Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
  • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/01—Manufacture or treatment
  • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/091—Locally and permanently deformed areas including dielectric material
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10954—Other details of electrical connections
  • H05K2201/10977—Encapsulated connections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
  • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
  • H05K3/305—Affixing by adhesive
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
  • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

• the present invention relates to an electronic component in which an interposer mounted with a semiconductor chip is bonded to the surface of a base circuit sheet.
• a method for joining an interposer mounted with a semiconductor chip there is a method in which the interposer is joined and bonded by an insulating adhesive applied to the surface of a connection terminal of a base circuit sheet.
• an insulating adhesive is applied in a pattern on the surface of the connection terminal of the base circuit sheet. That is, a portion where the insulating adhesive is applied and a portion where the insulating adhesive is not applied are formed on the surface of the connection terminal.
• the interposer is bonded to the base circuit sheet by pressing the connection terminal of the interposer against the connection terminal of the base circuit sheet to which the insulating adhesive is applied in a pattern.
• the physical connection between the connection terminals in the contact portion via the insulating adhesive and the electrical connection between the connection terminals in the contact portion without the insulating adhesive interposed.
• the above-described interposer joining method depending on the coating pattern of the insulating adhesive and the amount of coating, there is a possibility that physical connection and electrical connection between the connection terminals cannot be made compatible.
• the proportion of the surface of the connection terminal covered by the insulating adhesive increases, the physical connection may be sufficient, but the electrical connection may be insufficient.
• the proportion of the portion covered by the insulating adhesive is reduced, the physical connection, that is, the adhesive force becomes insufficient, and as a result, the electrical connection reliability may not be maintained at a high level.
• Patent Document 1 Japanese Patent Application Laid-Open No. 2003-69216 Disclosure of the invention
• the present invention has been made in view of the above-described conventional problems, and is an interposer that can connect an interposer mounted with a semiconductor chip to the surface of a base circuit sheet with high physical and electrical certainty.
• the present invention aims to provide a bonding method and a highly reliable electronic component manufactured by using this bonding method.
• an interposer having an interposer-side terminal which is a connection terminal extended from the semiconductor chip and mounted on a sheet-shaped chip holding member.
• an interposer joining method for joining to a base circuit sheet having base-side terminals provided on the surface of a member In an interposer joining method for joining to a base circuit sheet having base-side terminals provided on the surface of a member,
• At least one of the base member and the tip holding member is made of a plastic material, and at least one press die of the pair of press dies adjacent to the base member and the tip holding member made of the plastic material is:
• the interposer joining method is characterized in that a convex surface projecting toward the other press die is provided on the pressure surface facing the interposer side terminal or the back surface of the base side terminal.
• the interposer joining method includes the adhesive applying step of providing at least the surface of the base side terminal with the adhesive disposing layer and the adhesive disposing layer through the adhesive disposing layer.
• the interposer placement step of placing the interposer on the base circuit sheet so that the base side terminal and the interposer side terminal face each other, and the base circuit sheet and the interposer using a pair of press dies facing each other. Pinching And pressurizing and pressing.
• At least one of the base member and the chip holding member is made of a plastic material.
• the press die adjacent to the base member and the chip holding member made of the plastic material is the interposer side terminal or the base.
• the pressing surface facing the back surface of the side terminal has a convex portion protruding toward the other press die.
• At least one of the base member and the tip holding member made of a plastic material is formed by the convex portion provided on the pressing surface of the press die. It can be pressed from the interposer side terminal or the back side of the base side terminal. And by the said convex part, at least any one of the said interposer side terminal and the said base side terminal can be made to project and deform toward the other.
• the insulating adhesive is allowed to actively flow out from between the projecting deformed portion of at least! / Of the interposer side terminal and the base side terminal and the other connection terminal.
• the interposer side terminal and the base side terminal can be brought into direct contact with each other. In this state, the interposer side terminal and the base side terminal can be pressure-bonded by sandwiching and pressing the base circuit sheet and the interposer.
• the electrical connection between the base side terminal and the interposer side terminal can be realized with high reliability.
• the insulating adhesive remains as it is with the other connection terminal. Therefore, with this remaining insulating adhesive, physical connection between the interposer side terminal and the base side terminal, that is, adhesive bonding can be realized with high reliability.
• the interposer joining method As described above, in the interposer joining method according to the first aspect of the present invention, at least one of the interposer-side terminal and the base-side terminal facing each other is pressed from the back surface by the press-type convex portion. As a result, protruding deformation occurs. Thus, the projecting deformed portion and the other connecting terminal facing each other can be brought into direct contact. Therefore, the interposer side terminal and the base side terminal facing each other via an insulating adhesive are sandwiched and pressed, so that the physical connection by the insulating adhesive and the crimping of the connection terminals are performed. It is possible to simultaneously realize electrical connection by.
• an interposer having an interposer side terminal which is a connection terminal extended from the semiconductor chip force and having a semiconductor chip mounted on a sheet-like chip holding member is used as the interposer side terminal.
• At least one of the base member and the chip holding member is made of a plastic material, and at least one surface of the base-side terminal in the base circuit sheet is an adhesive material disposing layer that is an insulating adhesive material having electrical insulation.
• At least one press die adjacent to the plastic material is the interposer-side terminal, or the pressure surface facing the back surface of the base-side terminal, It is manufactured by performing a pressure pressing step of pressing the base circuit sheet and the interposer by using a pair of press dies having projections projecting toward the other press dies.
• a pressure pressing step of pressing the base circuit sheet and the interposer by using a pair of press dies having projections projecting toward the other press dies.
• the electronic component of the second invention is obtained by joining the interposer to the base circuit sheet by using the interposer joining method of the first invention.
• this electronic component at least a portion of the interposer side terminal and the base side terminal! /, A projecting deformed portion due to a displacement force, and a contact point between the other connection terminal and the interposer side terminal and the base side terminal Has been crimped to ensure reliable electrical connection.
• the interposer side terminal and the base side terminal are separated by an insulating adhesive in the gap.
• the physical connection that is, adhesive bonding, is realized with high reliability.
• the electronic component has an excellent quality in which the interposer is electrically and physically connected to the base circuit sheet with high reliability.
• FIG. 1 is an explanatory view showing a pressurizing process for joining an interposer and an antenna sheet in Example 1.
• FIG. 2A is a cross-sectional view showing a cross-sectional structure of an RF-ID medium in Example 1 (cross-sectional view along the longitudinal direction of the interposer).
• 2B is a cross-sectional view showing the cross-sectional structure of the RF-ID medium in Example 1 (a cross-sectional view taken along the line A-A in FIG. 2A).
• FIG. 3A is a front view showing an antenna sheet in Example 1.
• FIG. 3B is a front view showing an adhesive placement region on the antenna sheet in Example 1.
• FIG. 3C is a front view showing an adhesive placement region and an interposer placement region on the antenna sheet in Example 1.
• FIG. 4A A cross-sectional view showing a cross-sectional structure of an antenna sheet on which an adhesive layer is formed in Example 1 (a cross-sectional view along the longitudinal direction of the interposer.)
• 4B is a cross-sectional view showing the cross-sectional structure of the antenna sheet on which the adhesive layer is formed in Example 1 (a cross-sectional view taken along line BB in FIG. 4A;).
• FIG. 5A is a cross-sectional view showing a cross-sectional structure of an antenna sheet in which an interposer is arranged in Example 1 (cross-sectional view along the longitudinal direction of the interposer)
• FIG. 6A A cross-sectional view showing a cross-sectional structure of an RF-ID medium pressurized with a press die in Example 1 (a cross-sectional view along the longitudinal direction of the interposer.)
• FIG. 6B is a cross-sectional view showing a cross-sectional structure of the RF-ID medium pressed with a press die in Example 1 (a cross-sectional view taken along line D-D in FIG. 6A;).
• the chip holding member and the base member are made of synthetic resin such as PET film, PPS resin, PLA resin, general-purpose engineering plastic, paper, non-woven fabric, and aluminum foil. It can be formed from a metal material such as copper foil or a material such as glass.
• the material of the chip holding member and the material of the base member may be a combination of the same materials or different materials.
• PS, PC, PA, PP, PPE (PET) and other materials can be used as the plastic material.
• PET polyethylene
• the insulating adhesive hot melt, epoxy adhesive, acrylic adhesive, elastic adhesive, etc. can be used as the plastic material.
• the insulating adhesive is thermoplastic
• the press die provided with the convex portion preferably includes a heater for heating the pressure surface.
• the thermoplastic insulating adhesive can be transitioned to a high fluidity state by the amount of heat generated by the heater. Therefore, the insulating adhesive can flow out with higher certainty from the portion of the interposer side terminal and the base side terminal that are protruded and deformed by the convex portion.
• the contact portion between the protruding and deformed portion as described above and the other connection terminal can be heated and thermocompression bonded.
• thermocompression bonding It is possible to further improve the bonding state where the interposer side terminal and the base side terminal are in direct contact. Therefore, the electrical connection state between the interposer side terminal and the base side terminal can be further ensured, and the good connection state can be maintained with high reliability over a long period of use.
• the insulating adhesive is preferably a moisture-curing type.
• the moisture-curable insulating adhesive is a reactive type that cures in the atmosphere. Therefore, when using a moisture-curable adhesive as the insulating adhesive, store the base circuit sheet and the interposer subjected to the press-pressing process in an indoor environment in a factory or warehouse, for example. In the meantime, the curing of the insulating adhesive can be promoted to further strengthen the bonding of the interposer.
• an ultrasonic vibration acts between the interposer side terminal and the base side terminal.
• the interposer side terminal and the base side terminal can be fused by ultrasonic vibration at a location where the interposer side terminal and the base side terminal directly contact each other. According to this ultrasonic bonding, the electrical connection reliability between the interposer-side terminal and the base-side terminal can be further improved, and the durability can be further enhanced.
• the adhesive disposition region for forming the adhesive disposition layer in the adhesive application step is an interposer disposition for disposing the interposer in the interposer disposition step.
• U preferred to encompass the area.
• the insulating adhesive is adhered over the entire surface of the interposer that faces the base circuit sheet to further improve the bonding strength of the interposer. Can do. Furthermore, if the adhesive disposition area is formed so as to include the interposer disposition area, when the interposer and the base circuit sheet are sandwiched in the pressure pressing step, excess insulating adhesive is removed from the outer periphery of the interposer. It sticks around the side. Thereby, a slope made of an insulating adhesive can be formed between the outer peripheral side surface of the interposer and the surface of the base circuit sheet. Therefore, the interposer is formed by the insulating adhesive attached to the outer peripheral side of the interposer. Can be further strongly bonded.
• the base circuit sheet is formed with an antenna pattern for wireless communication made of a conductive pattern on the surface of the base member, and the interposer serves as an IC chip for RF-ID as the semiconductor chip. Is preferably implemented.
• RF-ID is an abbreviation for Radio- Frequency IDentification.
• the RF-ID medium for contactless ID in which the interposer is bonded to the surface of the base circuit sheet by the interposer bonding method of the first invention is used, the interposer and the base circuit sheet are physically connected. Highly reliable and excellent quality products that are connected with high reliability and electrical reliability can be manufactured extremely efficiently.
• the RF-ID medium is required to have low cost, the effect of the first invention excellent in production efficiency is particularly effective. It is also possible to produce ID media for contact ID.
• This example is an example relating to a joining method of an interposer 10 using an insulating adhesive and an electronic component 1 manufactured using the joining method of the interposer 10. This will be explained with reference to Figs. 1 to 6A and B.
• the interposer 10 is joined by mounting the semiconductor chip 11 on the sheet-like chip holding member 13 and connecting the interposer-side terminal 12 that is a connection terminal extending from the semiconductor chip 11.
• the interposer 10 having the above is joined to a base circuit sheet 20 in which base-side terminals 22 are provided on the surface of a sheet-like base member 21.
• an adhesive coating is provided in which an adhesive arrangement layer 25 made of an insulating adhesive having electrical insulation is provided on at least the surface of the base-side terminal 22 in the base circuit sheet 20.
• an interposer placement step of placing the interposer 10 on the surface of the base circuit sheet 20 so that the base side terminal 22 and the interposer side terminal 12 face each other with the adhesive material placement layer 25 interposed therebetween.
• a pressure press process for pressing the base circuit sheet 20 and the interposer 10 using a pair of press dies 30 facing each other.
• At least one of the base member 21 and the chip holding member 13 is made of a plastic material.
• One of the pair of press dies 30 adjacent to the one made of the plastic material among the base member 21 and the chip holding member 13 is the interposer side terminal 12.
• a convex portion 310 is provided that protrudes toward the other press mold (in this example, the press anvil 32, see FIG. 6).
• the electronic component 1 manufactured by using the joining method of the interposer 10 of this example is an RF-ID (Radio- Frequency IDentification) medium for contactless ID as shown in Fig. 1 (hereinafter referred to as RF as appropriate).
• RF Radio- Frequency IDentification
• This RF— ID media 1 is a semiconductor chip 11 with an RF-ID IC chip (hereinafter referred to as “IC chip 11” as appropriate) and an interposer 10 mounted.
• the base circuit sheet 20 is a combination of an antenna sheet provided with an antenna pattern 24 (hereinafter appropriately referred to as the antenna sheet 20).
• An ID medium for contact ID can also be produced based on the interposer joining method of this example.
• the interposer 10 is obtained by mounting an IC chip 11 on the surface of a sheet-like chip holding member 13 having a thickness of 177 ⁇ m as shown in FIG. 1 and FIGS. 2A and 2B.
• the chip holding member 13 made of a material PSF film is formed in a predetermined size including the formation region of the pair of base side terminals 22 of the antenna sheet 20.
• a conductive pad (not shown) electrically connected to an electrode pad (not shown) of the IC chip 11, and an interposer side terminal 12 extending from the conductive pad, A pair of conductive patterns including are provided.
• the conductive pattern on the surface of the chip holding member 13 is made of conductive ink.
• the material of the chip holding member 13 the PSF power of this example, PC, processed paper, etc. can be employed.
• an underfill material or a potting material may be used.
• a method of forming the conductive pattern of the chip holding member 13 the method of printing the conductive ink of this example is used. Instead, methods such as copper etching, dispensing, metal foil pasting, metal direct vapor deposition, metal vapor deposition film transfer, and conductive polymer layer formation may be employed.
• the antenna sheet 20 is an antenna in which conductive ink is printed in a predetermined pattern on the surface of a thermoplastic base member 21 made of a material PET as shown in FIGS. 1 and 2A, B and having a thickness of 50 ⁇ m. Pattern 24 is provided. At both ends of the antenna pattern 24, base-side terminals 22 that are electrically connected to the interposer-side terminals 12 are provided. As with the conductive pattern formed on the chip holding member 13 above, instead of the antenna pattern 24 made of conductive ink, copper etching foil, dispense, metal foil pasting, metal direct vapor deposition, metal vapor deposition film transfer, The antenna pattern 24 can also be formed by a method such as forming a conductive polymer layer.
• PET-G As the material of the base member 21, PET-G, PC, PP, nylon, paper, or the like of the PET in this example can be used.
• ink material for the conductive ink silver, black lead, silver chloride, copper, nickel, or the like can be used.
• an adhesive coating is provided in which an adhesive disposing layer 25 of an insulating adhesive material having electrical insulation is provided on at least the surface of the base-side terminal 22 in the antenna sheet 20 as described above.
• the attaching process (FIGS. 4A and B), the interposer placement process (FIGS. 5A and B) for placing the interposer 10 on the surface of the antenna sheet 20, and the antenna sheet 30 and the interposer using a pair of press dies 30 facing each other.
• pressurizing and pressing Fig. 6A, B).
• the adhesive placement region 250 (see FIG. 3B) including the pair of base-side terminals 22 of the antenna sheet 20 as shown in FIGS. 3A, B, and C is insulative. Apply adhesive.
• An adhesive disposing layer 25 was provided.
• thermoplastic and moisture-curable hot melt (model number TE-031 manufactured by 3EM) was used as the insulating adhesive.
• insulating adhesives include epoxy adhesives, acrylic adhesives, elastic adhesives, urethane adhesives An adhesive or the like can be used.
• a reactive insulating adhesive such as a thermosetting type, an ultraviolet curable type, or an electron beam curable type may be used.
• each base-side terminal 22 of the antenna sheet 20 and each interposer-side terminal 12 of the interposer 10 face each other as shown in FIGS. 3A, B, C and FIGS. 5A, 5B.
• the interposer 10 is arranged in a predetermined interposer arrangement region 150 in the antenna sheet 20.
• the adhesive placement region 250 of this example is formed so as to include the interposer placement region 150 as shown in FIG. 3C. Therefore, the interposer 10 faces the antenna sheet 20 through the insulating adhesive layer 25 over the entire surface.
• a press pressing process is performed in which the antenna sheet 20 and the interposer 10 are sandwiched and pressed using a pair of press dies 30 facing each other.
• the pressure surface of the die 31 that comes into contact with the base member 21 made of a thermoplastic material is positioned so as to face the back surface of each base-side terminal 22.
• Each has three convex portions 310 formed in parallel in a bowl shape.
• the protrusion height hs is preferably set to 20 to 80 ⁇ m, and for this purpose, the protrusion height hd is preferably set to a range of 100 to 400 / ⁇ ⁇ . Further, the protrusion height hd may be set to 260 to 300 / ⁇ ⁇ so as to form a protrusion height hs of 30 to 40 / ⁇ ⁇ .
• the pressing surface of the press die 32 on the interposer 10 side (hereinafter referred to as a press anvil 32) is a substantially flat surface.
• the die 31 of this example includes a die 31 in order to facilitate the projecting deformation of the base member 21 made of a thermoplastic material and increase the fluidity of the insulating adhesive of the adhesive disposing layer 25.
• a heater (not shown) for heating the pressure surface is provided.
• convex portions having various shapes such as a dotted shape, a cross shape, and a comb shape may be formed instead of the saddle shape of this example. it can.
• the protrusion 31 is provided on the die 31, but instead, the chip holding member 13 is made of a plastic material.
• a convex portion can be provided on the pressure surface of the press anvil 32.
• the base member 21 and the chip holding member 13 can be formed of a plastic material, and convex portions can be provided on both the die 31 and the press anvil 32.
• the die 31 heated to a surface temperature of 200 ° C was used, and a pressure of about 13.5 MPa was applied between the press anvil 32 and about 0.1.
• the antenna sheet 20 and the interposer 10 were pressurized by holding for 2 seconds.
• the gap force between the portion other than the convex portion 310 and the press anvil 32 in the die 31 is approximately 150 ⁇ m. Until they were close.
• each base-side terminal 22 in the antenna sheet 20 can be protruded and deformed by the convex portion 310 of the die 31. That is, the hook-shaped projecting deformation portions 220 can be formed on the base-side terminals 22 corresponding to the protrusions 310 provided in parallel with the pressing surface of the die 31 in a hook shape.
• the antenna sheet 20 and the interposer 10 are in direct contact with each other via the hook-shaped projecting deformed portion 220, and a gap is formed between the antenna sheet 20 and the other portions except for the projecting deformed portion 220.
• the insulating adhesive flows out between the protruding deformed portion 220 and the interposer side terminal 12, and the protruding deformed portion 220 is thermocompression bonded to the interposer side terminal 12.
• the electrical connection between the interposer side terminal 12 and the base side terminal 22 can be realized with high reliability.
• the insulating adhesive does not completely flow out, and an appropriate amount of the insulating adhesive remains as it is. Remains.
• the adhesive bonding between the interposer side terminal 12 and the base side terminal 22, that is, the physical connection is realized with high reliability through the insulating adhesive remaining in the gap. Furthermore, the interposer 10 faces the antenna sheet 20 through an insulating adhesive over the entire surface facing the antenna sheet 20. Therefore, the interposer 10 is firmly bonded to the antenna sheet 20 over the entire surface.
• the adhesive placement region 250 in the adhesive application step is formed to include the interposer placement region 150. Therefore, when the interposer 10 and the antenna sheet 20 are brought into contact with each other and pressed, excess insulating adhesive wraps around and adheres to the outer peripheral side surface of the interposer 10. As a result, the outer peripheral side surface of the interposer 10 connected only by the surface of the interposer 10 becomes an adhesive surface, and the interposer 10 is bonded to the antenna sheet 20 very firmly.
• the base member 21 is formed of a thermoplastic material, and a heater 31 is provided on the die 31 that is in contact with the base member 21. Therefore, by performing the pressure pressing step while heating the antenna sheet 20 using the die 31, the protruding deformed portion 220 can be efficiently formed by the convex portion 310 of the die 31.
• an insulating adhesive having thermoplasticity is used in this example. Therefore, the fluidity of the insulating adhesive between the antenna sheet 20 and the interposer 10 can be enhanced by transmitting the heat generated by the heater to the insulating adhesive via the die 31. Then, the insulating adhesive can flow out from between the protruding deformed portion 220 of the base-side terminal 22 and the interposer-side terminal 12, and electrical contact between the two can be realized with high certainty.
• the insulating adhesive used in this example is a moisture-curing reaction type.
• the joined state of the interposer 10 can be brought close to completeness while the produced RF-ID media 1 is being stored.
• the chip holding member 13 may be formed of a thermoplastic material, and a convex portion similar to the above may be formed on the pressure surface of the press anvil 32 on the interposer 10 side.
• the formation shape of the convex portion of the press anvil 32 can be substantially matched with the formation shape of the convex portion of the die 31.
• the protruding deformed portion 220 of the base side terminal 22 that is protruded and deformed by the convex portion on the die 31 side, and the protruding deformed portion of the interposer side terminal 12 that is protruded and deformed by the convex portion on the press anvil 32 side. Can be brought into contact with each other at the protruding vertices.
• the forming shape of the convex portion on the die 31 side and the convex portion on the press anvil 32 side may be different.
• the protruding deformed portion of the interposer-side terminal 12 and the protruding portion of the base-side terminal are formed at a location where the forming position of the protruding portion on the die 31 side substantially coincides with the forming position of the protruding portion on the press anvil 32 side.
• the deformable portion can be brought into contact.
• the joining method of the interposer 10 of this example is effective in manufacturing various electronic components using the interposer 10 that is not limited to the manufacture of the RF-ID media 1.
• it can be used in the manufacturing process of various electronic components such as FPC (Flexible Printed Circuit Board), paper computer, and disposable electrical products.
• the pressurizing step may be performed using a press apparatus equipped with an ultrasonic vibration unit.
• the interposer-side terminal 12 and the base-side terminal 22 are in direct contact with each other, both can be fused by ultrasonic bonding, and the electrical connection reliability can be further improved. If the interposer-side terminal 12 and the base-side terminal 22 are bonded by combining thermocompression bonding and fusion by ultrasonic bonding, excellent electrical properties between the two can be obtained over the long period of use of the RF-ID media 1. Can maintain a stable connection state with high stability.
• the adhesive placement region 250 is formed so as to include the interposer placement region 150. By reversing this inclusion relationship, the adhesive placement area 250 can be made smaller than the interposer placement area 150. It is also possible to form the adhesive disposing layer 25 independently for each base side terminal 22.

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• Engineering & Computer Science (AREA)
• Metallurgy (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Wire Bonding (AREA)

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Publications (1)

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Citations (4)

• 2004
  • 2004-11-12 JP JP2004329658A patent/JP4628067B2/ja not_active Expired - Lifetime
• 2005
  • 2005-11-10 WO PCT/JP2005/020654 patent/WO2006051885A1/ja not_active Ceased
  • 2005-11-11 TW TW094139662A patent/TW200628035A/zh not_active IP Right Cessation

Patent Citations (4)

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