • the inductance element 1 acts as a resistive element for an AC component such as noise, it is possible to prevent noise from being mixed in the circuit pattern. More preferably, if a capacitor is connected between the circuit pattern 9 and the ground line (not shown), an LC filter can be configured, which is more effective in preventing noise mixing.
  • the power input pattern 8 is connected to the other end of the second conductor pattern 5 via the through conductor 15, the power supply input pattern 8 is not connected to the other surface of the substrate 2. Even if the input pattern 8 is directly connected to the other end of the conductor pattern 5, the circuit pattern 9 may also be formed on the other surface of the substrate 2 and directly connected to one end of the conductor pattern 7.
  • the conductor patterns 3 and 5 may be formed on the substrate 2, and the conductor elements 3 and 5 may be connected by the through conductor 10 to constitute an inductance element.
  • FIG. 3 is a view showing an inductance element in another embodiment of the present invention.
  • the inductance element la of this embodiment is obtained by changing the arrangement of the conductor patterns 3 to 7 shown in FIG. 2, and the other configuration is the same as that of FIG. That is, with respect to the first conductor patterns 3 and 4 formed in parallel to one surface of the substrate 2, the second conductor patterns 5, 6 and 7 formed on the other surface of the substrate 2 are substantially perpendicular to each other. It is arranged to become.
  • the conductor patterns 5 and 7 are formed on the same straight line, and the conductor pattern 6 is formed in parallel to the conductor patterns 5 and 7.
  • the power supply input pattern 8 extends parallel to the conductor pattern 3 from the through conductor 15, and the tip portion is bent 90 degrees and extends to the end of the substrate 2.
  • the first conductor patterns 3 and 4 and the second conductor patterns 5, 6 and 7 are electrically connected by the through conductors 10, 11, 13 and 14 to form a continuous conductor. ing.
  • FIG. 4 and FIG. 5 are diagrams showing an example of arrangement of conductor patterns of inductance elements in still another embodiment of the present invention.
  • the inductance element lb in the example shown in FIG. 4 is such that the angle 0 1 formed by each of the conductor patterns 3 and 4 and the conductor patterns 5 6 and 7 forms an acute angle. It is arranged as follows.
  • the other power supply input patterns 8, circuit patterns 9 and through conductors 10 to 15 are the same as in FIG. 2 and FIG.
  • the length as the inductance element lb can be shortened and the width can be narrowed by reducing the acute angle ⁇ 1 and increasing the inclination angle of the conductor patterns 3 to 7 with respect to the vertical direction in FIG. .
  • the inductance elements lc in the example shown in FIG. 5 are arranged such that the angle ⁇ 2 between the conductor patterns 3 and 4 and the conductor patterns 5, 6 and 7 form an obtuse angle.
  • the other power supply input patterns 8, circuit patterns 9 and through conductors 10 to 15 are the same as in FIG. 2 and FIG.
  • the conductor patterns 3 to 7 so as to increase the obtuse angle ⁇ 2
  • the length of the inductance element lc can be increased but the width can be narrowed.
  • FIG. 6 is a view showing a specific arrangement example of the inductance element in the embodiment of the present invention.
  • the substrate 2 is formed in a rectangular shape, and along one end side of the substrate 2 in the longitudinal direction, the inductance element 1 configured in the same manner as FIG. 2 is disposed.
  • An area 20 on the substrate 2 is used as an area for arranging various electronic components constituting the electronic circuit. Therefore, in this embodiment, it is possible to form the inductance element 1 on the narrow area of the substrate 2 as compared to the inductance element which is formed in a planar spiral shape on the substrate of the conventional example. .
  • FIG. 7 is a diagram showing an inductance element in another embodiment of the present invention.
  • the substrate 2 is formed in a rectangular shape, and conductor patterns 21 and 22 are formed in parallel along one end and the other end of the short side of the one surface of the substrate 2, respectively.
  • Conductor patterns 23 and 24 are formed along the one end and the other end on the longitudinal side of the other surface of the substrate 2 respectively.
  • a circuit pattern 25 is formed parallel to the conductor pattern 21 on one side of the substrate 2.
  • One end of the conductor pattern 21 and one end of the conductor pattern 23 overlap via the substrate 2, and the overlapping ends are electrically connected to each other through the substrate 2 by the through conductor 26. .
  • the other end of the conductor pattern 23 and one end of the conductor pattern 22 overlap via the substrate 2, and the overlapping ends are electrically connected to each other through the substrate 2 by the through conductor 27.
  • the other end of the conductor pattern 22 and one end of the conductor pattern 24 overlap through the substrate 2, and the overlapping ends penetrate through the substrate 2 by the through conductor 28 and are electrically connected. It is continued!
  • the other end of the conductor pattern 24 and one end of the circuit pattern 25 overlap through the substrate 2, and the overlapping ends are electrically connected to each other through the substrate 2 by the through conductor 29.
  • the conductor patterns 21, 23, 22, 24 and the circuit pattern 25 are connected by the through conductors 26, 27, 28, 29, a continuous conductor is configured to form the inductance element Id. It can be configured.
  • the circuit pattern 25 can supply a DC voltage to each electronic circuit.
  • the area around substrate 2 is usually an empty area without mounting electronic components, and conductor patterns 21, 23, 22, 24 can be arranged in this empty area, so the space factor is improved. it can.
  • the conductor pattern 21 is formed on one side along one side of one side of the board 2 which forms the conductor patterns 21, 22, 23, 24 around the board 6, and the other side is formed on the other side.
  • an inductance element having a predetermined inductance value can be configured depending on the frequency to be used.
  • the conductor patterns are formed on the one surface and the other surface of one substrate 2 respectively.
  • one surface and the other surface of the laminated substrate are obtained by laminating a plurality of substrates. You may form a conductor pattern and connect with a through conductor. In this case, since the through conductor can be made longer, the inductance value can be increased.
  • the inductance element of the present invention can be used as an LC filter or the like because the inductance element can be configured by arranging the conductor patterns on one surface and the other surface of the substrate and electrically connecting them.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

La présente invention décrit des motifs de conducteur à bande (3, 4) formés sur un plan d'un substrat (2), les motifs de conducteur à bande (5, 6, 7) sont formés sur l'autre plan, chevauchant les sections d'extrémité des extrémités d'un premier côté des motifs de conducteur (3, 4) et les extrémités d'un premier côté des motifs du conducteur (5, 6) sont électriquement raccordées par des conducteurs pénétrants (10, 11) pénétrant dans le substrat (2). Les sections d'extrémité des extrémités de l'autre côté des motifs du conducteur (3, 4) et les extrémités de l'autre côté des motifs du conducteur (6, 7) sont électriquement raccordées à l'aide de conducteurs pénétrants (13, 14) pénétrant dans le substrat (2). De plus, un élément d'inductance (1) est formé.
PCT/JP2006/302859 2005-02-21 2006-02-17 Element d'inductance WO2006088146A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005044765A JP2006229173A (ja) 2005-02-21 2005-02-21 インダクタンス素子
JP2005-044765 2005-02-21

Publications (1)

Publication Number Publication Date
WO2006088146A1 true WO2006088146A1 (fr) 2006-08-24

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JP (1) JP2006229173A (fr)
TW (1) TW200643999A (fr)
WO (1) WO2006088146A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013122887A1 (fr) * 2012-02-13 2013-08-22 Qualcomm Incorporated Filtres l-c rf 3d utilisant des trous d'interconnexion à travers le verre

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283695A (ja) * 2008-05-22 2009-12-03 Alps Electric Co Ltd 積層型電子部品
US9425761B2 (en) * 2013-05-31 2016-08-23 Qualcomm Incorporated High pass filters and low pass filters using through glass via technology
JP6575312B2 (ja) * 2015-11-12 2019-09-18 株式会社村田製作所 Ｌｃ複合デバイスおよびプロセッサ
JP7533368B2 (ja) 2021-06-03 2024-08-14 株式会社村田製作所 インダクタ部品
CN114242421B (zh) * 2021-12-28 2023-07-21 横店集团东磁股份有限公司 一种薄膜电感及制作方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55169814U (fr) * 1979-05-22 1980-12-05
JPS60196910A (ja) * 1984-03-19 1985-10-05 Fujitsu Ltd ハイブリツドｉｃ及びその製造方法
JPS6115721U (ja) * 1984-07-02 1986-01-29 株式会社村田製作所 高周波ｌｃ回路素子
JPH0430615A (ja) * 1990-05-24 1992-02-03 Takeshi Ikeda ノイズ・フイルタ
JPH07272932A (ja) * 1994-03-31 1995-10-20 Canon Inc プリントインダクタ
JPH0992539A (ja) * 1995-09-22 1997-04-04 Uniden Corp 立体渦巻状インダクタ及びそれを用いた誘導結合フィルタ
JPH11274878A (ja) * 1998-03-18 1999-10-08 Hokuriku Electric Ind Co Ltd チップフィルタとその製造方法
JP2001118980A (ja) * 1999-10-21 2001-04-27 Denso Corp 混成集積回路装置及びプレート型コイル
JP2004055973A (ja) * 2002-07-23 2004-02-19 Keisoku Kenkyusho:Kk コイル装置およびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55169814U (fr) * 1979-05-22 1980-12-05
JPS60196910A (ja) * 1984-03-19 1985-10-05 Fujitsu Ltd ハイブリツドｉｃ及びその製造方法
JPS6115721U (ja) * 1984-07-02 1986-01-29 株式会社村田製作所 高周波ｌｃ回路素子
JPH0430615A (ja) * 1990-05-24 1992-02-03 Takeshi Ikeda ノイズ・フイルタ
JPH07272932A (ja) * 1994-03-31 1995-10-20 Canon Inc プリントインダクタ
JPH0992539A (ja) * 1995-09-22 1997-04-04 Uniden Corp 立体渦巻状インダクタ及びそれを用いた誘導結合フィルタ
JPH11274878A (ja) * 1998-03-18 1999-10-08 Hokuriku Electric Ind Co Ltd チップフィルタとその製造方法
JP2001118980A (ja) * 1999-10-21 2001-04-27 Denso Corp 混成集積回路装置及びプレート型コイル
JP2004055973A (ja) * 2002-07-23 2004-02-19 Keisoku Kenkyusho:Kk コイル装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013122887A1 (fr) * 2012-02-13 2013-08-22 Qualcomm Incorporated Filtres l-c rf 3d utilisant des trous d'interconnexion à travers le verre

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JP2006229173A (ja) 2006-08-31
TW200643999A (en) 2006-12-16

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